US20040177813A1 - Substrate support lift mechanism - Google Patents

Substrate support lift mechanism Download PDF

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Publication number
US20040177813A1
US20040177813A1 US10387619 US38761903A US2004177813A1 US 20040177813 A1 US20040177813 A1 US 20040177813A1 US 10387619 US10387619 US 10387619 US 38761903 A US38761903 A US 38761903A US 2004177813 A1 US2004177813 A1 US 2004177813A1
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Prior art keywords
substrate
support
gimbal
assembly
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US10387619
Inventor
Eric Schieve
Keith Koai
David Or
Rene Correa
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Applied Materials Inc
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Applied Materials Inc
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

An apparatus for positioning a substrate support within a processing chamber is provided. In one embodiment, an apparatus for positioning a substrate support includes a gimbal mechanism having radially aligned clamping that substantially prevents movement from a pre-defined plane of a substrate support coupled to the gimbal mechanism during clamping. In another embodiment, an apparatus for positioning a substrate support includes substrate support disposed in a processing chamber. A stem, coupled to the substrate support, extends through the processing chamber and is coupled to a gimbal assembly. The gimbal assembly has a radial clamping mechanism is adapted to adjust a planar orientation of the substrate support about a plurality of axes without exerting rotational moments on the substrate support during clamping. A bearing assembly, having a first carriage block and a second carriage block, is coupled to the gimbal assembly. An actuator is coupled to at least one of the carriage blocks and is adapted to control the elevation of the substrate support within the processing chamber.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    Embodiments of the present invention generally relate to a lift mechanism for controlling the position of a substrate support in a processing chamber.
  • [0003]
    2. Description of the Related Art
  • [0004]
    Many semiconductor processing operations, for example, chemical vapor deposition, physical vapor deposition and etch, among others, are performed in a vacuum environment. Typically, a substrate is positioned on a movable substrate support disposed within a processing chamber. The elevation of the substrate support is controlled by a lift mechanism so that the substrate may be disposed at a lower position within the processing chamber to facilitate substrate transfer and an elevated position that typically enhances substrate processing. As the spacing between the top of the processing chamber and the substrate seated on the substrate support may be 200 mils or closer when in the elevated position, the parallelism between the top of the processing chamber and the substrate support is a major attribute in maintaining process uniformity across the width of the substrate and ensuring process repeatability between substrates. For example, if one edge of the substrate is closer to the top of the processing chamber than another edge of the substrate, gases flowing between the substrates and the top of the processing chamber will be inclined to disadvantageously flow predominantly through the portion of the gap having the widest spacing, resulting in process non-uniformity across the width of the substrate. Additionally, variations in the distance between the substrate and the top of the processing chamber will typically result in process non-uniformity in plasma enhanced processes. As the intensity of the plasma formed between the substrate and the top of the processing chamber is dependent on the strength of the electrical field defined between the substrate support and the top of the processing chamber, which in turn is dependent on the distance between the substrate support and the top of the processing chamber. If this distance is not uniform, the plasma will not be uniform across the width of the substrate support and will contribute to process non-uniformity. Additionally, in the extreme cases, if the plane of the substrate support is not orientated perpendicular to the center line of the chamber, the plane of a wafer supported thereon may be skewed relative to the plane of operation of a transfer robot utilized to transfer the substrate to and from the processing chamber. In such instances, the end effector of the transfer robot may inadvertently collide with the substrate, causing particular generation and possibly knocking the substrate out of alignment. Moreover, if the lift pin mechanism is not parallel with the substrate support, the lift pins utilized to space the substrate from the substrate support may not extend uniformly through the substrate support, thereby causing the substrate to be supported in a skewed position that may lead to damage during transfer with the transfer robot as described above.
  • [0005]
    Typically, most substrate supports are coupled to their lift mechanisms by a mechanism in a manner that allows for the plane of the substrate support to be adjusted perpendicular to the center line of the processing chamber. However, many of the adjustment mechanisms utilized to level the substrate support are difficult to secure in a desired position. Furthermore, most adjustment mechanisms do not provide against drift during the securing procedures that is detrimental to systems requiring close parallelism tolerancing.
  • [0006]
    [0006]FIG. 8 depicts one embodiment of a conventional clamping arrangement 800 that is commonly utilized in a processing chamber 820 to couple a substrate support 810 to a lift mechanism 816. The clamping arrangement 800 typically has a clamp block 802 having a hole 804 disposed therethrough. The hole 804 accepts a shaft 806 extending from a lower portion of a stem 808 supporting the substrate support 810. Thus, as the orientation of the shaft 806 within the clamp block 806 is adjusted, the angle of the plane of the substrate support may be adjusted about the center line of the shaft 806.
  • [0007]
    A disadvantage of such a clamping arrangement 800 is that a clamp screw 812 utilized to clamp hole 804 around the shaft 806 imparts a tangential force upon the shaft 802, thus exerting a rotational moment upon the substrate support 810 as shown by arrow 814. Thus, as the substrate support 810 is being clamped into position, the clamping force, tangential to the shaft 806, causes the parallelism of the substrate support 810 to disadvantageously draft away from a predefined, desired position.
  • [0008]
    Therefore, there is a need for an apparatus for controlling the position of a substrate support.
  • SUMMARY OF THE INVENTION
  • [0009]
    An apparatus for positioning a substrate support within a processing chamber is provided. In one embodiment, an apparatus for positioning a substrate support includes a gimbal mechanism having radially aligned clamping that substantially prevents movement from a pre-defined plane of a substrate support coupled to the gimbal mechanism during clamping. In another embodiment, an apparatus for positioning a substrate support includes substrate support disposed in a processing chamber. A stem, coupled to the substrate support, extends through the processing chamber and is coupled to a gimbal assembly. The gimbal assembly has a radial clamping mechanism that is adapted to adjust a planar orientation of the substrate support about a plurality of axes without exerting rotational moments on the substrate support during clamping. A bearing assembly, having a first carriage block and a second carriage block, is coupled to the gimbal assembly. An actuator is coupled to at least one of the carriage blocks and is adapted to control the elevation of the substrate support within the processing chamber.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0010]
    A more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof that are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
  • [0011]
    [0011]FIG. 1 is a simplified sectional view of a semiconductor processing chamber having a substrate support lift assembly of the present invention;
  • [0012]
    FIGS. 2A-B are sectional side and front views of one embodiment of a bearing assembly;
  • [0013]
    [0013]FIG. 3 is an exploded view of one embodiment of a gimbal assembly;
  • [0014]
    [0014]FIG. 4 is a sectional view of a gimbal assembly taken along section lines 4-4 of FIG. 3;
  • [0015]
    [0015]FIG. 5 is a sectional view of a gimbal assembly taken along section line 5-5 of FIG. 3;
  • [0016]
    [0016]FIG. 6 is a sectional view of one embodiment of a lift pin actuation mechanism;
  • [0017]
    [0017]FIG. 7 is a sectional view of the lift pin actuation mechanism taken along section line 7-7 of FIG. 6; and
  • [0018]
    [0018]FIG. 8 is a sectional view of a conventional clamping arrangement utilized to couple a substrate support to a lift mechanism.
  • [0019]
    To facilitate understanding, identical reference numerals have been used, wherever possible, to designate identical elements that are common to the figures.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • [0020]
    [0020]FIG. 1 is a simplified sectional view of a semiconductor processing chamber 100 having a substrate support lift assembly 102 for controlling the elevation of a substrate support 104 disposed within the processing chamber 100. Examples of processing chambers that may be adapted to benefit from the invention include WzX® and TxZ™ metal chemical vapor deposition chambers, both available from Applied Materials, Inc. located in Santa Clara, Calif. Although one embodiment of the substrate support lift assembly is illustrated coupled to a chemical vapor deposition chamber, the substrate support lift assembly may be utilized in other processing chambers such as physical vapor deposition chambers, etch chambers, ion implant chambers, rapid thermal anneal chambers, among other chambers wherein parallelism of the substrate support and a lid of the chamber is desirable.
  • [0021]
    The processing chamber 100 typically includes sidewalls 106 and a bottom 108 that support a lid 110 to define an interior volume 112 of the processing chamber. The processing chamber 100 is typically fabricated from a monolithic block of aluminum or welded from stainless steel plates. At least one wall 108 of the processing chamber 100 includes a substrate access port 114 to facilitate entry and egress of substrates from the processing chamber 100.
  • [0022]
    An exhaust port 146 is typically disposed in the sidewalls 106 or bottom 108 of the processing chamber 100 and is coupled to a pumping system 148. The pumping system 148 generally includes various pumping components such as throttle valves and turbomolecular pumps to evacuate and maintain the interior volume 112 of the processing chamber 100 at a predefined pressure during processing.
  • [0023]
    The lid 110 of the processing chamber 100 is typically removable to allow access to the interior volume 112 of the processing chamber 100. A showerhead 116 is coupled to an interior side 118 of the lid 110 to facilitate uniform distribution of process gases within the processing chamber 100 and across the surface of a substrate 120 positioned on the substrate support 104 during processing. One example of suitable showerhead is described in U.S. patent application Ser. No. 09/603,117, filed Jun. 22, 2000, which is hereby incorporated by reference in its entirety.
  • [0024]
    A gas source 122 is typically coupled to the processing chamber 100 to provide process and other gases to the interior volume 112. In one embodiment, the lid 110 includes an inlet 124 through which process and/or other gases are provided from the gas source 122 to a plenum defined between the showerhead 116 and the interior surface 112 of the lid 110. The plenum allows the process and other gases provided into the interior volume 112 of the processing chamber 100 to spread across the backside of the showerhead 116, thereby enhancing uniformity of gas distribution through the showerhead 116 and across the substrate 120.
  • [0025]
    The substrate support 104 is disposed in the interior volume 112 of the processing chamber 100 and may be controlled in elevation along a central axis 150 between a processing position approximate the showerhead 116 and a lower transfer position aligned with the access port 114. The substrate support 104 may be a susceptor, heater, vacuum chuck, an electrostatic chuck or other platform for supporting the substrate 120 during processing or transfer. The substrate support 104 may be fabricated from ceramic, aluminum, stainless steel or other materials compatible with processing temperatures and chemistries. Two examples of substrate supports which may be adapted to benefit from the invention are described in U.S. patent application Ser. No. 09/596,854, filed Jun. 19, 2000 and U.S. patent application Ser. No. 10/055,634, filed Jan. 22, 2002, both of, which are hereby incorporated by reference in their entireties.
  • [0026]
    The substrate support 104 has an upper surface 126 that supports the substrate 120 and an opposing lower surface 128 facing the chamber bottom 108. A plurality of holes 130 (one is shown in FIG. 1) are formed through the substrate support 104 and are adapted to receive lift pins 132 utilized to space the substrate 120 from the upper surface 126 during substrate transfer. The lift pins 132 typically have a flared first end 134 that is flush with, or slightly recessed from, the upper surface 126 of the substrate support 104 and a second end 136 that extends beyond the lower surface 128 of the substrate support 104.
  • [0027]
    The second end 136 of the lift pins 132 may be selectively actuated by a lift pin actuation mechanism 138. The lift pin actuation mechanism 138 displaces the second end 136 of the lift pins 132 toward the lower surface 128 of the substrate support 104, thereby causing the flared first end 134 of the lift pins 132 to project above the upper surface 126 to space the substrate 120 from the substrate support 104. One lift pin mechanism that may be adapted to benefit from the invention is described in U.S. patent Ser. No. 09/698,814 filed Oct. 26, 2000, which is hereby incorporated by reference in its entirety.
  • [0028]
    A stem 140 is disposed through an aperture 142 formed in the bottom 108 of the processing chamber 100 and connects the substrate support 104 to the substrate support lift mechanism 102. The stem 140 is typically hollow and/or includes passages formed therethrough to facilitate coupling of power leads, sensors, control lines, fluid lines and other utilities (not shown) from the substrate support 104 to the exterior of the processing chamber 100. A bellows 144 is typically provided circumscribing the stem 140 to provide a flexible seal that facilitates elevation control of the substrate support 104 without vacuum leakage from the interior volume 112 of the processing chamber 100.
  • [0029]
    The substrate support lift mechanism 102 is configured to allow the substrate support 104 to be adjusted along five axes and typically includes an actuator 160, a bearing assembly 162 and a gimbal assembly 164. In one embodiment, the bearing assembly 162 is coupled to the exterior side of the chamber bottom 108. The gimbal assembly 164 is coupled between the stem 140 and the bearing assembly 162 and is driven by the actuator 160 to control the elevation of the substrate support 104.
  • [0030]
    FIGS. 2A-B are sectional side and front views of one embodiment of the bearing assembly 162. The bearing assembly 162 is mounted to the chamber bottom 108 by a mounting bracket 230. The mounting bracket 230 includes a base 214 coupled to the chamber bottom 108 by a plurality of fasteners 216. A mounting flange 232 extends from the base 214 and is coupled to the bearing assembly 162 by a plurality of fasteners 234.
  • [0031]
    The bearing assembly 162 includes a rectangular frame 202 and at least two carriage blocks 204, 206. The rectangular frame 202 has a first end 208 adapted for coupling to the chamber bottom 108 separated from a second end 210 by two longitudinal members 212. A center member 244 is coupled between the two longitudinal members 212 to form a c-section. The center member 244 provides geometrical stability of the two longitudinal members 212. The center member 244 includes a plurality of mounting holes 242 through which the plurality of fasteners 234 pass through and thread into a threaded hole 238 formed in the mounting flange 232 of the mounting bracket 230.
  • [0032]
    The facing surfaces of the longitudinal members include bearing surfaces 218 between which the carriage blocks 204, 206 ride. The bearing surfaces 218 may be an integral part of the longitudinal members 212 or may alternatively be a separate outer race of a bearing that facilitates movement of the blocks 204, 206 along the frame 202.
  • [0033]
    The bearing surfaces 218 and the carriage blocks 204, 206 form the inner and outer race for a plurality of bearings (not shown) disposed between the carriage blocks 204, 206 and the frame 202. The bearings may be ball, pin or tapered and are typically captured to recirculate about each carriage block 204, 206. Each carriage block 204, 206 includes a plurality of mounting holes 220 to facilitate coupling the bearing assembly 162 to the gimbal assembly 164. In the embodiment depicted in FIGS. 2A-B, each carriage block 204, 206 includes four mounting holes 220 that are threaded to accept a fastener 246 (shown in phantom in FIG. 2A) utilized to secure the bearing assembly 162 and gimbal assembly 164.
  • [0034]
    The actuator 160 is typically mounted to the second end 210 of the frame 202 but may alternatively be mounted in other configurations that allow the actuator 160 to control the position of the carriage blocks 204, 206 relative to the frame 202. The actuator 160 may be an electric motor, air motor, pneumatic cylinder, hydraulic cylinder, solenoid, ball screw, lead screw or other motion device adapted to control the linear position of the carriage blocks 204, 206. The actuator 160 is coupled to a controller 222 that controls the actuator's motion. In the embodiment depicted in FIG. 2B, the actuator 160 is a stepper motor or server motor that drives a lead screw 224. The lead screw 224 passes through a thrust nut 226 disposed or otherwise coupled to the second carriage block 206. As the actuator 160 controllably rotates the lead screw 224, the lead screw 224 imparts a force on the nut 226 held stationary in the second carriage block 206 that causes the nut 226 and carriage block 206 to move along the frame 202.
  • [0035]
    One or more sensors 228 are typically coupled to the substrate support lift assembly 102 to provide positional feedback to the controller 222 indicative of the elevation of the substrate support 104 within the processing chamber 100. The sensors 228 may include LVDT sensors, proximity sensors, read switches, Halifax switches, proximity switches, limit switches, motor encoders and the like. In the embodiment depicted in FIG. 2B, the sensors 228 comprise a first proximity switch and a second proximity switch coupled to the frame 202 of the bearing assembly 162. As the carriage blocks 204, 206 move between first and second ends 208, 210 of the frame 202, the presence of at least one of the carriage blocks 204, 206 adjacent the proximity switch (e.g., sensor 228) changes the state or output of that switch, thereby indicating the arrival of the substrate support 104 to a predefined position. The position of the sensors 228 on the frame 202 is adjustable so that the stroke of the substrate support 104 may be set within a predefined range of motion and adjust to a predefined elevation within the processing chamber 100. By incorporating two carriage blocks 202, 206 within the frame 202, the vacuum forces that act upon the substrate support 104 within the internal volume 112 of the processing chamber 100 which result in high tortional loads on the lift assembly that are distributed over larger load bearing surface areas, dramatically minimizing overall mechanical deflection, and thereby advantageously maintaining the parallelism of the substrate support 104 and the showerhead 116. This dual carriage bearing assembly 162 provides about a four-fold improvement in lateral deflection over conventional single carriage bearing assemblies.
  • [0036]
    [0036]FIG. 3 depicts an exploded view of one embodiment of the gimbal assembly 164. The gimbal assembly 164 includes a clamp block 302, a yoke 304 and a gimbal base 306. The clamp block 302 is typically fabricated from aluminum or another suitable material and includes a plurality of mounting holes 308 utilized to couple the gimbal assembly 164 to the carriage blocks 204, 206. In the embodiment depicted in FIG. 3, each of the mounting holes 308 includes a counterbore 310 adapted to receive the head of each fastener 246 (one is shown in FIG. 3) which threads into a respective one of the mounting holes 220 formed in the carriage blocks 204, 206.
  • [0037]
    The clamp block 302 includes a clamping aperture 314 formed therein. The clamping aperture 314 is adapted to receive a post 318 extending from the yoke 304 to secure the orientation of the yoke 304 within the clamp block 302 while allowing axial and rotational adjustment of the post 318 relative to the clamping aperture 314.
  • [0038]
    [0038]FIG. 4 is a sectional view of the clamp block 302 depicting one embodiment of the clamping aperture 314. The clamping aperture 314 is typically formed at least partially through the clamp block 302 in an orientation substantially perpendicular to the central axis 150 of the substrate support 104. A slot 402 is formed at least partially through the clamp block 302 in communication with the clamping aperture 314. The slot 402 is typically radially aligned with a center 404 of the clamping aperture 314. The slot 402 is adapted to receive a plunger 406 that may be urged through the slot 406 against the post 318 of the yoke 304, thereby fixing the position and rotational orientation of the yoke 304 relative to the clamp block 302. The plunger 406 may be urged against the post 318 and yoke 304 through any suitable means, including screws, motors, solenoids, over center clamps, clamps, electrostatic force, and the like.
  • [0039]
    In the embodiment depicted in FIG. 4, the clamp block 302 includes a first surface 410 disposed opposite a second surface 412 and separated by lateral surfaces 414. The lateral surfaces 414 are typically configured to guide the plunger 406 within the slot 402 so that a center 416 of the first surface 410 is urged into radial engagement with the post 318. A fastener 418 is disposed through a threaded hole 422 formed in a web 420 that bounds the end of the slot 402 opposite the clamping aperture 314. As the fastener 418 is threaded through the web 420, an end of the fastener 418 in contact with the post 318 urges the plunger 406 against the post 318 of the yoke 304, thereby securely clamping the post 318 in the aperture 314 of the clamp block 302. A jam nut or equivalent fixing method may be utilized to prevent the fastener 418 from backing out of the web 420 and allowing the post 318 to move. As the plunger 406 remains radially aligned with the aperture 314 and post 318 of the yoke 304 along an imaginary line 426 defined by the center of the aperture 314 and passing through the center of the slot 402, the clamping force is radially aligned and prevents the generation torque during clamping, advantageously preventing the yoke 304 from rotating relative to the clamp block 302 during clamping. Additionally, the angular orientation of the yoke 302 is advantageously maintained during clamping which preserves the parallelism of the substrate support 104 to the showerhead 116 within the processing chamber 100 during clamping.
  • [0040]
    To further prevent torque generation during clamping that could cause the yoke 304 to rotate relative to the clamp block 302, a clamping surface 424 of the plunger 406 may be configured to contact the post 318 at two locations. For example, the clamping surface 424 of the plunger 406 may include a “V” configuration, a step, depression, a radius or a curved surface configured to mate with the post 318 at at least two locations equidistance from the center.
  • [0041]
    Returning to FIG. 3, the yoke 304 is typically fabricated from aluminum or other suitable rigid material and includes a bifurcated end 330 extending from the post 318. The bifurcated end 330 includes a cross member 332 centered on the post 318 and arranged in a substantially perpendicular orientation relative to the center axis of the post 318. A first mounting flange 334 is formed on a first end 338 of the cross member 332. A second mounting flange 336 is formed on a second end 340 of the cross member 332 and is typically oriented parallel with the central axis of the post 318.
  • [0042]
    Each mounting flange 334, 336 includes an upper side 342 and a lower side 344 separated by facing inner lateral sides 346. The lateral sides 346 of the adjacent mounting flanges 334, 336 define a space between the mounting flanges 334, 336 configured to allow routing of the various conduits and wires routed out of the stem 140.
  • [0043]
    In one embodiment, the upper side 342 of each flange 334, 336 is accurate to facilitate adjusting the orientation of the gimbal base 306 seated on the mounting flange 334, 336. In the embodiment depicted in FIG. 3, the curvature of the upper side 342 typically has a radius of about 305 to about 304 mm relative to an axis 348 oriented substantially perpendicular to an offset from the central axis of the post 318. The lower side 334 of each mounting flange 334, 336 is typically convex and configured to have a radius defined from the axis 348.
  • [0044]
    Each mounting flange 334, 336 includes a slot 350 formed therethrough between the upper and lower sides 342, 344. The slot 350 is configured to accept a fastener or stud 352 extending from the gimbal base 306. A clamping block 354 is typically disposed on the portion of the stud 352 extending through the lower side 344 of the mounting flanges 334, 336. A nut 356 is threaded onto each of the studs 352 and may be tightened to urge a bottom surface 370 of the gimbal base 306 against the upper side 342 of the mounting flanges 334, 336. A contact surface 358 of the clamping block 354 typically is configured with the same radius as the lower side 344 of the mounting flanges 334, 336 to maintain axial tension on the studs 352 that substantially eliminates lateral drift of the studs 352 along the lower side 344 of the mounting flanges 334, 336 as the nuts 356 are tightened. Advantageously, this arrangement for coupling the gimbal base 306 to the yoke 304 allows the support surface of the substrate support 104 to be adjusted about an axis 348 perpendicular to the central axis of the yoke 304 and secured in that position without inducing any lateral forces on the stud that could compromise the parallelism of the substrate support 104 and the showerhead 116.
  • [0045]
    [0045]FIG. 5 is a sectional view of the yoke 304 and gimbal base 306. To further enhance the precision of the alignment between the gimbal base 306 and the yoke 304, the bottom surface 370 of the gimbal base 306 that engages the upper side 342 of each mounting flange 334, 336 is configured to contact the upper side 342 of the mounting flanges 334, 336 in two places. For example, in the embodiment depicted in FIG. 5, a stepped depression 534 is formed in the bottom surface 370 around each stud 352. The stepped depressions 534 provide dual contact points that are symmetrical about the studs 352, thus preventing the gimbal base 306 from rocking on the yoke 304 as the nuts 356 are tightened and thereby maintaining the desired planar orientation of the substrate support 104 during clamping.
  • [0046]
    Referring additionally to FIG. 3, the gimbal base 306 is typically configured with a slot or central aperture 360 to facilitate routing of the various conduits and wires exiting the stem 140. The gimbal base 306 also includes a plurality of mounting holes 362 formed therein that respectively accept a plurality of fasteners 364 (one of which are shown in FIG. 3) that thread into a threaded hole 534 formed in a base plate 320 of the stem 140 thereby coupling the gimbal base 306 to the stem 140. The mounting holes 362 include a counter bore 530 having that allows the fasteners 364 to seat below the bottom surface 370 of the gimbal base 306. Holes 532 formed in the yoke 304 substantially align with the counter bores 530 and are of sufficient diameter that allows passage of the fasteners 364 through the yoke 304 and into the gimbal base 306 through a range of angular orientation between the yoke 304 and into the gimbal base 306, thereby allowing the substrate support 104 to be removed after angular alignment of the substrate support 104. The holes 532 may optionally be part of the slot 350. As the gimbal assembly 164 is not susceptible to drift due to the axial and radial loading of the clamping mechanisms, the base plate 320 of the stem 140 may be unfastened from the gimbal base 306 to facilitate removal, surface and/or replacement of the substrate support 104 without having to realign the substrate support 104 relative to the plane of the lid 110 and showerhead 116 upon re-installation of the substrate support 104.
  • [0047]
    [0047]FIG. 6 depicts one embodiment of the lift pin actuation mechanism 138. The lift pin actuation mechanism 138 typically includes an annular lift plate 602 that is disposed below the second end 136 of the lift pins 132 and circumscribes the stem 140. The lift plate 602 is typically fabricated from aluminum and may include a plurality of ceramic contact pads 604 adapted to contact the lift pins 134 as the lift plate 602 is actuated toward the substrate support 104.
  • [0048]
    In one embodiment, the lift pin actuation mechanism 138 includes a lift plate 602 coupled by an actuation rod 606 to an actuator assembly 608. In order to minimize deflection between the lift plate 602 and rod 606, the mating surfaces of the lift plate 602 and rod 606 include a plurality of mating wedge-shaped keys 614, 616 (seen in FIG. 7). The keys 614, 616 are typically configured to expand and create an interference fit at processing temperatures, thus eliminating movement between the lift plate 602 and rod 606 associated with part tolerancing. One example of a lift plate and rod coupled in a similar arrangement is described in U.S. patent application Ser. No. 09/652,727, filed Oct. 31, 2000, which is hereby incorporated by reference in its entirety.
  • [0049]
    The rod 606 extends through an aperture 610 formed in the bottom 108 of the process chamber 100 and is coupled to the actuator assembly 608. A bellows 612 is typically disposed around the rod 606 to provide a flexible seal between the processing chamber 100 and the pin lift actuation mechanism 138 to prevent leakage into the chamber while facilitating actuation of the lift pins 132.
  • [0050]
    The actuator assembly 608 is typically coupled between the rod 606 and the chamber bottom 108 to control the elevation of the lift plate 602 and lift pins 132. The actuator assembly 608 may include solenoids, gear motors or other actuator suitable for controllably actuating the shaft in an axial direction. In one embodiment, the actuation assembly 608 is similar to the bearing assembly and actuator described above.
  • [0051]
    A spar 630 is utilized to couple the rod 606 to the actuator assembly 608. The spar is typically fabricated from aluminum or other suitably rigid material. The spar 630 includes a mounting side 632 and an opposing lower side 638 separated by first and second lateral sides 634, 636. The mounting side 632 of the spar 630 is coupled to the rod 606 by a plurality of fasteners 640. The second lateral side 636 is typically coupled to a bearing assembly 644 of the actuator assembly 608. The lower side 638 may include a chamfer 642 at the junction of the first lateral side 634 and the lower side 638.
  • [0052]
    The lateral sides 634, 636 are typically longer than the mounting side 632 to minimize deflection of the actuation mechanism 138 due to vacuum forces acting upon the annular plate 602 disposed within the chamber 100. To further stiffen the spar 630, the lower side 638 typically extends from the second lateral side 636 beyond a center line 618 of the rod 606 before the chamfer 642. As the rigidity of the spar 630 is superior to conventional L-shaped brackets commonly used in conventional designs, the reduced deflection of the lift pin actuation mechanism 138 enhances the planarity between the plate 602 and the substrate support 104, thereby allowing the substrate 102 to retain its parallelism to the substrate support 104 when spaced therefrom by the lift pins 132 displaced by the plate 602.
  • [0053]
    As discussed above, maintaining the parallelism between the lid 110 and the upper support surface 126 of the substrate support 104 is important for maintaining process uniformity and repeatability. The invention also improves the parallelism of the substrate 120 when spaced from the substrate support 104 that minimizes particular generation or wafer damage during robotic wafer exchange. In one aspect of the invention, the substrate support lift assembly 102 experiences reduced tortional deflection when the substrate support 104 is exposed to a vacuum within the processing chamber 100. In another aspect of the invention, the spaced bearing surfaces of the carriage blocks 204, 206 maintains parallelism of the substrate support 104 to the lid 110 as the substrate support 104 is moved between the elevated and lowered position. Additionally, the dual carriage blocks 204, 206 minimize deflection of the lift 102 thereby maintaining the desired planar orientation of the substrate support 104 when the substrate support 104 is subjected to vacuum forces. In another aspect of the invention, the lift pin actuation mechanism 138 is configured to minimize deflection under vacuum loading of the lift mechanism 138 to enable simultaneous contact and substantially equal displacement of the lift pins, resulting in enhanced parallelism of the substrate and substrate support when spaced apart to facilitate wafer exchange with a robotic mechanism while minimizing the probability of inadvertent wafer to robot contact due to misalignment and/or deflection issues.
  • [0054]
    While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (61)

    What is claimed is:
  1. 1. An apparatus for positioning a substrate support, comprising:
    a yoke having at least a first slot formed therethrough;
    a gimbal base having a first surface adapted to support the substrate support and an opposing second surface; and
    a first threaded member disposed through the first slot and axially urging the yoke and gimbal base against each other.
  2. 2. The apparatus of claim 1, wherein the yoke and gimbal base further comprise mating accurate surfaces.
  3. 3. The apparatus of claim 2, wherein the first threaded member is radially aligned with the mating curved surfaces.
  4. 4. The apparatus of claim 3, wherein the mating curved surface of the gimbal base further comprises a stepped recess.
  5. 5. The apparatus of claim 1, wherein the yoke further comprise:
    a post; and
    a connecting member coupled to the post;
    a first flange coupled to a first end of the connecting member, the first slot defined between a first side supporting the gimbal base and an opposing second side of the first flange;
    a second flange coupled to a first end of the connecting member;
    a second slot defined between a first side of the second flange that supports the gimbal base and an opposing second side; and
    a second threaded member disposed through second slot and axially urging the yoke and gimbal base against each other.
  6. 6. The apparatus of claim 5, wherein the first side of the first flange is curved.
  7. 7. The apparatus of claim 5, wherein the first side of the first flange has a radius of curvature between about 305 to about 304 mm.
  8. 8. The apparatus of claim 7, wherein the second side of the first flange is curved concentrically to the first side.
  9. 9. The apparatus of claim 1 further comprising:
    a clamp block having a clamping aperture receiving a post extending from the yoke.
  10. 10. The apparatus of claim 9, wherein the clamp block further comprises:
    a slot formed at least partially through the clamp block and communicating with the clamping aperture; and
    a plunger disposed in the slot and movable in a direction radially aligned with a center of the clamping aperture.
  11. 11. The apparatus of claim 10, wherein the plunger includes a contact surface that, when urged against the post, does not exert a rotational moment force upon the post.
  12. 12. The apparatus of claim 10, wherein the clamp block further comprises:
    a web disposed over the slot opposite the clamping aperture; and
    member disposed through the web and radially aligned with the center of the clamping aperture, the member adapted to urge the plunger against the post.
  13. 14. The apparatus of claim 1 further comprising:
    a bearing assembly having a first carriage block and a second carriage block, and coupled to the clamp block; and
    an actuator coupled to at least one of the carriage blocks and adapted to control the linear position of the carriage blocks along the bearing assembly.
  14. 15. An apparatus for positioning a substrate support, comprising:
    a gimbal assembly comprising:
    a clamp block;
    a yoke coupled to the clamp block, the yoke positional along and rotational about a first axis relative to the clamp block; and
    a gimbal base coupled to the yoke and adapted to support the substrate support, the gimbal base movable about a second axis orthogonal to the first axis; and
    a bearing assembly having a first carriage block and a second carriage block, the bearing assembly coupled to the clamp block; and
    an actuator coupled to at least one of the carriage blocks and adapted to control the linear position of the carriage blocks along the bearing assembly.
  15. 16. The apparatus of claim 15, wherein the clamp block further comprises:
    a clamping aperture form therein for receiving a post extending from the yoke.
  16. 17. The apparatus of claim 16, wherein the clamp block further comprises:
    a slot formed at least partially through the clamp block and communicating with the clamping aperture; and
    a plunger disposed in the slot and movable in a direction radially aligned with a center of the clamping aperture.
  17. 18. The apparatus of claim 17, wherein the plunger includes a contact surface that, when urged against the post, does not exert a rotational moment force upon the post.
  18. 19. The apparatus of claim 17, wherein the clamp block further comprises:
    a web disposed over the slot opposite the clamping aperture; and
    member disposed through the web and radially aligned with the center of the clamping aperture, the member adapted to urge the plunger against the post.
  19. 20. The apparatus of claim 17, wherein the yoke further comprises:
    at least one flange;
    a slot formed through the flange;
    a gimbal base having a first surface adapted to support the substrate support and an opposing second surface disposed against the flange; and
    a member disposed through first slot and urging the yoke and gimbal base against each other along axis of the member.
  20. 21. The apparatus of claim 1, wherein the second surface of the yoke and gimbal base contact along a curved surface.
  21. 22. The apparatus of claim 21, wherein the member is radially aligned relative to the curved surface.
  22. 23. The apparatus of claim 22, wherein the second surface of the gimbal base has a stepped recess formed therein.
  23. 24. The apparatus of claim 15, wherein the yoke further comprise:
    a post; and
    a connecting member coupled to the post;
    a first flange coupled to a first end of the connecting member, the first slot defined between a first side supporting the gimbal base and an opposing second side of the first flange;
    a second flange coupled to a first end of the connecting member;
    a second slot defined between a first side of the second flange that supports the gimbal base and an opposing second side; and
    a second threaded member disposed through second slot and axially urging the yoke and gimbal base against each other.
  24. 25. The apparatus of claim 24, wherein the first side and the second side of the first flange are curved concentrically.
  25. 26. The apparatus of claim 25 further comprising:
    a spacer disposed on the stud and having a first curved surface; and
    a nut threaded on the stud and adapted to urge the first curved surface of the spacer disposed against the second side of the first flange.
  26. 27. An apparatus for positioning a substrate support, comprising:
    a processing chamber;
    a substrate support disposed in the chamber body;
    a stem coupled to the substrate support and extending through a first hole formed in the chamber body;
    a gimbal assembly coupled to the stem and adapted to adjust a planar orientation of the substrate support, the gimbal assembly comprising:
    a) a yoke having at least first slot formed therethrough;
    b) a gimbal base having a first surface adapted to support the substrate support and an opposing second surface; and
    c) a first threaded member disposed through first slot and axially urging the yoke and gimbal base against each other;
    a bearing assembly having a first carriage block and a second carriage block, the bearing assembly coupled to the gimbal assembly; and
    an actuator coupled to at least one of the carriage blocks and adapted to control the elevation of the substrate support within the processing chamber.
  27. 28. The apparatus of claim 27, wherein the yoke and gimbal base contact along a curved surface.
  28. 29. The apparatus of claim 28, wherein the first threaded member is radially aligned with the curved surface.
  29. 30. The apparatus of claim 28, wherein the second surface of the gimbal base has a stepped recess formed therein.
  30. 31. The apparatus of claim 27, wherein the yoke further comprise:
    a post; and
    a connecting member coupled to the post;
    a first flange coupled to a first end of the connecting member, the first slot defined between a first side supporting the gimbal base and an opposing second side of the first flange;
    a second flange coupled to a first end of the connecting member;
    a second slot defined between a first side of the second flange that supports the gimbal base and an opposing second side; and
    a second threaded member disposed through second slot and axially urging the yoke and gimbal base against each other.
  31. 32. The apparatus of claim 31, wherein the first side and the second side of the first flange are curved concentrically.
  32. 33. The apparatus of claim 32 further comprising:
    a spacer disposed on the first threaded member and having a first curved surface; and
    a nut threaded on the first threaded member and adapted to urge the first curved surface of the spacer disposed against the second side of the first flange.
  33. 34. The apparatus of claim 27, wherein the gimbal assembly further comprises:
    a clamp block coupled to the yoke, the yoke positional along and rotational about an axis relative to the clamp block.
  34. 35. An apparatus for positioning a substrate support, comprising:
    a processing chamber;
    a substrate support disposed in the chamber body;
    a plurality of lift pin disposed through the substrate support and having an end extending below the substrate support;
    a stem coupled to the substrate support and extending through a first hole formed in the processing chamber;
    a gimbal assembly coupled to the stem and adapted to adjust a planar orientation of the substrate support;
    a bearing assembly having a first carriage block and a second carriage block, the bearing assembly coupled to the gimbal assembly;
    an actuator coupled to at least one of the carriage blocks and adapted to control the elevation of the substrate support within the processing chamber;
    an annular plate circumscribing the stem;
    a rod coupled to the lift plate and extending through a second hole formed in the processing chamber;
    a lift pin actuator assembly adapted to urge the plate against and displace the lift pins; and
    a spar coupling the rod to the lift pin actuator assembly, the spar comprising:
    a mounting surface coupled to the rod;
    a lower surface disposed opposite the mounting surface; and
    a first lateral side and a second lateral side extending between the mounting surface and the lower surface, the second lateral side coupled to the lift pin actuator assembly, the lateral sides having a length greater than mounting surface.
  35. 36. The apparatus of claim 35, wherein the lower surface of the spar extends from the second lateral side to a position beyond the center line of the rod.
  36. 37. The apparatus of claim 35, wherein the rod further comprises wedges interleaved with mating wedges of the plate.
  37. 38. The apparatus of claim 35, wherein the gimbal assembly further comprises:
    a clamp block;
    a yoke coupled to the clamp block, the yoke positional along and rotational about a first axis relative to the clamp block; and
    a gimbal base coupled to the yoke and adapted to support the substrate support, the gimbal base movable about a second axis orthogonal to the first axis; and
    a first threaded member disposed through a slot formed in the yoke and axially urging the yoke and gimbal base against each other.
  38. 39. The apparatus of claim 38, wherein the yoke and gimbal base contact along a curved surface.
  39. 40. The apparatus of claim 39, wherein the first threaded member is radially aligned with the curved surface.
  40. 41. The apparatus of claim 39, wherein the gimbal base further comprises a stepped recess formed in a surface contacting the yoke.
  41. 42. The apparatus of claim 38, wherein the yoke further comprise:
    a post;
    a connecting member coupled to the post;
    a first flange coupled to a first end of the connecting member, the first slot defined between a first side supporting the gimbal base and an opposing second side of the first flange;
    a second flange coupled to a first end of the connecting member;
    a second slot defined between a first side of the second flange that supports the gimbal base and an opposing second side; and
    a second threaded member disposed through second slot and axially urging the yoke and gimbal base against each other.
  42. 43. The apparatus of claim 42, wherein the first side of the first flange is curved.
  43. 44. The apparatus of claim 39, wherein the first curved surface has a radius of curvature between about 305 to about 304 mm.
  44. 45. The apparatus of claim 44, wherein the second side of the first flange is curved concentrically to the first side.
  45. 46. The apparatus of claim 38, wherein the clamp block further comprises:
    a clamping aperture formed therein for receiving a post extending from the yoke.
  46. 47. The apparatus of claim 46, wherein the clamp block further comprises:
    a slot formed at least partially through the clamp block and communicating with the clamping aperture; and
    a plunger disposed in the slot and movable in a direction radially aligned with a center of the clamping aperture, wherein the plunger includes a contact surface that, when urged against the post, does not a moment force upon the post.
  47. 48. The apparatus of claim 47, wherein the clamp block further comprises:
    a web disposed over the slot opposite the clamping aperture; and
    member disposed through the web and radially aligned with the center of the clamping aperture, the member adapted to urge the plunger against the post.
  48. 49. An apparatus for positioning a substrate support, comprising:
    a processing chamber;
    a substrate support disposed in the chamber body;
    a stem coupled to the substrate support and extending through a first hole formed in the chamber body;
    a gimbal assembly coupled to the stem and adapted to adjust a planar orientation of the substrate support about 5 axes;
    a bearing assembly having a first carriage block and a second carriage block, the bearing assembly coupled to the gimbal assembly; and
    an actuator coupled to at least one of the carriage blocks and adapted to control the elevation of the substrate support within the processing chamber.
  49. 50. The apparatus of claim 49, wherein the gimbal assembly further comprises:
    a yoke having at least first slot formed therethrough;
    a gimbal base having a first surface adapted to support the substrate support and an opposing second surface; and
    a first threaded member disposed through first slot and axially urging the yoke and gimbal base against each other.
  50. 51. The apparatus of claim 50, wherein the yoke and gimbal base contact along a curved surface.
  51. 52. The apparatus of claim 51, wherein the first threaded member is radially aligned with the curved surface.
  52. 53. The apparatus of claim 51, wherein the second surface of the gimbal base has a stepped recess formed therein.
  53. 54. The apparatus of claim 49, wherein the yoke further comprise:
    a post; and
    a connecting member coupled to the post;
    a first flange coupled to a first end of the connecting member, the first slot defined between a first side supporting the gimbal base and an opposing second side of the first flange;
    a second flange coupled to a first end of the connecting member;
    a second slot defined between a first side of the second flange that supports the gimbal base and an opposing second side; and
    a second threaded member disposed through second slot and axially urging the yoke and gimbal base against each other.
  54. 55. The apparatus of claim 54, wherein the first side and the second side of the first flange are curved concentrically.
  55. 56. The apparatus of claim 55 further comprising:
    a spacer disposed on the first threaded member and having a first curved surface; and
    a nut threaded on the first threaded member and adapted to urge the first curved surface of the spacer disposed against the second side of the first flange.
  56. 57. The apparatus of claim 49, wherein the gimbal assembly further comprises:
    a clamp block;
    a yoke coupled to the clamp block, the yoke positional along and rotational about a first axis relative to the clamp block; and
    a gimbal base coupled to the yoke and adapted to support the substrate support, the gimbal base movable about a second axis orthogonal to the first axis.
  57. 58. The apparatus of claim 57, wherein the gimbal base further comprises:
    a plurality of holes formed therein having a counter bore that substantially aligns with a passage formed through the yoke.
  58. 59. Apparatus for positioning a substrate support, comprising:
    a gimbal assembly providing freedom of movement about perpendicular axes, the gimbal assembly including two clamps, each adjustable to prevent movement about one axis by a clamping forced applied through that axis.
  59. 60. The apparatus of claim 59, wherein the gimbal assembly further comprises:
    a clamp block;
    a yoke coupled to the clamp block, the yoke being positioned along and rotational about one of the axes relative to the clamp block;
    a gimbal base connected to support the substrate support and movably mounted in the yoke for rotation about the other of the axes relative to the yoke.
  60. 61. The apparatus of claim 60, wherein movement about each axis is prevented by the force of clamp held by a fastener applied through the axis.
  61. 62. The apparatus of claim 50, wherein the gimbal base further comprises:
    a plurality of holes formed therein having a counter bore that substantially aligns with a passage formed through the yoke.
US10387619 2003-03-12 2003-03-12 Substrate support lift mechanism Abandoned US20040177813A1 (en)

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PCT/US2004/007164 WO2004081994A3 (en) 2003-03-12 2004-03-10 Substrate support lift mechanism
KR20057016866A KR101103863B1 (en) 2003-03-12 2004-03-10 Substrate support lift mechanism
US11426555 US7871470B2 (en) 2003-03-12 2006-06-26 Substrate support lift mechanism

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050028739A1 (en) * 2003-08-08 2005-02-10 Sumitomo Electric Industries, Ltd. Semiconductor Manufacturing Apparatus
US20060180968A1 (en) * 2005-01-24 2006-08-17 Kim Kyung S Semiconductor manufacturing apparatus
US20080017117A1 (en) * 2006-07-18 2008-01-24 Jeffrey Campbell Substrate support with adjustable lift and rotation mount
US20080017116A1 (en) * 2006-07-18 2008-01-24 Jeffrey Campbell Substrate support with adjustable lift and rotation mount
US20080295771A1 (en) * 2007-05-30 2008-12-04 Industrial Technology Research Institute Power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same
US20090276097A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Non-contact substrate support position sensing system and corresponding adjustments
US20100059183A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine
US7871470B2 (en) 2003-03-12 2011-01-18 Applied Materials, Inc. Substrate support lift mechanism
JPWO2013005481A1 (en) * 2011-07-05 2015-02-23 エピクルー株式会社 Susceptor apparatus and film forming apparatus having the same
WO2018022577A1 (en) * 2016-07-25 2018-02-01 Applied Materials, Inc. Fine leveling of large carousel based susceptor

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771538B2 (en) 2004-01-20 2010-08-10 Jusung Engineering Co., Ltd. Substrate supporting means having wire and apparatus using the same
US8317450B2 (en) * 2008-10-30 2012-11-27 Lam Research Corporation Tactile wafer lifter and methods for operating the same
JP5324231B2 (en) 2009-01-08 2013-10-23 日東電工株式会社 Semiconductor wafer alignment apparatus
JP5457216B2 (en) * 2009-02-27 2014-04-02 キヤノンアネルバ株式会社 Substrate supporting apparatus and a substrate transfer apparatus, a manufacturing method of the electrical device
CN102108503B (en) 2009-12-10 2013-09-11 北京北方微电子基地设备工艺研究中心有限责任公司 Grounding/supporting device and plasma treatment equipment employing same
WO2012046397A1 (en) * 2010-10-07 2012-04-12 キヤノンアネルバ株式会社 Substrate processing device
JP2013033963A (en) * 2011-07-29 2013-02-14 Semes Co Ltd Substrate processing apparatus and substrate processing method
US8968654B2 (en) * 2012-06-21 2015-03-03 Automation Solutions, Inc. Fluid delivery system and lift for use in conjunction therewith
CN104103549B (en) * 2013-04-07 2018-05-18 盛美半导体设备(上海)有限公司 The semiconductor process chamber
CN103215563A (en) * 2013-04-28 2013-07-24 光垒光电科技(上海)有限公司 Deposition equipment and rotary device
CN104233191A (en) * 2013-06-08 2014-12-24 北京北方微电子基地设备工艺研究中心有限责任公司 Heating chamber and plasma processing apparatus
US9859145B2 (en) * 2013-07-17 2018-01-02 Lam Research Corporation Cooled pin lifter paddle for semiconductor substrate processing apparatus
CN104752302B (en) * 2013-12-30 2018-05-08 北京北方华创微电子装备有限公司 One kind of base support structure and a chamber
WO2016007251A1 (en) * 2014-07-11 2016-01-14 Applied Materials, Inc. Apparatus and methods for alignment of a susceptor
WO2016196105A1 (en) * 2015-06-05 2016-12-08 Applied Materials, Inc. Susceptor position and rotation apparatus and methods of use
CN105080803A (en) * 2015-08-21 2015-11-25 京东方科技集团股份有限公司 Base plate bearing structure, pressure reduction drying device and pressure reduction drying method

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168668A (en) *
US202473A (en) * 1878-04-16 Improvement in shaft-couplings
US539796A (en) * 1895-05-28 Coupling
US1100504A (en) * 1913-07-22 1914-06-16 Herbert Othro Taft Jack-spool and fastener.
US1104666A (en) * 1913-06-18 1914-07-21 Corona Mfg Co Ratchet-wheel and the like.
US1173289A (en) * 1916-02-29 American Manganese Steel Co Mill-pinion.
US2499146A (en) * 1946-01-24 1950-02-28 Ernest T Kindt Dowel pin
US2619215A (en) * 1950-08-22 1952-11-25 Toledo Scale Co Mounting for key buttons
US3876174A (en) * 1972-05-15 1975-04-08 Southwestern Ind Inc Universally adjustable mounting apparatus
US4629321A (en) * 1985-09-27 1986-12-16 Spectra-Physics, Inc. Grade setting and calibration arrangement for laser beam projection device
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5796066A (en) * 1996-03-29 1998-08-18 Lam Research Corporation Cable actuated drive assembly for vacuum chamber
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
US5860640A (en) * 1995-11-29 1999-01-19 Applied Materials, Inc. Semiconductor wafer alignment member and clamp ring
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6001234A (en) * 1997-09-30 1999-12-14 Semitool, Inc. Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
US6089723A (en) * 1995-08-14 2000-07-18 Kabushiki Kaisha Tokai Rika Denki Seisakusho Mounting structure of base and base cover in door mirror for automobile
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6146504A (en) * 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
US6213478B1 (en) * 1999-03-11 2001-04-10 Moore Epitaxial, Inc. Holding mechanism for a susceptor in a substrate processing reactor
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US20020121312A1 (en) * 2001-03-01 2002-09-05 Dmitry Lubomirsky Lift pin alignment and operation methods and apparatus
US6511368B1 (en) * 1999-10-27 2003-01-28 Strasbaugh Spherical drive assembly for chemical mechanical planarization
US20030075387A1 (en) * 2001-10-22 2003-04-24 Chung-Chiang Wang Wafer loading device
US6609909B2 (en) * 2000-10-19 2003-08-26 Tokyo Ohka Kogyo C., Ltd. Heat treatment apparatus and method

Family Cites Families (167)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US309438A (en) 1884-12-16 Island
US645860A (en) * 1899-11-02 1900-03-20 William Frederick Scholze Game device.
US1550651A (en) 1921-06-25 1925-08-18 James A Charter Metal-wheel-welding machine
US2921326A (en) 1956-10-09 1960-01-19 Iodent Chemical Company Toothbrush
US2972493A (en) 1959-02-13 1961-02-21 Westinghouse Electric Corp Means for attaching a knob or the like to a shaft
US3582116A (en) 1969-04-24 1971-06-01 Stephen A Young Stem extension for plumbing fixtures
FI52359C (en) 1974-11-29 1977-08-10 Instrumentarium Oy A method and apparatus for increasing compound thin films.
FI57975C (en) 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande at uppbyggande and the arrangement of the thin foereningshinnor
US4389973A (en) 1980-03-18 1983-06-28 Oy Lohja Ab Apparatus for performing growth of compound thin films
US4415275A (en) 1981-12-21 1983-11-15 Dietrich David E Swirl mixing device
US4607974A (en) 1984-02-27 1986-08-26 Cooper Industries, Inc. Wand and wand extension
GB2162207B (en) 1984-07-26 1989-05-10 Hitoshi Abe Semiconductor crystal growth apparatus
US5294286A (en) 1984-07-26 1994-03-15 Research Development Corporation Of Japan Process for forming a thin film of silicon
US4891087A (en) 1984-10-22 1990-01-02 Texas Instruments Incorporated Isolation substrate ring for plasma reactor
US4761269A (en) 1986-06-12 1988-08-02 Crystal Specialties, Inc. Apparatus for depositing material on a substrate
JPH0639357B2 (en) 1986-09-08 1994-05-25 セイコ電子工業株式会社 Method of growing element semiconductor single crystal thin film
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
US4821674A (en) * 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
DE3721637A1 (en) 1987-06-30 1989-01-12 Aixtron Gmbh Gas inlet for a plurality of different reactive gases in reaktionsgefaesse
DE3743938C2 (en) 1987-12-23 1995-08-31 Cs Halbleiter Solartech A process for atomic layer epitaxial growth of a III / V compound semiconductor thin film
FR2628985B1 (en) 1988-03-22 1990-12-28 Labo Electronique Physique An epitaxial reactor wall is protected against deposits
US5261959A (en) 1988-05-26 1993-11-16 General Electric Company Diamond crystal growth apparatus
JPH0824191B2 (en) 1989-03-17 1996-03-06 富士通株式会社 Thin film transistor
US5225366A (en) 1990-06-22 1993-07-06 The United States Of America As Represented By The Secretary Of The Navy Apparatus for and a method of growing thin films of elemental semiconductors
US5483919A (en) 1990-08-31 1996-01-16 Nippon Telegraph And Telephone Corporation Atomic layer epitaxy method and apparatus
US5178681A (en) 1991-01-29 1993-01-12 Applied Materials, Inc. Suspension system for semiconductor reactors
US5173327A (en) 1991-06-18 1992-12-22 Micron Technology, Inc. LPCVD process for depositing titanium films for semiconductor devices
US5480818A (en) 1992-02-10 1996-01-02 Fujitsu Limited Method for forming a film and method for manufacturing a thin film transistor
US5338362A (en) 1992-08-29 1994-08-16 Tokyo Electron Limited Apparatus for processing semiconductor wafer comprising continuously rotating wafer table and plural chamber compartments
JP3566740B2 (en) 1992-09-30 2004-09-15 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated All wafer deposition equipment
US5607009A (en) 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
JP3265042B2 (en) 1993-03-18 2002-03-11 東京エレクトロン株式会社 Film formation method
US6042852A (en) * 1993-03-23 2000-03-28 The Pillsbury Company Low pressure refrigerated dough product
US5443647A (en) 1993-04-28 1995-08-22 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for depositing a refractory thin film by chemical vapor deposition
JP3165938B2 (en) 1993-06-24 2001-05-14 東京エレクトロン株式会社 Gas processing equipment
US5803994A (en) * 1993-11-15 1998-09-08 Kaiser Aluminum & Chemical Corporation Aluminum-copper alloy
JP3181171B2 (en) 1994-05-20 2001-07-03 シャープ株式会社 Vapor deposition apparatus and a vapor phase growth method
US5796116A (en) 1994-07-27 1998-08-18 Sharp Kabushiki Kaisha Thin-film semiconductor device including a semiconductor film with high field-effect mobility
DE4428310A1 (en) 1994-08-10 1996-02-15 Manfred Schanz Fastening device for a tool or workpiece
US5562947A (en) 1994-11-09 1996-10-08 Sony Corporation Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment
FI100409B (en) 1994-11-28 1997-11-28 Asm Int A method and apparatus for producing thin films
FI97731C (en) 1994-11-28 1997-02-10 Mikrokemia Oy Method and device for producing thin films
FI97730C (en) 1994-11-28 1997-02-10 Mikrokemia Oy An apparatus for producing thin films
US5558717A (en) 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5868847A (en) 1994-12-16 1999-02-09 Applied Materials, Inc. Clamp ring for shielding a substrate during film layer deposition
US5804042A (en) 1995-06-07 1998-09-08 Tokyo Electron Limited Wafer support structure for a wafer backplane with a curved surface
GB9608108D0 (en) * 1996-04-19 1996-06-26 Naco Inc Steel Castings
US6313035B1 (en) 1996-05-31 2001-11-06 Micron Technology, Inc. Chemical vapor deposition using organometallic precursors
US5916365A (en) 1996-08-16 1999-06-29 Sherman; Arthur Sequential chemical vapor deposition
US5835677A (en) 1996-10-03 1998-11-10 Emcore Corporation Liquid vaporizer system and method
US6071572A (en) 1996-10-15 2000-06-06 Applied Materials, Inc. Forming tin thin films using remote activated specie generation
US5951776A (en) * 1996-10-25 1999-09-14 Applied Materials, Inc. Self aligning lift mechanism
US5807792A (en) 1996-12-18 1998-09-15 Siemens Aktiengesellschaft Uniform distribution of reactants in a device layer
US6174377B1 (en) 1997-03-03 2001-01-16 Genus, Inc. Processing chamber for atomic layer deposition processes
US5851775A (en) * 1997-03-20 1998-12-22 Johns Hopkins University β-catenin, Tcf-4, and APC interact to prevent cancer
JPH10321572A (en) * 1997-05-15 1998-12-04 Toshiba Corp Both-surface cleaning apparatus for semiconductor wafer and polishing method for semiconductor wafer
US6200693B1 (en) * 1997-05-22 2001-03-13 Henkel Corporation Water-based liquid treatment for aluminum and its alloys
FI972874A0 (en) 1997-07-04 1997-07-04 Mikrokemia Oy Foerfarande and the arrangement of the Foer framstaellning tunnfilmer
US6073366A (en) 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US5879459A (en) 1997-08-29 1999-03-09 Genus, Inc. Vertically-stacked process reactor and cluster tool system for atomic layer deposition
US6197683B1 (en) 1997-09-29 2001-03-06 Samsung Electronics Co., Ltd. Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact of semiconductor device using the same
KR100274603B1 (en) 1997-10-01 2001-01-15 윤종용 Method and apparatus for fabricating semiconductor device
US5972430A (en) 1997-11-26 1999-10-26 Advanced Technology Materials, Inc. Digital chemical vapor deposition (CVD) method for forming a multi-component oxide layer
EP0959149A3 (en) 1998-05-18 2002-07-24 IPS Ltd Apparatus for depositing thin films
KR100267885B1 (en) 1998-05-18 2000-11-01 서성기 Deposition apparatus
NL1009327C2 (en) 1998-06-05 1999-12-10 Asm Int Method and device for the transfer of wafers.
KR100275738B1 (en) 1998-08-07 2000-12-15 윤종용 Method for producing thin film using atomatic layer deposition
US20030101938A1 (en) 1998-10-27 2003-06-05 Applied Materials, Inc. Apparatus for the deposition of high dielectric constant films
US6454860B2 (en) 1998-10-27 2002-09-24 Applied Materials, Inc. Deposition reactor having vaporizing, mixing and cleaning capabilities
KR100331544B1 (en) 1999-01-18 2002-04-06 윤종용 Method for introducing gases into a reactor chamber and a shower head used therein
US6133700A (en) * 1999-02-23 2000-10-17 General Electric Company Torque controller system having a torque processor with improved tractive effort distribution
US6305314B1 (en) 1999-03-11 2001-10-23 Genvs, Inc. Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
US6200893B1 (en) 1999-03-11 2001-03-13 Genus, Inc Radical-assisted sequential CVD
KR100347379B1 (en) 1999-05-01 2002-08-07 주식회사 피케이엘 Atomic layer deposition apparatus for depositing multi substrate
FI118342B (en) 1999-05-10 2007-10-15 Asm Int Device for producing thin films
US6168868B1 (en) * 1999-05-11 2001-01-02 Ppg Industries Ohio, Inc. Process for applying a lead-free coating to untreated metal substrates via electrodeposition
KR100319494B1 (en) 1999-07-15 2002-01-09 김용일 Apparatus for Deposition of thin films on wafers through atomic layer epitaxial process
US6984415B2 (en) 1999-08-20 2006-01-10 International Business Machines Corporation Delivery systems for gases for gases via the sublimation of solid precursors
US6511539B1 (en) 1999-09-08 2003-01-28 Asm America, Inc. Apparatus and method for growth of a thin film
US6548112B1 (en) 1999-11-18 2003-04-15 Tokyo Electron Limited Apparatus and method for delivery of precursor vapor from low vapor pressure liquid sources to a CVD chamber
EP1233983A2 (en) 1999-11-22 2002-08-28 Human Genome Sciences, Inc. Kunitz-type protease inhibitor polynucleotides, polypeptides, and antibodies
KR100330749B1 (en) 1999-12-17 2002-04-03 서성기 Thin film deposition apparatus for semiconductor
FI118474B (en) 1999-12-28 2007-11-30 Asm Int Device for producing thin films
FI118343B (en) 1999-12-28 2007-10-15 Asm Int Device for producing thin films
KR100378871B1 (en) 2000-02-16 2003-04-07 주식회사 아펙스 showerhead apparatus for radical assisted deposition
FI117978B (en) 2000-04-14 2007-05-15 Asm Int Method and apparatus for growing thin film on the substrate
US7060132B2 (en) 2000-04-14 2006-06-13 Asm International N.V. Method and apparatus of growing a thin film
FI117980B (en) 2000-04-14 2007-05-15 Asm Int The method of growing a thin film on the substrate
FI118805B (en) 2000-05-15 2008-03-31 Asm Int The method and composition of vapor-phase reactants into the reactor chamber
KR100427423B1 (en) 2000-05-25 2004-04-13 가부시키가이샤 고베 세이코쇼 Inner tube for cvd apparatus
US6579372B2 (en) 2000-06-24 2003-06-17 Ips, Ltd. Apparatus and method for depositing thin film on wafer using atomic layer deposition
US6852168B2 (en) 2000-06-24 2005-02-08 Ips Ltd. Reactor for depositing thin film on wafer
FI20001694A0 (en) 2000-07-20 2000-07-20 Asm Microchemistry Oy The method of growing a thin film on the substrate
KR100444149B1 (en) 2000-07-22 2004-08-09 주식회사 아이피에스 ALD thin film depositin equipment cleaning method
US6302965B1 (en) 2000-08-15 2001-10-16 Applied Materials, Inc. Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces
EP1202330A2 (en) * 2000-10-26 2002-05-02 Applied Materials, Inc. De-coupled wafer lift and five axis adjustable heater lift system for CVD process chamber
KR100436941B1 (en) 2000-11-07 2004-06-23 주성엔지니어링(주) apparatus and method for depositing thin film
US20020104481A1 (en) 2000-12-06 2002-08-08 Chiang Tony P. System and method for modulated ion-induced atomic layer deposition (MII-ALD)
US6878402B2 (en) 2000-12-06 2005-04-12 Novellus Systems, Inc. Method and apparatus for improved temperature control in atomic layer deposition
US20020144655A1 (en) 2001-04-05 2002-10-10 Chiang Tony P. Gas valve system for a reactor
US20020144657A1 (en) 2001-04-05 2002-10-10 Chiang Tony P. ALD reactor employing electrostatic chuck
US20020076481A1 (en) 2000-12-15 2002-06-20 Chiang Tony P. Chamber pressure state-based control for a reactor
US20020076507A1 (en) 2000-12-15 2002-06-20 Chiang Tony P. Process sequence for atomic layer deposition
US6630201B2 (en) 2001-04-05 2003-10-07 Angstron Systems, Inc. Adsorption process for atomic layer deposition
US20020073924A1 (en) 2000-12-15 2002-06-20 Chiang Tony P. Gas introduction system for a reactor
JP3963078B2 (en) 2000-12-25 2007-08-22 株式会社高純度化学研究所 Method of forming a tertiary amyl imido-tris (dimethylamide) tantalum and their preparation and mocvd raw material solution and the tantalum nitride film using the same using the same
KR100434487B1 (en) 2001-01-17 2004-06-05 삼성전자주식회사 Shower head & film forming apparatus having the same
US6613656B2 (en) 2001-02-13 2003-09-02 Micron Technology, Inc. Sequential pulse deposition
US6660126B2 (en) 2001-03-02 2003-12-09 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US20020121241A1 (en) 2001-03-02 2002-09-05 Nguyen Anh N. Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
JP4680429B2 (en) 2001-06-26 2011-05-11 Okiセミコンダクタ株式会社 Fast reading control method in a text-to-speech conversion system
DE60203912T2 (en) 2001-07-03 2006-02-16 Asm International N.V. A container assembly for chemicals
US20030198754A1 (en) 2001-07-16 2003-10-23 Ming Xi Aluminum oxide chamber and process
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US7098131B2 (en) 2001-07-19 2006-08-29 Samsung Electronics Co., Ltd. Methods for forming atomic layers and thin films including tantalum nitride and devices including the same
US7081409B2 (en) 2002-07-17 2006-07-25 Samsung Electronics Co., Ltd. Methods of producing integrated circuit devices utilizing tantalum amine derivatives
US7105444B2 (en) 2001-07-19 2006-09-12 Samsung Electronics Co., Ltd. Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same
US20030017697A1 (en) 2001-07-19 2003-01-23 Kyung-In Choi Methods of forming metal layers using metallic precursors
US6820570B2 (en) 2001-08-15 2004-11-23 Nobel Biocare Services Ag Atomic layer deposition reactor
US20030042630A1 (en) 2001-09-05 2003-03-06 Babcoke Jason E. Bubbler for gas delivery
US6718126B2 (en) 2001-09-14 2004-04-06 Applied Materials, Inc. Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6797108B2 (en) 2001-10-05 2004-09-28 Applied Materials, Inc. Apparatus and method for evenly flowing processing gas onto a semiconductor wafer
US6828002B2 (en) 2001-10-12 2004-12-07 Advanced Semiconductor Engineering, Inc. Substrate strip with sides having flanges and recesses
US7780785B2 (en) 2001-10-26 2010-08-24 Applied Materials, Inc. Gas delivery apparatus for atomic layer deposition
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
WO2003038145A3 (en) 2001-10-29 2003-07-31 Ken Doering Chemical vapor deposition system
US6773507B2 (en) 2001-12-06 2004-08-10 Applied Materials, Inc. Apparatus and method for fast-cycle atomic layer deposition
US6729824B2 (en) 2001-12-14 2004-05-04 Applied Materials, Inc. Dual robot processing system
US20030116087A1 (en) 2001-12-21 2003-06-26 Nguyen Anh N. Chamber hardware design for titanium nitride atomic layer deposition
WO2003065424A3 (en) 2002-01-25 2004-03-11 Applied Materials Inc Apparatus for cyclical deposition of thin films
US6866746B2 (en) 2002-01-26 2005-03-15 Applied Materials, Inc. Clamshell and small volume chamber with fixed substrate support
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US7063981B2 (en) 2002-01-30 2006-06-20 Asm International N.V. Active pulse monitoring in a chemical reactor
US6777352B2 (en) 2002-02-11 2004-08-17 Applied Materials, Inc. Variable flow deposition apparatus and method in semiconductor substrate processing
US20030216981A1 (en) 2002-03-12 2003-11-20 Michael Tillman Method and system for hosting centralized online point-of-sale activities for a plurality of distributed customers and vendors
US6932871B2 (en) 2002-04-16 2005-08-23 Applied Materials, Inc. Multi-station deposition apparatus and method
US6778762B1 (en) 2002-04-17 2004-08-17 Novellus Systems, Inc. Sloped chamber top for substrate processing
US20030235961A1 (en) 2002-04-17 2003-12-25 Applied Materials, Inc. Cyclical sequential deposition of multicomponent films
US20030213560A1 (en) 2002-05-16 2003-11-20 Yaxin Wang Tandem wafer processing system and process
KR100505043B1 (en) 2002-05-25 2005-07-29 삼성전자주식회사 Method for forming a capacitor
KR100476926B1 (en) 2002-07-02 2005-03-17 삼성전자주식회사 Method for forming dual gate of semiconductor device
US6955211B2 (en) 2002-07-17 2005-10-18 Applied Materials, Inc. Method and apparatus for gas temperature control in a semiconductor processing system
US7186385B2 (en) 2002-07-17 2007-03-06 Applied Materials, Inc. Apparatus for providing gas to a processing chamber
US7066194B2 (en) 2002-07-19 2006-06-27 Applied Materials, Inc. Valve design and configuration for fast delivery system
US6772072B2 (en) 2002-07-22 2004-08-03 Applied Materials, Inc. Method and apparatus for monitoring solid precursor delivery
US7300038B2 (en) 2002-07-23 2007-11-27 Advanced Technology Materials, Inc. Method and apparatus to help promote contact of gas with vaporized material
US6921062B2 (en) 2002-07-23 2005-07-26 Advanced Technology Materials, Inc. Vaporizer delivery ampoule
US6915592B2 (en) 2002-07-29 2005-07-12 Applied Materials, Inc. Method and apparatus for generating gas to a processing chamber
US20040065255A1 (en) 2002-10-02 2004-04-08 Applied Materials, Inc. Cyclical layer deposition system
US6821563B2 (en) 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US20040069227A1 (en) 2002-10-09 2004-04-15 Applied Materials, Inc. Processing chamber configured for uniform gas flow
US6905737B2 (en) 2002-10-11 2005-06-14 Applied Materials, Inc. Method of delivering activated species for rapid cyclical deposition
US6716287B1 (en) 2002-10-18 2004-04-06 Applied Materials Inc. Processing chamber with flow-restricting ring
US7204886B2 (en) 2002-11-14 2007-04-17 Applied Materials, Inc. Apparatus and method for hybrid chemical processing
US6868859B2 (en) 2003-01-29 2005-03-22 Applied Materials, Inc. Rotary gas valve for pulsing a gas
US6994319B2 (en) 2003-01-29 2006-02-07 Applied Materials, Inc. Membrane gas valve for pulsing a gas
US6818094B2 (en) 2003-01-29 2004-11-16 Applied Materials, Inc. Reciprocating gas valve for pulsing a gas
US20040177813A1 (en) 2003-03-12 2004-09-16 Applied Materials, Inc. Substrate support lift mechanism
US7442415B2 (en) 2003-04-11 2008-10-28 Sharp Laboratories Of America, Inc. Modulated temperature method of atomic layer deposition (ALD) of high dielectric constant films
JP2007514293A (en) 2003-04-21 2007-05-31 アヴィザ テクノロジー インコーポレイテッド System and method for forming a multi-component dielectric layer
US20050070126A1 (en) 2003-04-21 2005-03-31 Yoshihide Senzaki System and method for forming multi-component dielectric films
US6881437B2 (en) 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
US20050095859A1 (en) 2003-11-03 2005-05-05 Applied Materials, Inc. Precursor delivery system with rate control
US20050104142A1 (en) 2003-11-13 2005-05-19 Vijav Narayanan CVD tantalum compounds for FET get electrodes
US20050153571A1 (en) 2003-11-17 2005-07-14 Yoshihide Senzaki Nitridation of high-k dielectric films

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168668A (en) *
US202473A (en) * 1878-04-16 Improvement in shaft-couplings
US539796A (en) * 1895-05-28 Coupling
US1173289A (en) * 1916-02-29 American Manganese Steel Co Mill-pinion.
US1104666A (en) * 1913-06-18 1914-07-21 Corona Mfg Co Ratchet-wheel and the like.
US1100504A (en) * 1913-07-22 1914-06-16 Herbert Othro Taft Jack-spool and fastener.
US2499146A (en) * 1946-01-24 1950-02-28 Ernest T Kindt Dowel pin
US2619215A (en) * 1950-08-22 1952-11-25 Toledo Scale Co Mounting for key buttons
US3876174A (en) * 1972-05-15 1975-04-08 Southwestern Ind Inc Universally adjustable mounting apparatus
US4629321A (en) * 1985-09-27 1986-12-16 Spectra-Physics, Inc. Grade setting and calibration arrangement for laser beam projection device
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
US6089723A (en) * 1995-08-14 2000-07-18 Kabushiki Kaisha Tokai Rika Denki Seisakusho Mounting structure of base and base cover in door mirror for automobile
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5860640A (en) * 1995-11-29 1999-01-19 Applied Materials, Inc. Semiconductor wafer alignment member and clamp ring
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US5796066A (en) * 1996-03-29 1998-08-18 Lam Research Corporation Cable actuated drive assembly for vacuum chamber
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
US6001234A (en) * 1997-09-30 1999-12-14 Semitool, Inc. Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
US6146504A (en) * 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
US6213478B1 (en) * 1999-03-11 2001-04-10 Moore Epitaxial, Inc. Holding mechanism for a susceptor in a substrate processing reactor
US6511368B1 (en) * 1999-10-27 2003-01-28 Strasbaugh Spherical drive assembly for chemical mechanical planarization
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6609909B2 (en) * 2000-10-19 2003-08-26 Tokyo Ohka Kogyo C., Ltd. Heat treatment apparatus and method
US20020121312A1 (en) * 2001-03-01 2002-09-05 Dmitry Lubomirsky Lift pin alignment and operation methods and apparatus
US20030075387A1 (en) * 2001-10-22 2003-04-24 Chung-Chiang Wang Wafer loading device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7871470B2 (en) 2003-03-12 2011-01-18 Applied Materials, Inc. Substrate support lift mechanism
US20050028739A1 (en) * 2003-08-08 2005-02-10 Sumitomo Electric Industries, Ltd. Semiconductor Manufacturing Apparatus
US20060180968A1 (en) * 2005-01-24 2006-08-17 Kim Kyung S Semiconductor manufacturing apparatus
US20080017116A1 (en) * 2006-07-18 2008-01-24 Jeffrey Campbell Substrate support with adjustable lift and rotation mount
US20080017117A1 (en) * 2006-07-18 2008-01-24 Jeffrey Campbell Substrate support with adjustable lift and rotation mount
US20080295771A1 (en) * 2007-05-30 2008-12-04 Industrial Technology Research Institute Power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same
US7927425B2 (en) * 2007-05-30 2011-04-19 Industrial Technology Research Institute Power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same
US8747560B2 (en) * 2008-05-02 2014-06-10 Applied Materials, Inc. System and method for pedestal adjustment
US20090276097A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Non-contact substrate support position sensing system and corresponding adjustments
US20090272719A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. System and method for pedestal adjustment
US8398777B2 (en) * 2008-05-02 2013-03-19 Applied Materials, Inc. System and method for pedestal adjustment
US8441640B2 (en) 2008-05-02 2013-05-14 Applied Materials, Inc. Non-contact substrate support position sensing system and corresponding adjustments
US20100059183A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine
JPWO2013005481A1 (en) * 2011-07-05 2015-02-23 エピクルー株式会社 Susceptor apparatus and film forming apparatus having the same
WO2018022577A1 (en) * 2016-07-25 2018-02-01 Applied Materials, Inc. Fine leveling of large carousel based susceptor

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