JP2010038691A - Circuit board, method of manufacturing the same, electrical testing tool, and electrical testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board, a method of manufacturing the same, an electrical testing tool incorporating the same, and an electrical testing apparatus that do not increase the cost of electrical testing even if there is a change in the electrode array pattern of an object to be tested. <P>SOLUTION: A circuit board 30 includes: a base 31 made of an insulating material; and a plurality of conductors 33 that are fixed to the base 31 and pass through the base. The plurality of conductors 33 are exposed on one surface of the base to form a terminal 33a and besides extended out of the other surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board, a manufacturing method thereof, an electrical inspection jig, and an electrical inspection apparatus. More specifically, the present invention relates to a circuit board used for electrical inspection of a flexible printed circuit board (FPC), an IC package, and the manufacture thereof. The present invention relates to a method, an electrical inspection jig, and an electrical inspection device.

  For an IC package such as an LSI and a circuit board such as an FPC, all electrical inspections are performed on a production line for quality assurance. Probe pins are arranged in an electric inspection jig that constitutes a head of an electric inspection device used for electric inspection, and wiring that communicates with the tester is connected to the probe pins. The tester can inspect normality or abnormality (disconnection, etc.) of a circuit between predetermined electrodes in a state where the probe pins of the electric inspection jig are in contact with the electrodes of the IC package, FPC or the like. With respect to electrodes such as FPCs with which the terminals of the electrical inspection jig come into contact, the electrode pitch tends to be narrowed and densified as the functions of cellular phones and the like increase.

Corresponding to such an electrode arrangement, a pitch conversion board (printed circuit board), an anisotropic conductive sheet, a probe pin, etc. are used for an electrical inspection jig, and with a high-density arrangement electrode, with high efficiency, Low-cost electrical connection is realized (Patent Document 1). Among these, the pitch conversion board (printed circuit board) has terminals arranged on one surface in the same arrangement pattern as electrodes such as FPC and every other one on the other surface in a direction orthogonal to the terminal arrangement direction. By alternately shifting to each other, an array of terminals in which the pitch interval is doubled is formed. There are several patterns for how to deviate in the direction orthogonal to the terminal arrangement direction, and it is not limited to the above two rows. That is, a terminal pattern in which three adjacent terminals (N terminals) are shifted so as to form three rows (N rows) in the orthogonal direction is also possible. In this case, the terminal pitch in each column direction is three times (N times) the terminal pitch on one surface.
Japanese Patent Laid-Open No. 5-159821

  In FPC and the like, due to frequent changes in models of mobile phones and the like, a wide variety of electrode arrangement patterns are being used as the density of electrodes increases. Accordingly, it is necessary to change the terminals on one surface of the pitch conversion board in order to match the electrode arrangement such as FPC. That is, the pitch conversion substrate needs to be changed according to the change in the arrangement of the electrodes of the device under test. The pitch conversion board has a high initial cost such as a design cost and a mold cost. If the pitch conversion board is changed each time according to the change of the object to be inspected, an electrical inspection cost increases. An object of the present invention is to provide a circuit board, a manufacturing method thereof, an electric inspection jig incorporating the circuit board, and an electric inspection apparatus capable of suppressing an increase in cost of electric inspection.

The circuit board of the present invention includes a substrate made of an insulator and a plurality of conductive wires fixed to the substrate and penetrating the substrate. The plurality of conductive wires are exposed on one surface of the substrate to form a terminal and extend from the other surface.

  According to said structure, the conducting wire part (end surface etc.) exposed to one surface of a board | substrate and the electrode of an electronic component can be electrically connected. A contact sheet may be interposed between the exposed conductor portion and the electrode of the electronic component. A conductive wire extending from the other surface of the base is used as a wiring for connection to a tester. The conductive wire extending from the other surface facilitates connection to the tester wiring, and has substantially the same effect as increasing the pitch. For this reason, said circuit board can be used instead of a pitch conversion board | substrate. The arrangement of the conductive wires on the circuit board may be an arrangement that matches the arrangement of electrodes such as an FPC. Moreover, it is good also as a general-purpose (universal) circuit board corresponding to all electrode arrangements, such as FPC, by covering the whole surface with a narrow pitch using an ultrafine wire for a conducting wire.

  The leading end portion of the conducting wire extending from the other surface can be used as a connection insertion portion. As a result, it is possible to improve the efficiency of connection work for each of the tester terminal and the conductor and to improve the accuracy of the connection.

Said base part can be made into the resin board by which the some conducting wire was penetrated. Thus, an inexpensive circuit board can be obtained that can be easily manufactured using a perforated resin plate, a conductive wire, an adhesive, and the like. For this reason, the electrical inspection cost can be reduced.

The base portion can be constituted by a resin portion that fixes one end of a plurality of bundled covered conductors and a covering portion of the covered conductors. As a result, it is possible to use extra fine wires, and for example, the above-described universal circuit board can be obtained at low cost.

The electrical inspection jig of the present invention is an electrical inspection jig for establishing electrical connection with an electrode of an electronic component and communicating with a tester. Using any one of the circuit boards described above, the terminal exposed on one surface of the circuit board and the electrode of the electronic component are electrically connected, and the lead wire extending from the other surface of the circuit board is connected to the tester. And Accordingly, the above circuit board can be used instead of the pitch conversion board. In addition, by using a universal circuit board, it is not necessary to change the terminal arrangement on one side every time the model is changed, so that further cost savings are possible. Moreover, since the conducting wire extending from the other surface of the circuit board can be used as the wiring, the efficiency of the connection work to the tester can be improved.

The electrical inspection device of the present invention is an electrical inspection device that conducts with the electrodes of the electronic component and inspects with a tester. Using any one of the circuit boards described above, the terminal exposed on one surface of the circuit board is electrically connected to the electrode of the electronic component, and the conductive wire extending from the other surface of the circuit board is connected to the tester. To do. As a result, the effects of the electrical inspection jig can be obtained as they are, for example, the circuit board can be used instead of the pitch conversion board.

A connection board for connecting a conductor from the circuit board to the terminal of the tester is provided, and a connection receiving portion to which wiring from the terminal of the tester is connected is arranged on the connection board, from the other surface of the circuit board It can be set as the structure by which the front-end | tip part of the extending conducting wire is inserted and connected to the connection receiving part. As a result, the connection work to the tester can be made highly efficient and erroneous connection can be suppressed.

  In the method of manufacturing a circuit board according to the present invention, a plurality of through holes are formed in a substrate made of an insulator, a plurality of conductive wires are inserted into the through holes, and the conductive wires are exposed from one surface of the substrate to form a terminal, The plurality of conducting wires are fixed in a state where the conducting wires are extended from the other surface. Thereby, a circuit board can be manufactured by a simple method. For this reason, even if the terminal arrangement on one surface is changed every time the model is changed, as in the case of the pitch conversion board, a large increase in cost is not caused.

In another method of manufacturing a circuit board according to the present invention, a plurality of insulation-coated conductors are bundled with both ends aligned, one end of the bundled conductor is solidified with an insulating resin, and one of the conductors solidified with the insulation resin A terminal is formed by polishing the end face of the first end and etching the polished end face to expose the conducting wire on the end face. Thereby, a circuit board can be manufactured by a simple method. In this manufacturing method, it is easy to use extra fine wires, and a terminal arrangement with a narrow pitch can be obtained. For this reason, it is easy to obtain a universal circuit. The universal circuit board does not have to be changed in accordance with the electrode arrangement pattern of the electronic component every time the model is changed. Further, the conductive wire extending from the other surface can also be used to improve the efficiency of connection to the tester terminal as described above.

An insertion portion for connection can be formed at the end of the conducting wire opposite to the end that is the terminal. As a result, the connection work to the tester can be made highly efficient and erroneous connections can be reduced.

  With the circuit board, electrical inspection jig, and electrical inspection apparatus of the present invention, an increase in the cost of electrical inspection can be suppressed.

(Embodiment 1)
FIG. 1 is a diagram showing an electrical inspection jig 10 and an electrical inspection device 50 using a circuit board 30 according to Embodiment 1 of the present invention. The electric inspection jig 10 is sandwiched between inspection device bases 51 positioned above and below, and is pressurized during inspection. An inspection object 70 such as an FPC has an electrode 71 on the surface facing the wiring 21 to the tester 20 of the electric inspection jig. The electrode 71 of the object to be inspected is electrically connected to the terminal 30a on the surface of the circuit board 30 with the contact sheet (anisotropic conductive sheet) 5 interposed therebetween. In the electrical inspection apparatus 50 according to the first embodiment of the present invention, the circuit board 30 is unique. The circuit board 30 is formed of an insulating plate 31 as a base and a conductive wire 33 inserted and fixed in a through hole provided in the insulating plate. Therefore, it can be expressed as a circuit board with a conducting wire.

  The above-mentioned circuit board 30 with a conducting wire is usually used instead of the printed circuit board used. The pitch conversion board is a kind of printed circuit board. The printed circuit board is often expressed as a pitch conversion board because the front terminals have a dense arrangement and the back terminals have an arrangement with a larger pitch interval. In the pitch conversion substrate, the terminal on the front surface is electrically connected to the terminal whose interval (pitch) is widened on the back surface (second surface). The back terminal that is electrically connected to the electrode 71 of the device under test 70 is connected to a connection probe pin or the like, and is connected to the tester 20 via a wiring 21.

  Unlike the pitch conversion board, the circuit board 30 with a conductor does not have a back terminal, and instead a conductor 33 is extended on the back side. A table 53 is attached to the lower inspection apparatus base 51, and a push base 54 is attached to the upper inspection apparatus base 51. The insulating base 11 is fixed to the lower table 53 with its position aligned. The conducting wire 33 of the circuit board with conducting wire 30 is connected to the wiring 21 to the tester 20 through the through hole 11 h provided in the insulating base 11 at the connecting portion 29. Further, the upper push stand 54 is provided with a pin (not shown), and is inserted into a positioning hole provided in the object 70 to be aligned. In the electrical inspection device 50, in order to ensure electrical connection, the set (inspected object 70 / electrical inspection jig 10) set by performing alignment is pressurized from above and below. This elasticity or stretchability against pressurization is ensured by the elasticity of the contact sheet 5 itself.

  FIG. 2 is a diagram for explaining the above-described circuit board 30 with a conducting wire. The insulating base 11 in FIG. 1 is omitted. Moreover, FIG. 3 is the elements on larger scale of the circuit board with conducting wire. The surface terminal 33a of the circuit board 30 with the conductive wire is electrically connected to the electrode 71 of the device under test 70 such as an FPC with the contact sheet 5 interposed therebetween. The conducting wire 33 extending to the rear surface side of the circuit board 30 has a connecting insertion portion 33b formed at the tip thereof. Further, a receiving portion 21b for connection is provided at the tip of each wiring 21 of the tester 20. The insertion part 33b is inserted in the receiving part 21b, and electrical connection can be easily realized.

  4 and 5 are diagrams for explaining a method of manufacturing a circuit board according to the embodiment of the present invention. 4A and 5A are plan views, and FIG. 5B is a cross-sectional view. First, as shown in FIGS. 4A and 4B, a through hole 31 h is formed in the insulating resin plate 31. And as shown to Fig.5 (a), (b), the conducting wire 33 is inserted in each through-hole 11h, and an adhesive agent is arrange | positioned and fixed to the inner wall of the through-hole 11h. As shown in FIG. 5 (a), the end of the conducting wire 33 on the surface side is arranged so as to protrude slightly from the surface of the resin plate 31 so as to form the surface terminal 33a. The conducting wire 33 may be a copper wire with an enamel coating or a bare conducting wire without an enamel coating. Further, a conductive wire coated with an insulating resin with a thin coating thickness may be used. In any case of the conductive wire 33, the surface terminal 33a portion and the portion of the insertion portion 33b at the end of the conductive wire extending from the back surface side must be stripped to achieve electrical connection. The manufacturing method of the circuit board 30 as described above is very simple and can be manufactured at low cost.

The structural features of the circuit board 30 are as follows.
(1) The arrangement of the surface terminals 33a is matched to the electrode arrangement of the device under test 70, similarly to the pitch conversion substrate. However, on the back surface, in the pitch conversion substrate, the terminal density is lowered by alternately shifting the back surface terminals in a plane. On the other hand, in the circuit board with conducting wire, there is no back terminal, and the back conducting wire is extended to realize electrical connection with the tester wiring. The back conductor 33 and the plug-in portion 33b can be easily and quickly connected to the wiring 21 of the tester 20 by greatly reducing the density of the back terminals using a three-dimensional space depending on the way of view. Can be seen. That is, the reduction in terminal density and the ease of wiring to the tester are realized by making the back terminal three-dimensional.
(2) The conducting wire is the same from the front surface to the back surface, and is disposed straight. For this reason, the structure is simple, and design costs, mold costs, etc. are almost unnecessary.

The advantages of using the circuit board 30 in the present embodiment are as follows.
(1) It is not necessary to use a pitch conversion substrate. As described above, the pitch conversion substrate needs to be changed according to the change in the arrangement of the electrodes of the device under test. The pitch conversion substrate has a high initial cost such as design and mold, and if it is changed each time according to the change of the object to be inspected, the electrical inspection cost increases. By using the circuit board 30 described above, the cost of electrical inspection can be reduced.
(2) In assembling the electrical inspection jig 10, the electrical connection between the conductor 33 of the circuit board 30 and the wiring 21 of the tester 20 can be performed easily, quickly and accurately. Such facilitation, speeding up and improvement in accuracy of the electrical connection in the electrical inspection jig 10 will also lead to a reduction in electrical inspection costs.

(Embodiment 2)
FIG. 6 is a cross-sectional view illustrating a circuit board 30 according to the second embodiment of the present invention. The circuit board 30 according to the present embodiment is different from the circuit board according to the first embodiment in that a thin wire is used as the conducting wire 33. The configuration of the base 31 is also different from the base of the first embodiment. The number of conducting wires 33 per unit area of the circuit board 30 is higher in the present embodiment than in the first embodiment. For this reason, even if the arrangement of the electrodes 71 of the device under test 70 is changed or the density is changed within a predetermined range, the same circuit board 30 of the present embodiment can cope with it. . That is, a general-purpose (universal) circuit board 30 can be obtained. For this reason, unlike the surface terminals of the first embodiment, it is not necessary to set the arrangement in accordance with the electrode arrangement of the device under test 70. The base 31 is formed of an insulating resin that hardens the bundled thin wires 33. The base 31 in the present embodiment will be clarified from now on through explanation of the manufacturing method and the like.

  Since the thin wires 33 are arranged at a high density, it is desirable that a thin coating 33s such as enamel coating is firmly applied. FIG. 7 is a partially enlarged view of the circuit board 30. In FIG. 7, the resin 31 is sandwiched between the fine wires 33, but the resin 31 may be hardly present between the fine wires 33. Further, the resin 31 between the thin wires 33 provided with the coating 33s may be an insulating adhesive instead of the resin of the resin plate. For electrical connection with the tester wiring 21, a connection board 60 on which connection receiving portions 61 are arranged can be arranged in the electrical inspection jig 10. By inserting the insertion portion 33b provided at the end of the conductive wire 33 of the circuit board 30 into the receiving portion 61, electrical connection can be realized easily, quickly and accurately. The insertion portion 33b and the receiving portion 61 are usually provided with a simple mechanism for connecting / disconnecting elastically biased, such as a small protrusion on the insertion portion 33b. It is desirable to provide a receiving recess or the like.

  8A to 8C are diagrams showing a method for manufacturing the circuit board 30 shown in FIG. First, as shown in FIG. 8A, the conducting wire 33 having the insulating coating layer 33s is bound. At this time, it is preferable to use the conductor 33 in which the insertion portion 33b is formed at the end of the conductor 33 on the back surface side in advance. Next, as shown in FIG. 8B, one end (surface terminal side) is hardened with an insulating resin 31. At this time, the insulating resin 31 may enter the gap between the conductive wires 33 having the insulating coating layer 33s and serve as an adhesive, or the conductive wire 33 may be bonded using an adhesive without entering the gap. In any case, the insulating resin 31 has a sufficient strength, and the connection strength between each conductive wire 33 and the insulating resin 31 is sufficiently high. The base 31 in the present embodiment has the above configuration. Thereafter, the end face on the surface side is polished to ensure flatness. Next, the insulating resin 31 and the conductive wire covering layer 33s are etched to form the surface terminal 33a. The conductors on the back surface side can be uncoupled to individually move the insertion portion 33b.

  By the above manufacturing method, it is possible to obtain the circuit board 30 in which the number of terminals per area is high on the front surface side, and the continuous conductors extend from the front surface side terminals on the back surface side. The terminal number density on the surface side is made larger than the electrode number density in the densest region of the electrode array such as the FPC 70. Then, in the densest region of the electrode array such as the FPC 70, the circuit board 30 is made dense so that there is no terminal 33a not corresponding to the electrodes. In other words, any one of the electrodes 71 of the FPC 70 is always connected to at least one terminal 33a of the circuit board 30. As a result, for example, the FPC 70 can be used without changing the circuit board 30 regardless of the model change.

  That is, the universal circuit board 30 can be obtained by setting the terminals 33a in an array satisfying the above conditions. As a result, a universal electrical inspection jig can be assembled. The universal electric inspection jig does not need to be reassembled from the beginning including the design each time the FPC is changed. Such a universal electrical inspection jig is very useful and not only replaces the pitch conversion board, but also can greatly reduce the cost of electrical inspection and the time required for electrical inspection by being universal.

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The electrical inspection jig and electrical inspection apparatus of the present invention uses a circuit board with a conductor instead of an expensive pitch conversion board, and not only the low cost of the circuit board itself, but also easy, quick and accurate connection with the tester wiring. Can be realized. Moreover, there is a possibility of obtaining a universal electrical inspection jig by using a thin wire for the conductor of the circuit board with the conductor.

It is a figure which shows the electrical inspection apparatus incorporating the circuit board in Embodiment 1 of this invention. It is a figure which shows the circuit board integrated in the electrical inspection jig | tool shown in FIG. It is the elements on larger scale of the circuit board of FIG. 2A and 2B are diagrams showing a state in which a through hole is formed in an insulating resin plate in the manufacture of the circuit board of FIG. 2, wherein FIG. 3A is a plan view and FIG. It is a figure which shows the state which inserted and fixed the conducting wire to the through-hole of the insulating resin board of the state of FIG. 4, and formed the surface terminal, (a) is a top view, (b) is sectional drawing. It is a figure which shows the circuit board in Embodiment 2 of this invention. It is a figure for demonstrating the mechanism which connects the conducting wire of the circuit board of FIG. 6 to the wiring of a tester using a connection board. FIG. 7 is a diagram for explaining a method of manufacturing the circuit board of FIG. 6, (a) shows a state in which thin wires coated with insulation are bound, (b) shows a state in which the end on the surface side is fixed with resin, and (c) shows It is a figure which shows the state in which the surface terminal was formed by grinding | polishing and etching the surface side edge, respectively.

Explanation of symbols

5 Contact sheet, 5a Conducting portion, 5b Insulating portion, 10 Electrical inspection jig, 11 Insulating base, 11h Through hole, 20 tester, 21 Tester wiring, 21b Receiving portion, 29 Connection portion, 30 Circuit board, 31 Base ( Insulation resin (plate)), 33 circuit board conductor, 33a surface terminal, 33b conductor insertion part, 33s insulation coating, 50 electrical inspection device, 51 inspection device base, 53 table, 54 pedestal, 60 connection board, 61 Part, 70 inspection object (FPC sheet), 71 electrode.

Claims (10)

A base made of an insulator;
A plurality of conducting wires fixed to the base and passing through the base;
The circuit board, wherein the plurality of conductive wires are exposed on one surface of the base to form a terminal and extend from the other surface.   The circuit board according to claim 1, wherein a leading end portion of the conducting wire extending from the other surface is a connection insertion portion. The circuit board according to claim 1, wherein the base portion is a resin plate through which the plurality of conducting wires are inserted. 3. The circuit board according to claim 1, wherein the base portion includes a resin portion that fixes one end of a plurality of coated conductor wires that are bound together, and a sheath portion of the sheathed conductor wire.   An electrical inspection jig for conducting electrical connection with an electrode of an electronic component and communicating with a tester, wherein the circuit board according to any one of claims 1 to 4 is used and exposed to one surface of the circuit board. An electrical inspection jig characterized in that a terminal and an electrode of the electronic component are electrically connected, and a conductive wire extending from the other surface of the circuit board is connected to the tester. An electrical inspection device that conducts with an electrode of an electronic component and inspects with a tester, using the circuit board according to any one of claims 1 to 4, and a terminal exposed on one surface of the circuit board; An electrical inspection apparatus characterized in that an electrical wire extending from the other surface of the circuit board is connected to the tester, and is electrically connected to the electrode of the electronic component. A connection board for connecting a conductor from the circuit board to a terminal of the tester is provided, and a connection receiving portion to which wiring from the terminal of the tester is connected is arranged on the connection board, and the other of the circuit board is arranged. The electrical inspection device according to claim 6, wherein a leading end portion of a conducting wire extending from the surface is inserted and connected to the connection receiving portion. A circuit board manufacturing method comprising:
A plurality of through holes are made in a substrate made of an insulator,
A plurality of conducting wires are inserted into the through holes, the terminals are formed by exposing the conducting wires from one surface of the substrate, and the plurality of conducting wires are fixed in a state of extending the conducting wires from the other surface. A method for manufacturing a circuit board, comprising: A circuit board manufacturing method comprising:
Bundling multiple insulated wires with both ends aligned,
One end of the bundled conductor is hardened with an insulating resin,
Polishing one end face hardened with the insulating resin,
A method of manufacturing a circuit board, comprising: etching the polished end face to expose the conductive wire on the end face to form a terminal. The method for manufacturing a circuit board according to claim 8 or 9, wherein a connection insertion portion is formed at an end of the conducting wire on the opposite side to the end serving as the terminal.

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