KR20090003755A - Ejector for ejecting a test board - Google Patents
Ejector for ejecting a test board Download PDFInfo
- Publication number
- KR20090003755A KR20090003755A KR1020070066684A KR20070066684A KR20090003755A KR 20090003755 A KR20090003755 A KR 20090003755A KR 1020070066684 A KR1020070066684 A KR 1020070066684A KR 20070066684 A KR20070066684 A KR 20070066684A KR 20090003755 A KR20090003755 A KR 20090003755A
- Authority
- KR
- South Korea
- Prior art keywords
- ejector
- test
- test board
- force
- guide groove
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/765—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket the terminal pins having a non-circular disposition
Abstract
Description
The present invention relates to an ejector for a test board, and more particularly, to an ejector for a test board for drawing out a test board inserted in a test head.
In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical elements on a silicon wafer used as a semiconductor wafer, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.
Subsequently, an electrical test signal pattern is applied to the lead exposed to the outside of the manufactured semiconductor package to compare the output pattern according to the internal operation of the semiconductor chip with the applied test signal to test whether the semiconductor package is defective.
Recently, in order to test semiconductor memory chips of a semiconductor device, test apparatuses for a semiconductor device that are equipped with tens or hundreds of chips at a time and test at a high speed are being developed.
The conventional test apparatus includes a test head for receiving a test board for generating a test signal pattern as an electrical signal, a socket board on which a semiconductor device is mounted, and high-fixes including connection cables electrically connecting the test board and the socket board to each other. Contains interface units such as (hifix).
Recently, test boards are densely arranged in parallel in the test head to test numerous semiconductor devices at the same time. In addition, in order to test various kinds of semiconductor devices, test boards suitable for the types of semiconductor devices are replaced and used.
Conventional test boards are inserted in a direction perpendicular to the test head. The test board has a relatively large volume and considerable weight. Therefore, it is difficult and difficult for an operator to separate the test board from the test head for the replacement or repair of the test board, and the work takes a long time, thereby reducing the yield.
An object of the present invention is to provide an ejector for easily withdrawing a test board from a test head using the principle of the lever.
In order to achieve the object of the present invention, the ejector for the test board according to the present invention includes a body portion, a lever and an acting portion. The body portion is inserted into a guide groove formed on the sidewall of the test head, and has a support point in contact with the guide groove. The lever extends from the body portion in a first direction and a force is applied to a force point spaced apart from the support point by a first distance. The actuating part extends in a second direction from the body part to contact a catching jaw formed at one side of the test board inserted into the test head, and is spaced apart from the supporting point by a second distance shorter than the first distance. The force is applied.
In one embodiment of the present invention, the action portion includes a contact pin in contact with the locking jaw, the contact pin may be coupled with two cantilever beams extending in the second direction from the body portion. At this time, the contact pin may be fixed to the cantilever beam by a fixing ring.
In one embodiment of the present invention, the first direction may be orthogonal to the second direction.
In one embodiment of the present invention, the guide groove may have a U-shaped cross-sectional shape.
The ejector for the test board according to the present invention configured as described above includes a body portion, a lever extending in the first direction from the body portion, and an action portion extending in the second direction from the body portion. In order to take out the test board inserted in the test head, the body of the ejector is inserted into the guide groove formed in the test head, and the body is rotated by applying a force to the lever. Accordingly, the actuating part moves the locking jaw of the test board to the upper portion, thereby allowing the test board to be easily withdrawn from the test head.
Hereinafter, an ejector for a test board according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.
Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It should be understood that it does not exclude in advance the possibility of the presence or addition of gongs or numbers, steps, actions, components, parts or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.
1 is a perspective view illustrating a part of a
Referring to FIG. 1, a
The
On the
A
A
Hereinafter, the ejector for extracting the
2A and 2B are cross-sectional views illustrating an
2A, 2B, and 3, the
The
For example, the
The
The operator applies a force to the force point F of the
The acting
The point of contact with the locking
According to one embodiment of the present invention, the first direction in which the
In addition, the
Both ends of the contact pins 132 are coupled and supported by two cantilever beams 112. Therefore, the two
Specifically, both ends of the contact pin 132 is fixed by a fixing
Referring again to FIG. 2A, the
Referring to FIG. 2B again, a force is applied to the action point F of the
Thus, the
4 is a cross-sectional view of the
Referring to FIG. 4, the
According to one embodiment of the present invention, the
In addition, at the other end of the
Accordingly, an
As described above, the ejector for the test board according to the preferred embodiment of the present invention includes a body portion, a lever extending in the first direction from the body portion and an action portion extending in the second direction from the body portion. In order to take out the test board inserted in the test head, the body of the ejector is inserted into the guide groove formed in the test head, and the body is rotated by applying a force to the lever.
Accordingly, the actuating part moves the latching jaw of the test board to the upper side, so that the test board can be easily withdrawn from the test head.
1 is a perspective view illustrating a part of a test head in which a test board drawn out by an ejector according to an embodiment of the present invention is accommodated.
2A and 2B are sectional views illustrating an ejector according to an embodiment of the present invention.
Figure 3 is a side view showing an ejector according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a test head to which the ejector of FIG. 3 is inserted and supported.
Explanation of symbols on the main parts of the drawings
10: test board 12: jam jaw
20: test head 24: receiving groove
26: guide groove 30: connector
100: ejector 110: body portion
112: cantilever 120: lever
130: working part 132: contact pin
134: retaining ring
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070066684A KR20090003755A (en) | 2007-07-03 | 2007-07-03 | Ejector for ejecting a test board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070066684A KR20090003755A (en) | 2007-07-03 | 2007-07-03 | Ejector for ejecting a test board |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090003755A true KR20090003755A (en) | 2009-01-12 |
Family
ID=40486334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070066684A KR20090003755A (en) | 2007-07-03 | 2007-07-03 | Ejector for ejecting a test board |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20090003755A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101249018B1 (en) * | 2012-08-10 | 2013-04-02 | (주)디지털프론티어 | Ejector and ejecting system using ejector |
KR101249017B1 (en) * | 2012-08-10 | 2013-04-02 | (주)디지털프론티어 | Ejector and ejector system using ejector |
KR101327979B1 (en) * | 2012-04-05 | 2013-11-13 | 삼성탈레스 주식회사 | Ejector supporting device |
-
2007
- 2007-07-03 KR KR1020070066684A patent/KR20090003755A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101327979B1 (en) * | 2012-04-05 | 2013-11-13 | 삼성탈레스 주식회사 | Ejector supporting device |
KR101249018B1 (en) * | 2012-08-10 | 2013-04-02 | (주)디지털프론티어 | Ejector and ejecting system using ejector |
KR101249017B1 (en) * | 2012-08-10 | 2013-04-02 | (주)디지털프론티어 | Ejector and ejector system using ejector |
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Legal Events
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |