JP2009198258A - Vertical-probe-mounted probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To test all ICs on one wafer or most of the ICs by one touchdown of a probe card to the wafer. <P>SOLUTION: The probe card includes first openings smaller than second openings. The probe card includes a first probe plate in which a plurality of first tapered holes are formed. The first openings and the second openings are formed in opposite surfaces of the first probe plate. The probe card includes first openings smaller than second openings. The probe card includes a second probe plate in which a plurality of second tapered holes are formed. The first openings and the second openings are formed in opposite surfaces of the second probe plate. The surfaces having the second openings are arranged adjacently to one another. Pairs of tapered holes in the first and second probe plates are approximately matched with each other. The probe card further includes a plurality of probes, and each probe is arranged at a pair of tapered holes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to integrated circuit technology. In particular, the present invention relates to an integrated circuit technology test method and apparatus.

  Integrated circuits (ICs) are typically tested before being used in applications such as circuit boards. IC testing is often performed on a wafer prior to packaging, after being packaged, and often even after being soldered onto a circuit board. Final products containing ICs are also often tested prior to shipping to consumers, and testing these final products includes testing the ICs that the final product contains.

  Testing of an IC at the wafer level is usually performed by bringing a probe card into contact with the IC pad and sending and receiving electrical signals to and from the IC. More specifically, the probe of the probe card is configured to contact an IC bond pad for transmitting and receiving electrical signals. The electrical signal received from the IC is generated by the IC in response to the electrical signal transmitted to the IC by the probe card. The electrical signal transmitted to the probe card is often generated by a signal generator such as an automatic tester (ATE) device. The ATE receives a signal from the IC via the probe card and compares the received electrical signal with a known pass and / or fail test pattern to determine whether to package the IC. Sometimes configured.

  The relatively early probe cards were configured to contact and test one IC (or die) on the wafer. These early probe cards often included tungsten probes that were positioned approximately horizontally at the tip of the probe and bent to contact the IC bond pads. Subsequent refinements of these probe cards included a series of probes arranged approximately diagonally to test two or more ICs with a single touchdown of the probe card to the wafer. One disadvantage of these two types of early probe cards is that the number of ICs that can be tested with a single touchdown is limited. This shortcoming has become serious as IC manufacturers have become eager to test all or almost all ICs on a single wafer with a single touchdown of the probe card to the wafer.

  Therefore, there is a need for a new probe card method and new probe equipment for testing wafers that can test all or almost all ICs on a single wafer with a single touchdown of the probe card to the wafer. It is said that.

  The present invention has been made paying attention to the above-mentioned technical background, and the object of the present invention is to make all ICs or almost all on one wafer with one touchdown of the probe card to the wafer. It is an object of the present invention to provide a new probe card system and a new probe apparatus for testing a wafer capable of testing an IC.

  The present invention provides a new test scheme and test apparatus for integrated circuit technology. More specifically, the present invention provides a probe card configured to be able to send and receive test signals to and from an integrated circuit.

  According to one embodiment of the present invention, the probe card has a first probe plate having a first plurality of tapered holes. Each of the tapered holes has a first opening that is smaller than the second opening. The first opening and the second opening are on opposite surfaces of the first probe plate. The probe card further includes a second probe plate in which a second plurality of tapered holes are formed. Each of the tapered holes has a first opening that is smaller than the second opening. The first opening and the second opening are on opposite surfaces of the second probe plate. The surfaces having the second openings are arranged adjacent to each other. The tapered hole pairs of the first and second probe plates are substantially aligned. The probe card further includes a plurality of probes, each of the probes being disposed in one of the pair of tapered holes.

  According to one embodiment of the present invention, the surface of the second probe plate including the first opening is the first surface of the probe card, and the second end of each of the probes is The probe card is configured to extend from the first surface.

  In accordance with another embodiment of the present invention, a space transducer including a plurality of pads disposed on a first surface thereof is included, each of the pads being a first end of each of the probes. It is comprised so that it may contact. Each probe includes a lateral support configured to allow the force applied to the probe by the space transducer to be different from the force applied to the probe by an integrated circuit bond pad. . In a particular embodiment, a portion of each probe between the space transducer and the lateral support is constrained with a compressive force higher than the compressive force applied to the probe by a bond pad. The space converter includes a second plurality of pads disposed on a second surface disposed opposite to the first surface.

  According to one embodiment of the present invention, the probe card includes a printed wiring board (PCB) coupled to the space converter, the printed wiring board being a second plurality of pads of the space converter. Includes a plurality of pads configured to be coupled to each other. The density of the plurality of pads of the printed wiring board is smaller than the density of the first plurality of pads of the space converter.

  According to another embodiment of the present invention, each probe is configured to be coupled to a surface of the first probe plate that includes a first opening of the first probe plate. including. Each lateral support of the probe is configured to prevent the probe from coming off the first and second probe plates. The lateral support portion is linear, curved, and / or springy. Each of the probes has a spring-like top, and the top is configured to bend when the probe is pressed against a space transducer. The top has a linear shape, a coil shape, or a winding structure. Each probe includes a springy bottom that is configured to bend when the probe presses an integrated circuit bond pad. The bottom may be linear, coiled, or twisted. The first and second plurality of tapered holes in the top and bottom probe plates are formed by laser erosion.

FIG. 1A is a simplified side view of a probe card according to one embodiment of the present invention. FIG. 1B is a simplified bottom view of a probe card according to one embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view of a part of the probe card shown in FIGS. 1A and 1B. FIG. 3A is a simplified side view of various probes according to various embodiments of the present invention. FIG. 4 is a simplified cross-sectional view of a portion of a probe card according to another embodiment of the present invention. FIG. 5 is a simplified cross-sectional view of a portion of a probe card according to another embodiment of the present invention. FIG. 6 is a simplified cross-sectional view of a probe card according to another embodiment of the present invention.

  A better understanding of the nature and advantages of the present invention may be gained with reference to the following detailed description and the accompanying drawings.

  1A and 1B show simplified side and bottom views of a probe card 100 according to one embodiment of the present invention. The probe card includes a top probe plate 105, a bottom probe plate 110, and a plurality of probes 115. The probe has a basic reference number 115 and an alphabetic suffix. The probe card may include a space converter 120 and a printed circuit board (PCB) 125. For convenience, the probe card 100 is not shown in FIGS. 1A and 1B due to scale.

  The plurality of probes 115 are configured to contact a plurality of one or more ICs on one wafer. In certain embodiments of the present invention, multiple probes touch all of the ICs on the wafer so that all of the ICs on the wafer can be tested with a single touch down of the probe card to the wafer. Is configured to do. More specifically, the plurality of probes may be configured to contact an IC bond pad on a single wafer. Each probe may be configured to contact one bond pad of the IC. Each probe may also be configured to contact one or more bond pads of the IC. It should be understood that the probe patterns shown in FIGS. 1A and 1B are exemplary only and that the probes can be placed on almost any turn that fits the bond pad of each IC.

  FIG. 2 is an enlarged cross-sectional view of a part 200 (see FIG. 1A) of the probe card 100. For convenience, one probe 115a is shown in the portion 200 of the probe card of FIG. It should be understood that each of the probes may be similarly disposed within the probe card. According to one embodiment of the present invention, the probe 115a is disposed in a first hole 105a formed in the top probe plate and a second hole 110a formed in the bottom probe plate. The holes in the top and bottom probe plates are aligned in a substantially vertical direction so that the probe is oriented substantially vertically.

  According to one embodiment of the present invention, each of the top and bottom probe plate holes (eg, holes 105a and 110a) is drilled by laser ablation (or laser drilling). In a typical laser drilling process, at the surface where the laser is incident on the material to be drilled, the inlet portion of the hole (eg, the inlet portion 105a ′) is more than the outlet portion of the hole (eg, the outlet portion 105a ″). This hole will be approximately circular or oval, for example, if the hole is oval, the inlet or outlet will be at the longest and shortest opening of the inlet or outlet. Along the top and bottom probe plates, such that the entrance surfaces of these probe plates (eg, the surfaces associated with the entrance into the laser material) are adjacent to each other. The exit surfaces (eg, the surfaces associated with the exit from within the laser material) will face each other, so that the smaller exit portion of the hole will be the larger of the holes. From the entrance The leaving even more. By relatively long intervals of outlet holes, thereby improving the lateral stability of the probe.

  According to one embodiment of the present invention, the space transducer is configured to reduce the density and / or pitch of the electrical contacts of the probe card. More specifically, the plurality of probes may include a second density (or PCB contact density) of the plurality of PCB contact pads 205 disposed on a bottom surface of the printed circuit board (PCB) and / or a second pitch (for example, , PCB contact pitch) and / or a first pitch (eg, probe pitch). Contact pad 205 is an annular ring in one embodiment of the invention. One contact pad 205a is shown in FIG. More particularly, referring to FIG. 2, the space transducer includes a bottom contact pad 210 for each probe (eg, probe 115a). In the example under consideration, the first tip 115 a ′ of the probe 115 a is configured to contact the bottom contact pad 210. The second tip 115a "of the probe is configured to extend from the bottom of the probe card and to contact the bond pad of the wafer. The bottom contact pad 210 of the space converter is on the bottom surface of the space converter. Coupled to a disposed trace 215. Trace 215 may be coupled to a via 220 that extends from the bottom surface of the space transducer to the top surface of the space transducer, which is located on the top surface of the space transducer. 2 may be coupled to a top contact pad 225. Trace 215 is shown in FIG. 2 as being located on the bottom surface of the space transducer, but the trace is the top surface of the space transducer. Or it may be located in the inner layer of the space transducer, where the various traces of the space transducer are the bottom, top, and Or, in one embodiment, at least one contact pad of the space converter is coupled to a via of the space converter, after which the via has no intervening traces, Coupled to the top contact pads of the space converter (eg, see FIG. 1 for top and bottom contact pads associated with probe 115d and see FIG. 2 for vias that couple these contact pads).

  According to one embodiment of the present invention, the top probe plate and the bottom probe plate are joined by one or more fasteners 230, such as screws, clamps, and the like (see FIG. 1A). ). The PCB and the space converter are also joined by one or more fasteners such as screws, clamps, and the like. The combined PCB and space converter are connected to the top and bottom plates with one or more fasteners 235, such as screws, clamps, and the like. The combined PCB and space transducer may be separable from the top and bottom plates to facilitate replacement of one or more probes. For example, the probe may be replaceable when the probe is damaged or the length of the probe is changed.

  FIG. 3 is a simplified side view of various probes according to various embodiments of the present invention. In various embodiments, the probe has a variety of shapes. For example, the probe 300 includes a top spring portion 305, a lateral support portion 310, and a bottom spring portion 315. The top and bottom spring portions may be coiled, serpentine, or similar shapes so that these portions can be compressed in the vertical direction. For example, the top spring portion may be compressed when the space transducer is combined with the top and bottom probe plates. The bottom spring portion may be configured to compress when the probe contacts the IC bond pad. The lateral support 310 may be configured to contact the exit surface of the top probe plate to prevent the probe from falling off the probe card.

  In addition, the probe 330 includes a top 335 and a bottom 336 that are straight. The probe 330 may include a lateral support (described above). The top and bottom of the probe 330 may be configured to bend in a lateral direction when a compressive force (for example, a force almost along the longitudinal axis of the probe) is applied linearly. Lateral bending at the top or bottom of the probe provides a spring action to the probe. For example, when the space transducer is coupled with the top and bottom probe plates, and when the bottom contact pad 210 presses the probe tip 115a ′ (eg, the top of the probe 330), the top of the probe is subjected to a compressive force. It may be configured to bend in the lateral direction when The bottom of the probe may be configured to bend laterally when the probe is pressed into contact with an IC bond pad. According to one embodiment, the bottom contact pad of the space transducer is connected to the probe tip with sufficient force so that the tip of the probe does not stick away from the bottom pad of the space transducer and hardly damage the bottom contact pad. Press. That is, each tip contacts the corresponding lower contact pad of the space transducer within an area of approximately the same size as the tip, so the tip does not move from that area at all, so the bottom contact pad of the space transducer is scratched. Not stick. For example, when the probe is pressed into contact with the bond pad of the wafer, the tip of the probe that is in contact with the bottom contact pad of the space transducer will hardly scratch the bottom contact pad. The tip of each pin between the space transducer and the lateral support is constrained by a higher compression force than the compression force applied by the space transducer and applied to the bottom of the probe. The compressive force applied to the bottom of the probe is applied by pressing the probe against the bond pad of the wafer.

  Probe 350 includes a lateral support 355 that is bent and configured to be compressed when the space transducer is coupled to the top and bottom probe plates. Probe 360 includes a lateral support 365 that includes two bends that are configured to be compressed when the space transducer is coupled to the top and bottom probe plates. Probe 370 has a stepped shape provided by lateral support 375. The probes shown in FIG. 3 are merely representative examples, and those skilled in the art will be able to come up with other useful probes, and these probes are considered to be within the scope of the present invention. Each of the probes 350, 360, and 370 has a linear top and bottom, such as the top and bottom of the probe 330 described above. Instead, the probes 350, 360, and 370 have tops and / or bottoms that have a coiled, serpentine, and similar shape, such as the top and bottom of the probe 300 described above. But you can.

  Probe 380 includes a bottom 382 that is coiled, serpentine, and the like, and includes a top having a first lateral bend and / or a second lateral bend. Probe 380 may include a lateral support 388.

  Probe 390 includes an arched bottom 392 with one arch and an arched top 394 with one or more arches. Probe 390 may include a lateral support 388.

  Probe 395 includes a bottom 397 that is a spring, such as a microspring, and a top 398, which is a spring, such as a microspring. The microspring may be of the type manufactured by Microfabrica Inc., located in Van Nuys, California. A tip 399 that is substantially perpendicular (eg, perpendicular to the plane of the drawing) may be coupled to the tip of each spring. Probe 390 may include a lateral support 388.

  FIG. 4 is a simplified cross-sectional view of a portion 400 of a probe card according to another embodiment of the present invention. The probe card to which a portion 400 of the probe card belongs is different from the probe card embodiment described above in which the probe card includes a set of spacers 410 between the top probe plate and the bottom probe plate. One set referred to herein includes one or more members. The spacer is configured to provide a space between the top and bottom probe plates. The space provided by the spacer may be configured to allow various lengths of probes to be used with the probe card. The space provided by the spacer may allow the probe to bend relatively laterally.

  FIG. 5 is a simplified cross-sectional view of a portion 500 of a probe card according to another embodiment of the present invention. The probe card to which a portion 500 of the probe card belongs is different from the above-described probe card embodiment in which the probe card includes a set of spacers 510 between the top probe plate and the bottom probe plate. A plurality of holes are formed in the spacer, each hole being in a position where one of the probes is present. Similar to the set of spacers 510 described above, the spacers 510 may be configured to allow various lengths of probes to be used with the probe card, and the space provided by the spacers allows the probes to be It may be allowed to bend relatively horizontally.

  FIG. 6 is a simplified cross-sectional view of a probe card according to another embodiment of the present invention. The same numbering scheme used in FIG. 1A is used in FIG. 6 to show the generally similar portions of probe cards 100 and 600. The probe card 600 differs from the probe card described above in that it includes a spacer plate 605. The spacer plate 605 is located between the space transducer 120 and the top probe plate 105. A plurality of holes 610 are formed in the space transducer. The holes can be formed by laser drilling or other methods. The hole 610 is formed so that the top of the probe fits in the hole. Probe card 600 may include spacers 410 or 510.

  In one embodiment of the assembly method for assembling the probe card described above, the top probe plate and the bottom probe plate may be combined first. The top probe plate and the bottom probe plate may be moved laterally relative to each other during or after coupling. The top probe plate and / or the bottom probe plate may be coupled to one or more stages (eg, a micrometer stage) configured to move the plates in one or more lateral directions. Good. The plate may be moved laterally by one or more stages to adjust the position of the holes in the top probe plate to fit the holes in the bottom probe plate. Through the relative movement of these holes, the longitudinal angle of the probe may be adjusted so that the probe tip is aligned with the set of bond pads on the wafer. The position may be adjusted. Although the foregoing embodiments have been described as including the use of stages to move the top and bottom probe plates relative to each other, these plates can be moved by other methods well known to those skilled in the art. And / or may be matched, and such methods are considered to be within the scope of the present invention. After joining the top probe plate and the bottom probe plate, the probe may be inserted into holes drilled in these plates. The space transducer may then be coupled to the assembled top and bottom probe plates. The PCB may then be coupled to the space converter. Alternatively, the combined PCB and space transducer may be combined as a unit with the top and bottom probe plates. Spacers and / or spacer plates may be coupled to associated components at various assembly stages, as will be appreciated by those skilled in the art.

  According to one embodiment, the space converter is a ceramic or flexible circuit board and may be made of low temperature co-fired ceramics (LTCC). The PCB may be formed from a variety of well-known materials such as glass fiber, polyimide, polyester, or the like. The probe may be made of tungsten, nickel, beryllium copper, combinations thereof, or other known probe materials.

  The above-described exemplary embodiments are only for the purpose of explanation, and various modifications and changes in similar viewpoints should be presented by those skilled in the art. It should be understood that it is included within the scope and scope of the appended claims. Therefore, the above description should not be taken as limiting the scope of the invention, as defined by the claims.

DESCRIPTION OF SYMBOLS 100 Probe card 105 Top probe board 110 Bottom probe board 115 Probe 120 Space converter 125 Printed circuit board (PCB)
205 Bond pad 210 Bottom contact pad 215 Trace 220 Via 225 Top contact pad 230 Fastener 235 Fastener 300 Probe 305 Top spring part 310 Lateral support part 315 Bottom spring part 330 Probe 335 Top part 340 Bottom part 350 Probe 355 Lateral support part 360 Probe 365 Lateral support portion 370 Probe 375 Lateral support portion 379 Probe 380 Probe 382 Bottom portion 384 Lateral bend portion 386 Lateral bend portion 388 Lateral support portion 390 Probe 392 Bottom portion 394 Top portion 395 Probe 397 Bottom portion 399 Top portion 399 Spacer 410 Card part 510 Spacer 600 Probe card 605 Spacer plate 610 Hole

Claims (21)

A first probe plate having a first plurality of tapered holes;

i) each of the tapered holes has a first opening smaller than the second opening;
ii) the first opening and the second opening are provided on opposite surfaces of the first probe plate;

A second probe plate coupled to the first probe plate and formed with a second plurality of tapered holes;

i) each of the tapered holes has a first opening smaller than the second opening;
ii) The first opening and the second opening are provided on opposite surfaces of the second probe plate,
iii) the surfaces having the second openings are arranged adjacent to each other;
iV) The pair of tapered holes in the first and second probe plates are substantially aligned,

as well as,

A plurality of probes, each disposed in one of the pair of tapered holes;

Including probe card.   It further includes a space transducer having a plurality of pads disposed on its first surface, whereby each of the pads is configured to contact a first end of each of the probes. The probe card according to claim 1.   Each probe includes a lateral support configured to allow the force applied to the probe by the space transducer to be different from the force applied to the probe by an integrated circuit bond pad. The probe card according to claim 2.   The probe card according to claim 3, wherein a part of each probe between the space converter and the lateral support is constrained by a compressive force higher than a compressive force applied to the probe by a bond pad. .   The probe card of claim 3, wherein the higher compressive force prevents the plurality of pads from being damaged.   The surface of the second probe plate including the first opening is the first surface of the probe card, and the second end of each of the probes extends from the first surface of the probe card. The probe card according to claim 2, wherein the probe card is configured to extend.   3. The probe card according to claim 2, wherein the space converter includes a second plurality of pads disposed on a second surface disposed on a side opposite to the first surface of the space converter.   The printed circuit board further includes a printed circuit board (PCB) coupled to the space converter, the printed circuit board having a plurality of pads, and the pads are respectively connected to the second plurality of pads of the space converter. The probe card of claim 7, wherein the probe card is configured to mate.   The probe card according to claim 7, wherein a density of the plurality of pads of the printed wiring board is smaller than a density of the first plurality of pads of the space converter.   The probe card of claim 1, wherein each probe includes a lateral support configured to be coupled to a surface of the first probe plate that includes the first opening of the first probe plate.   The probe card according to claim 10, wherein the lateral support of each of the probes is configured to prevent the probe from detaching from the first and second probe plates.   The probe card according to claim 11, wherein the lateral support portion has a linear shape, a curved shape, and / or a spring property.   The probe card according to claim 1, wherein each of the probes includes a top portion having a spring property, and the top portion is configured to bend when the probe is pressed by the space converter.   The probe card according to claim 11, wherein the top portion is a linear shape, a coil shape, a meandering shape, and / or a microspring.   The probe card according to claim 13, wherein each probe includes a bottom portion having a spring property, and the bottom portion is configured to bend when the probe presses a bond pad of an integrated circuit.   The probe card according to claim 15, wherein the bottom portion is a linear shape, a coil shape, a meandering shape, and / or a microspring.   The probe card of claim 1, wherein the first and second plurality of tapered holes are formed by laser ablation.   The probe card according to claim 1, wherein the probe inserted into the pair of tapered holes is configured to be removable and replaceable. A first probe plate having a first plurality of tapered holes;

i) each of the tapered holes has a first opening smaller than the second opening;
ii) The first opening and the second opening are provided on opposite surfaces of the second probe plate.

A second probe plate formed with a second plurality of tapered holes;

i) each of the tapered holes has a first opening smaller than the second opening;
ii) The first opening and the second opening are provided on opposite surfaces of the second probe plate.
iii) the surfaces having the second openings are arranged adjacent to each other;
iV) The pair of tapered holes in the first and second probe plates are substantially aligned,

A plurality of probes, each arranged in one of said pair of tapered holes;

First and second opposing surfaces coupled to the first probe plate and each including first and second plurality of pads, each of the first pads being a first of each of the probes. A space converter coupled to one end,

as well as

A first and second opposing surfaces coupled to the space transducer, the first surface comprising a plurality of pads each coupled to the second plurality of pads of the space transducer. Including printed wiring board (PCB),

Including probe card.   The second surface of the printed wiring board (PCB) is a top surface of the probe card, and the surface of the second probe plate including the first opening is a bottom surface of the probe card; The probe card according to claim 19, wherein the probe extends from the bottom surface.   The probe card according to claim 19, wherein the probe inserted into the pair of tapered holes is configured to be removable and replaceable.

Images