FI347374A - - Google Patents

Info

Publication number
FI347374A
FI347374A FI3473/74A FI347374A FI347374A FI 347374 A FI347374 A FI 347374A FI 3473/74 A FI3473/74 A FI 3473/74A FI 347374 A FI347374 A FI 347374A FI 347374 A FI347374 A FI 347374A
Authority
FI
Finland
Prior art keywords
single element
atomic layer
substrate
subjecting
elements
Prior art date
Application number
FI3473/74A
Other languages
English (en)
Finnish (fi)
Other versions
FI52359C (fi
FI52359B (no
Inventor
T Suntola
J Antson
Original Assignee
Instrumentarium Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to SE7400089A priority Critical patent/SE393967B/xx
Application filed by Instrumentarium Oy filed Critical Instrumentarium Oy
Priority to FI743473A priority patent/FI52359C/fi
Priority to ZA00757128A priority patent/ZA757128B/xx
Priority to NLAANVRAGE7513284,A priority patent/NL173824C/xx
Priority to AT0868675A priority patent/AT381122B/de
Priority to IL7548478A priority patent/IL48478A/xx
Priority to GB47212/75A priority patent/GB1495987A/en
Priority to AU86662/75A priority patent/AU505960B2/en
Priority to BR7507724*A priority patent/BR7507724A/pt
Priority to NO75753921A priority patent/NO143634C/no
Priority to CH1517475A priority patent/CH618469A5/de
Priority to IN2234/CAL/75A priority patent/IN143912B/en
Priority to CA240,388A priority patent/CA1066174A/en
Priority to US05/635,233 priority patent/US4058430A/en
Priority to BE162146A priority patent/BE835906A/xx
Priority to IT7529660A priority patent/IT1049804B/it
Priority to DE2553048A priority patent/DE2553048C3/de
Priority to DD189734A priority patent/DD122479A5/xx
Priority to SE7513336A priority patent/SE401986B/xx
Priority to FR7536480A priority patent/FR2292517A1/fr
Priority to DK539875A priority patent/DK152060C/da
Priority to CS758087A priority patent/CS249502B2/cs
Priority to JP14168175A priority patent/JPS5735158B2/ja
Priority to HU75IU282A priority patent/HU174175B/hu
Priority to SU752193253A priority patent/SU810085A3/ru
Priority to PL1975185107A priority patent/PL118412B1/pl
Publication of FI347374A publication Critical patent/FI347374A/fi
Application granted granted Critical
Publication of FI52359B publication Critical patent/FI52359B/fi
Publication of FI52359C publication Critical patent/FI52359C/fi
Priority to HK648/80A priority patent/HK64880A/xx
Priority to AT0868675A priority patent/ATA868675A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
    • C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
    • C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02543—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02557—Sulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/025—Deposition multi-step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/935—Gas flow control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/971—Stoichiometric control of host substrate composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
FI743473A 1974-11-29 1974-11-29 Menetelmä ja laite yhdisteohutkalvojen kasvattamiseksi. FI52359C (fi)

Priority Applications (28)

Application Number Priority Date Filing Date Title
SE7400089A SE393967B (sv) 1974-11-29 1974-01-04 Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
FI743473A FI52359C (fi) 1974-11-29 1974-11-29 Menetelmä ja laite yhdisteohutkalvojen kasvattamiseksi.
ZA00757128A ZA757128B (en) 1974-11-29 1975-11-12 Procedure and apparatus for producing compound thin films
NLAANVRAGE7513284,A NL173824C (nl) 1974-11-29 1975-11-13 Werkwijze voor het op een oppervlak doen aangroeien van dunne films van een verbinding.
AT0868675A AT381122B (de) 1974-11-29 1975-11-14 Verfahren zum zuechten von verbindungs -duennschichten
IL7548478A IL48478A (en) 1974-11-29 1975-11-14 Process and apparatus for producing compound thin films on a surface by deposition from the gaseous phase
GB47212/75A GB1495987A (en) 1974-11-29 1975-11-17 Methods of producing compound thin films on substrates
AU86662/75A AU505960B2 (en) 1974-11-29 1975-11-17 Monatomic epitaxial layer coating
BR7507724*A BR7507724A (pt) 1974-11-29 1975-11-21 Processo e aparelho para producao de peliculas finas compostas
NO75753921A NO143634C (no) 1974-11-29 1975-11-21 Fremgangsmaate for fremstilling av tynne hinner av en forbindelse paa et substrat
IN2234/CAL/75A IN143912B (no) 1974-11-29 1975-11-24
CH1517475A CH618469A5 (no) 1974-11-29 1975-11-24
BE162146A BE835906A (fr) 1974-11-29 1975-11-25 Procede et appareil de formation de pellicules minces de composes
US05/635,233 US4058430A (en) 1974-11-29 1975-11-25 Method for producing compound thin films
CA240,388A CA1066174A (en) 1974-11-29 1975-11-25 Method for producing compound thin films
IT7529660A IT1049804B (it) 1974-11-29 1975-11-26 Procedimento e apparecchio per produrre pellicce composte sottili per deposizione dalla fase gassosa
DE2553048A DE2553048C3 (de) 1974-11-29 1975-11-26 Verfahren zum epitaktischen Aufwachsen von Verbindungs-DünnschJchten auf einem Substrat
SE7513336A SE401986B (sv) 1974-11-29 1975-11-27 Forfarande for att bygga upp tunna hinnor av en kemisk forening fran gasformigt tillstand genom att avlagra foreningens kemiska grundemneskomponenter och anordning for utforande av forfarandet
DD189734A DD122479A5 (no) 1974-11-29 1975-11-27
DK539875A DK152060C (da) 1974-11-29 1975-11-28 Fremgangsmaade til opbygning af tynde hinder af en forbindelse paa et substrat
FR7536480A FR2292517A1 (fr) 1974-11-29 1975-11-28 Procede et appareil de formation de pellicules minces de composes
CS758087A CS249502B2 (en) 1974-11-29 1975-11-28 Method of compounds' thin layers formation
JP14168175A JPS5735158B2 (no) 1974-11-29 1975-11-28
HU75IU282A HU174175B (hu) 1974-11-29 1975-11-28 Sposob poluchenija tonkikh sloev
SU752193253A SU810085A3 (ru) 1974-11-29 1975-11-28 Способ получени составных пленокНЕОРгАНичЕСКиХ СОЕдиНЕНий
PL1975185107A PL118412B1 (en) 1974-11-29 1975-11-29 Process for manufacturing epitaxial thin film of chemical compound from chemical elements of this compoundheskogo soedinenija iz khimicheskikh ehlementov ehtogo soedinenija
HK648/80A HK64880A (en) 1974-11-29 1980-11-13 Improvements in methods of producing compound thin films on substrates
AT0868675A ATA868675A (de) 1974-11-29 1985-11-14 Verfahren zum zuechten von verbindungs -duennschichten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI743473A FI52359C (fi) 1974-11-29 1974-11-29 Menetelmä ja laite yhdisteohutkalvojen kasvattamiseksi.

Publications (3)

Publication Number Publication Date
FI347374A true FI347374A (no) 1976-05-30
FI52359B FI52359B (no) 1977-05-02
FI52359C FI52359C (fi) 1977-08-10

Family

ID=8508475

Family Applications (1)

Application Number Title Priority Date Filing Date
FI743473A FI52359C (fi) 1974-11-29 1974-11-29 Menetelmä ja laite yhdisteohutkalvojen kasvattamiseksi.

Country Status (26)

Country Link
US (1) US4058430A (no)
JP (1) JPS5735158B2 (no)
AT (2) AT381122B (no)
AU (1) AU505960B2 (no)
BE (1) BE835906A (no)
BR (1) BR7507724A (no)
CA (1) CA1066174A (no)
CH (1) CH618469A5 (no)
CS (1) CS249502B2 (no)
DD (1) DD122479A5 (no)
DE (1) DE2553048C3 (no)
DK (1) DK152060C (no)
FI (1) FI52359C (no)
FR (1) FR2292517A1 (no)
GB (1) GB1495987A (no)
HK (1) HK64880A (no)
HU (1) HU174175B (no)
IL (1) IL48478A (no)
IN (1) IN143912B (no)
IT (1) IT1049804B (no)
NL (1) NL173824C (no)
NO (1) NO143634C (no)
PL (1) PL118412B1 (no)
SE (2) SE393967B (no)
SU (1) SU810085A3 (no)
ZA (1) ZA757128B (no)

Families Citing this family (898)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI117944B (fi) 1999-10-15 2007-04-30 Asm Int Menetelmä siirtymämetallinitridiohutkalvojen kasvattamiseksi
FI118158B (sv) * 1999-10-15 2007-07-31 Asm Int Förfarande för modifiering av utgångsämneskemikalierna i en ALD-prosess
FI119941B (fi) * 1999-10-15 2009-05-15 Asm Int Menetelmä nanolaminaattien valmistamiseksi
US4207836A (en) * 1977-07-01 1980-06-17 Hitachi, Ltd. Vacuum vapor-deposition apparatus
US4313338A (en) * 1978-08-18 1982-02-02 Matsushita Electric Industrial Co., Ltd. Gas sensing device
US4239584A (en) * 1978-09-29 1980-12-16 International Business Machines Corporation Molecular-beam epitaxy system and method including hydrogen treatment
DE2847620C2 (de) * 1978-11-02 1984-10-18 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Herstellung von elektrischen Bauelementen, insbesondere Schichtkondensatoren
FI57975C (fi) * 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande och anordning vid uppbyggande av tunna foereningshinnor
US4289797A (en) * 1979-10-11 1981-09-15 Western Electric Co., Incorporated Method of depositing uniform films of Six Ny or Six Oy in a plasma reactor
US4261771A (en) * 1979-10-31 1981-04-14 Bell Telephone Laboratories, Incorporated Method of fabricating periodic monolayer semiconductor structures by molecular beam epitaxy
DE3040693A1 (de) * 1979-11-08 1981-05-27 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zur metallisierung von halbleiterbauelementen
EP0090817B1 (en) * 1981-10-15 1986-01-08 Prutec Limited Thin films of compounds and alloy compounds of group iii and group v elements
FI64878C (fi) * 1982-05-10 1984-01-10 Lohja Ab Oy Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer
JPS5950027A (ja) * 1982-09-13 1984-03-22 Hitachi Ltd 二硫化チタン薄膜およびその形成法
US4664960A (en) * 1982-09-23 1987-05-12 Energy Conversion Devices, Inc. Compositionally varied materials and method for synthesizing the materials
US4520039A (en) * 1982-09-23 1985-05-28 Sovonics Solar Systems Compositionally varied materials and method for synthesizing the materials
US4483725A (en) * 1982-09-30 1984-11-20 At&T Bell Laboratories Reactive vapor deposition of multiconstituent material
JPS59156996A (ja) * 1983-02-23 1984-09-06 Koito Mfg Co Ltd 化合物結晶膜の製造方法とその装置
US4523051A (en) * 1983-09-27 1985-06-11 The Boeing Company Thin films of mixed metal compounds
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
JPS60110163U (ja) * 1983-12-29 1985-07-26 スズキ株式会社 パ−キングブレ−キケ−ブルの配索構造
JPS60202927A (ja) * 1984-03-28 1985-10-14 Nippon Telegr & Teleph Corp <Ntt> ３−５族元素化合物半導体層の形成法
US4592926A (en) * 1984-05-21 1986-06-03 Machine Technology, Inc. Processing apparatus and method
JPH0766906B2 (ja) * 1984-07-26 1995-07-19 新技術事業団 ＧａＡｓエピタキシャル成長方法
GB2162862B (en) * 1984-07-26 1988-10-19 Japan Res Dev Corp A method of growing a thin film single crystalline semiconductor
JPH0766910B2 (ja) * 1984-07-26 1995-07-19 新技術事業団 半導体単結晶成長装置
GB2162207B (en) 1984-07-26 1989-05-10 Japan Res Dev Corp Semiconductor crystal growth apparatus
US5294286A (en) * 1984-07-26 1994-03-15 Research Development Corporation Of Japan Process for forming a thin film of silicon
JPH0766909B2 (ja) * 1984-07-26 1995-07-19 新技術事業団 元素半導体単結晶薄膜の成長法
GB8421162D0 (en) * 1984-08-21 1984-09-26 British Telecomm Growth of semi-conductors
US4622083A (en) * 1985-03-11 1986-11-11 Texas Instruments Incorporated Molecular beam epitaxial process
JPS61210679A (ja) * 1985-03-15 1986-09-18 Sony Corp 半導体装置
US5250148A (en) * 1985-05-15 1993-10-05 Research Development Corporation Process for growing GaAs monocrystal film
US6077718A (en) * 1985-07-23 2000-06-20 Canon Kabushiki Kaisha Method for forming deposited film
US5769950A (en) * 1985-07-23 1998-06-23 Canon Kabushiki Kaisha Device for forming deposited film
US5261961A (en) * 1985-07-23 1993-11-16 Canon Kabushiki Kaisha Device for forming deposited film
JPH0817159B2 (ja) * 1985-08-15 1996-02-21 キヤノン株式会社 堆積膜の形成方法
AU590327B2 (en) * 1985-09-09 1989-11-02 Sumitomo Electric Industries, Ltd. Method of growth of thin film layer for use in a composite semiconductor
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US4058430A (en) 1977-11-15
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SE393967B (sv) 1977-05-31
IN143912B (no) 1978-02-05
ZA757128B (en) 1976-10-27
DE2553048B2 (de) 1978-11-30
PL118412B1 (en) 1981-10-31
NL173824B (nl) 1983-10-17
FI52359C (fi) 1977-08-10
CH618469A5 (no) 1980-07-31
FR2292517B1 (no) 1982-04-02
ATA868675A (de) 1986-01-15
NO143634B (no) 1980-12-08
DE2553048A1 (de) 1976-06-10
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CA1066174A (en) 1979-11-13
AU505960B2 (en) 1979-12-06
AT381122B (de) 1986-08-25
NO143634C (no) 1981-03-18
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CS249502B2 (en) 1987-03-12
IL48478A (en) 1978-12-17
AU8666275A (en) 1977-05-26
NL173824C (nl) 1984-03-16
IT1049804B (it) 1981-02-10
FI52359B (no) 1977-05-02
SE401986B (sv) 1978-06-12
IL48478A0 (en) 1976-01-30
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HU174175B (hu) 1979-11-28
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BE835906A (fr) 1976-03-16

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