M421505 * ·. 五、新型說明： 【新型所屬之技術領域】 本創作是一種測試裝置，特別是指一種用於晶圓檢測 用途的測試探針卡。 【先前技術】 晶圓測試機係用於檢測晶圓良率之機具，主要係以探M421505 * ·. V. New description: [New technical field] This creation is a test device, especially a test probe card for wafer inspection purposes. [Prior Art] Wafer testing machine is used to detect wafer yield, mainly to explore
針接觸待測晶圓中之每一晶片單元上的接點，並施以檢測 ^號以對晶圓進行功能性檢測，進而篩選出不良品。 請參考圖1 〇所示之一習知晶圓測試機的探針卡，該 探針卡主要在一配線基板50下側設置一固定座51，該固 疋座51具有一朝下的開口 51〇，該固定座51内部設有上 下堆疊的一介面層52與一線路轉換板53,該配線基板 5〇、介面| 52與該線路轉換板53皆設有導電接點而彼此 構成電性接觸；又，該固定S 51的開α 510中設有一探 十、卫件54，該探針組件54係由設置在該固定座51下側 的Pf位板55項:在該固^座51的開口 中並使探針 』件54上的複數探針與該線路轉換板的導電接點構成 電!生接觸’其中該固定座51與限位板55係由螺栓5 固在配線基板5〇上。 項 =作時’探針組件54 i的探針將接觸待測晶圓，並 傳送到m s 路轉換板53與料組件54而 ’、曰曰圓’待測晶圓的反應信號再由探針組件Μ 3 M421505 回傳到微電腦’由微電腦進行功能性分析，藉此進行 的檢測目的。 若介面層52、線路轉換板53與探針組件54其中之 一構件損壞而必須更換時，因該固定座51與該限位板55 僅由螺栓56鎖固在配線基板5G上，必須先將螺检56拆 離此時固定座51、介面層52、線路轉換板53、探針組 件54與限位板55將彼此分離，從而將損壞的構件替換為 可正“吏用的構件；然而，因固定座51、介面層Μ、線 路轉換板53、探針組件54與限位板55已呈分離之態 樣，又因無法判別介面層52、線路轉換板53與探針組= 54:之何構件損壞’造成作業人員須逐一進行檢測，再將 知壞的構件予以更換後，將前述所有構件重新安裝組合在 配線基板50，造成作業上的繁瑣不便。 此外，當組設線路轉換板53於介面層52上時，為確 保"面層52、線路轉換板53與探針組件54間的導電接 點係正確電連接，介面層52與線路轉換板53間的導電接 點必須經過一次校正；又，當組設探針組件於線路轉 換板53上時，探針組件54與線路轉換板53間的導電接 點必須再經過一次校正’因此校正步驟繁複，造成使用上 的不便。 【新型内容】 习本^創作的主要目的是提供一種測試探針卡，希望改善 習知探針卡於介面層、線路轉換板與探針組件中之任一^ 件損壞時’須全部構件拆解且逐—檢測後，再將每一構件 以及組裝過程中校正步 重新組裝之作業繁項不便等問題， 驟繁複之問題。 -探::揭::含有本創作所採用的技術手段是提供- 一轉接模組，包含有： 固定框，其中間部位形成一鏤空區；及 一線路轉接板’係可拆組的裝設在該固定框中， 該線路轉接板於相應固定框的鏤空區處設有複數轉 接線路，每一轉接線路於線路轉接板相對的兩側面 分別形成接點；以及 一探針模組，包含有： 框體，其中間部位形成有一鏤空區； 一介面層，設置在該框體中，該介面層中具有複 中"線路’母一中介線路於介面層相對的兩側面 分別形成接點； 探針組件，設置在該框體中，該探針組件包含 有複數探針，每一探針與介面層中相應的中介線路 的接點形成電性接觸；及 一固定板，提供框體、探針組件與介面層組設其 中，該固定板相應於探針組件的複數探針處形成一 開口，探針模組以固定板組設於轉接模組的固定框 上，介面層的每一中介線路的接點與線路轉接板相 應的轉接線路的接點構成電性接觸。 孔所述之測試探針卡，其中該探針組件上設有複數窺 且該複數探針設置在該複數窺孔所圍的區域内，該介 面層於窺孔對應的位置設有定位參考點 藉由前述測試探針卡設計，其主要係利用轉接模組及 探針模組兩獨立模組組裝而成之構造，若當線路轉接板、 介面層或探針址件中之任一或以上有損壞的情況而欲更換 時係可先將轉接模組及探針模組彼此拆離，冑而獨立替 換線路轉接板、介面層或探針組件，或以個職組直接更 換因此才目&於先前技術，纟創作避免將測試裝置整體 完全拆離，並可以模組化方式㈣，而可提升重新組裝本 創作的速度與便利性，並能有效提升作業效率。 此外，因探針組件與介面層係組設在框體上，又探針 :件上設有複數窺孔，且該介面層於窺孔對應的位置設有 疋位參考，點&裝時，只須將窺孔與定位參考點間進行對 準較正，即可確保介面層與探針組件正確連接，相較於先 前技術，係方便許多。 【實施方式】 請參考圖1所示之較佳實施例，本創作測試探針卡包 含有一轉接模組1及一探針模組2。 該轉接模組1包含有一固定框n及一線路轉接板 其中： 該固定框11的中間部位形成鏤空區彳1〇，於本較佳實 施例中，該固定框11於鏤空區110上側再外擴形成一較 大外環槽111’於鏤空區110下側尚可再外擴形成一設置 槽112(如圖5所示）。 該線路轉接板12係設置在該固定框彳】的鏤空區11〇 M421505 中’或如本較佳實施例，令線路轉接板12組設於鏤空區 110的設置槽112中，線路轉接板12於相應固定框的 鏤空區110處設有複數轉接線路，每一轉接線路於線路轉 接板12相對的兩側面分別形成接點120。 該探針模組2包含有一框體20、一探針組件21、一 介面層22與一固定板23。其中： 該框體20可為單一構件或為複數構件之組合體，於 本較佳實施例中’該框體20包含有一底框200及一上裡 2〇1。該底框200係形成一橢圓的環狀體，且其中間部位 形成一矩形的鏤空區202，底框200上側於矩形鏤空區 202的相對長邊外圍分別形成一定位凹部203，於兩相對 短邊上側形成定位槽204，且底框200下侧於鏤空區2〇2 外圍再形成一容置槽2〇5(如圖5所示）；該上框2〇1係一 矩形框體，其中間部位形成有一鏤空區2〇6，該上框2〇1 係設置在該底框200上側’並位在底框200的鏤空區202 中’該上框201四個端部形成延伸部207以供設置在底框 200的定位槽204中。 該探針組件21設置在該框體20中，其包含有單—陶 瓷板210以及複數個探針211。該陶瓷板21〇係設置在該 底框200與上框201上側，並容置在底框2〇〇的定位凹部 203中，5亥陶瓷板210的外環處形成有複數縱向貫穿的窺 孔212，且該陶瓷板210外環處的厚度於相鄰窺孔212之 間形成較薄；該複數探針211係分布穿設在該複數窺孔 212所圍的區域以内，該複數探針211的頂端凸出於該陶 瓷板21 0頂侧，請參考圖6所示，各個探針2彳彳主要是於 M421505 一探針頭接設一彈簧213, 213提供電性傳輪與彈力 動0 使探針211的探針頭藉由彈簧 並可相對陶瓷板210上下移 該介面層22係、設置在該框體扣底側，本實施例係設 置在底框2〇0的容置槽2()5中，請參考如圖7與圖8所 不，該介面層22上侧面對於該複數窺孔212位置形成定 位參考點220,於該複數定位參考點22q所㈣域内設有 複數個中介線路，每-中介線路分別於介面層22上側面 形成上導電接點221 ’以及於介面層22下側面形成下導電 接點222。當探針組件21與介面層22設置在該框體2〇 上時，各個定位參考點220皆可對應到該探針組件21上 各個窺孔212的位置，且該介面層22上的各個上導電接 點221分別電接觸相應的探針211底端；因此在安裝時， 只須確認窺孔212與定位參考點22〇之間已經對位，即可 確保介面層22與探針組件21已構成正確的電連接。 該固定板23係形成環片狀，其中間區域形成一貫穿 的開口 230,該固定板23於開口 23〇下側形成一容槽 231(如圖5所示），該容槽231供前述探針組件21之頂側 係設置其中，且開口 230外周對應探針組件21窺孔212 的區域再形成缺口 232，係令該些窺孔212與探針211可 外露於該開口 230與缺口 232。 探針模組2是利用固定板2 3組設在固定框11的外環 槽111中’而鎖固在固定框11上，使框體2〇、探針組件 21與介面層22固定在該固定框11的鎮空區之中， 並令該介面層22下表面的下導電接點222電性接觸該電 M421505 轉接板12上相應的轉接線路的接點120。 一請搭配參考Η 2㈣5力示本創作較佳實施例安裝於 一電路載板的示意圖。本創作測試探針卡應用於晶圓檢測 j具時’係令測試探針卡翻轉倒裝，並以轉接模組】之固 疋柩11鎖IU於晶圓檢職具的電路載板1Q上，並使線路 fn接板12上的接點12Q與該電路載板1G上相應的接點 構成電性接觸，進而通過介面層的中介線路，使每_ 探針川分別與該電路載板1()上相應的接點1GG構成電 姓接觸’該電路載板1()之該些接點觸另電連接至晶圓 檢測機具的微電腦。 請參考圖9所示，進行晶圓檢測時，係令晶圓檢測機 具的承載台30上放置一待測晶圓31，操作人員可操作本 創作中之探針211電接觸待測晶圓31中一晶片單元上的 相應的接點，並由微電腦透過該些探針211對該待測晶圓 31傳送測試信號，並接收待測晶圓31反應的信號，而由 微電腦進行分析判斷晶片單元之功能是否正確，藉此 晶圓的測試。 藉本創作之设汁’因為本創作係由可拆組的轉接模組 1及探針模組2組裝而成，若線路轉接板12與介面層、 有損壞的情況而欲更換時，係可將轉接模組1及探針模组 2彼此拆離’而獨立替換轉接模組1上的線路轉接板12， 或是替換探針模組2上的介面層22，因此不須將測試裝置 整體構件拆除分離’此外’亦可利用轉接模組】或探 組2採取整個模組更換之方式進行，故此，本創作提升重 新組裝本創作的速度與便㈣，並能有效提升作業效率。 9 【圖式簡單說明】 圖 意圖 :本創作測試探針卡之 一較佳實施例立體分解示 圖2 :圖 的立體分解圖 所示測試探針卡較佳實施例與-電路栽板 圖3 :圖2組合立體外觀圖。 圖4:圖2局部放大平面示意圖。 圖5:圖4之剖視示意圖。 圖6·圖5局部放大示意圖。 圖7:本創作中之電轉接板立體外觀圖。 圖8:本創作中之電轉接板另一立體外觀圖。 圖9:本創作中之較佳實施例使用狀態示意圖 圖10:習知晶圓測試裝置剖視示意圖。 10電路載板 11固定框 1 1 1外環槽 12線路轉接板 20框體 201上框 2 0 3定位凹部 205容置槽 207延伸部 【主要元件符號說明】 1轉接模組 100接點 11〇鏤空區 112設置槽 120接點 2探針模組 200底框 202鏤空區 204定位槽 206鐘空區The pin contacts the contact on each of the wafer units in the wafer to be tested, and applies a detection number to perform functional inspection on the wafer, thereby screening for defective products. Please refer to the probe card of the conventional wafer testing machine shown in FIG. 1 . The probe card is mainly provided with a fixing seat 51 on the lower side of the wiring substrate 50 , and the fixing base 51 has a downward opening 51 〇. The fixing base 51 is internally provided with an interface layer 52 stacked on the upper and lower sides and a circuit conversion board 53. The wiring substrate 5, the interface|52 and the circuit conversion board 53 are all provided with conductive contacts to form electrical contact with each other; The opening α 510 of the fixed S 51 is provided with a probe 10 and a guard 54. The probe assembly 54 is defined by a Pf position plate 55 disposed on the lower side of the fixing base 51: in the opening of the fixing base 51 The plurality of probes on the probe member 54 are electrically connected to the conductive contacts of the circuit conversion board. The holder 51 and the limiting plate 55 are fixed to the wiring substrate 5 by bolts 5. The probe of the probe assembly 54 i will contact the wafer to be tested and be transferred to the ms conversion board 53 and the material assembly 54 to 'receive the reaction signal of the wafer to be tested and then the probe. Component Μ 3 M421505 Back to the microcomputer 'Functional analysis by the microcomputer for the purpose of detection. If one of the interface layer 52, the line conversion board 53 and the probe assembly 54 is damaged and must be replaced, since the fixing base 51 and the limiting plate 55 are only locked by the bolts 56 on the wiring substrate 5G, it must first be At this time, the screw 56 is detached, and the fixing base 51, the interface layer 52, the line changing plate 53, the probe assembly 54, and the limiting plate 55 are separated from each other, thereby replacing the damaged member with a member that can be used properly; however, Since the fixing base 51, the interface layer Μ, the line switching board 53, the probe assembly 54, and the limiting plate 55 have been separated, the interface layer 52, the line switching board 53 and the probe set = 54 cannot be discriminated. If the component is damaged, the operator must perform the inspection one by one, and then replace the components that have been damaged, and then reassemble all the components in the wiring substrate 50, causing cumbersome inconvenience in operation. Further, when the circuit conversion board 53 is assembled. On the interface layer 52, in order to ensure that the conductive contacts between the surface layer 52, the line conversion plate 53 and the probe assembly 54 are correctly electrically connected, the conductive contacts between the interface layer 52 and the line conversion plate 53 must pass once. Correction; again, when setting up probes When the device is placed on the line conversion board 53, the conductive contacts between the probe assembly 54 and the line conversion board 53 must be corrected once again. Therefore, the correction step is complicated, resulting in inconvenience in use. [New content] The main content of the textbook The purpose is to provide a test probe card, and it is desirable to improve the conventional probe card when any one of the interface layer, the line conversion board and the probe assembly is damaged, 'all components must be disassembled and tested one by one, and then each A component and the inconvenience of the re-assembly of the calibration step in the assembly process are complicated and complicated. The problem is complicated. -Exploration:: The technical means used in this creation is provided - an adapter module, including: a fixing frame, wherein a middle portion forms a hollow area; and a line adapter plate is detachably assembled in the fixing frame, and the line adapter plate is provided with a plurality of connecting lines at the hollow area of the corresponding fixing frame Each of the adapter lines respectively forms a contact on opposite sides of the line adapter board; and a probe module includes: a frame body having a hollowed out area formed therein; and an interface layer disposed on the frame body The interface layer has a complex intermediate line, and the intermediate line forms a contact on opposite sides of the interface layer; a probe component is disposed in the frame, and the probe component includes a plurality of probes, each of which a probe is in electrical contact with a contact of a corresponding interposer in the interface layer; and a fixing plate is provided with a frame, a probe assembly and an interface layer, wherein the fixing plate corresponds to the plurality of probes of the probe assembly An opening is formed, and the probe module is set on the fixing frame of the adapter module by the fixing plate, and the contact point of each intermediate line of the interface layer and the corresponding connecting line of the line adapter plate constitute electrical property. The test probe card of the hole, wherein the probe component is provided with a plurality of peeps and the plurality of probes are disposed in an area surrounded by the plurality of peepholes, and the interface layer is positioned at a position corresponding to the peephole The reference point is designed by the aforementioned test probe card, which is mainly constructed by using two independent modules of the adapter module and the probe module, if the circuit adapter board, the interface layer or the probe address part Any or more of the damages In the case of replacement, the adapter module and the probe module can be detached from each other, and the circuit adapter board, the interface layer or the probe component can be replaced independently, or can be directly replaced by a staff group. The creation avoids the complete detachment of the test device and can be modularized (4), which can improve the speed and convenience of re-assembling the creation, and can effectively improve the work efficiency. In addition, since the probe component and the interface layer are assembled on the frame, the probe component is provided with a plurality of peepholes, and the interface layer is provided with a clamp reference at a position corresponding to the peephole, and the point & It is only necessary to align the peephole with the positioning reference point to ensure that the interface layer and the probe assembly are properly connected, which is much more convenient than the prior art. [Embodiment] Referring to the preferred embodiment shown in FIG. 1, the prototype test probe card package includes an adapter module 1 and a probe module 2. The adapter module 1 includes a fixed frame n and a line adapter plate. The middle portion of the fixed frame 11 forms a hollow area 彳1〇. In the preferred embodiment, the fixed frame 11 is on the upper side of the hollow area 110. Further expanding to form a larger outer ring groove 111' can be further expanded to form a groove 112 (shown in FIG. 5) on the lower side of the hollow region 110. The line adapter plate 12 is disposed in the hollow area 11 〇 M421505 of the fixed frame 或 or, as in the preferred embodiment, the line arranging plate 12 is disposed in the installation slot 112 of the hollow area 110, and the line is turned The connecting plate 12 is provided with a plurality of connecting lines at the hollowed-out area 110 of the corresponding fixing frame, and each of the connecting lines forms a contact 120 on opposite sides of the line regulating plate 12, respectively. The probe module 2 includes a frame 20, a probe assembly 21, an interface layer 22 and a fixing plate 23. Wherein: the frame 20 can be a single member or a combination of a plurality of members. In the preferred embodiment, the frame 20 includes a bottom frame 200 and an upper frame 2〇1. The bottom frame 200 forms an elliptical annular body, and a middle portion of the bottom frame 200 forms a rectangular hollow portion 202. The upper side of the bottom frame 200 forms a positioning concave portion 203 on the outer periphery of the relatively long side of the rectangular hollow portion 202, respectively. A positioning groove 204 is formed on the upper side of the bottom frame, and a receiving groove 2〇5 is formed on the lower side of the hollow frame 2〇2 on the lower side of the bottom frame 200 (as shown in FIG. 5); the upper frame 2〇1 is a rectangular frame body, wherein The upper portion is formed with a hollowed out area 2〇6, and the upper frame 2〇1 is disposed on the upper side of the bottom frame 200 and is positioned in the hollowed-out area 202 of the bottom frame 200. The four ends of the upper frame 201 form an extension portion 207. It is provided in the positioning groove 204 of the bottom frame 200. The probe assembly 21 is disposed in the housing 20 and includes a single-ceramic plate 210 and a plurality of probes 211. The ceramic plate 21 is disposed on the upper side of the bottom frame 200 and the upper frame 201, and is received in the positioning recess 203 of the bottom frame 2〇〇. The outer ring of the 5th ceramic plate 210 is formed with a plurality of longitudinally penetrating holes. 212, and a thickness of the outer ring of the ceramic plate 210 is thinner between adjacent peepholes 212; the plurality of probes 211 are distributed and disposed within a region surrounded by the plurality of peepholes 212, and the plurality of probes 211 The top end of the ceramic plate 21 0 protrudes from the top side of the ceramic plate 21, please refer to FIG. 6. Each probe 2 is mainly connected to a M213505 probe head with a spring 213, and 213 provides electrical transmission and elastic force. The probe head of the probe 211 is disposed on the bottom of the frame by the spring layer and can be moved up and down with respect to the ceramic plate 210. The embodiment is disposed in the receiving groove 2 of the bottom frame 2〇0. In the case of (5), please refer to FIG. 7 and FIG. 8. The upper side of the interface layer 22 forms a positioning reference point 220 for the position of the plurality of peepholes 212, and a plurality of intermediaries are provided in the (four) domain of the plurality of positioning reference points 22q. Lines, each of the intermediate lines form an upper conductive contact 221 ' on the upper side of the interface layer 22 and a lower side of the interface layer 22 Into a lower conductive contacts 222. When the probe assembly 21 and the interface layer 22 are disposed on the frame 2, each of the positioning reference points 220 can correspond to the position of each of the peepholes 212 on the probe assembly 21, and each of the interface layers 22 The conductive contacts 221 are electrically connected to the bottom ends of the corresponding probes 211 respectively; therefore, it is only necessary to confirm that the puncture holes 212 and the positioning reference points 22 are aligned after installation, thereby ensuring that the interface layer 22 and the probe assembly 21 have been Form the correct electrical connection. The fixing plate 23 is formed in a ring shape, and a middle portion thereof defines a through opening 230. The fixing plate 23 defines a receiving groove 231 (shown in FIG. 5) on the lower side of the opening 23, and the receiving groove 231 is provided for the foregoing The top side of the needle assembly 21 is disposed therein, and the outer circumference of the opening 230 corresponds to the area of the probe hole 21 of the probe assembly 21 to form a notch 232, so that the peephole 212 and the probe 211 can be exposed to the opening 230 and the notch 232. The probe module 2 is locked in the outer ring groove 111 of the fixing frame 11 by the fixing plate 23 and locked to the fixing frame 11 to fix the frame body 2, the probe assembly 21 and the interface layer 22 thereto. The lower conductive contact 222 of the lower surface of the interface layer 22 is electrically connected to the contact 120 of the corresponding transfer line on the electrical board M421505. Please refer to the reference Η 2 (4) 5 for a schematic diagram of the preferred embodiment of the present invention mounted on a circuit carrier. The creation test probe card is applied to the wafer inspection device when the device is tested and the probe card is flipped and flipped, and the adapter module is used to fix the IU on the circuit carrier board of the wafer inspection tool 1Q. And electrically connecting the contact 12Q on the line fn board 12 with the corresponding contact on the circuit carrier 1G, and then passing each of the probes and the circuit carrier through the intermediate layer of the interface layer. The corresponding contacts 1GG on 1() constitute the microcomputer whose electrical contact is contacted with the contacts of the circuit carrier 1 () and electrically connected to the wafer inspection tool. Referring to FIG. 9, when wafer inspection is performed, a wafer 31 to be tested is placed on the carrier 30 of the wafer inspection tool, and the operator can operate the probe 211 in the present invention to electrically contact the wafer to be tested 31. Corresponding contacts on the wafer unit, and the microcomputer transmits the test signal to the wafer 31 to be tested through the probes 211, and receives the signal of the reaction of the wafer 31 to be tested, and the wafer unit is analyzed and judged by the microcomputer. Whether the function is correct, thereby testing the wafer. The design of the present invention is based on the detachable assembly of the adapter module 1 and the probe module 2, and if the circuit adapter plate 12 and the interface layer are damaged, the replacement is required. The adapter module 1 and the probe module 2 can be detached from each other to replace the line adapter board 12 on the adapter module 1 or replace the interface layer 22 on the probe module 2, so The whole component of the test device must be removed and separated. 'In addition' can also be carried out by using the adapter module or the probe module 2 to replace the entire module. Therefore, this creation enhances the speed and convenience of re-assembling the creation (4) and can be effective. Improve work efficiency. 9 [Simplified description of the drawings] FIG. 2 is a perspective view of a preferred embodiment of the present invention; FIG. 2 is a perspective view showing a preferred embodiment of the test probe card and a circuit board FIG. : Figure 2 combines a stereoscopic appearance. Figure 4: A partially enlarged plan view of Figure 2. Figure 5: Schematic cross-sectional view of Figure 4. Figure 6 is a partially enlarged schematic view of Figure 5. Figure 7: Stereoscopic view of the electrical adapter plate in this creation. Figure 8: Another perspective view of the electrical adapter plate in this creation. Figure 9 is a schematic view showing the state of use of the preferred embodiment of the present invention. Figure 10 is a schematic cross-sectional view of a conventional wafer test apparatus. 10 circuit carrier board 11 fixed frame 1 1 1 outer ring groove 12 line adapter plate 20 frame 201 upper frame 2 0 3 positioning recess 205 receiving groove 207 extension [main component symbol description] 1 adapter module 100 contact 11 hollow area 112 is provided slot 120 contact 2 probe module 200 bottom frame 202 hollow area 204 positioning slot 206 clock empty area