KR100875679B1 - Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same - Google Patents
Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same Download PDFInfo
- Publication number
- KR100875679B1 KR100875679B1 KR1020070066679A KR20070066679A KR100875679B1 KR 100875679 B1 KR100875679 B1 KR 100875679B1 KR 1020070066679 A KR1020070066679 A KR 1020070066679A KR 20070066679 A KR20070066679 A KR 20070066679A KR 100875679 B1 KR100875679 B1 KR 100875679B1
- Authority
- KR
- South Korea
- Prior art keywords
- connector
- test
- connection
- guide member
- holes
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
The present invention relates to a test device connector and a test device for a semiconductor device having the same, and more particularly, to a connector for a test device for connecting a test signal by inserting contact and a test device for a semiconductor device having the same.
In general, semiconductor devices are fabricated in a fab (fab) process for forming an electrical circuit including conductive structures on a silicon wafer used as a semiconductor wafer, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.
Subsequently, an electrical test signal pattern is applied to the lead exposed to the outside of the manufactured semiconductor package to compare the output pattern according to the internal operation of the semiconductor chip with the applied test signal to test whether the semiconductor package is defective.
Recently, in order to test semiconductor memory chips of a semiconductor device, test devices for semiconductor devices are being developed that test at a high speed by mounting tens or hundreds of chips at a time.
The conventional test apparatus includes a test head for accommodating a test board for generating a test signal pattern as an electrical signal, a socket board on which a semiconductor device is mounted, and high-fixes including connection cables electrically connecting the test board and the socket board to each other. Contains interface units such as (hifix).
At this time, the interface unit and the test board are interconnected by a connector. In detail, the connector includes a first connector connected to the test board and a second connector coupled to the interface unit and connected to the connection cables. The first connector and the second connector are inserted into and connected to each other as male and female connectors.
In a conventional test apparatus, the test boards of the test apparatus are densely arranged in parallel to test a large number of semiconductor devices at the same time. Accordingly, the first and second connectors corresponding to the test board are also densely arranged at narrow intervals, and the connection cables connected to the second connector are also densely arranged together.
In this case, connection cables having a relatively large volume are arranged in a horizontal direction in the interface unit. Accordingly, the second connector coupled to the frame of the interface unit is inserted into the first connector while being inclined by the connecting cables bent in the horizontal direction, resulting in a problem of poor connection with the first connector. .
An object of the present invention is to provide a connector for a test apparatus that can prevent contact failure.
Another object of the present invention is to provide a test device for a semiconductor device connected by the connector described above.
In order to achieve the object of the present invention, a test device connector according to the present invention includes a connection part, a coupling part, a guide member, and a fixing pin. The connection portion is provided with a plurality of contact pins. The coupling part is formed at one side of the connection part and has at least two holes. The guide member has a diameter smaller than that of the hole and is inserted into each of the holes to move only in a direction perpendicular to the insertion direction. The fixing pin is inserted into the guide member to fix the guide member to the frame of the test apparatus.
In one embodiment of the present invention, the guide member may include a first bushing inserted through the hole and a second bushing fixing the first bushing to the hole.
In one embodiment of the present invention, the test device connector may further include an elastic member surrounding the fixing pin between the frame and the coupling portion.
In one embodiment of the present invention, the connecting portion is formed to protrude so as to be inserted into the insertion slot of the test device and the insertion portion formed with guide grooves in which the contact pins are spaced apart from each other and the connection cables of the test device are inserted It may include a connection for fixing the contact pins.
In an embodiment of the present invention, the contact pins may be disposed on both sides of the connection part in a first direction, respectively, and the holes may be disposed in a second direction orthogonal to the first direction.
For another object of the present invention, a test device for a semiconductor device according to the present invention includes a test head, an interface unit, a first connector, and a second connector. The test head houses a test board that generates a test signal pattern. The interface unit includes a frame mounted on the test head and a plurality of connection cables for electrical connection with the semiconductor device. The first connector is installed at one end of the test board and has an insertion slot open in a vertical direction. The second connector is coupled to the frame of the interface unit, the connection portion is inserted and withdrawn into the insertion slot of the first connector, the connection portion is provided with a plurality of contact pins for electrically connecting the test board and the connection cable, the connection portion A coupling part formed on one side and having at least two holes for coupling the connection part to the frame of the interface unit, a guide member having a diameter smaller than the hole and inserted in each of the holes and moving in a direction perpendicular to an insertion direction, And a fixing pin inserted into the guide member to fix the guide member to the frame.
In one embodiment of the present invention, the guide member may include a first bushing inserted through the hole and a second bushing to fix the insertion bushing to the hole.
In example embodiments, the contact pins may be disposed on both sides of the connection part in a first direction, and the holes may be disposed in a second direction orthogonal to the first direction. It may be spaced apart from each other along the two directions.
The connector for a test device of the semiconductor device according to the present invention configured as described above includes a guide member inserted into holes for coupling with a frame of the interface unit. The guide member has a diameter smaller than that of the hole to be movable only in a direction orthogonal to the direction in which the guide member is inserted.
Thus, the connector can be prevented from poor contact with the connector that is in contact with each other in combination with the frame of the interface unit while maintaining the horizontal direction without tilting left and right.
Hereinafter, a test apparatus connector and a test apparatus for a semiconductor device having the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. It is to be understood, however, that the intention is not to limit the invention to the particular form disclosed, but to include all modifications, equivalents, and substitutes included in the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.
Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and, unless expressly defined in this application, are construed in ideal or excessively formal meanings. It doesn't work.
1 is a cross-sectional view illustrating a
Referring to FIG. 1, a
The
For example, an electronic circuit used to test a semiconductor device 101 (device under test (DUT)) to be inspected may be mounted on the
The
The
Specifically, the
The
The
Hereinafter, the second connector of the aforementioned test apparatus will be described in detail.
FIG. 2 is a perspective view illustrating the
2 and 3, the
According to an embodiment of the present invention, the
In detail, the
Therefore, when the
The
Insertion holes (not shown) are formed in the lower wall of the
Therefore, when the other end of the
The
A
According to an embodiment of the present invention, the
In this case, the
Here, the interval of the
According to an embodiment of the present invention, two
As described above, the distance between the
The fixing
In addition, an
4A and 4B are side views illustrating the
4A and 4B, two
Therefore, the
In order to test many semiconductor devices at the same time, the
However, according to one embodiment of the present invention, the
Therefore, the
As described above, the two
Accordingly, the
The connector for a test device of a semiconductor device according to a preferred embodiment of the present invention includes a guide member inserted into the holes for engaging the frame of the interface unit. The guide member has a diameter smaller than that of the hole to be movable only in a direction orthogonal to the direction in which the guide member is inserted.
Thus, the connector can be prevented from poor contact with the connector that is in contact with each other in combination with the frame of the interface unit while maintaining the horizontal direction without tilting left and right.
1 is a cross-sectional view illustrating a test apparatus for a semiconductor device according to an exemplary embodiment of the present invention.
FIG. 2 is a perspective view illustrating a second connector of the test apparatus of FIG. 1. FIG.
3 is a cross-sectional view illustrating a second connector of the test apparatus of FIG. 1.
4A and 4B are side views illustrating a second connector of the test apparatus of FIG. 1.
Explanation of symbols on the main parts of the drawings
100: test head 101: semiconductor device
110: test board 120: first connector
200: interface unit 210: frame
220: connection cable 300: second connector
301: contact pin 310: connection
320: inserting portion 330: connecting portion
350: coupling portion 352: hole
360: guide member 362: first bush
364: second bush 370: fixing pin
380: elastic member 400: performance board
1000: test device
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070066679A KR100875679B1 (en) | 2007-07-03 | 2007-07-03 | Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070066679A KR100875679B1 (en) | 2007-07-03 | 2007-07-03 | Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100875679B1 true KR100875679B1 (en) | 2008-12-26 |
Family
ID=40373109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070066679A KR100875679B1 (en) | 2007-07-03 | 2007-07-03 | Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100875679B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101999320B1 (en) * | 2018-03-02 | 2019-10-01 | 이승용 | Test socket comprising pogo pin and test apparatus comprising the test socket |
CN113945739A (en) * | 2021-11-06 | 2022-01-18 | 北京华峰测控技术股份有限公司 | Interface device, circuit board unit, and semiconductor test apparatus |
KR102678167B1 (en) * | 2024-05-17 | 2024-06-25 | 주식회사 오킨스전자 | Connector apparatus for semiconductor testing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100657768B1 (en) | 2006-02-14 | 2006-12-14 | 주식회사 파이컴 | Unit for connecting circuit board and apparatus for testing plat display panel having the unit |
-
2007
- 2007-07-03 KR KR1020070066679A patent/KR100875679B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100657768B1 (en) | 2006-02-14 | 2006-12-14 | 주식회사 파이컴 | Unit for connecting circuit board and apparatus for testing plat display panel having the unit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101999320B1 (en) * | 2018-03-02 | 2019-10-01 | 이승용 | Test socket comprising pogo pin and test apparatus comprising the test socket |
CN113945739A (en) * | 2021-11-06 | 2022-01-18 | 北京华峰测控技术股份有限公司 | Interface device, circuit board unit, and semiconductor test apparatus |
KR102678167B1 (en) * | 2024-05-17 | 2024-06-25 | 주식회사 오킨스전자 | Connector apparatus for semiconductor testing |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6252415B1 (en) | Pin block structure for mounting contact pins | |
KR20150088262A (en) | Probes with spring mechanisms for impeding unwanted movement in guide-holes | |
TW201633636A (en) | Formed wire probe interconnect for test die contactor | |
JP2007017234A (en) | Socket for inspection device | |
JP7095753B2 (en) | probe | |
KR101485433B1 (en) | Insert and Apparatus for testing semiconductor package including the same | |
KR100875679B1 (en) | Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same | |
KR101627172B1 (en) | Socket With One Piece Housing | |
JP7314633B2 (en) | Probe pins, inspection fixtures and inspection units | |
KR20190027137A (en) | Connector and connector assembly | |
KR101369406B1 (en) | Probe structure and electric tester having a probe structure | |
KR101076846B1 (en) | Hi-fix board tester connector | |
US9063170B2 (en) | Interface for a test system | |
US8128417B2 (en) | Methods and apparatus for connecting printed circuit boards using zero-insertion wiping force connectors | |
US6259263B1 (en) | Compliant contactor for testing semiconductors | |
KR200313240Y1 (en) | Test socket for ball grid array package | |
KR100902376B1 (en) | Connector for connecting test signals for testing a semiconductor device | |
KR20080091902A (en) | Socket for testing memory module | |
US20240364050A1 (en) | Test connector | |
KR20090003755A (en) | Ejector for ejecting a test board | |
TWI485406B (en) | Connector for semiconductor device testing equipment and test board for burn-in tester | |
US20230314472A1 (en) | Contact pins for test sockets and test sockets comprising the same | |
JP3148239U (en) | Microelectronic connector with both ends | |
US20240361352A1 (en) | Test socket and assembly device thereof | |
US10840620B2 (en) | Socket |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130930 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140527 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150423 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160616 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170628 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180528 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20190604 Year of fee payment: 12 |