TWI577998B - Semiconductor transport test fixture - Google Patents

Description

Semiconductor transfer test fixture

The present invention relates to a semiconductor transfer test jig for transporting semiconductors, and more particularly to a semiconductor transfer test jig suitable for transport and pre-test of narrow-pitch BGA type semiconductors.

Semiconductor integrated circuits (hereinafter referred to as "IC") are increasingly developed, but when ICs are applied to products, pre-tests such as functional tests and burn-in tests are usually performed before the products are embedded.

In addition, in the pre-test, the ICs are transported to the test fixtures, and a plurality of semiconductor transport test fixtures are generally carried in the transport frame and carried out beforehand.

Therefore, in order to perform the pre-test, the IC and the semiconductor test device (hereinafter referred to as "IC tester") of the test object are reliably connected by the semiconductor transfer test jig and the test socket.

In addition, when the IC is removed from the semiconductor transfer test fixture during the transfer, it is necessary to stop the manual operation of the semiconductor test device, and the operation rate of the semiconductor test device is lowered. Therefore, it is important to prevent the IC from falling off.

A variety of semiconductor transfer test fixtures that can be applied to ICs for prior testing have been proposed (for example, refer to Patent Document 1 and Patent Document 2).

That is, referring to Patent Document 1, it is disclosed that the body is frame-shaped and has A semiconductor transfer test fixture having a clamping mechanism (latch) for holding the upper and lower sides of the IC.

Further, Patent Document 2 discloses a semiconductor transfer test in which a main body has a frame shape and has a clamping mechanism (latch) for holding the IC, and a device supporting portion for supporting the IC at the bottom of the frame. With.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-139370

Patent Document 2: Japanese Laid-Open Patent Publication No. 2010-266344

In recent years, the diameter and narrow pitch of the external connection terminals of ICs have been increasing, especially in BGA (Ball Grid Array) type ICs or LGA (Land Grid Array) type ICs using solder balls as external connection terminals. The pitch of the terminals is reduced from 1.0 to 0.65 mm pitch in the prior art to less than 0.5 mm pitch.

However, the semiconductor transfer test jig disclosed in Patent Document 1 and Patent Document 2 is such that the external connection terminal of the IC and the contact pin of the pre-test socket are in direct contact with each other, and the pitch of the external connection terminal is narrowed, beforehand. It is also necessary to have a narrow pitch for the contact pins of the test socket itself, so that the test socket beforehand also becomes a problem of high price.

Further, the semiconductor transfer disclosed in Patent Document 1 and Patent Document 2 Since the test fixture is configured to hold the IC by a latch or a narrow device support portion, the IC may have a problem of falling off during the transport process.

The present invention has been made in view of the above problems, and an object thereof is to provide a risk of not only completely eliminating the risk of IC falling off, but also in the case of application to an IC having a narrow pitch external connection terminal. A semiconductor transfer test fixture with a narrow pitch using a socket.

The semiconductor transport test fixture of the present invention includes a frame portion and a bottom film which can be inserted into the inside of the semiconductor integrated circuit having external connection terminals; the bottom film is adhered to the lower surface of the frame portion and formed on the surface. The first pad that is in contact with the external connection terminal has a second pad that is electrically connected to the corresponding first pad and is in contact with the test socket, and the frame portion has "the semiconductor When the integrated circuit is inserted into the inner side wall of the frame portion, the latch protrudes above the semiconductor integrated circuit.

According to the above configuration, it is possible to completely solve the drop of the IC during the transfer.

In the semiconductor transport test fixture of the present invention, the bottom film is made of a flexible material.

According to the above configuration, it is possible to reliably contact the external connection terminal of the IC with the first pad and the second pad and the test socket.

In the semiconductor transfer test fixture of the present invention, the arrangement pattern of the first pad and the second pad is different.

According to the above configuration, even in the case of an IC applied to an external connection terminal having a narrow pitch, it is not necessary to narrow the pitch of the test socket beforehand.

In the semiconductor transport test fixture of the present invention, the frame portion and the bottom film have positioning holes that are joined to positioning pins provided at predetermined positions on the test socket.

According to the above configuration, it is possible to reliably position the semiconductor transport test jig and the test socket.

In the semiconductor transport test fixture of the present invention, the first pads are each ring-shaped, separated, or circular, or polygonal.

According to the above configuration, the proximity of the external connection terminal of the IC and the first pad can be improved.

According to the semiconductor transfer test jig of the present invention, not only can the IC be prevented from falling off during the transfer process, but even if it is applied to a narrow pitch BGA type semiconductor having a pitch of 0.5 mm or less, it becomes unnecessary to The test socket is narrowly pitched.

In the following embodiments, the case where the external connection terminal of the IC is a BGA (solder ball) will be described, but the present invention is also applicable to the case where the external connection terminal of the IC is an LGA (ground grid array).

(First embodiment)

1 is a perspective view showing a state in which the semiconductor transport test fixture of the present invention is attached to a transfer frame, and the aluminum transfer frame 1 has a plurality of (for example, 8 × 4) mounting portions and a semiconductor equipped with IC5. The transport test fixture 2 is screwed to each mounting portion.

2 is a top perspective view (a) and a lower oblique view (b) of the semiconductor transport test fixture of the present invention, and the frame portion 21 of the semiconductor transport test fixture 2 is made of resin, and the IC 5 is formed to be inserted into the recessed portion. structure.

The inner side wall 22 of the body is composed of an inclined wall 221 and a vertical wall 222. Further, the inclined wall 221 is formed to be inclined so as to be easily introduced into the IC 5 and the opening is gradually enlarged upward, and the vertical wall 222 is formed by a gap (for example, 0.1 mm or less) and surrounding the side surface of the IC 5.

Further, at least one portion of the inclined wall 221 is formed with a latch 23 that protrudes above the IC when the IC enters the inside of the vertical wall 222.

The latch 23 is introduced into the inclined wall 221 by pressing the control panel 24 that covers the upper surface of the frame portion 21 so as to be insertable into the IC.

That is, when the IC 5 is inserted into the semiconductor transport jig 2, the control board 24 is pushed down, and the latch 23 is introduced into the inclined wall 221.

Further, the IC 5 is inserted along the inclined wall 221 and embedded in the inner side of the vertical wall 222.

After the insertion of the IC 5, the release of the control board 24 is released to cause the latch 23 to protrude above the IC 5. Thereby, the IC is prevented from being ejected from the semiconductor transport jig 2 during the transfer.

Fig. 3 is a partial cross-sectional view showing a semiconductor transfer test jig and a pre-test test socket according to the first embodiment of the present invention. Further, since the pre-test socket is applicable to the public, the description of the cross-sectional structure is omitted.

The bottom surface of the semiconductor transport test fixture 2 is covered with a bottom film 25 adhered to the lower surface of the frame portion 21 to prevent the IC from being detached from the bottom surface of the semiconductor transport test fixture 2.

The bottom film 25 is formed by adhering an adhesive to the bottom surface of the frame portion 21, and the bottom film 25 is formed by being exchanged when damaged.

Further, the bottom film 25 has an IC side pad 26 (first pad) which is in contact with the solder ball 51 on the lower surface of the IC, and a socket side pad which is in contact with the contact pin which protrudes upward from the front test socket. 27 (2nd pad).

When the bottom film 25 is adhered to the bottom surface of the frame portion 21, it is necessary for the frame portion 21 to position the IC-side pad 26 with an accuracy equal to or less than the gap between the IC 5 and the vertical wall 222.

4 is a perspective view of the semiconductor transport test fixture in a state in which the bottom film is adhered, and the positioning holes 29 are formed in at least two places in the bottom film 25 and the frame portion 21 of the semiconductor transport test fixture 2.

When the control panel 24 is pressed to introduce the latch 23 into the inside of the inclined wall 221, if the IC 5 is inserted from the upper portion of the semiconductor transport test fixture 2, the IC 5 is guided by the inclined wall 221 to reach the vertical wall 222 and the bottom film. 25 surrounded by the area.

Since the side of the IC and the gap of the vertical wall 222 are set to be extremely narrow Since it is narrow (for example, 0.1 mm or less), the solder ball 51 disposed on the bottom surface of the IC 5 is surely brought into contact with the IC side pad 26 on the upper surface of the bottom film 25.

The IC side pad 26 provided on the upper surface of the bottom film 25 and the socket side pad 27 provided on the lower surface of the bottom film 25 are electrically connected by a conductive circuit 28 that vertically penetrates the inside of the bottom film 25.

The pre-test socket 6 is fixed to the substrate by pressing the base 61 on a substrate (not shown) by a fixing member 62.

The contact pin 63 stands on the upper surface 6a of the pre-test socket 6, and the positioning pin 64 penetrating the fixing member 62 stands on the base 61 of the pre-test socket 6.

The semiconductor transfer test fixture 2 on which the IC 5 is mounted is transported to the test socket 6, and the socket is punched into the bottom film 25 and the positioning hole 29 of the frame portion 21 of the semiconductor transport test fixture 2 to be engaged with the positioning pin 64. The side pad 27 and the contact pin 63 are surely in contact.

As a result, the IC5 and the IC tester (not shown) are electrically connected.

Further, in the present embodiment, the socket-side pad 27 is present directly under the IC-side pad 26, and it is necessary to make the arrangement pattern of the contact pins 63 of the pre-test socket 6 the same as the arrangement pattern of the solder balls 51. .

Further, the bottom film 25 is made of a flexible polymer film such as polyester or polyimide, and it is desirable that the IC side pad is in contact with the solder ball 51 and the socket side pad and the contact are connected. The pressure at the time of contact of the foot 63 is softly deformed.

Fig. 5 is a top view (upper section) and a cross-sectional view (lower section) of the shape of the IC side pad 26, and it is desirable to make sure contact with the solder ball 51, and form a ring shape (a), a separation shape (b), or It is a polygonal cone (c) with a cone.

Here, the separate shape refers to a shape in which a plurality of terminals are arranged on the circumference of the diameter of the maximum diameter of the solder balls 51 at equal intervals, and (b) shows a case where four square terminals are arranged.

(Second embodiment)

Fig. 6 is a partial cross-sectional view showing the semiconductor transfer test jig and the pre-test test socket according to the second embodiment of the present invention, except that the configuration of the bottom film is different.

In other words, in the bottom film 35 of the second embodiment, the arrangement pattern of the IC side pad 36 disposed on the upper surface of the film and the socket side pad 37 disposed on the lower surface of the film is different.

Therefore, the conductive circuit 38 connecting the IC side pad 36 and the socket side pad 37 vertically penetrates the bottom surface film 35 from directly under the IC side pad 36, and extends horizontally from the bottom surface film to the socket side pad 37. .

According to the present embodiment, the arrangement interval of the contact pins 63 of the pre-test socket 6 can be further expanded than the arrangement interval of the solder balls 51 of the IC 5, and the manufacturing cost of the pre-test socket 6 can be suppressed.

In addition, since other structures are the same as those of the first embodiment, the description thereof is omitted.

(Third embodiment)

Fig. 7 is a partial cross-sectional view showing a semiconductor transfer test jig and a pre-test test socket according to a third embodiment of the present invention, and a film having a multilayer structure is used as a bottom film.

In other words, in the bottom film 45 of the third embodiment, the conductive circuit 48 that connects the IC side pad 46 and the socket side pad 47 extends horizontally inside the multilayer bottom film.

According to the present embodiment, the arrangement interval of the contact pins 63 of the pre-test socket 6 can be further expanded than the arrangement interval of the solder balls 51 of the IC 5, and the manufacturing cost of the pre-test socket 6 can be suppressed.

In addition, since other structures are the same as those of the first embodiment, the description thereof is omitted.

[Industrial availability]

The semiconductor transfer test fixture of the present invention can be applied to the transfer and pre-test of a narrow-pitch BGA type IC, and can be utilized industrially.

1‧‧‧Transport box

2‧‧‧Semiconductor transport fixture

3‧‧‧Pre-test test socket

4‧‧‧fixer

5‧‧‧IC (semiconductor integrated circuit)

21‧‧‧ Frame Department

22‧‧‧ inner side wall

23‧‧‧Latch

24‧‧‧Control panel

25‧‧‧ bottom film

26, 36, 46‧‧‧IC side pads (1st pad)

27, 37, 47‧‧‧ socket side pads (2nd pad)

28, 38, 48‧‧ ‧ circuit

29‧‧‧Positioning holes

51‧‧‧ solder balls

63‧‧‧Contact pins

64‧‧‧Locating pins

221‧‧‧ sloping wall

222‧‧‧ vertical wall

Fig. 1 is a perspective view showing a state in which the semiconductor transfer test jig of the present invention is attached to a transfer frame.

Fig. 2 is a top perspective view (a) and a lower oblique view (b) of the semiconductor transport test fixture of the present invention.

Fig. 3 is a partial cross-sectional view showing the semiconductor transfer test fixture and the pre-test test socket of the first embodiment of the present invention before being fitted.

Figure 4 is a bottom perspective view of the semiconductor transfer test fixture of the bottom film of the device.

Fig. 5 is a top view (upper section) and a cross-sectional view (lower section) of the shape of the IC side pad.

Fig. 6 is a partial cross-sectional view showing the semiconductor transfer test fixture and the pre-test test socket before the fitting of the second embodiment of the present invention.

Fig. 7 is a partial cross-sectional view showing the semiconductor transfer test fixture and the pre-test test socket before the fitting of the third embodiment of the present invention.

21‧‧‧ Frame Department

24‧‧‧Control panel

25‧‧‧ bottom film

27‧‧‧Socket side pad (2nd pad)

29‧‧‧Positioning holes

Claims (9)

A semiconductor transport test fixture comprising a frame portion and a bottom film, wherein the frame portion is insertable into a semiconductor integrated circuit having an external connection terminal, the bottom film is adhered to the underside of the frame portion, and is formed on the surface: The first pad that is in contact with the external connection terminal has a second pad that is electrically connected to the corresponding first pad and is in contact with the test socket, and the frame portion has the semiconductor body a latch that protrudes above the semiconductor integrated circuit when the circuit is inserted into the inner side wall of the frame portion, wherein the bottom film has a multilayer structure, and the conductive circuit connecting the first pad and the second pad is on the bottom surface The inside of the film extends horizontally. The semiconductor transfer test fixture according to claim 1, wherein the bottom film is made of a flexible material. The semiconductor transfer test fixture according to claim 1 or 2, wherein the arrangement pattern of the first pad and the second pad is different. The semiconductor transfer test fixture according to claim 1 or 2, wherein the frame portion and the bottom film have positioning holes that are joined to positioning pins provided at predetermined positions on the test socket. The semiconductor transport test fixture according to claim 3, wherein the frame portion and the bottom film are provided: A positioning hole engaged by a positioning pin at a predetermined position on the test socket. The semiconductor transfer test fixture according to claim 1 or 2, wherein each of the first pads is annular, separated, or circular, or polygonal. The semiconductor transfer test fixture according to claim 3, wherein each of the first pads is annular, separated, or circular, or polygonal. The semiconductor transfer test fixture of claim 4, wherein each of the first pads is annular, separated, or circular, or polygonal. The semiconductor transfer test fixture according to claim 5, wherein each of the first pads is annular, separated, or circular, or polygonal.