CN204154753U - A kind of novel encapsulated chip testing jig - Google Patents
A kind of novel encapsulated chip testing jig Download PDFInfo
- Publication number
- CN204154753U CN204154753U CN201420534557.9U CN201420534557U CN204154753U CN 204154753 U CN204154753 U CN 204154753U CN 201420534557 U CN201420534557 U CN 201420534557U CN 204154753 U CN204154753 U CN 204154753U
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- double ended
- base
- ended probes
- gland
- chip testing
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- 238000012360 testing method Methods 0.000 title claims abstract description 46
- 239000000523 sample Substances 0.000 claims abstract description 49
- 210000004907 gland Anatomy 0.000 claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 19
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a kind of novel encapsulated chip testing jig, comprise measurement jig main body and test board, measurement jig main body comprises latching device, gland, supporting plate, double ended probes, signal flap and base; Test board is positioned at the bottom of measurement jig main body, is fixedly connected with base; Base is connected by rotating shaft with gland, and buckle structure is positioned at gland top; Be inlaid with double ended probes in base, the top of base and bottom are respectively carved with a groove, and supporting plate is arranged in top groove, and signal flap is fixed in bottom groove; The pad above of signal flap and the end thereof contacts of double ended probes, below the contact pads of pad and test board.The utility model is by embedding signal flap, add stability and the contact area of double ended probes relative position, improve signal conduction rate, double ended probes is not easily lost, tool is not fragile, without the need to frequent maintenance, improves testing efficiency, reduce debugging difficulty, there is easy to use, good reliability and the advantage such as debugging is simple.
Description
Technical field
The utility model relates to chip testing field, particularly relates to a kind of image sensor chip encapsulation finished product measurement jig.
Background technology
Image sensor chip is through COB(Chip On Board chip on board) technology encapsulation after, be made as the plastic chip carrier that PLCC(Plastic Leaded Chip Carrier is with lead-in wire) finished product, PLCC finished product can be used as SMD components and parts, PCB(Printed Circuit Board printed wiring board is mounted on by tin cream) or FPC(Flexible Printed Circuit Board flexible printed circuit board) on, be then the requisite processing procedure of image sensor chip encapsulation factory to the functional test of PLCC finished product.
The method of testing of industry PLCC finished product is mainly: by measurement jig, and by the signal line conducting of PLCC finished product on test board, signal by after the conversion, amplification etc. of test board process, then transfers to test platform and carries out computing.Traditional test tool is locked in tool by PLCC finished product, measurement jig is locked on test board, some double ended probes are had bottom tool, double ended probes is the one of the connector of two ends extension type, and pressing and latching device are arranged at tool top, when laminating mechanism press down and snap close time, PLCC finished product sinks, make one end of the contact pads double ended probes of PLCC finished product bottom surface, the other end of double ended probes, by the pad of engaged test plate, realizes signal conduction.
Along with image sensor chip integrated level is more and more higher, PLCC finished product after encapsulation is also more and more less, double ended probes is also more and more less, this proposes challenge to the intensity of double ended probes and reliability, now traditional test tool both cannot ensure that all signal wires can by double ended probes conducting, again cannot confirmation signal line conducting situation quickly and easily, and measurement jig easily causes the damage of double ended probes in debug process, measurement jig is made to need frequent maintenance, affect testing efficiency, these bring very large technology puzzlement to the functional test of PLCC finished product.
Utility model content
The technical matters that the utility model mainly solves is to provide a kind of novel encapsulated chip testing jig, can solve the problems such as debugging difficulty that traditional test tool exists, poor reliability, efficiency are low.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of novel encapsulated chip testing jig, comprise measurement jig main body and test board, described measurement jig main body comprises latching device, gland, supporting plate, double ended probes, signal flap and base; Described test board is positioned at the bottom of described measurement jig main body, and is fixedly connected with described base; Described base is connected by rotating shaft with described gland, and described buckle structure is positioned at the one end at described gland top; Described double ended probes is inlaid with in described base, the top of described base and bottom are respectively carved with a groove, described supporting plate is arranged in the top groove of described base, and connect with the described gland on it is movable, described signal flap is fixedly mounted in the bottom groove of described base, the upper and lower surface of described signal flap is all provided with pad, the end thereof contacts of pad and described double ended probes above it, the contact pads of pad and described test board below it.
In the utility model preferred embodiment, described signal flap is double-sided PCB board.
In the utility model preferred embodiment, described double ended probes, just to the top groove and bottom groove with described base, so that its probe contacts with signal flap with described finished product to be measured, realizes signal conduction.
In the utility model preferred embodiment, the probe of two ends up and down of described double ended probes is compression and exposes.
In the utility model preferred embodiment, the probe one_to_one corresponding of pad and the described double ended probes lower end above of described signal flap.
In the utility model preferred embodiment, described supporting plate is accompanied with spring device, spring device makes supporting plate be Compressible structure, has certain buffer action when this structure makes the related supporting plate of finished product to be measured sink, and reduce further the possibility that double ended probes damages.
The beneficial effects of the utility model are: a kind of novel encapsulated chip testing jig of the utility model, by directly embedding the signal flap of one piece of two-sided pad of band bottom measurement jig, add stability and the contact area of relative position, make PLCC finished product in test process, signal conduction rate improves greatly, double ended probes is not easily lost, tool is not fragile, without the need to frequent maintenance, improve testing efficiency, reduce the difficulty of debugging, and there is easy to use, good reliability and the advantage such as debugging is simple.
Accompanying drawing explanation
Fig. 1 is the perspective view of a kind of novel encapsulated chip testing jig of the utility model;
Fig. 2 is the schematic side view that shown novel encapsulated chip testing jig is in snap close stationary state;
In accompanying drawing, the mark of each parts is as follows: 1. test board, 2. base, 3. supporting plate, 4. double ended probes, 5. gland, 6. latching device, 7. signal flap.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection domain of the present utility model.
Refer to Fig. 1 and Fig. 2, the utility model embodiment comprises:
A kind of novel encapsulated chip testing jig, comprise measurement jig main body and test board 1, described measurement jig main body comprises latching device 6, gland 5, supporting plate 3, double ended probes 4, signal flap 7 and base 2; Described test board 1 is positioned at the bottom of described measurement jig main body, and is fixedly connected with described base 2 by reference column and screw hole;
Described base 2 is connected by rotating shaft with described gland 5, and described buckle structure 6 is positioned at the one end at described gland 5 top;
Double ended probes 4 is inlaid with in described base 2, the probe of two ends up and down of double ended probes 4 is compression and exposes, namely Compressible structure is exposed, the top of described base 2 and bottom, the position relative with described double ended probes 4 is respectively carved with a groove, wherein, in the top groove of described base 2, supporting plate 3 is installed, the bottom groove internal fixtion of described base 2 is provided with signal flap 7, double ended probes 4 just to the described top groove of base 2 and the structural design of bottom groove, double ended probes can be contacted with signal flap 7 with described finished product to be measured, realize signal conduction.
Described supporting plate 3 is accompanied with spring device, is Compressible structure, has certain buffer action when this structure makes the related supporting plate of finished product to be measured sink, and reduce further the possibility that double ended probes damages;
Supporting plate 3 connects with the gland 5 on it is movable, and when namely latching system 6 is in open mode, supporting plate 3 is separated with gland 5, does not contact, and when latching system is in the lock state, gland 5 presses down, and contacts with the finished product to be measured that supporting plate 3 or supporting plate 3 are placed;
Described signal flap 7 is the double-sided PCB board that upper and lower surface is all provided with pad, the lower end probes touch of pad and double ended probes 4 above it one_to_one corresponding, the contact pads of pad and described test board 1 below it.Because the area of signal flap is large, and the relative position between double ended probes is stablized, and repeatedly debugs without the need to follow-up, can realize this segment signal conducting and stablize, and double ended probes is not fragile yet; In addition, the contact pads of signal flap bottom surface pad and test board, the contact area due to pad is far longer than the end of double ended probes, therefore can realize the good on-state rate of signal.
Carry out the method for testing of novel encapsulated chip testing with above-mentioned measurement jig, comprise the steps:
(1) latching system 6 is in open mode, is placed in by finished product to be measured on described supporting plate 3;
(2) press described gland 5, finished product to be measured is pressed down together with supporting plate 3;
(3) described gland 5 and described base 2 pin fixing by latching device 6, now, and the pad of finished product bottom surface to be measured and the probes touch of described double ended probes 4 upper end;
(4) signal between finished product to be measured and described test board, by described double ended probes conducting, carries out follow-up test work then.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model instructions and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (6)
1. a novel encapsulated chip testing jig, is characterized in that, comprises measurement jig main body and test board, and described measurement jig main body comprises latching device, gland, supporting plate, double ended probes, signal flap and base; Described test board is positioned at the bottom of described measurement jig main body, and is fixedly connected with described base; Described base is connected by rotating shaft with described gland, and described buckle structure is positioned at the one end at described gland top; Described double ended probes is inlaid with in described base, the top of described base and bottom are respectively carved with a groove, described supporting plate is arranged in the top groove of described base, and connect with the described gland on it is movable, described signal flap is fixedly mounted in the bottom groove of described base, the upper and lower surface of described signal flap is all provided with pad, the end thereof contacts of pad and described double ended probes above it, the contact pads of pad and described test board below it.
2. novel encapsulated chip testing jig according to claim 1, is characterized in that, described signal flap is double-sided PCB board.
3. novel encapsulated chip testing jig according to claim 1, is characterized in that, described double ended probes is just to the top groove and bottom groove with described base.
4. novel encapsulated chip testing jig according to claim 3, is characterized in that, the probe of two ends up and down of described double ended probes is compression and exposes.
5. novel encapsulated chip testing jig according to claim 4, is characterized in that, the probe one_to_one corresponding of pad and the described double ended probes lower end above of described signal flap.
6. novel encapsulated chip testing jig according to claim 1, is characterized in that, described supporting plate is accompanied with spring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420534557.9U CN204154753U (en) | 2014-09-17 | 2014-09-17 | A kind of novel encapsulated chip testing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420534557.9U CN204154753U (en) | 2014-09-17 | 2014-09-17 | A kind of novel encapsulated chip testing jig |
Publications (1)
| Publication Number | Publication Date |
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| CN204154753U true CN204154753U (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420534557.9U Expired - Fee Related CN204154753U (en) | 2014-09-17 | 2014-09-17 | A kind of novel encapsulated chip testing jig |
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| CN (1) | CN204154753U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104483517A (en) * | 2014-12-31 | 2015-04-01 | 日月光半导体（昆山）有限公司 | Chip testing tool |
| CN105222990A (en) * | 2015-10-13 | 2016-01-06 | 广州万孚生物技术股份有限公司 | Light-emitting component measurement jig |
| CN106249132A (en) * | 2016-08-31 | 2016-12-21 | 中山昂欣科技有限责任公司 | Method and device for on-off test of AC light-emitting chip |
| CN107045101A (en) * | 2017-04-06 | 2017-08-15 | 天津普仁万合信息技术有限公司 | A kind of apparatus and method that accuracy detection is carried out to blood pressure measurement chip |
| CN108169618A (en) * | 2018-01-08 | 2018-06-15 | 四川九洲电器集团有限责任公司 | A kind of test device and test method |
| CN108941905A (en) * | 2017-05-12 | 2018-12-07 | 江苏凯尔生物识别科技有限公司 | Laser welding high-efficiency and precision jig |
| CN109342020A (en) * | 2018-11-20 | 2019-02-15 | 武汉精毅通电子技术有限公司 | A bearing device for display panel testing |
| CN110109004A (en) * | 2019-06-10 | 2019-08-09 | 成都鸿芯光电通信有限公司 | A kind of multiconductor locating test device |
| CN116087564A (en) * | 2022-12-28 | 2023-05-09 | 中国电子科技集团公司第二十九研究所 | Clamp and test method for microwave performance test of BGA packaging assembly |
| CN117192338A (en) * | 2023-09-22 | 2023-12-08 | 厦门夏新智能物联技术有限公司 | A PCB automated functional testing tool and testing method |
| CN117434412A (en) * | 2023-09-28 | 2024-01-23 | 海信家电集团股份有限公司 | Testing device for power device |
-
2014
- 2014-09-17 CN CN201420534557.9U patent/CN204154753U/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104483517A (en) * | 2014-12-31 | 2015-04-01 | 日月光半导体（昆山）有限公司 | Chip testing tool |
| CN105222990A (en) * | 2015-10-13 | 2016-01-06 | 广州万孚生物技术股份有限公司 | Light-emitting component measurement jig |
| CN105222990B (en) * | 2015-10-13 | 2018-07-31 | 广州万孚生物技术股份有限公司 | Light-emitting component measurement jig |
| CN106249132A (en) * | 2016-08-31 | 2016-12-21 | 中山昂欣科技有限责任公司 | Method and device for on-off test of AC light-emitting chip |
| CN107045101A (en) * | 2017-04-06 | 2017-08-15 | 天津普仁万合信息技术有限公司 | A kind of apparatus and method that accuracy detection is carried out to blood pressure measurement chip |
| CN107045101B (en) * | 2017-04-06 | 2023-10-13 | 天津普仁万合信息技术有限公司 | A device and method for accuracy detection of blood pressure measurement chips |
| CN108941905A (en) * | 2017-05-12 | 2018-12-07 | 江苏凯尔生物识别科技有限公司 | Laser welding high-efficiency and precision jig |
| CN108169618B (en) * | 2018-01-08 | 2021-02-09 | 四川九洲电器集团有限责任公司 | Testing device and testing method |
| CN108169618A (en) * | 2018-01-08 | 2018-06-15 | 四川九洲电器集团有限责任公司 | A kind of test device and test method |
| CN109342020A (en) * | 2018-11-20 | 2019-02-15 | 武汉精毅通电子技术有限公司 | A bearing device for display panel testing |
| CN110109004A (en) * | 2019-06-10 | 2019-08-09 | 成都鸿芯光电通信有限公司 | A kind of multiconductor locating test device |
| CN116087564A (en) * | 2022-12-28 | 2023-05-09 | 中国电子科技集团公司第二十九研究所 | Clamp and test method for microwave performance test of BGA packaging assembly |
| CN117192338A (en) * | 2023-09-22 | 2023-12-08 | 厦门夏新智能物联技术有限公司 | A PCB automated functional testing tool and testing method |
| CN117434412A (en) * | 2023-09-28 | 2024-01-23 | 海信家电集团股份有限公司 | Testing device for power device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180821 Address after: 334000 electronic information double creation Park, B District, Guangfeng District, Shangrao, Jiangxi Patentee after: Jiangxi Italy Optoelectronic Technology Co., Ltd. Address before: 215500 18 Suzhou Road, Yushan hi tech Industrial Park, Changshou City, Suzhou, Jiangsu. Patentee before: CHANGSHU SHIYING OPTICAL TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20200917 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |