CN108169618A - A kind of test device and test method - Google Patents
A kind of test device and test method Download PDFInfo
- Publication number
- CN108169618A CN108169618A CN201810015821.0A CN201810015821A CN108169618A CN 108169618 A CN108169618 A CN 108169618A CN 201810015821 A CN201810015821 A CN 201810015821A CN 108169618 A CN108169618 A CN 108169618A
- Authority
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- China
- Prior art keywords
- conductive pin
- module
- tested
- conducting wire
- installing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
Abstract
The invention discloses a kind of test device, including conductive pin, conducting wire, pedestal, quick compression bonding apparatus and installing plate；Groove is set on the pedestal；The installing plate is set to bottom portion of groove；Conductive pin is set on the installing plate, and conductive pin is towards groove top；The position of the conductive pin and the position of pad in module to be tested match；One end of the conducting wire is electrically connected to conductive pin, and the other end of conducting wire is connected to test equipment.The invention also discloses a kind of methods tested using the test device.The present invention compared with the prior art, prevents module soldering pads from coming off, module thermal damage, saves the welding lead time, during test, since conductive pin and conducting wire have been fixed, so only need to can detect the pad of module to be tested and conductive pin alignment, be not in contact pin mistake and caused by burn out；Module to be tested is fixed using quick compression bonding apparatus simultaneously, the both hands of user has been liberated, the module more than two test points can be tested.
Description
Technical field
The present invention relates to patch module testing fields, and in particular to a kind of test device and test method.
Background technology
With the development and progress of modern science and technology, the miniaturization of equipment, modularization are the certainty of future electronic equipment development
Trend, to adapt to society development, device, installing plate, module integrated level will be higher and higher, use the device of patch, patch
The installing plate of piece, the module of patch also can be more and more.(device of patch, the installing plate of patch, patch module, it is simple below
Claim patch module)
But this patch module of test becomes a problem, need to be welded from patch module pin pad when such as testing
Conducting wire directly connects test equipment, is tested so that pad is easy to fall off, and patch module easily causes thermal damage, increases weld interval；
And instrument connection is reserved around patch pad, and the contact pin of just size is inserted in the hole, the wiring on contact pin, another termination test
Instrument when being tested, can cause loose contact, contact pin and jack matching are more demanding, easy wrong；It is drawn on contact pin
Conducting wire connecting test instrument is contacted contact pin on patch pad with hand, and when loosing one's grip again after testing, can cause need to manually always
Contact, can not do other things, easy wrong, more than two points will be unable to test.Therefore, the patch module of this no pin is anxious
Need it is a kind of can it is convenient for mounting and clamping, contact is good, is not easy the quick despatch test device of wrong.
Invention content
When the technical problems to be solved by the invention are existing no pin patch module tests when clamping inconvenience, test
Loose contact is good, easy wrong, pad solder can influence pad quality etc., and it is an object of the present invention to provide a kind of test device and test side
Method solves the above problems.
The present invention is achieved through the following technical solutions：
A kind of test device, including conductive pin, conducting wire, pedestal, quick compression bonding apparatus and installing plate；It is set on the pedestal
Groove；The installing plate is set to bottom portion of groove；Conductive pin is set on the installing plate, and conductive pin is towards groove top；Institute
The position and the position of pad in module to be tested for stating conductive pin match；One end of the conducting wire is electrically connected to conductive pin, and
The other end of conducting wire is connected to test equipment；The quick compression bonding apparatus is set on pedestal, and the crimping of quick compression bonding apparatus
Point is set to above installing plate.
In the prior art, test equipment need to be directly connect from welding lead on patch module pin pad during test, is surveyed
Examination so that pad is easy to fall off, and patch module easily causes thermal damage, increases weld interval；And test is reserved around patch pad
Hole inserts in the hole the contact pin of just size, the wiring on contact pin, another termination test equipment, when being tested, can cause to connect
Tactile bad, contact pin and jack matching are more demanding, easy wrong；The extraction wire connecting test instrument on contact pin, will with hand
Contact pin is contacted on patch pad, when loosing one's grip again after testing, can be caused manually to be permanently connected to, can not be done other things, is held
Easy wrong, more than two points will be unable to test.The present invention is in application, when being tested, and elder generation is according to different die trials to be measured
The installing plate that the conductive pin position of block selection matches with pad locations in module to be tested；Installing plate is installed on groove-bottom again
Portion；Then the corresponding instrument of a termination or equipment, the other end of conducting wire are electrically connected to conductive pin；Subsequently according to be tested
The suitable quick compression bonding apparatus of size and thickness selection of module；It is subsequently that the pad of module to be tested is corresponding towards pad
Conductive pin after pad is aligned with conductive pin, is pushed down module to be tested with quick compression bonding apparatus, and the completion test that is powered.
The present invention is realized in a manner that quick compression bonding apparatus, conductive pin and installing plate are combined to no pin patch
The quick detection of module, compared with the prior art, the present invention does not need to welding lead, prevents module soldering pads from coming off, module heat waste
Wound saves the welding lead time, during test, since conductive pin and conducting wire have been fixed, so only needing module to be tested
Pad and conductive pin alignment are i.e. detectable, be not in contact pin mistake and caused by burn out；It simultaneously will using quick compression bonding apparatus
Module to be tested is fixed, and has liberated the both hands of user, can test the module more than two test points.
Further, conducting wire is set to portal on the side wall of the groove, and conducting wire portals the side wall of through-going recess；It is described to lead
Portal across conducting wire and be connected to test equipment in the one end of line far from conductive pin.
Further, the installing plate is fixedly installed on bottom portion of groove by screw.
Further, the conductive pin uses spring conductive pin；The spring conductive pin includes contact and pedestal；It is described to touch
Head is connected to pedestal, and pedestal is set on installing plate by spring；The contact is towards groove top.
Further, the installing plate uses pcb board；Setting printing band line on the pcb board；The conducting wire passes through printing
Band line is electrically connected to conductive pin.
The present invention is in application, conductive pin is welded on the printing band line of installing plate, contact is good, and is led by spring
Acusector can cause in detection, and pad and conductive pin contact can be allowed even closer, be adapted to being pasted without pin for more kinds of thickness
Piece module；In a manner that spring conductive pin and printing are with line so that repeatedly examined to same no pin patch module
During survey, pad can be contacted effectively with conductive pin, and welding manner of the printing with line is very stable, and multiplicating will not take off
Weldering by way of the two combination, preferably can carry out repeated detection to same no pin patch module, produce expectation
Less than technique effect.
A kind of test method, includes the following steps：S1：According to the different conductive pin positions of modules selection to be tested with it is to be tested
The installing plate that pad locations match in module；S2：Installing plate is installed on bottom portion of groove；S3：One termination of conducting wire is opposite
The instrument or equipment answered, the other end are electrically connected to conductive pin；S4：It is suitable fast according to the size of module to be tested and thickness selection
Ram compression connection device；S5：By the pad of module to be tested towards the corresponding conductive pin of pad, after pad is aligned with conductive pin, use
Quick compression bonding apparatus pushes down module to be tested, and the completion test that is powered.
Further, the suitable quick compression bonding apparatus causes the contact pads conductive pin of module to be tested.
The present invention first selects conductive pin positions with treating in application, when being tested according to different modules to be tested
The installing plate that pad locations match in test module；Installing plate is installed on bottom portion of groove again；Then by a termination of conducting wire
Corresponding instrument or equipment, the other end are electrically connected to conductive pin；Subsequently selected according to the size of module to be tested and thickness
Suitable quick compression bonding apparatus；Subsequently by the pad of module to be tested towards the corresponding conductive pin of pad, by pad and conduction
After neat, module to be tested is pushed down with quick compression bonding apparatus, and the completion test that is powered.
Compared with prior art, the present invention it has the following advantages and advantages：
1st, a kind of test device of the present invention in a manner that quick compression bonding apparatus, conductive pin and installing plate are combined, is realized
Quick detection to no pin patch module, compared with the prior art, the present invention does not need to welding lead, prevents module soldering pads
Come off, module thermal damage, save the welding lead time, during test, since conductive pin and conducting wire have been fixed, thus only need by
Pad and the conductive pin alignment of module to be tested are i.e. detectable, be not in contact pin mistake and caused by burn out；Simultaneously using fast
Ram compression connection device fixes module to be tested, has liberated the both hands of user, can test the module more than two test points；
2nd, a kind of test method of the present invention in a manner that quick compression bonding apparatus, conductive pin and installing plate are combined, is realized
Quick detection to no pin patch module, compared with the prior art, the present invention does not need to welding lead, prevents module soldering pads
Come off, module thermal damage, save the welding lead time, during test, since conductive pin and conducting wire have been fixed, thus only need by
Pad and the conductive pin alignment of module to be tested are i.e. detectable, be not in contact pin mistake and caused by burn out；Simultaneously using fast
Ram compression connection device fixes module to be tested, has liberated the both hands of user, can test the module more than two test points.
Description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is schematic structural view of the invention；
Fig. 2 is present invention modular structure schematic diagram to be tested.
Label and corresponding parts title in attached drawing：
1- conductive pins, 2- conducting wires, 3- pedestals, the quick compression bonding apparatus of 4-, 5- installing plates, 6- screws, 7- printing band lines, 8- are led
Line portals, 9- pads, 10- modules to be tested.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment 1
As depicted in figs. 1 and 2, a kind of test device of the present invention, including conductive pin 1, conducting wire 2, pedestal 3, quick crimping dress
Put 4 and installing plate 5；Groove is set on the pedestal 3；The installing plate 5 is set to bottom portion of groove；It is set on the installing plate 5
Conductive pin 1, and conductive pin 1 is towards groove top；The position of the conductive pin 1 and the position phase of pad 9 in module 10 to be tested
Matching；One end of the conducting wire 2 is electrically connected to conductive pin 1, and the other end of conducting wire 2 is connected to test equipment；The fast ram compression
Connection device 4 is set on pedestal 3, and the crimping point of quick compression bonding apparatus 4 is set to 5 top of installing plate.
When the present embodiment is implemented, when being tested, first 1 position of conductive pin is selected according to different modules 10 to be tested
With the installing plate 5 that 9 position of pad matches in module 10 to be tested；Installing plate 5 is installed on bottom portion of groove again；Then by conducting wire
The 2 corresponding instrument of a termination or equipment, the other end is electrically connected to conductive pin 1；Subsequently according to the big of module 10 to be tested
The suitable quick compression bonding apparatus 4 of small and thickness selection；Subsequently the pad 9 of module 10 to be tested is led towards pad 9 is corresponding
Acusector 1 after pad 9 is aligned with conductive pin 1, is pushed down module 10 to be tested with quick compression bonding apparatus 4, and the completion that is powered is surveyed
Examination.The present invention is realized in a manner that quick compression bonding apparatus 4, conductive pin 1 and installing plate 5 are combined to no pin patch mould
The quick detection of block, compared with the prior art, the present invention does not need to welding lead, prevents module soldering pads 9 from coming off, module heat waste
Wound saves the welding lead time, during test, since conductive pin 1 and conducting wire 2 have been fixed, so only needing module to be tested
10 pad 9 and conductive pin 1 alignment is i.e. detectable, be not in contact pin mistake and caused by burn out；Simultaneously using quick crimping
Device 4 fixes module 10 to be tested, has liberated the both hands of user, can test the module more than two test points.
Embodiment 2
The present embodiment sets conducting wire to portal 8 on the basis of embodiment 1 on the side wall of the groove, and conducting wire portals and 8 passes through
Wear the side wall of groove；The described one end of conducting wire 2 far from conductive pin 1 is portalled across conducting wire 8 and is connected to test equipment.The installation
Plate 5 is fixedly installed on bottom portion of groove by screw 6.The conductive pin 1 uses spring conductive pin；The spring conductive pin includes touching
Head and pedestal；The contact is connected to pedestal by spring, and pedestal is set on installing plate 5；The contact is towards groove top
Portion.The installing plate 5 uses pcb board；Setting printing band line 7 on the pcb board；The conducting wire 2 is electrically connected by printing band line 7
In conductive pin 1.
When the present embodiment is implemented, conductive pin 1 is welded on the printing band line 7 of installing plate 5, contact is good, and passes through
Spring conductive pin 1 can cause in detection, can allow pad 9 and conductive pin 1 contacts even closer, be adapted to more kinds of thickness
Without pin patch module；In a manner that spring conductive pin 1 and printing are with line 7 so as to same no pin patch module
When carrying out repeated detection, pad 9 can be contacted effectively with conductive pin 1, and welding manner of the printing with line 7 is very stable, more
Secondary repetition will not desoldering, by way of the two combination, preferably same no pin patch module can be carried out multiple
Detection, produces unexpected technique effect.
Embodiment 3
A kind of test method of the present invention, includes the following steps：S1：Conductive pin 1 is selected according to different modules 10 to be tested
It puts and 9 position of pad matches in module 10 to be tested installing plate 5；S2：Installing plate 5 is installed on bottom portion of groove；S3：It will lead
The corresponding instrument of a termination or equipment, the other end of line 2 are electrically connected to conductive pin 1；S4：According to the size of module 10 to be tested
With the suitable quick compression bonding apparatus 4 of thickness selection；S5：By the pad 9 of module 10 to be tested towards 9 corresponding conductive pin 1 of pad,
After pad 9 is aligned with conductive pin 1, module 10 to be tested is pushed down with quick compression bonding apparatus 4, and the completion test that is powered.It is described
Suitable quick compression bonding apparatus 4 is so that the pad 9 of module 10 to be tested contacts conductive pin 1.
When the present embodiment is implemented, when being tested, first 1 position of conductive pin is selected according to different modules 10 to be tested
With the installing plate 5 that 9 position of pad matches in module 10 to be tested；Installing plate 5 is installed on bottom portion of groove again；Then by conducting wire
The 2 corresponding instrument of a termination or equipment, the other end is electrically connected to conductive pin 1；Subsequently according to the big of module 10 to be tested
The suitable quick compression bonding apparatus 4 of small and thickness selection；Subsequently the pad 9 of module 10 to be tested is led towards pad 9 is corresponding
Acusector 1 after pad 9 is aligned with conductive pin 1, is pushed down module 10 to be tested with quick compression bonding apparatus 4, and the completion that is powered is surveyed
Examination.The present invention is realized in a manner that quick compression bonding apparatus 4, conductive pin 1 and installing plate 5 are combined to no pin patch mould
The quick detection of block, compared with the prior art, the present invention does not need to welding lead, prevents module soldering pads 9 from coming off, module heat waste
Wound saves the welding lead time, during test, since conductive pin 1 and conducting wire 2 have been fixed, so only needing module to be tested
10 pad 9 and conductive pin 1 alignment is i.e. detectable, be not in contact pin mistake and caused by burn out；Simultaneously using quick crimping
Device 4 fixes module 10 to be tested, has liberated the both hands of user, can test the module more than two test points.
Above-described specific embodiment has carried out the purpose of the present invention, technical solution and advantageous effect further
It is described in detail, it should be understood that the foregoing is merely the specific embodiment of the present invention, is not intended to limit the present invention
Protection domain, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (7)
1. a kind of test device, which is characterized in that including conductive pin (1), conducting wire (2), pedestal (3), quick compression bonding apparatus (4) and
Installing plate (5)；Groove is set on the pedestal (3)；The installing plate (5) is set to bottom portion of groove；It is set on the installing plate (5)
Put conductive pin (1), and conductive pin (1) is towards groove top；The position of the conductive pin (1) and pad in module to be tested (10)
(9) position matches；One end of the conducting wire (2) is electrically connected to conductive pin (1), and the other end of conducting wire (2) is connected to survey
Try equipment；The quick compression bonding apparatus (4) is set on pedestal (3), and the crimping point of quick compression bonding apparatus (4) is set to installation
Above plate (5).
2. a kind of test device according to claim 1, which is characterized in that conducting wire is set to portal on the side wall of the groove
(8), and conducting wire portals the side wall of (8) through-going recess；Portal (8) across conducting wire the one end of the conducting wire (2) far from conductive pin (1)
And it is connected to test equipment.
3. a kind of test device according to claim 1, which is characterized in that the installing plate (5) is fixed by screw (6)
It is set to bottom portion of groove.
4. a kind of test device according to claim 1, which is characterized in that the conductive pin (1) is using spring conductive pin；
The spring conductive pin includes contact and pedestal；The contact is connected to pedestal by spring, and pedestal is set to installing plate (5)
On；The contact is towards groove top.
5. a kind of test device according to claim 1, which is characterized in that the installing plate (5) is using pcb board；It is described
Setting printing band line (7) on pcb board；The conducting wire (2) is electrically connected to conductive pin (1) by printing band line (7).
6. use the test method of test device described in 5 any one of Claims 1 to 5, which is characterized in that include the following steps：
S1：According to different module (10) selection conductive pin (1) positions to be tested and pad (9) position phase in module to be tested (10)
Matched installing plate (5)；
S2：Installing plate (5) is installed on bottom portion of groove；
S3：The corresponding instrument of a termination or equipment, the other end of conducting wire (2) are electrically connected to conductive pin (1)；
S4：According to the size of module to be tested (10) and the suitable quick compression bonding apparatus (4) of thickness selection；
S5：By the pad (9) of module to be tested (10) towards the corresponding conductive pin (1) of pad (9), by pad (9) and conductive pin
(1) after being aligned, module to be tested (10) is pushed down with quick compression bonding apparatus (4), and the completion test that is powered.
7. a kind of test method according to claim 6, which is characterized in that the suitable quick compression bonding apparatus (4) makes
Obtain pad (9) the contact conductive pin (1) of module (10) to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810015821.0A CN108169618B (en) | 2018-01-08 | 2018-01-08 | Testing device and testing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810015821.0A CN108169618B (en) | 2018-01-08 | 2018-01-08 | Testing device and testing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108169618A true CN108169618A (en) | 2018-06-15 |
| CN108169618B CN108169618B (en) | 2021-02-09 |
Family
ID=62517830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810015821.0A Active CN108169618B (en) | 2018-01-08 | 2018-01-08 | Testing device and testing method |
Country Status (1)
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| CN (1) | CN108169618B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108169618B (en) | 2021-02-09 |
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