CN108169618B - Testing device and testing method - Google Patents
Testing device and testing method Download PDFInfo
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- CN108169618B CN108169618B CN201810015821.0A CN201810015821A CN108169618B CN 108169618 B CN108169618 B CN 108169618B CN 201810015821 A CN201810015821 A CN 201810015821A CN 108169618 B CN108169618 B CN 108169618B
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- module
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a testing device, which comprises a conductive pin, a lead, a base, a quick crimping device and a mounting plate, wherein the conductive pin is arranged on the base; a groove is formed in the base; the mounting plate is arranged at the bottom of the groove; the mounting plate is provided with a conductive pin, and the conductive pin faces the top of the groove; the position of the conductive pin is matched with the position of a bonding pad on the module to be tested; one end of the wire is electrically connected to the conductive pin, and the other end of the wire is connected to the test equipment. The invention also discloses a method for testing by using the testing device. Compared with the prior art, the invention prevents the module bonding pad from falling off and the module from being thermally damaged, saves the time for welding the lead, can detect the module to be tested only by aligning the bonding pad with the lead of the module to be tested because the lead and the lead are fixed during the test, and can not burn out due to pin inserting errors; meanwhile, the rapid crimping device is used for fixing the module to be tested, so that both hands of a user are liberated, and the module with more than two test points can be tested.
Description
Technical Field
The invention relates to the field of patch module testing, in particular to a testing device and a testing method.
Background
With the development and progress of modern technologies, the miniaturization and modularization of equipment are inevitable trends of future electronic equipment development, and to adapt to the development of the society, the integration level of devices, mounting plates and modules will be higher and higher, and devices, mounting plates and modules using patches will be more and more. (device of patch, mounting plate of patch, module of patch, hereinafter referred to as patch module)
However, the testing of the chip module becomes a difficult problem, for example, when the testing is carried out, a lead is required to be welded on a pin bonding pad of the chip module and is directly connected with a testing instrument for testing, so that the bonding pad is easy to fall off, the chip module is easy to cause thermal damage, and the welding time is increased; a test hole is reserved around the chip bonding pad, a pin with the right size is inserted into the hole, the pin is connected with a wire, the other end of the pin is connected with a test instrument, poor contact can be caused during testing, the requirement on the matching performance of the pin and the jack is high, and wrong connection is easy to occur; the lead is led out on the contact pin to connect the test instrument, the contact pin is contacted on the paster pad by hand, and when the hand is loosened after the test is finished, the contact can be always carried out by people, other things can not be done, the connection is easy to be wrong, and the test can not be carried out by more than two points. Therefore, a quick assembling and disassembling testing device which is convenient to clamp, good in contact and not prone to wrong connection is urgently needed for the pin-free chip module.
Disclosure of Invention
The invention aims to solve the technical problems that the conventional pin-free chip module is inconvenient to clamp during testing, poor in contact during testing, easy to connect wrongly, and the quality of a bonding pad is influenced by bonding pad welding.
The invention is realized by the following technical scheme:
a testing device comprises a conductive pin, a lead, a base, a rapid crimping device and a mounting plate; a groove is formed in the base; the mounting plate is arranged at the bottom of the groove; the mounting plate is provided with a conductive pin, and the conductive pin faces the top of the groove; the position of the conductive pin is matched with the position of a bonding pad on the module to be tested; one end of the wire is electrically connected to the conductive needle, and the other end of the wire is connected to the test equipment; the quick crimping device is arranged on the base, and the crimping point of the quick crimping device is arranged above the mounting plate.
In the prior art, during testing, a lead needs to be welded on a pin bonding pad of a patch module and directly connected with a testing instrument for testing, so that the bonding pad is easy to fall off, the patch module is easy to cause thermal damage, and the welding time is prolonged; a test hole is reserved around the chip bonding pad, a pin with the right size is inserted into the hole, the pin is connected with a wire, the other end of the pin is connected with a test instrument, poor contact can be caused during testing, the requirement on the matching performance of the pin and the jack is high, and wrong connection is easy to occur; the lead is led out on the contact pin to connect the test instrument, the contact pin is contacted on the paster pad by hand, and when the hand is loosened after the test is finished, the contact can be always carried out by people, other things can not be done, the connection is easy to be wrong, and the test can not be carried out by more than two points. When the test device is applied, when the test is needed, the mounting plate with the position of the conductive needle matched with the position of the bonding pad on the module to be tested is selected according to different modules to be tested; then mounting the mounting plate at the bottom of the groove; then connecting one end of the wire with a corresponding instrument or equipment, and electrically connecting the other end of the wire with the conductive needle; then selecting a proper rapid crimping device according to the size and the thickness of the module to be tested; and then, enabling the pad of the module to be tested to face the corresponding conductive pin of the pad, aligning the pad with the conductive pin, pressing the module to be tested by using a quick crimping device, and electrifying to finish the test.
Compared with the prior art, the invention does not need to weld wires, prevents the module pad from falling off and the module from being thermally damaged, saves the time for welding the wires, can detect the module pad to be tested only by aligning the conductive pins with the pad to be tested because the conductive pins and the wires are fixed, and can not burn out due to pin inserting errors; meanwhile, the rapid crimping device is used for fixing the module to be tested, so that both hands of a user are liberated, and the module with more than two test points can be tested.
Furthermore, a wire outlet hole is formed in the side wall of the groove and penetrates through the side wall of the groove; and one end of the lead, which is far away from the conductive pin, passes through the lead outlet hole and is connected with the test equipment.
Furthermore, the mounting plate is fixedly arranged at the bottom of the groove through screws.
Further, the conductive needle adopts a spring conductive needle; the spring conductive pin comprises a contact and a base; the contact is connected to the base through a spring, and the base is arranged on the mounting plate; the contacts face the top of the recess.
Furthermore, the mounting plate is a PCB; the PCB is provided with printed strip lines; the lead is electrically connected to the conductive pin through the printed strip line.
When the conductive pin is applied, the conductive pin is welded on the printing strip line of the mounting plate, the contact is good, and the contact between the bonding pad and the conductive pin can be tighter in detection through the spring conductive pin, so that the conductive pin is suitable for pin-free surface mount modules with more thicknesses; through the mode of the electrically conductive needle of spring and printing belted line for when examining same kind of no pin paster module many times, the pad all can be effectual with electrically conductive needle contact, and the welding mode of printing belted line is very stable, and repeated many times also can not desolder, through the mode that both combine, can be better carry out many times to same kind of no pin paster module and detect, produced unexpected technological effect.
A method of testing, comprising the steps of: s1: selecting a mounting plate with the position of the conductive pin matched with the position of the bonding pad on the module to be tested according to different modules to be tested; s2: mounting the mounting plate at the bottom of the groove; s3: connecting one end of the lead with a corresponding instrument or equipment, and electrically connecting the other end of the lead with the conductive needle; s4: selecting a proper rapid crimping device according to the size and the thickness of the module to be tested; s5: and enabling the pad of the module to be tested to face the conductive pin corresponding to the pad, aligning the pad with the conductive pin, pressing the module to be tested by using a quick crimping device, and electrifying to finish the test.
Further, the proper quick press connection device enables the welding pads of the module to be tested to contact the conductive pins.
When the test device is applied, when the test is needed, the mounting plate with the position of the conductive needle matched with the position of the bonding pad on the module to be tested is selected according to different modules to be tested; then mounting the mounting plate at the bottom of the groove; then connecting one end of the wire with a corresponding instrument or equipment, and electrically connecting the other end of the wire with the conductive needle; then selecting a proper rapid crimping device according to the size and the thickness of the module to be tested; and then, enabling the pad of the module to be tested to face the corresponding conductive pin of the pad, aligning the pad with the conductive pin, pressing the module to be tested by using a quick crimping device, and electrifying to finish the test.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. according to the testing device, the pin-free chip module is quickly detected in a mode of combining the quick compression joint device, the conductive pins and the mounting plate, compared with the prior art, the wire is not required to be welded, the module bonding pad is prevented from falling off and the module is prevented from being thermally damaged, the time for welding the conductive wires is saved, and during testing, the bonding pad of the module to be tested and the conductive pins can be detected only by aligning the conductive pins and the bonding pad of the module to be tested due to the fact that the conductive pins and the conductive wires are fixed, and burnout caused by pin inserting errors can be avoided; meanwhile, the rapid crimping device is used for fixing the module to be tested, so that the hands of a user are liberated, and the modules with more than two test points can be tested;
2. according to the testing method, the pin-free chip module is quickly detected in a mode of combining the quick compression joint device, the conductive pins and the mounting plate, compared with the prior art, the wire does not need to be welded, the module bonding pad is prevented from falling off and the module is prevented from being thermally damaged, the time for welding the conductive wires is saved, and during testing, the bonding pad of the module to be tested and the conductive pins can be detected only by aligning the conductive pins and the bonding pad of the module to be tested due to the fact that the conductive pins and the conductive wires are fixed, and burnout caused by pin inserting errors can be avoided; meanwhile, the rapid crimping device is used for fixing the module to be tested, so that both hands of a user are liberated, and the module with more than two test points can be tested.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a structure of a module to be tested according to the present invention.
Reference numbers and corresponding part names in the drawings:
the testing method comprises the following steps of 1-conducting pins, 2-conducting wires, 3-bases, 4-rapid crimping devices, 5-mounting plates, 6-screws, 7-printed strip lines, 8-conducting wire outlet holes, 9-bonding pads and 10-modules to be tested.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
As shown in fig. 1 and 2, the testing device of the present invention comprises a conductive pin 1, a conductive wire 2, a base 3, a quick crimping device 4 and a mounting plate 5; a groove is arranged on the base 3; the mounting plate 5 is arranged at the bottom of the groove; the mounting plate 5 is provided with a conductive pin 1, and the conductive pin 1 faces the top of the groove; the position of the conductive pin 1 is matched with the position of a bonding pad 9 on a module to be tested 10; one end of the lead 2 is electrically connected to the conductive needle 1, and the other end of the lead 2 is connected to the test equipment; the quick crimping device 4 is arranged on the base 3, and the crimping point of the quick crimping device 4 is arranged above the mounting plate 5.
In the implementation of the embodiment, when testing is required, the mounting plate 5 with the position of the conductive pin 1 matched with the position of the pad 9 on the module to be tested 10 is selected according to different modules to be tested 10; then the mounting plate 5 is mounted at the bottom of the groove; then connecting one end of the lead 2 with a corresponding instrument or equipment, and electrically connecting the other end of the lead to the conductive needle 1; then selecting a proper rapid crimping device 4 according to the size and the thickness of the module 10 to be tested; and then, the bonding pad 9 of the module to be tested 10 faces the conductive pin 1 corresponding to the bonding pad 9, after the bonding pad 9 is aligned with the conductive pin 1, the module to be tested 10 is pressed by the rapid crimping device 4, and the test is completed by electrifying. The invention realizes the rapid detection of the pin-free patch module by combining the rapid compression joint device 4, the conductive pin 1 and the mounting plate 5, compared with the prior art, the invention does not need to weld wires, prevents the module pad 9 from falling off and the module from being thermally damaged, saves the time for welding the wires, and can detect the pin-free patch module only by aligning the pad 9 of the module to be tested 10 and the conductive pin 1 because the conductive pin 1 and the conductive wire 2 are fixed during the test, thereby avoiding the burnout caused by pin inserting errors; meanwhile, the rapid crimping device 4 is used for fixing the module to be tested 10, so that the hands of a user are liberated, and the module with more than two test points can be tested.
Example 2
In this embodiment, on the basis of embodiment 1, the side wall of the groove is provided with a wire outlet hole 8, and the wire outlet hole 8 penetrates through the side wall of the groove; one end of the lead 2, which is far away from the conductive pin 1, passes through the lead outlet hole 8 and is connected to the test equipment. The mounting plate 5 is fixedly arranged at the bottom of the groove through a screw 6. The conductive needle 1 is a spring conductive needle; the spring conductive pin comprises a contact and a base; the contact is connected to the base through a spring, and the base is arranged on the mounting plate 5; the contacts face the top of the recess. The mounting plate 5 is a PCB; the PCB is provided with printed strip lines 7; the conductor 2 is electrically connected to the conductor pin 1 via a printed strip line 7.
In the implementation of the embodiment, the conductive pin 1 is welded on the printed strip line 7 of the mounting plate 5, the contact is good, and the pad 9 and the conductive pin 1 can be contacted more tightly in the detection through the spring conductive pin 1, so that the method is suitable for the pin-free surface mount module with more thicknesses; through the mode of the spring conducting pin 1 and the printed strip line 7, when detecting the same pin-free patch module for a plurality of times, the pad 9 can be effectively contacted with the conducting pin 1, the welding mode of the printed strip line 7 is stable, the welding can not be detached repeatedly for a plurality of times, and through the mode of combining the two, the detection can be better carried out on the same pin-free patch module for a plurality of times, and unexpected technical effects are generated.
Example 3
The invention relates to a test method, which comprises the following steps: s1: selecting a mounting plate 5 with the position of the conductive pin 1 matched with the position of a bonding pad 9 on a module to be tested 10 according to different modules to be tested 10; s2: mounting the mounting plate 5 at the bottom of the groove; s3: connecting one end of a lead 2 with a corresponding instrument or equipment, and electrically connecting the other end of the lead to the conductive needle 1; s4: selecting a proper rapid crimping device 4 according to the size and the thickness of the module 10 to be tested; s5: and (3) enabling the bonding pad 9 of the module to be tested 10 to face the conductive pin 1 corresponding to the bonding pad 9, aligning the bonding pad 9 with the conductive pin 1, pressing the module to be tested 10 by using the rapid crimping device 4, and electrifying to finish the test. The suitable quick crimping device 4 brings the pads 9 of the module to be tested 10 into contact with the conductive pins 1.
In the implementation of the embodiment, when testing is required, the mounting plate 5 with the position of the conductive pin 1 matched with the position of the pad 9 on the module to be tested 10 is selected according to different modules to be tested 10; then the mounting plate 5 is mounted at the bottom of the groove; then connecting one end of the lead 2 with a corresponding instrument or equipment, and electrically connecting the other end of the lead to the conductive needle 1; then selecting a proper rapid crimping device 4 according to the size and the thickness of the module 10 to be tested; and then, the bonding pad 9 of the module to be tested 10 faces the conductive pin 1 corresponding to the bonding pad 9, after the bonding pad 9 is aligned with the conductive pin 1, the module to be tested 10 is pressed by the rapid crimping device 4, and the test is completed by electrifying. The invention realizes the rapid detection of the pin-free patch module by combining the rapid compression joint device 4, the conductive pin 1 and the mounting plate 5, compared with the prior art, the invention does not need to weld wires, prevents the module pad 9 from falling off and the module from being thermally damaged, saves the time for welding the wires, and can detect the pin-free patch module only by aligning the pad 9 of the module to be tested 10 and the conductive pin 1 because the conductive pin 1 and the conductive wire 2 are fixed during the test, thereby avoiding the burnout caused by pin inserting errors; meanwhile, the rapid crimping device 4 is used for fixing the module to be tested 10, so that the hands of a user are liberated, and the module with more than two test points can be tested.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A testing device is characterized by comprising a conductive pin (1), a lead (2), a base (3), a quick crimping device (4) and a mounting plate (5); a groove is arranged on the base (3); the mounting plate (5) is arranged at the bottom of the groove; the mounting plate (5) is provided with a conductive needle (1), and the conductive needle (1) faces the top of the groove; the position of the conductive pin (1) is matched with the position of a bonding pad (9) on a module to be tested (10); one end of the lead (2) is electrically connected to the conductive needle (1), and the other end of the lead (2) is connected to the test equipment; the rapid crimping device (4) is arranged on the base (3), and a crimping point of the rapid crimping device (4) is arranged above the mounting plate (5);
the mounting plate (5) adopts a PCB; the PCB is provided with printed strip lines (7); the lead (2) is electrically connected to the conductive needle (1) through a printed strip line (7).
2. A testing device according to claim 1, wherein a wire outlet hole (8) is provided on the side wall of the groove, and the wire outlet hole (8) penetrates through the side wall of the groove; one end of the lead (2) far away from the conductive needle (1) penetrates through the lead outlet hole (8) and is connected with the test equipment.
3. A testing device according to claim 1, characterized in that the mounting plate (5) is fixed to the bottom of the recess by means of screws (6).
4. A testing device according to claim 1, characterized in that the conductive pin (1) is a spring conductive pin; the spring conductive pin comprises a contact and a base; the contact is connected to the base through a spring, and the base is arranged on the mounting plate (5); the contacts face the top of the recess.
5. A test method using the test apparatus according to any one of claims 1 to 4, characterized by comprising the steps of:
s1: selecting a mounting plate (5) with the position of the conductive pin (1) matched with the position of a bonding pad (9) on the module to be tested (10) according to different modules to be tested (10);
s2: mounting the mounting plate (5) at the bottom of the groove;
s3: connecting one end of the lead (2) with a corresponding instrument or equipment, and electrically connecting the other end of the lead to the conductive needle (1);
s4: selecting a proper rapid crimping device (4) according to the size and the thickness of the module (10) to be tested;
s5: the pad (9) of the module (10) to be tested faces the conductive pin (1) corresponding to the pad (9), after the pad (9) is aligned with the conductive pin (1), the module (10) to be tested is pressed by the rapid crimping device (4), and the test is completed after electrification.
6. A testing method according to claim 5, characterized in that the suitable quick crimping device (4) brings the pads (9) of the module to be tested (10) into contact with the conductive pins (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810015821.0A CN108169618B (en) | 2018-01-08 | 2018-01-08 | Testing device and testing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810015821.0A CN108169618B (en) | 2018-01-08 | 2018-01-08 | Testing device and testing method |
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| CN108169618A CN108169618A (en) | 2018-06-15 |
| CN108169618B true CN108169618B (en) | 2021-02-09 |
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| CN108169618A (en) | 2018-06-15 |
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