JP2007281101A - Printed wiring structure of control board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently test by the collective setting utilizing a fixture, and to detect that a surface mounted connector is not mounted, etc. <P>SOLUTION: A probe pin 16 is provided for probing the lead potential of a surface mounted connector 4 on the fixture 12 fitted in a control board 1. A mounting pad 25 soldered to a lead 4a of the connector 4 is provided on the surface side of the control board 1, connected to a test pad 27 disposed on the backside of the board 1 through a pad 26 in the through-hole 1b of the board 1, and divided in two regions 25a, 25b through a slit 28. The lead 4a of the connector 4 is soldered across the two regions 25a, 25b, a lead 5a of an IC component 5 is connected to the region 25a not connected to the test pad 27, and the probe pin 16 is contacted to the test pad 27. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a printed wiring structure of a control board having a surface mount type external interface connector.

  At present, a control device using a control electronic circuit generally uses a printed wiring board for the construction of the circuit. In addition, in the manufacture of this printed circuit board, when conducting an operation test of this control board, it is confirmed that the electronic components and connectors mounted on the printed circuit board are securely soldered. In general, it is confirmed by a function test, an appearance inspection or the like. The present invention relates to an apparatus for efficiently performing such energization and function test of a control board, and particularly relates to pattern creation on a printed wiring board.

The prior art document information related to the invention of this application includes the following.
JP-A-6-61604 JP 2003-215208 A JP 2004-340617 A

  As described above, in a manufacturer that manufactures electronic equipment, it is confirmed that the electronic components and connectors mounted on the manufactured printed wiring board are securely soldered by conducting an energization test, a functional test, an appearance inspection, etc. It is common to check. In particular, in the case of a control board for exchanging signals with the outside, a signal connector is generally mounted on the control board, and the signal connection between the control boards is directly performed by this connector, or the cable is temporarily connected. Or make signal connections. In this sense, this signal connector is one of important components. Therefore, in the control board test process for exchanging signals with the outside, it is possible to confirm that the connector for external connection is securely soldered in manufacturing and that the external interface of the control board is correctly connected. is necessary.

  Currently, in the test process of a control board having such a connector part, a cable is directly connected to this connector part, and an actual signal is exchanged with the opposing device to confirm the connectivity of this part. However, since this method always requires manpower to attach and detach the cable to and from the connector portion, it has been difficult to efficiently test a large number of products. This is shown in FIG. In FIG. 5, 1 is a control board to be tested, 2 is a connector for a human interface (console) for performing an operation when performing the test, 3 is a power connector, and 4 is an external device to be tested. These are interface connectors, and these connectors 2 to 4 are all provided on the control board 1. Reference numeral 5 denotes an IC component that exchanges control signals on the control board 1, and is a point where the lead 5 a is soldered to the pattern of the control board 1, and the lead 5 a is connected to the lead mounting pad of the connector 4. The Reference numeral 6 denotes a console device for setting, starting, and the like of a control operation of the control board 1 during a test, and a personal computer or the like corresponds to this. 6a is a human interface cable for connecting the console device 6 and the control board 1, and 7 is a connector (receptacle side) for connecting the cable 6a to the control board 1 via the connector 2.

  Reference numeral 8 denotes a power supply device for supplying power to the control board 1 during the test, and this corresponds to an AC / DC adapter device or the like. 8 a is a power cable for connecting the power supply device 8 and the control board 1, one end is connected to the power supply apparatus 8, and the other end is connected to the control board 1 via the connector (receptacle side) 9 and the power supply connector 3. Is done. Furthermore, reference numeral 10 denotes a counter device that communicates with the control board 1 to exchange signals, and various devices are assumed. Here, a counter personal computer is taken as an example assuming a LAN (Ethernet (registered trademark)) interface. Reference numeral 10 a denotes a signal cable that connects the opposing device 10 and the control board 1, one end of which is connected to the opposing device 10, and the other end is connected to the control board 1 via the connector (receptacle side) 11 and the connector 4. The

  Here, considering the case where a functional test of the control board is performed using these test peripheral devices and cables, connection of each peripheral device and its associated cable, and connection operation of the control board and those cables are not performed. is necessary. When there are a large number of control boards as in product testing, the connection between the peripheral device and the cable is only required once, but the control board and the cable must be inserted / extracted (insertion / extraction) for each control board. It will not be. In particular, as shown in FIG. 5, when there are a plurality of cable connectors (4, 11, 2, 7, 3, and 9), it is not possible to move to the next control board test unless all of them are inserted and removed. become. This is not suitable for a process in which a large number of control boards are present, because the time required for manual operation is increased.

  In order to solve this problem, in recent years, a framework called a fixture that allows the control board to be tested to be easily attached and detached is prepared, and a component pad (soldering part) on the control board is probed below the fixture. It has become common to employ a method in which necessary signals can be connected and tested at once by simply placing a control board to be tested by placing probe pins that can be tested. This is shown in FIG. The parts denoted by reference numerals 1 to 11 indicate the same parts as in FIG. 5, and the fixture 12 is sized to fit the control board 1 exactly. Reference numeral 13 denotes an insulating substrate in the fixture 12, which is a substrate for setting probe pins on the coordinates in accordance with the component arrangement (position of lead soldering pad) of the control substrate 1 to be tested. Reference numerals 14 to 16 denote probe pins corresponding to the signal pins of the connectors 2 to 4 on the control board 1, respectively. Reference numerals 17 to 19 denote connectors equivalent to the connectors 2 to 4 on the control board 1, respectively, which are arranged on the fixture 12 and are electrically connected to the probe pins 14 to 16, respectively. These connectors 17 to 19 are such that the connectors 7, 9, 11 connected to the connectors 2 to 4 can be connected as they are. The connector 7 is the connector 17, the connector 9 is the connector 18, and the connector 11 is the connector 11. Each is connected to a connector 19.

  When the control board 1 is moved in the direction of the thick arrow 20 and fitted into the fixture 12 under such a mechanism, the connector 2 is connected to the probe pin 14, the connector 3 is connected to the probe pin 15, and the connector 4 is connected to the probe. The pins 16 are in contact with each other and are connected to the connectors 17 to 19. As described above, in the case of the energization test using the probe pins 14 to 16 using the fixture 12, when the component mounted on the control board 1 is a radial lead component, the through hole for soldering the component lead and its pad are controlled. Since it exists on the bottom surface side of the substrate 1, if the probe pins 14 to 16 are set up on this pad portion, it can be confirmed whether or not this component is mounted and soldered. This is shown in FIG. FIG. 7 is a cross-sectional view of the state immediately before the probe board 16 is brought into contact with the lead 4a of the connector 4 when the control board 1 is fitted into the fixture 12, with the center of the connector 4 taken as a cross-section and viewed from the right side. Is a lead constituting a contact point of the connector 4 and a lead pin, and is inserted into the through hole 1 a of the control board 1. 19a is a lead constituting the contact and lead pin of the connector 19, 11a is a lead constituting the contact and lead pin of the connector 11, and the leads 11a and 19a are in contact with each other. The probe pin 16 is movably inserted through the insulating substrate 13, 16a is a cable connecting the probe pin 16 and the lead 19a, and 16b is a spring member that repels the pressing operation of the probe pin 16. Reference numeral 21 denotes a mounting pad for the lead 4a when the connector 4 is mounted on the control board 1. The mounting pad 21 is provided on the front surface side of the control board 1 and the back surface of the control board 1 through the through hole 1a. Also provided on the side. Soldering is performed in the portion A, that is, in the through hole 1a and on the back surface side, and the lead 4a is fixed to the mounting pad 21. Other parts are the same as those in FIGS.

  Now, when the control board 1 is fitted and moved in the direction of the arrow 22, the tip of the lead 4 a comes into contact with the probe pin 16. When the mounting of the connector 4 and the soldering at the part A are correctly performed, the electrical connection from the lead 5a of the IC component 5 to the connector 11 is ensured. ) Will pass. FIG. 8 shows this state.

  FIG. 9 shows a case where the connector 4 is mounted but soldering is not performed correctly. In this case, the lead 4a of the connector 4 and the probe pin 16 are in contact with each other, but since the lead 4a and the mounting pad 21 are not soldered, electrical connection (conduction) from the lead 5a of the IC component 5 to the connector 11 is established. ) Is not obtained, and an error occurs in this functional test (which may be an energization test), so that a manufacturing defect in this portion can be detected.

  On the other hand, FIG. 10 shows a case where the connector 4 is not mounted. In this case, even if the control board 1 is mounted on the fixture 12, the mounting pad 21 and the probe pin 16 do not come into contact with each other. In this case as well, electrical connection from the lead 5a of the IC component 5 to the connector 11 ( Continuity) is not obtained, and an error occurs in this functional test (which may be an energization test), and a manufacturing defect in this portion can be detected. With such a mechanism, when the fixture 12 is used, even when there are a large number of control boards 1, the control board 1 can be simply fitted to and removed from the fixture 12 without inserting or removing many connectors. Functional tests, continuity tests, etc. can be performed, and the testing process can be greatly rationalized.

  However, the mechanism of the fixture 12 cannot be used well when the connector 4 is a surface-mounted component due to the following problems. This is shown in FIG. FIG. 11 shows the case where the connector 4 is a surface mount component. In this case, the lead 4b of the connector 4 is soldered to the mounting pad 23 on the surface side of the control board 1, but there is no through hole 1a, so that the mounting pad 23 does not exist in the B portion on the back surface side of the control board 1 with which the probe pin 16 contacts, and even if the fixture 12 is used, probing cannot be performed. In order to solve this problem, the mounting pad 23 provided only on the front surface side of the control board 1 is provided also on the back surface side through the through hole 1b of the control board 1, and the mounting pad 23 provided on this back surface side is provided. The probe pin 16 can be used for probing. An example of this is shown in FIG. In this way, even if the connector is a surface mount component, it can be probed from the back side by the fixture 12, but in this case, as shown in part C, the lead 4b of the connector 4 and the surface side of the mounting pad 23 Even if the gap is not soldered or the connector 4 is not mounted, the electrical connection (conduction) from the lead 5a of the IC component 5 to the connector 11 can be obtained, so that a manufacturing defect in this part is detected. I couldn't.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. In a control board provided with a mounting pad on the surface side to which a lead of a surface mount connector is soldered, collective setting using a fixture To obtain a printed wiring structure of a control board capable of performing an efficient test according to the above and detecting whether the surface mount connector is not mounted or the surface mount connector is not properly soldered to the mounting pad. For the purpose.

  The printed wiring structure of the control board according to claim 1 of the present invention is a control board provided with a mounting pad on the surface side to which a lead of a surface mount connector is soldered, and the mounting pad is in a through hole of the control board. The pad is connected to a test pad provided on the back side of the control board, and the mounting pad is divided into two regions by providing a slit, and the connector lead is soldered across the two regions. A probe pin provided to connect a signal to a region of the mounting pad that is not connected to the test pad and to probe the lead potential of the connector to the fixture that fits to the control board contacts the test pad. It is made to let you.

  In the printed wiring structure of the control board according to claim 2, the slit is provided substantially in parallel to the length direction of the mounting pad.

  As described above, according to the first aspect of the present invention, the mounting pad provided on the front surface side of the control board and to which the lead of the surface mount connector is soldered is connected to the control board via the pad in the through hole of the control board. It is connected to the test pad provided on the back side, and the lead potential of the surface mount connector can be probed by bringing the probe pin provided on the fixture fitted to the control board into contact with the test pad. Enables batch setting by the tea, eliminates the need for manual connector insertion / removal, and enables efficient testing. In addition, the mounting pad provided on the surface side of the control board is divided into two regions by slits, and the connector leads are soldered across the two regions, so that the mounting pad is not connected to the test pad. If a signal is connected and the surface mount connector is not mounted or the lead of the connector is not soldered correctly, the electrical connection between the two areas will not be made and the lead potential of the connector will be reduced. It cannot be detected, and a manufacturing defect can be detected.

  According to claim 2, the slit of the mounting pad is substantially parallel to the length direction of the mounting pad, the overlapping distance between the soldering portion and the slit is increased, and the soldering state is detected more accurately. Can do.

Best Embodiment 1
The best mode for carrying out the present invention will be described below with reference to the drawings. In general, a mounting pad (footprint) 24 for mounting a surface-mounted component on the control board 1 has a shape as shown in FIG. Reference numeral 24 denotes an attachment pad to which the lead 4b of the connector 4 is attached at the attachment position 4'b. The attachment pad 24 is integrally provided with a pattern portion 24a to which the lead 5a of the IC component 5 is connected. 1A and 1B are a longitudinal sectional front view and an enlarged view of a D portion of a printed wiring structure of a control board 1 according to Embodiment 1 of the present invention, and FIG. 2 is a front view of a mounting pad 25 for a surface mount connector. As shown in the figure, the connector 4 is mounted on the surface of the control board 1, the lead 4b is soldered to a mounting pad 25 provided on the surface side of the control board 1, and 4'b indicates the mounting position. An insulating substrate 13 is provided in the fixture 12 to be fitted to the control substrate 1, and a probe pin 16 is provided in a position corresponding to the mounting pad 25 of the insulating substrate 13 so as to be movable up and down. The probe pin 16 is a spring member. 16b, cable 16a, and leads 19a and 11a are connected to connectors 19 and 11.

  One end of the mounting pad 25 is connected to a test pad 27 provided on the back side of the control board 1 via a pad 26 in the through hole 1 b of the control board 1, and the mounting pad 25 is divided into two regions by a slit 28. The lead 4b is soldered across the two regions 25a and 25b. Further, the lead 5a of the IC component 5 is connected to the region 25a of the mounting pad 25 that is not connected to the test pad 27 via the pattern portion 29, and a control signal is connected thereto. The probe pin 16 contacts the test pad 27 and probes the potential of the lead 4b of the connector 4.

  In the first embodiment, the configuration is as described above, the connector 4 is securely mounted, and the lead 4b of the connector 4 is securely soldered to both sides over the two regions 25a and 25b of the mounting pad 25. Only in this case, since the electrical connection (conduction) from the lead 5a of the IC component 5 to the connector 11 is ensured, the test passes the functional test (which may be an energization test) between them.

  On the contrary, if the connector 4 is not mounted or if the lead 4b is not soldered correctly, the areas 25a and 25b of the mounting pad 25 can be obtained even if the control board 1 is mounted on the fixture 12. Is not electrically connected, so that electrical connection (conduction) from the lead 5a of the IC component 5 to the connector 11 cannot be obtained, and an error occurs in this functional test (which may be an energization test). Manufacturing defects can be detected.

  In the first embodiment described above, the mounting pad 25 provided on the front surface side of the control board 1 is connected to the test pad 27 on the back surface side of the control board 1 via the pad 26 in the through hole 1b. The probe pin 16 provided on the chuck 12 is brought into contact with the test pad 27, so that the potential of the lead 4b of the surface mount connector 4 can be probed, and the batch setting by the fixture 12 becomes possible. Therefore, an efficient test can be performed. Also, the lead 4b of the connector 4 is soldered across the two divided regions 25a and 25b of the mounting pad 25, and the surface mount connector 4 is not mounted or the lead 4b of the connector 4 is soldered correctly. If not, electrical connection between the two regions 25a and 25b is not performed, the lead potential of the connector 4 cannot be detected, and a manufacturing defect can be detected.

Embodiment 2
FIG. 3 shows a front view of a mounting pad according to the second embodiment of the present invention. In the first embodiment, the mounting pad 25 is provided with a slit 28 in a direction perpendicular to its longitudinal direction, and two regions 25a are provided. 25b, the mounting pad 25 is divided into two by a slit 30 substantially parallel to the length direction in the second embodiment, and the overlapping distance E between the soldered portion and the slit 30 is It becomes longer and the soldering state can be detected more accurately.

It is the principal part longitudinal section front view of the printed wiring structure of the control board by Embodiment 1 of this invention, and the D section enlarged view. 1 is a front view of a mounting pad according to a first embodiment. 6 is a front view of a mounting pad according to Embodiment 2. FIG. It is a front view of the conventional mounting pad. It is a disassembled perspective view which shows the printed wiring structure of the conventional control board. It is a disassembled perspective view which shows the printed wiring structure of the other conventional control board. It is a principal part vertical front view at the time of the electricity supply test of the printed wiring structure of the other conventional control board. It is a principal part longitudinal front view at the time of the electricity supply test of the printed wiring structure of the other conventional control board in case the connector is soldered correctly. It is a principal part longitudinal front view at the time of the energization test of the printed wiring structure of the other conventional control board when the soldering of the connector is not performed correctly. It is a principal part longitudinal front view at the time of the energization test of the printed wiring structure of the other conventional control board in case the connector is not mounted. It is a principal part longitudinal front view at the time of the electricity supply test of the printed wiring structure of the other conventional control board in case a connector is a surface mounting component. It is a principal part longitudinal front view at the time of the energization test of the printed wiring structure of the conventional control board corresponding to the case where a connector is a surface mounting component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Control board 1b ... Through-hole 4, 11, 19 ... Connector 5 ... IC component 4b, 5a, 11a, 19a ... Lead 12 ... Fixture 13 ... Insulation board 16 ... Probe pin 25 ... Mounting pad 26 ... Pad 27 ... Test Pad 28, 30 ... Slit 29 ... Pattern

Claims (2)

  In the control board provided with a mounting pad on the surface side to which the lead of the surface mount connector is soldered, the mounting pad is provided with a test pad provided on the back side of the control board via a pad in a through hole of the control board. In addition to connecting, the mounting pad is divided into two regions by providing a slit, and the lead of the connector is soldered across the two regions, and a signal is sent to the region of the mounting pad that is not connected to the test pad. A printed wiring structure for a control board, wherein a probe pin provided for probing the lead potential of the connector to a fixture that is connected and fitted to a control board is brought into contact with the test pad. The printed wiring structure for a control board according to claim 1, wherein the slit is provided substantially parallel to the length direction of the mounting pad.

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