JP3148239U - Microelectronic connector with both ends - Google Patents

Abstract

A connector that achieves miniaturization, high density, and high performance is provided. A microelectronic ball grid array connector includes a cylinder having a diameter of less than 1 mm, the cylinder extending from a doorway end along a long side of the cylinder to allow the cylinder wall to expand. Each slot has an incision in the vicinity of but not at the doorway, which forms a detent across the slot, so that when the ball is inserted into the doorway end, The ball whose diameter is larger than the inner diameter of the cylinder can be captured and held by the detent. [Selection] Figure 1

Description

  The present invention relates to a small electrical connector, and is particularly known as a ball grid array (BGA) connector including a cylindrical ball plug and socket having a diameter of less than 1 millimeter, and more particularly a diameter of about 0.5 millimeter. It relates to a class of microelectronic connectors. In general, such sockets and plugs are exposed in arrays where the center-to-center spacing is less than 2 millimeters in pitch.

  Connectors are widely used for wiring microelectronic devices such as various semiconductor integrated circuits (ICs), printed boards, system boards, backplanes, cables and the like. A socket is a connector used to connect a terminal of an electronic device to a corresponding contact or other electrical wiring means on a printed circuit board. The socket is often an array of concave elements for engaging the convex elements of the plug array. In addition, sockets are: (a) Electronic device performance inspection system (various socket groups have been developed to connect devices under test (DUT) with various terminals and configurations), Or (b) It is usually used in a system for burn-in of an electronic device at an elevated temperature. A cable connector is another type of connector commonly used to connect a terminal array of electrical cables to a group of parallel, electrically wired conductors or other conductors. Backplane connectors and interboard connectors are yet another type of connector used to connect a terminal array on one printed circuit board to a corresponding terminal array on another printed circuit board.

  The class of connectors used to fit ICs is specialized and important in the electronics industry. Recent developments in BGA terminals for IC packaging have led to the use of new and diverse sockets adapted to BGA to increase the number of terminals and the surface density. BGA sockets have evolved in several directions. One type involves the use of a cam driven spring line that contacts the side of each ball. In certain applications where the high cost of the socket is acceptable, it has been adapted to use spring pins or Pogo® pins in BGA sockets.

  BGA sockets may use stamped springs, which move and fix each ball of the BGA to provide some measure of mechanical compliance necessary to compress the spring connector into contact with the mating ball. A variation of the stamped molded spring is configured to use two or more molded springs to grip each ball, thereby making positive electrical contact while mechanically holding the ball. The miniaturization and density of mechanical stamped springs are limited to a certain size with current capabilities. While stamped spring manufacturing technology continues to advance, sockets with contacts so formed are limited in density due to the complexity of stamping very miniaturized springs. Furthermore, the mechanical compliance of the stamped spring is generally less in the vertical direction perpendicular to the ball substrate. Due to the low compliance in the vertical direction, small stamped springs may not be able to adapt to the movement of the contact support relative to the mating ball, and thus vibration, mechanical shock loads and forces, Strain or other causes the connector to slide up on the surface of the ball. It is known in the art that repeated fine movement of one contact with respect to its mating contact causes dissolution leading to poor contact and accumulation of fine particle fragments.

  BGA sockets also make electrical contact to the bottom area of the ball by helical wire bundles, lines made of elastomeric material, cantilever springs, lithographically formed flat springs, and other contacts that apply force perpendicular to the mating balls. It has been built with contacts. A normal force is necessary to make a good connection between the balls of the BGA, and such contacts are important in BGA packages with a large number of balls or bumps. For example, the clamping force of a BGA socket that applies force perpendicular to 1200 contact bumps is 30 Kg, which is necessary to achieve proper contact with each contact bump. The clamping force required by a BGA socket that makes contact by applying a vertical force is becoming increasingly problematic as the number of contact bumps increases to thousands.

  Advances in the density and speed of electronic devices are placing additional demands on connectors. In particular, the continuous increase in wiring density of electronic systems requires that the connector density, determined by the number of contacts per unit area, be evolved accordingly. In addition, as frequency and clock speeds increase, connector size and self-inductance become important limiting factors on system performance. Future electronic systems will require improvements in impedance control and shielding in addition to low inductance.

  In view of the above, even though various connector technologies can be used in the prior art, this technical field satisfies one or more of the requirements specified above for downsizing, higher density, and higher performance. There is always a need for a connector to do.

  Ball grid array connectors for electrical connection are cylinders with a diameter of less than 1 mm, typically about 0.5 mm in diameter and about 0.005 mm in wall thickness, so that the cylinder wall can be expanded A plurality of slots extending from the end along the long side of the cylinder, typically four slots, each slot having an incision near the entrance but not the entrance, which detents cross the slot As a result, when the ball is inserted into the entrance / exit end, the detent can catch and hold the ball having a diameter larger than the inner diameter of the cylinder. Opposing ends are similarly formed, thereby providing a compact structure in which slots are interposed to receive the ball at each end.

  Referring to FIGS. 1-5, a ball grid array connector 10 for electrical connection is a cylinder 12 having a diameter of less than 1 mm, typically about 0.5 mm, and having a wall 14 having a wall thickness of about 0.005 mm. . The wall 14 is from eight opposing doorways 20, 120 that are circumferentially offset and generally have four pairs at each end so that the cylinder wall 14 can extend between the slots 15-18. A plurality of slots 15-18, 115-118 extending longitudinally along the cylinder 12 are provided.

  According to the present invention, each of the slots 15 to 18 and 115 to 118 has incisions 21 to 24 and 121 to 125 (shown) at positions near the entrance 20 but not the entrance 20. The incisions are paired (eg, 22 and 23) to form a detent across the slot 16, so that the detent can catch and hold the balls 26, 26 '(FIG. 5). The ball must have a diameter that is larger than the inner diameter of the cylinder 12 when the balls 26, 26 'are inserted into the ends of the doorways 20, 120.

  In operation, the balls 26, 26 ′ are inserted into the doorways 20, 120 and extend the wall of the cylinder 12 until the balls 26, 26 ′ reach a detent formed by, for example, a pair of incisions 22, 23 and 122, 123. To do. Then, the balls 26 and 26 'are accommodated in the detents. The inner raised edges 30, 31 of each incision 22, 23, 122, 123 are sharp, so that the balls 26, 26 'are engaged and the balls 26, 26' are even shaved, resulting in surface contamination and corrosion. Reduce electrical resistance and increase conductivity.

  The inherent elasticity of the wall of the conductive cylinder 12, the metal or metal alloy produces enough inward force to securely hold the ball 26 in the cylinder 12 until the antagonizing return force releases the ball 26. Wall flexibility is enhanced by the overlap of slots cut from opposite ends. It can be said that this force is achieved by a mechanical connection (not shown) of the ball 26.

  The invention has been described with reference to specific embodiments. Other embodiments will be apparent to those skilled in the art. Accordingly, it is not intended that the invention be limited except as by the appended claims.

FIG. 6 is a perspective view of an 8-slot both-end connector according to the present invention. It is a front view of the connector by this invention, and the left view, the right view, and the rear view are the same. It is a bottom view of the connector by this invention. It is a top view of the connector by this invention. 1 is a side view of a connector according to the present invention showing an example of a ball terminal connector inserted according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ball grid array connector 12 Cylinder 14 Wall 15-18 Slot 20 Entrance / exit 21-24 Incision part 26 Ball | bowl 30, 31 Inner protruding edge

Claims (1)

A cylinder having a diameter of less than 1 mm and having an entrance and exit end;
In order to allow expansion of the cylinder wall, the first and second inlet / outlet ends and a plurality of slots extending in a longitudinal direction along the cylinder from the second inlet / outlet end, each slot being the inlet / outlet There is an incision in the vicinity but not at the entrance and exit, which forms a detent that crosses the slot, and when the ball is inserted into the entrance and exit end, a ball having a diameter larger than the inner diameter of the cylinder A ball grid array connector characterized in that the detent can be captured and held.

Images