KR100875679B1 - Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same - Google Patents

Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same Download PDF

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Publication number
KR100875679B1
KR100875679B1 KR1020070066679A KR20070066679A KR100875679B1 KR 100875679 B1 KR100875679 B1 KR 100875679B1 KR 1020070066679 A KR1020070066679 A KR 1020070066679A KR 20070066679 A KR20070066679 A KR 20070066679A KR 100875679 B1 KR100875679 B1 KR 100875679B1
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KR
South Korea
Prior art keywords
connector
test
connection
guide member
holes
Prior art date
Application number
KR1020070066679A
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Korean (ko)
Inventor
함응진
Original Assignee
주식회사 엑시콘
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Priority to KR1020070066679A priority Critical patent/KR100875679B1/en
Application granted granted Critical
Publication of KR100875679B1 publication Critical patent/KR100875679B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The connector for the test apparatus of the semiconductor device is provided to prevent the contact failure of the connector with the frame of the interface unit. The connector(300) for the test apparatus comprises the connection part(310), and the joint(350), at least two guide member(360), and the fixation pin. The connection part has a plurality of contact pin(301). The joint is formed in one side of the connection part. The joint comprises at least two holes having the first diameter. The guide member has the second outer diameter smaller than the first diameter of hole. And the guide member is inserted into hole. The guide member is fixed to the holes not to move in the insertion direction. The guide member prevents the joint from being inclined in the insertion direction vertical to the plane. The fixation pin is inserted into the guide members and fixes the guide member on the frame of the test apparatus.

Description

Connector for test device and test device for semiconductor device having same {Connector for connecting test signals for a semiconductor device and Apparatus for testing a semiconductor device having the same}

The present invention relates to a test device connector and a test device for a semiconductor device having the same, and more particularly, to a connector for a test device for connecting a test signal by inserting contact and a test device for a semiconductor device having the same.

In general, semiconductor devices are fabricated in a fab (fab) process for forming an electrical circuit including conductive structures on a silicon wafer used as a semiconductor wafer, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

Subsequently, an electrical test signal pattern is applied to the lead exposed to the outside of the manufactured semiconductor package to compare the output pattern according to the internal operation of the semiconductor chip with the applied test signal to test whether the semiconductor package is defective.

Recently, in order to test semiconductor memory chips of a semiconductor device, test devices for semiconductor devices are being developed that test at a high speed by mounting tens or hundreds of chips at a time.

The conventional test apparatus includes a test head for accommodating a test board for generating a test signal pattern as an electrical signal, a socket board on which a semiconductor device is mounted, and high-fixes including connection cables electrically connecting the test board and the socket board to each other. Contains interface units such as (hifix).

At this time, the interface unit and the test board are interconnected by a connector. In detail, the connector includes a first connector connected to the test board and a second connector coupled to the interface unit and connected to the connection cables. The first connector and the second connector are inserted into and connected to each other as male and female connectors.

In a conventional test apparatus, the test boards of the test apparatus are densely arranged in parallel to test a large number of semiconductor devices at the same time. Accordingly, the first and second connectors corresponding to the test board are also densely arranged at narrow intervals, and the connection cables connected to the second connector are also densely arranged together.

In this case, connection cables having a relatively large volume are arranged in a horizontal direction in the interface unit. Accordingly, the second connector coupled to the frame of the interface unit is inserted into the first connector while being inclined by the connecting cables bent in the horizontal direction, resulting in a problem of poor connection with the first connector. .

An object of the present invention is to provide a connector for a test apparatus that can prevent contact failure.

Another object of the present invention is to provide a test device for a semiconductor device connected by the connector described above.

In order to achieve the object of the present invention, a test device connector according to the present invention includes a connection part, a coupling part, a guide member, and a fixing pin. The connection portion is provided with a plurality of contact pins. The coupling part is formed at one side of the connection part and has at least two holes. The guide member has a diameter smaller than that of the hole and is inserted into each of the holes to move only in a direction perpendicular to the insertion direction. The fixing pin is inserted into the guide member to fix the guide member to the frame of the test apparatus.

In one embodiment of the present invention, the guide member may include a first bushing inserted through the hole and a second bushing fixing the first bushing to the hole.

In one embodiment of the present invention, the test device connector may further include an elastic member surrounding the fixing pin between the frame and the coupling portion.

In one embodiment of the present invention, the connecting portion is formed to protrude so as to be inserted into the insertion slot of the test device and the insertion portion formed with guide grooves in which the contact pins are spaced apart from each other and the connection cables of the test device are inserted It may include a connection for fixing the contact pins.

In an embodiment of the present invention, the contact pins may be disposed on both sides of the connection part in a first direction, respectively, and the holes may be disposed in a second direction orthogonal to the first direction.

For another object of the present invention, a test device for a semiconductor device according to the present invention includes a test head, an interface unit, a first connector, and a second connector. The test head houses a test board that generates a test signal pattern. The interface unit includes a frame mounted on the test head and a plurality of connection cables for electrical connection with the semiconductor device. The first connector is installed at one end of the test board and has an insertion slot open in a vertical direction. The second connector is coupled to the frame of the interface unit, the connection portion is inserted and withdrawn into the insertion slot of the first connector, the connection portion is provided with a plurality of contact pins for electrically connecting the test board and the connection cable, the connection portion A coupling part formed on one side and having at least two holes for coupling the connection part to the frame of the interface unit, a guide member having a diameter smaller than the hole and inserted in each of the holes and moving in a direction perpendicular to an insertion direction, And a fixing pin inserted into the guide member to fix the guide member to the frame.

In one embodiment of the present invention, the guide member may include a first bushing inserted through the hole and a second bushing to fix the insertion bushing to the hole.

In example embodiments, the contact pins may be disposed on both sides of the connection part in a first direction, and the holes may be disposed in a second direction orthogonal to the first direction. It may be spaced apart from each other along the two directions.

The connector for a test device of the semiconductor device according to the present invention configured as described above includes a guide member inserted into holes for coupling with a frame of the interface unit. The guide member has a diameter smaller than that of the hole to be movable only in a direction orthogonal to the direction in which the guide member is inserted.

Thus, the connector can be prevented from poor contact with the connector that is in contact with each other in combination with the frame of the interface unit while maintaining the horizontal direction without tilting left and right.

Hereinafter, a test apparatus connector and a test apparatus for a semiconductor device having the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. It is to be understood, however, that the intention is not to limit the invention to the particular form disclosed, but to include all modifications, equivalents, and substitutes included in the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and, unless expressly defined in this application, are construed in ideal or excessively formal meanings. It doesn't work.

1 is a cross-sectional view illustrating a test device 1000 of a semiconductor device according to an example embodiment.

Referring to FIG. 1, a test apparatus 1000 of a semiconductor device may be mounted on a test head 100 and a test head 100 in which a test board 110 for generating a test signal pattern as an electrical signal is accommodated. Coupled to the interface unit 200 electrically connecting the 110 and the semiconductor device 101 to be inspected, the first connector 120 installed at one end of the test board 110, and the frame 210 of the interface unit 200. And a second connector 300 connected to the first connector 120.

The test board 110 is inserted into the test head 100 in the vertical direction. Specifically, receiving grooves extending in the vertical direction are formed on sidewalls facing each other of the test head 100. The test boards 110 inserted into the receiving grooves are mounted in parallel to the test head 100.

For example, an electronic circuit used to test a semiconductor device 101 (device under test (DUT)) to be inspected may be mounted on the test board 110. In addition, the semiconductor device 101 may be a semiconductor package or a semiconductor module including the semiconductor package.

The first connector 120 is installed on the upper end of the test board 100. According to an embodiment of the present invention, the first connector 120 may be a female connector type. The first connector 120 has an insertion slot 122 open in the vertical direction. In addition, although not shown in the drawings, the lower end of the test board 110 may be connected to the tester control unit (not shown) by a control cable (not shown).

The frame 210 of the interface unit 200 is mounted on the test head 100, and the interface unit 200 is electrically connected to the performance board 400 disposed thereon. In addition, the interface unit 200 includes a plurality of connection cables 220 for electrical connection with the semiconductor device 101, which is an inspection target, disposed on the frame 210.

Specifically, the semiconductor device 101 to be inspected is mounted on the performance board 400, and the interface unit 200 faces the performance board 400 and is connected to the connectors 410 of the performance board 400. It may include a plurality of connectors 222. In addition, the connector 222 of the interface unit 200 may be electrically connected to one side of the connection cable 220.

The second connector 300 is coupled to the lower portion of the frame 210 of the interface unit 200. According to an embodiment of the present invention, the second connector 300 may be a male connector type. The first and second connectors 120 and 300 may be a zero insertion force (ZIF) type connector that may reduce frictional force due to insertion / separation. In addition, the second connector 300 may be electrically connected to the other side of the connection cable 220 of the interface unit 200.

The second connector 300 according to the exemplary embodiment of the present invention includes a connection part 310 and a coupling part 350. The coupling part 310 of the second connector 300 is coupled to the frame 210 of the interface unit 200. In addition, a plurality of contact pins are provided at the connection portion 350 of the second connector 300, and the connection portion 350 connects the contact pins 220 and the contact pins of the interface unit 200.

Hereinafter, the second connector of the aforementioned test apparatus will be described in detail.

FIG. 2 is a perspective view illustrating the second connector 300 of the test apparatus 1000 of FIG. 1, and FIG. 3 is a cross-sectional view illustrating the second connector 300 of the test apparatus 1000 of FIG. 1.

2 and 3, the second connector 300 is formed at one side of the connection part 310 and the connection part 310 inserted into and withdrawn from the insertion slot 122 of the first connector 120 of FIG. 1. And a coupling part 350 for coupling the connection part 310 to the frame 210 of FIG. 1. In this case, the second connector 300 is a connector for connecting a test signal of a semiconductor device.

According to an embodiment of the present invention, the connection part 310 may include an insertion part 320 and a connection part 330.

In detail, the insertion part 320 protrudes from the connection part 330 such that the contact pins 301 are inserted into and withdrawn from the insertion slot 122 of the first connector 120. According to an embodiment of the present invention, the contact pins 301 may be spaced apart in the first direction on both sides of the insertion part 320. In addition, the guide part 322 is formed in the insertion part 320 such that the contact pins 301 are spaced apart from each other.

Therefore, when the insertion part 320 is inserted into the insertion slot 122 of the first connector 120, one end of the contact pin 301 comes into contact with the connector pin (not shown) of the second connector 120. The contact pin 301 is electrically connected to the test board 110.

The connection part 330 is formed with an insertion groove 332 into which the connection cables 220 of the interface unit 200 are inserted. According to an embodiment of the present invention, the insertion groove 332 may be formed extending in the first direction.

Insertion holes (not shown) are formed in the lower wall of the insertion groove 332 to insert the other ends of the contact pins 301, and contact pins 301 are formed on the upper surface of the connection portion 330 adjacent to the insertion groove 332. Fixing grooves 334 for fixing the () are formed. Accordingly, the contact pins 301 are inserted into the insertion holes, respectively, and the other ends of the contact pins 301 are bent and fixed in the fixing grooves 334.

Therefore, when the other end of the connection cable 220 is inserted into the insertion groove 332, the connection cable 220 is in contact with the other end of the contact pin 301 is electrically connected.

The coupling part 350 is formed at one side of the connection part 310. The coupling part 350 has at least two holes 352 for coupling the connection part 310 to the frame 210 of the interface unit 200. According to an embodiment of the present invention, the holes 352 may be formed along a second direction perpendicular to the first direction. The hole 352 formed through the coupling part 350 may extend in a direction orthogonal to both the first direction and the second direction.

A guide member 360 is inserted into each of the holes 352. The guide member 360 has a predetermined tolerance with respect to the hole 352 to be slidable only in a direction orthogonal to the direction in which the guide member 360 is inserted in the hole 352. For example, the hole 352 has a first diameter D1, and the guide member 360 has a second diameter D2 smaller than the first diameter D1. Here, the second diameter D2 of the guide member 360 refers to an outer diameter of the guide member 360 inserted into the hole 352. Accordingly, the guide member 360 is slidably movable by the tolerance obtained by subtracting the second outer diameter D2 from the first diameter D1 in a direction orthogonal to the direction in which the guide member 360 is inserted in the hole 352. Done.

According to an embodiment of the present invention, the guide member 360 includes a first bush 362 and a second bush 364. The first bush 362 is inserted through the hole 352, and the second bush 364 inserts and fixes the first bush 362 through the hole 352. In detail, an upper portion of the first bush 362 is inserted into and fixed to the second bush 364. The first and second bushes 362 and 364 may have a cylindrical shape and may be coupled to each other by a fitting coupling.

In this case, the first bush 362 has a second diameter D2 larger than the first diameter D1 of the hole 352. In addition, when the first bush 362 and the second bush 364 are inserted into and fixed to the coupling hole 352, the interval between the guide members 360 is greater than the thickness of the coupling part 350 in which the coupling hole 352 is formed. The smaller amount is formed to be larger, whereby the second connector 300 can be slidably moved between the guide members 360 in the horizontal direction (that is, the direction orthogonal to the direction in which the groove member 360 is inserted).
Here, the interval of the guide member 360 is disposed on the upper side of the protrusion and the hole 352 of the first bush 362 is inserted into the lower side of the hole 352 and in contact with the lower surface of the coupling portion 350. An upper portion of the first bush 362 is inserted to mean a distance between the protrusions of the second bush 364 in contact with the upper surface of the coupling portion 350.
According to an embodiment of the present invention, two holes 352 may be disposed in the coupling part 350 of the second connector 300 along the second direction. In addition, the holes 352 may be formed symmetrically on both sides of the insertion part 320 of the protruding second connector 300 (see FIGS. 4A and 4B).
As described above, the distance between the guide members 360, that is, the distance between the protrusions of the first bush 362 and the protrusions of the second bush 364 is formed to be smaller than the thickness of the coupling part 350. . Accordingly, the guide member 360 is in a direction orthogonal to the direction in which the guide member 360 is inserted in the hole 352 (the second direction) or on a plane perpendicular to the direction in which the guide member 360 is inserted. It becomes a sliding movement by the tolerance which subtracted the 2nd outer diameter D2 from the 1st diameter D1.

The fixing pin 370 is inserted into the first bush 362 of the guide member 360 and fixed to the frame 210 of the interface unit 200. Accordingly, the guide member 360 of the second connector 300 is fixed to the frame 210 of the interface unit 200 by the fixing pin 370. In this case, the distance between the frame 210 and the second connector 300 may be determined in consideration of the degree to which the second connector 300 is inserted. In addition, the fixing pin 370 may have a sufficient length so as to be spaced apart according to the distance between the coupling part 360 and the frame 210.

In addition, an elastic member 380 surrounding the fixing pin 370 may be further provided between the frame 210 and the coupling part 360. For example, the elastic member 380 may include a spring. Accordingly, the elastic member 380 serves to buffer the load of the frame 210 applied to the second connector 300.

4A and 4B are side views illustrating the second connector 300 of the test apparatus 1000 of FIG. 1.

4A and 4B, two holes 352 are disposed in the coupling part 350 of the second connector 300 along the second direction. According to one embodiment of the present invention, the holes 352 may be symmetrically formed at both sides with respect to the insertion part 320 of the protruding second connector 300. Alternatively, three or more holes 352 may be disposed depending on the degree of inclination of the second connector 300.

Therefore, the second connector 300 is coupled to the frame 210 while maintaining the horizontal direction parallel to the second direction without tilting left and right. In addition, the second connector 300 may move only in the horizontal direction by a difference between the first diameter D1 of the hole 352 and the second diameter D2 of the guide member 360. Furthermore, the second connector 300 is movable in the vertical direction by the fixing pin 370 having a sufficient length, and the elastic member 380 buffers the load of the frame 210 applied to the second connector 300. You can.

In order to test many semiconductor devices at the same time, the connection cables 220 connected to the second connectors 300 arranged in a dense manner are arranged in the horizontal direction in the interface unit 200. Accordingly, the conventional connector coupled to the frame 210 of the interface unit 200 is inclined by the connection cables 220 bent in the second direction, resulting in poor contact.

However, according to one embodiment of the present invention, the guide member 360 inserted into each of the holes 352 arranged along the second direction moves only in a direction perpendicular to the direction in which the guide member 360 is inserted. It is formed to be possible to prevent the second connector 300 is inclined by the connection cables 220. In this case, the second diameter D2 of the guide member 360 may be adjusted to have a tolerance corresponding to a distance allowed in the horizontal direction of the second connector 300 coupled to the frame 210.

Therefore, the second connector 300 may move by the tolerance corresponding to the allowable distance only in the horizontal direction. In addition, the second connector 300 may be inserted into the insertion slot 122 of the first connector 120 while maintaining the horizontal direction without being inclined by the connection cables 220 bent in the horizontal direction.
As described above, the two guide members 360 are inserted into two holes 352 symmetrically formed at both sides with respect to the insertion part 320 of the second connector 300. In this case, the guide members 360 are inserted into and fixed to the holes 360 by the protrusions of the first bush 362 and the second bush 354, so that the guide member 360 is connected to the guide member 360. It is fixed without moving in the inserted direction, that is, the extending direction of the hole 352. In addition, the fixing pins 370 are inserted into the guide members 360, respectively, and are fixed to the frame 210 of the interface unit 200.
Accordingly, the guide members 360 may have a plane perpendicular to the insertion direction of the guide member 360 (or the insertion direction of the guide member 360) orthogonal to the insertion direction of the guide member 360. Tilting relative to the horizontal direction) can be prevented.

The connector for a test device of a semiconductor device according to a preferred embodiment of the present invention includes a guide member inserted into the holes for engaging the frame of the interface unit. The guide member has a diameter smaller than that of the hole to be movable only in a direction orthogonal to the direction in which the guide member is inserted.

Thus, the connector can be prevented from poor contact with the connector that is in contact with each other in combination with the frame of the interface unit while maintaining the horizontal direction without tilting left and right.

1 is a cross-sectional view illustrating a test apparatus for a semiconductor device according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view illustrating a second connector of the test apparatus of FIG. 1. FIG.

3 is a cross-sectional view illustrating a second connector of the test apparatus of FIG. 1.

4A and 4B are side views illustrating a second connector of the test apparatus of FIG. 1.

Explanation of symbols on the main parts of the drawings

100: test head 101: semiconductor device

110: test board 120: first connector

200: interface unit 210: frame

220: connection cable 300: second connector

301: contact pin 310: connection

320: inserting portion 330: connecting portion

350: coupling portion 352: hole

360: guide member 362: first bush

364: second bush 370: fixing pin

380: elastic member 400: performance board

1000: test device

Claims (10)

A connection portion provided with a plurality of contact pins; A coupling part formed at one side of the connection part and having at least two holes having a first diameter; It has a second outer diameter smaller than the first diameter of the hole, is inserted into each of the holes, the sliding movement in the direction orthogonal to the direction inserted in the hole by the tolerance minus the second outer diameter from the first diameter At least two guide members each fixed to the holes so as not to move in the inserted direction, to prevent the coupling portion from being inclined with respect to a plane orthogonal to the inserted direction; And And fixing pins respectively inserted into the guide members to fix the guide member to a frame of the test apparatus. The method of claim 1, wherein the guide member A first bush inserted through the hole; And And a second bushing for fixing the first bushing to the hole. The connector of claim 1, further comprising an elastic member surrounding the fixing pin between the frame and the coupling part. The method of claim 1, wherein the connecting portion An insertion part protruding to be inserted into an insertion slot of the test apparatus, and having guide grooves in which the contact pins are spaced apart from each other; And And a connection part to which the connection cables of the test device are inserted and fix the contact pins. The test signal connection of claim 1, wherein the contact pins are disposed on both sides of the connection part in a first direction, and the holes are disposed in a second direction perpendicular to the first direction. Connector. A test head containing a test board for generating a test signal pattern; An interface unit including a frame mounted on the test head and a plurality of connection cables for electrical connection with a semiconductor device; A first connector installed at one end of the test board and having an insertion slot open in a vertical direction; And A connection part coupled to the frame of the interface unit, the connector including a plurality of contact pins inserted into and withdrawn from an insertion slot of the first connector and electrically connecting the test board and the connection cables, and formed on one side of the connection part A coupling having at least two holes having a first diameter for coupling a connection to the frame of the interface unit, having a second outer diameter smaller than the first diameter of the hole and inserted into each of the holes, In the direction orthogonal to the insertion direction, the first and second slides are fixed by the tolerances minus the second outer diameter, but are fixed to the holes so as not to move in the insertion direction. At least two guide parts for preventing inclination with respect to orthogonal planes S, and the test device of the semiconductor device are respectively inserted into the guide member and a second connector having a fixing pins to fix the guide member to the frame. The method of claim 6, wherein the guide member A first bush inserted through the hole; And And a second bush that fixes the insertion bush to the hole. The test apparatus of claim 6, further comprising an elastic member surrounding the fixing pin between the frame and the coupling part. The method of claim 6, wherein the connecting portion An insertion part protruding to be inserted into an insertion slot of the first connector and having guide grooves in which the contact pins are spaced apart from each other; And And a connection portion into which one ends of the connection cables are inserted to electrically connect the connection cables of the interface unit with the contact pins. The method of claim 6, wherein the contact pins are disposed on both sides of the connection part in a first direction, the holes are disposed in a second direction orthogonal to the first direction, and the test board is disposed in the second direction. Test device for a semiconductor device, characterized in that spaced apart from each other along the.
KR1020070066679A 2007-07-03 2007-07-03 Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same KR100875679B1 (en)

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Application Number Priority Date Filing Date Title
KR1020070066679A KR100875679B1 (en) 2007-07-03 2007-07-03 Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same

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KR1020070066679A KR100875679B1 (en) 2007-07-03 2007-07-03 Connector for connecting test signals for a semiconductor device and apparatus for testing a semiconductor device having the same

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101999320B1 (en) * 2018-03-02 2019-10-01 이승용 Test socket comprising pogo pin and test apparatus comprising the test socket
CN113945739A (en) * 2021-11-06 2022-01-18 北京华峰测控技术股份有限公司 Interface device, circuit board unit, and semiconductor test apparatus
KR102678167B1 (en) * 2024-05-17 2024-06-25 주식회사 오킨스전자 Connector apparatus for semiconductor testing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100657768B1 (en) 2006-02-14 2006-12-14 주식회사 파이컴 Unit for connecting circuit board and apparatus for testing plat display panel having the unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100657768B1 (en) 2006-02-14 2006-12-14 주식회사 파이컴 Unit for connecting circuit board and apparatus for testing plat display panel having the unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101999320B1 (en) * 2018-03-02 2019-10-01 이승용 Test socket comprising pogo pin and test apparatus comprising the test socket
CN113945739A (en) * 2021-11-06 2022-01-18 北京华峰测控技术股份有限公司 Interface device, circuit board unit, and semiconductor test apparatus
KR102678167B1 (en) * 2024-05-17 2024-06-25 주식회사 오킨스전자 Connector apparatus for semiconductor testing

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