JP2003287562A - Semiconductor-testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor-testing apparatus that can be miniaturized. <P>SOLUTION: The semiconductor-testing apparatus comprises a performance board that is arranged opposite to a test head body, and a plurality of pin electronics circuit units where a contact pin is arranged opposite to the performance board while the plurality of pin electronics circuit units are mounted to the test head body. The semiconductor-testing apparatus has a contact probe block that is arranged at a position where the pin connector on a surface that opposes the performance board of the test head body is not arranged, is connected to the test head body or the pin electronics circuit units that are provided outside the test head body by cables, and is electrically connected to the performance board. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inexpensive semiconductor tester device which can be downsized.

[0002]

2. Description of the Related Art A semiconductor tester device provides a test signal to an IC to be inspected, such as an IC or an LSI, and judges pass / fail by the output from the IC to be inspected. Conventionally, such an IC tester is equipped with a performance board for exchanging signals between an inspection IC and a test head, and a clamp mechanism is adopted for attaching the performance board to the test head to ensure electrical continuity. It

FIG. 12 is an explanatory view of the configuration of a conventional example which is generally used in the past. 13 is a plan view of FIG. 12,
14 is a plan view of the test head body, FIG. 15 is a side sectional view of FIG. 14, and FIG. 16 is an overall explanatory view of FIG.

In the figure, the test head body 1 has a pin electronics circuit unit 2 for sending a test signal to each terminal of an IC to be inspected (not shown), and has elasticity to serve as a signal input / output terminal of the circuit. The contact pin 3 is arranged facing upward.

The performance board 4 has electrode pads formed on its lower surface, and is arranged from above the test head body 1 so that the electrode pads come into contact with the contact pins 3.

The board pressing portion 5 has a connecting hole (not shown), and is connected from above the performance board 4 to the connecting hole by a pull-in pin (not shown) of the test head body 1.

A pulling force is applied to the pull-in pin (not shown) from the test head body 1 to pull the performance board 4 to the test head body 1. As a result, the performance board 4 is pressed against the elastic contact pins 3, and the electrical continuity is secured by the repulsive force of the contact pins 3.

[0008]

However, in such a device, as shown in FIG. 14, a large number of pin electronics circuit units 2 are densely arranged on the upper surface of the test head body 1 and slightly left. On the lower surface of the surface 7, for example, as shown in FIG. 15, an exhaust duct B of the airflow A for cooling the pin electronics circuit unit 2 and the like are arranged.

Therefore, in order to increase the number of pin electronics circuit units 2, the performance board 4 and the like must be upsized, and downsizing is difficult. Also, depending on the number of pin electronics circuit units 2 used,
Even if it is a step-by-step method, it is necessary to prepare several kinds of performance boards 4, and the performance boards 4 of different sizes will increase.

Therefore, in preparation for manufacturing and repairing, it is necessary to always secure and store several types of performance boards 4, which complicates inventory management and incurs inventory costs. In this case, the pin electronics circuit unit 2 is composed of two printed boards.

An object of the present invention is to solve the above problems, and an object of the present invention is to provide an inexpensive semiconductor tester device which can be downsized.

[0012]

In order to achieve such an object, according to the present invention, in claim 1, a performance board arranged facing the test head body and a performance board facing the performance board are arranged. In a semiconductor tester device including a plurality of pin electronics circuit units mounted with contact pins and attached to the test head body, a portion of the test head body facing the performance board where the pin connector is not arranged. A contact probe block that is connected to the test head body or a pin electronics circuit unit provided outside the test head body by a cable and electrically contacts the performance board.

According to a second aspect of the present invention, in the semiconductor tester device according to the first aspect, floating support means for floatingly supporting the contact probe block on the test head body, and the contact probe block on the test head body. It is characterized by comprising general positioning means for roughly positioning and positioning means for positioning the contact probe block on the performance board.

According to a third aspect of the present invention, in the semiconductor tester device according to the second aspect, as the floating support means, a floating support guide pin attached to the test head body and the floating provided on the contact probe block are provided. A support guide pin is inserted and the floating support guide pin and a floating support guide hole having a gap are provided.

According to a fourth aspect of the present invention, in the semiconductor tester device according to the second or third aspect, the taper groove provided in the contact probe block and the test head body are provided as the rough positioning means. A ball plunger hole, a ball provided in the ball plunger hole, and a plunger spring provided in the ball plunger hole for roughly positioning the contact probe block by pressing the ball into the tapered groove. It is characterized by

According to a fifth aspect of the present invention, in the semiconductor tester device according to the third aspect, the positioning pin attached to the contact probe block and the positioning pin substantially provided on the performance board serve as the positioning means. And a positioning hole into which is inserted.

[0017]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to the drawings. FIG. 1 is an explanatory view of the main configuration of an embodiment of the present invention,
2 is a plan view of FIG. 1, FIG. 3 is a plan view of a test head main body, FIG. 4 is a side sectional view of FIG. 3, FIG. 5 is an explanatory view of a main part of a contact probe block, and FIG. 6 is a side view of FIG. 7, FIG. 7 is a cross-sectional view taken along the line AA of FIG. 5, FIG. 8 is a detailed explanatory view of the essential parts of FIG. 7, FIG. 9 is a detailed explanatory view of the essential parts of FIG. 7, and FIG. 11 is an explanatory diagram of the operation of FIG.

In the figure, the same symbols as those in FIG. 12 represent the same functions. Only parts different from FIG. 12 will be described below.

In the figure, 21 is a test head body 1.
Is an expansion case in which the expanded pin electronics circuit unit 2 is mounted.

Reference numeral 31 is arranged on the surface 7 of the test head body 1 facing the performance board 4 on which the pin connector is not arranged, and the test head body 1 or a pin provided outside the test head body 1. The contact probe block is connected to the electronics circuit unit 2 and the cable 32 and contacts the performance board 4.

In this case, the cable 32 is connected to the pin electronics circuit unit 2 provided outside the test head body 1. Reference numeral 41 designates the contact probe block 31 as shown in FIG.
It is a floating support means for floating support.

In this case, the floating support means 41
, The floating support guide pin 411 attached to the test head body 1 and the floating support guide pin 4 provided on the contact probe block 31.
11 is inserted into the floating support guide pin 411.
And a floating support guide hole 412 having a gap.

As shown in FIG. 9, 42 is a rough positioning means for roughly positioning the contact probe block 31 on the test head body 1.

In this case, as the rough positioning means 42, a taper groove 421 provided in the contact probe block 31, a ball plunger hole 422 provided in the test head body 1, and a ball 423 provided in the ball plunger hole 422. And a plunger spring 424 that is provided in the ball plunger hole 422 and presses the ball 423 to the tapered groove 421 to roughly position the contact probe block 31.

Reference numeral 43 denotes a positioning means for positioning the contact probe block 31 on the performance board 4, as shown in FIG. In this case, as the positioning means 43, the positioning pin 431 attached to the contact probe block 31 and the performance board 4 are used.
And a positioning hole 432 into which the positioning pin 431 is inserted.

In this case, as shown in FIG. 10, the positioning pin 431 is inserted into the positioning hole 432 provided in the positioning plate C, and the second positioning pin D provided in the positioning plate C is replaced with the performance board 4. It is inserted into the second positioning hole E provided in the.

This is the contact probe block 31.
The second positioning pin D and the second positioning hole F having a large diameter can be arranged apart from the periphery of the contact probe block 31 so that a large number of wiring patterns can be provided around the periphery of the contact probe block 31. , Positioning hole 432
Are substantially provided on the performance board 4.

That is, it goes without saying that the positioning plate C, the second positioning pin D and the second positioning hole E may be omitted and the positioning hole 432 may be directly provided in the performance board 4.

In the above structure, the contact probe block 31 is connected to the predetermined pin electronics circuit unit 2 provided outside the test head body 1 by the cable 32.

The contact probe block 31 is provided on the floating support guide pin 411 attached to the test head body 1 and the contact probe block 31, the floating support guide pin 411 is inserted, and there is a gap with the floating support guide pin 411. It is floatingly supported by the floating support guide hole 412.

Next, the contact probe block 31
Is a taper groove 421 provided in the contact probe block 31, a ball plunger hole 422 provided in the test head body 1, a ball 423 provided in the ball plunger hole 422, and a ball plunger hole 422. The rough positioning is performed by the plunger spring 424 that presses the taper groove 421 against the taper groove 421 and roughly positions the contact probe block 31.

Further, the contact probe block 31
Are positioned by the positioning pin 431 attached to the contact probe block 31 and the positioning hole 432 which is substantially provided in the performance board 4 and into which the positioning pin 431 is inserted.

Then, the contact probe block 31
The pins of the contact the precise position of the performance board 4.

As a result, (1) the pin electronics circuit unit 2 can be easily expanded by using the contact probe block 31.
It is not necessary to upsize the performance board 4 and the like, and a semiconductor tester device that can be easily downsized can be obtained.

(2) Corresponding to the number of pin electronic circuit units 2 used, the number of types of performance boards 4 and the like to be prepared and placed is small, inventory management is easy, inventory costs can be reduced, and semiconductors are inexpensive. A tester device is obtained.

(3) Contact probe block 31
A floating support means 41 for floatingly supporting the test head body 1, a rough positioning means 42 for roughly positioning the contact probe block on the test head body 1, and a positioning means 4 for positioning the contact probe block 31 on the performance board 4.
3 and 3 were provided.

Therefore, the contact probe block 31
Can be easily positioned, and it is not necessary to increase the positional accuracy of the components, and the contact probe block 31 can be easily positioned, and an inexpensive semiconductor tester device can be obtained.

(4) As the floating support means 41, the floating support guide pin 411 attached to the test head body 1 and the floating support guide pin 411 provided in the contact probe block 31 are inserted to form a gap with the floating support guide pin 411. Since the floating support guide hole 412 which it has is provided, an inexpensive floating support means 41 is obtained,
An inexpensive semiconductor tester device can be obtained.

(5) As a rough positioning means 42, a taper groove 42 provided in the contact probe block 31.
1, the ball plunger hole 422 provided in the test head body 1, the ball 423 provided in the ball plunger hole 422, and the ball 423 provided in the 422 ball plunger hole, and the ball 423 is pressed against the taper groove 421. Since the plunger spring 424 for performing the rough positioning is provided, the rough rough positioning means can be obtained, and the cheap semiconductor tester device can be obtained.

(6) As the positioning means 43, the positioning pin 4 attached to the contact probe block 31
31 and the positioning hole 432 which is substantially provided on the performance board 4 and into which the positioning pin 431 is inserted, the inexpensive positioning means 43 is obtained, and the inexpensive semiconductor tester device is obtained.

The above description merely shows specific preferred embodiments for the purpose of explaining and exemplifying the present invention. Therefore, the present invention is not limited to the above-mentioned embodiment, and many modifications are made without departing from the essence thereof.
It also includes deformation.

[0042]

As described above, according to the first aspect of the present invention.
According to the above, there are the following effects. A semiconductor tester device comprising: a performance board arranged to face a test head body; and a plurality of pin electronics circuit units mounted to the test head body, the pin connectors being arranged to face the performance board. The test board is arranged at a position where the pin connector is not arranged on the surface of the test head body facing the performance board, and is cable-connected to the test head body or a pin electronics circuit unit provided outside the test head body. A semiconductor tester device having a contact probe block for making contact was constructed.

Therefore, (1) by using the contact probe block, the pin electronics circuit unit can be easily added, the performance board or the like need not be upsized, and the semiconductor tester device can be easily downsized.

(2) Corresponding to the number of pin electronics circuit units used, the number of types of performance boards and the like prepared and placed is small, inventory management is easy, inventory costs can be reduced, and inexpensive semiconductors are available. A tester device is obtained.

According to claim 2 of the present invention, there are the following effects. Floating support means for floatingly supporting the contact probe block on the test head body, general positioning means for roughly positioning the contact probe block on the test head body, and positioning means for positioning the contact probe block on the performance board were provided.

Therefore, the contact probe block can be easily positioned, the positional accuracy of the components need not be increased, the contact probe block can be easily positioned, and an inexpensive semiconductor tester device can be obtained.

According to claim 3 of the present invention, there are the following effects. As the floating support means, a floating support guide pin attached to the test head main body and a floating support guide hole provided in the contact probe block into which the floating support guide pin is inserted and having a gap with the floating support guide pin are provided, which are inexpensive. Floating support means can be obtained, and an inexpensive semiconductor tester device can be obtained.

According to claim 4 of the present invention, the following effects can be obtained. As a general positioning means, a taper groove provided in the contact probe block, a ball plunger hole provided in the test head body, a ball provided in the ball plunger hole, and a ball provided in the ball plunger hole are pressed against the taper groove. Since the plunger spring for roughly positioning the contact probe block is provided, an inexpensive general positioning means can be obtained and an inexpensive semiconductor tester device can be obtained.

According to claim 5 of the present invention, the following effects can be obtained. As the positioning means, the positioning pin attached to the contact probe block and the positioning hole which is substantially provided on the performance board and into which the positioning pin is inserted are provided. Therefore, an inexpensive positioning means can be obtained and an inexpensive semiconductor tester device can be obtained. Is obtained.

Therefore, according to the present invention, downsizing can be achieved,
It is possible to realize an inexpensive semiconductor tester device.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a main part configuration of an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a plan view of a test head body.

FIG. 4 is a side sectional view of FIG.

FIG. 5 is an explanatory diagram of a main configuration of a contact probe block.

FIG. 6 is a side view of FIG.

7 is a cross-sectional view taken along the line AA of FIG.

8 is a detailed explanatory diagram of a main part of FIG. 7. FIG.

9 is a detailed explanatory diagram of a main part of FIG. 7. FIG.

10 is a detailed explanatory diagram of a main part of FIG. 7. FIG.

FIG. 11 is an explanatory diagram of the operation of FIG. 1;

FIG. 12 is an explanatory diagram of a main part configuration of a conventional example that is generally used in the past.

FIG. 13 is a plan view of FIG.

FIG. 14 is a plan view of a test head body.

FIG. 15 is a side sectional view of FIG.

16 is an overall explanatory diagram of FIG.

[Explanation of symbols]

1 Test head body 2-pin electronics circuit unit 3 contact pins 4 Performance board 5 Board holding part 7 sides 21 expansion case 31 Contact probe block 32 cables 41 Floating support means 411 Floating support guide pin 412 Floating support guide hole 42 General positioning means 421 taper groove 422 ball plunger hole 423 ball 424 Plunger spring 43 Positioning means 431 Positioning pin 432 Positioning hole A air flow B exhaust duct C Positioning plate D Second positioning pin E Second positioning hole

Claims (5)

[Claims] 1. A semiconductor comprising a performance board arranged facing a test head body, and a plurality of pin electronics circuit units mounted on the test head body, wherein contact pins are arranged facing the performance board. In the tester device, a cable connection is made to the test head main body or a pin electronics circuit unit provided outside the test head main body, which is arranged at a portion of the surface of the test head main body facing the performance board where the pin connector is not arranged. A semiconductor tester device comprising a contact probe block electrically contacting the performance board. 2. Floating support means for floatingly supporting the contact probe block on the test head body, general positioning means for roughly positioning the contact probe block on the test head body, and the contact probe block on the performance board. 2. The semiconductor tester device according to claim 1, further comprising a positioning means for positioning. 3. As the floating support means, a floating support guide pin attached to the test head body, and a floating support guide provided on the contact probe block into which the floating support guide pin is inserted and having a gap with the floating support guide pin. The semiconductor tester device according to claim 2, further comprising a hole. 4. A taper groove provided in the contact probe block, a ball plunger hole provided in the test head body, a ball provided in the ball plunger hole, and the ball plunger as the rough positioning means. 4. A semiconductor tester device according to claim 2 or 3, further comprising a plunger spring which is provided in a hole and presses the ball into the tapered groove to roughly position the contact probe block. 5. The positioning means includes a positioning pin attached to the contact probe block, and a positioning hole substantially provided on the performance board and into which the positioning pin is inserted. The semiconductor tester device according to claim 2.