JP4785229B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4785229B2
JP4785229B2 JP2000135602A JP2000135602A JP4785229B2 JP 4785229 B2 JP4785229 B2 JP 4785229B2 JP 2000135602 A JP2000135602 A JP 2000135602A JP 2000135602 A JP2000135602 A JP 2000135602A JP 4785229 B2 JP4785229 B2 JP 4785229B2
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Japan
Prior art keywords
film
layer
conductive
pixel electrode
forming
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Expired - Fee Related
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JP2000135602A
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English (en)
Japanese (ja)
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JP2001318626A (ja
JP2001318626A5 (enExample
Inventor
舜平 山崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to US09/566,733 priority Critical patent/US6900084B1/en
Priority to JP2000135602A priority patent/JP4785229B2/ja
Priority to TW90105335A priority patent/TW497122B/zh
Priority to KR20010025175A priority patent/KR101253485B1/ko
Publication of JP2001318626A publication Critical patent/JP2001318626A/ja
Priority to US11/132,276 priority patent/US7102165B2/en
Priority to KR1020060041215A priority patent/KR100864798B1/ko
Priority to US11/514,274 priority patent/US7323715B2/en
Publication of JP2001318626A5 publication Critical patent/JP2001318626A5/ja
Priority to US12/010,487 priority patent/US7902550B2/en
Priority to KR1020080024222A priority patent/KR100884700B1/ko
Priority to KR1020090036546A priority patent/KR100920321B1/ko
Priority to US13/037,927 priority patent/US8525173B2/en
Application granted granted Critical
Publication of JP4785229B2 publication Critical patent/JP4785229B2/ja
Priority to KR1020120083391A priority patent/KR20120090923A/ko
Priority to KR1020130012042A priority patent/KR20130026465A/ko
Priority to US14/013,443 priority patent/US8823004B2/en
Priority to KR1020130162265A priority patent/KR20140012921A/ko
Priority to US14/471,594 priority patent/US9048146B2/en
Priority to US14/721,482 priority patent/US9429807B2/en
Anticipated expiration legal-status Critical
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

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US09/566,733 US6900084B1 (en) 2000-05-09 2000-05-09 Semiconductor device having a display device
JP2000135602A JP4785229B2 (ja) 2000-05-09 2000-05-09 半導体装置の作製方法
TW90105335A TW497122B (en) 2000-05-09 2001-03-07 Semiconductor device and manufacturing method thereof
KR20010025175A KR101253485B1 (ko) 2000-05-09 2001-05-09 반도체 디바이스 및 그의 제조 방법
US11/132,276 US7102165B2 (en) 2000-05-09 2005-05-19 Semiconductor device and manufacturing method thereof
KR1020060041215A KR100864798B1 (ko) 2000-05-09 2006-05-08 반도체 디바이스
US11/514,274 US7323715B2 (en) 2000-05-09 2006-09-01 Semiconductor device and manufacturing method thereof
US12/010,487 US7902550B2 (en) 2000-05-09 2008-01-25 Semiconductor device and manufacturing method thereof
KR1020080024222A KR100884700B1 (ko) 2000-05-09 2008-03-17 반도체 디바이스
KR1020090036546A KR100920321B1 (ko) 2000-05-09 2009-04-27 반도체 디바이스
US13/037,927 US8525173B2 (en) 2000-05-09 2011-03-01 Semiconductor device and manufacturing method thereof
KR1020120083391A KR20120090923A (ko) 2000-05-09 2012-07-30 액정 디스플레이 디바이스
KR1020130012042A KR20130026465A (ko) 2000-05-09 2013-02-01 반도체 디바이스 제조 방법
US14/013,443 US8823004B2 (en) 2000-05-09 2013-08-29 Semiconductor device and manufacturing method thereof
KR1020130162265A KR20140012921A (ko) 2000-05-09 2013-12-24 반도체 디바이스 제조 방법
US14/471,594 US9048146B2 (en) 2000-05-09 2014-08-28 Semiconductor device and manufacturing method thereof
US14/721,482 US9429807B2 (en) 2000-05-09 2015-05-26 Semiconductor device and manufacturing method thereof

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Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7872728B1 (en) 1996-10-22 2011-01-18 Seiko Epson Corporation Liquid crystal panel substrate, liquid crystal panel, and electronic device and projection display device using the same
JP3728755B2 (ja) * 1996-10-22 2005-12-21 セイコーエプソン株式会社 アクティブマトリックス型液晶パネル
US7226798B2 (en) * 1999-07-19 2007-06-05 United Microelectronics Corp. Fabrication method for a multi-layered thin film protective layer
JP2001053283A (ja) 1999-08-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
US6825488B2 (en) * 2000-01-26 2004-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4118484B2 (ja) 2000-03-06 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001257350A (ja) 2000-03-08 2001-09-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4700160B2 (ja) 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
JP4118485B2 (ja) * 2000-03-13 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4683688B2 (ja) * 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4393662B2 (ja) * 2000-03-17 2010-01-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
US6900084B1 (en) 2000-05-09 2005-05-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a display device
US20020031909A1 (en) * 2000-05-11 2002-03-14 Cyril Cabral Self-aligned silicone process for low resistivity contacts to thin film silicon-on-insulator mosfets
TW497269B (en) * 2000-05-13 2002-08-01 Semiconductor Energy Lab Manufacturing method of semiconductor device
US6503833B1 (en) * 2000-11-15 2003-01-07 International Business Machines Corporation Self-aligned silicide (salicide) process for strained silicon MOSFET ON SiGe and structure formed thereby
US6891194B2 (en) * 2001-02-07 2005-05-10 Sharp Kabushiki Kaisha Active matrix substrate, electromagnetic detector, and liquid crystal display apparatus
US7071037B2 (en) 2001-03-06 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4087620B2 (ja) * 2002-03-01 2008-05-21 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4101533B2 (ja) * 2002-03-01 2008-06-18 株式会社半導体エネルギー研究所 半透過型の液晶表示装置の作製方法
JP4237442B2 (ja) 2002-03-01 2009-03-11 株式会社半導体エネルギー研究所 半透過型液晶表示装置
KR100840323B1 (ko) * 2002-03-15 2008-06-20 삼성전자주식회사 반사형 액정 표시 장치용 박막 트랜지스터 기판 및 그의제조 방법
JP3890270B2 (ja) 2002-07-19 2007-03-07 Ｎｅｃ液晶テクノロジー株式会社 薄膜トランジスタの製造方法
US7190000B2 (en) * 2003-08-11 2007-03-13 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof
JP4654581B2 (ja) * 2004-01-30 2011-03-23 セイコーエプソン株式会社 Ｔｆｔ基板の製造方法
JP4499481B2 (ja) * 2004-06-03 2010-07-07 富士通株式会社 液晶表示装置及びその製造方法
KR101126396B1 (ko) * 2004-06-25 2012-03-28 엘지디스플레이 주식회사 박막트랜지스터 어레이 기판 및 그 제조방법
WO2006080550A1 (en) * 2005-01-31 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
EP1854140A4 (en) * 2005-02-10 2008-06-04 Semiconductor Energy Lab MEMORY ELEMENT AND SEMICONDUCTOR DEVICE
US8253179B2 (en) 2005-05-13 2012-08-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US7432201B2 (en) * 2005-07-19 2008-10-07 Applied Materials, Inc. Hybrid PVD-CVD system
TWI295816B (en) * 2005-07-19 2008-04-11 Applied Materials Inc Hybrid pvd-cvd system
WO2007015458A1 (ja) * 2005-08-03 2007-02-08 Sharp Kabushiki Kaisha 液晶表示装置およびそれを備えた電子機器
JP5080978B2 (ja) * 2005-09-30 2012-11-21 シャープ株式会社 薄膜トランジスタアレイ基板の製造方法
JP2007212699A (ja) * 2006-02-09 2007-08-23 Idemitsu Kosan Co Ltd 反射型ｔｆｔ基板及び反射型ｔｆｔ基板の製造方法
CN101395525B (zh) 2006-03-23 2010-11-10 夏普株式会社 液晶显示装置
CN101484839B (zh) * 2006-06-30 2012-07-04 夏普株式会社 液晶显示装置和液晶显示装置的制造方法
US8111356B2 (en) 2006-09-12 2012-02-07 Sharp Kabushiki Kaisha Liquid crystal display panel provided with microlens array, method for manufacturing the liquid crystal display panel, and liquid crystal display device
JP4903807B2 (ja) * 2006-10-18 2012-03-28 シャープ株式会社 液晶表示装置および液晶表示装置の製造方法
EP2085813B1 (en) * 2006-10-18 2014-01-01 Sharp Kabushiki Kaisha Liquid crystal display and method for manufacturing liquid crystal display
US7879631B2 (en) * 2006-10-24 2011-02-01 Hong Jim T Systems and methods for on-die light sensing with low leakage
CN101558350B (zh) * 2006-12-14 2011-08-03 夏普株式会社 液晶显示装置和液晶显示装置的制造方法
CN101589331B (zh) * 2007-01-24 2011-06-22 夏普株式会社 液晶显示装置
US7777224B2 (en) * 2007-01-30 2010-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
EP2124094A4 (en) * 2007-01-31 2011-09-07 Sharp Kk LIQUID CRYSTAL DISPLAY DEVICE
JP4658979B2 (ja) * 2007-02-23 2011-03-23 京セラ株式会社 液晶表示装置
EP2144109B1 (en) 2007-04-13 2012-05-23 Sharp Kabushiki Kaisha Liquid crystal display and method of manufacturing liquid crystal display
EP2166403A4 (en) * 2007-06-26 2011-05-25 Sharp Kk Liquid crystal display arrangement and method for producing a liquid crystal display
US8334537B2 (en) * 2007-07-06 2012-12-18 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
TWI456663B (zh) 2007-07-20 2014-10-11 Semiconductor Energy Lab 顯示裝置之製造方法
TWI360708B (en) * 2007-12-17 2012-03-21 Au Optronics Corp Pixel structure, display panel, elecro-optical app
TWI574423B (zh) * 2008-11-07 2017-03-11 半導體能源研究所股份有限公司 半導體裝置和其製造方法
WO2010098101A1 (ja) * 2009-02-27 2010-09-02 株式会社アルバック トランジスタ、トランジスタの製造方法及びその製造装置
JPWO2010098100A1 (ja) * 2009-02-27 2012-08-30 株式会社アルバック トランジスタ、トランジスタの製造方法及びその製造装置
US9047815B2 (en) 2009-02-27 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
JP5488136B2 (ja) * 2010-04-05 2014-05-14 セイコーエプソン株式会社 電気光学装置及び電子機器並びにトランジスター
KR101372084B1 (ko) 2010-06-29 2014-03-07 쿨레지 라이팅 인크. 항복형 기판을 갖는 전자 장치
TWI584383B (zh) * 2011-12-27 2017-05-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
TWI612689B (zh) 2013-04-15 2018-01-21 半導體能源研究所股份有限公司 發光裝置
US9494792B2 (en) * 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR102331396B1 (ko) 2014-06-13 2021-11-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US10147747B2 (en) 2014-08-21 2018-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and electronic device
KR102378360B1 (ko) * 2015-05-12 2022-03-25 삼성디스플레이 주식회사 유기 발광 표시 장치
US10330994B2 (en) * 2015-06-05 2019-06-25 Sharp Kabushiki Kaisha Active matrix substrate, liquid crystal panel, and method for manufacturing active matrix substrate
JP6545625B2 (ja) * 2016-02-04 2019-07-17 株式会社コベルコ科研 表示装置用配線構造
TWI744383B (zh) * 2016-10-19 2021-11-01 日商索尼股份有限公司 液晶顯示裝置及投射型顯示裝置
JP2018124480A (ja) * 2017-02-02 2018-08-09 株式会社ジャパンディスプレイ 表示装置
CN107065328A (zh) * 2017-05-23 2017-08-18 京东方科技集团股份有限公司 一种像素结构、显示面板、显示装置及像素结构制作方法
CN110085740B (zh) * 2018-01-25 2022-01-11 绵阳京东方光电科技有限公司 柔性基板及其制作方法、面板以及电子装置
CN108241240B (zh) * 2018-02-08 2021-05-14 上海天马微电子有限公司 一种显示面板以及显示装置
KR102724703B1 (ko) * 2018-10-23 2024-11-01 삼성디스플레이 주식회사 디스플레이 장치 및 디스플레이 장치를 제조하기 위한 마스크
CN111352262A (zh) * 2018-12-21 2020-06-30 群创光电股份有限公司 电子装置
US11256308B2 (en) * 2019-03-14 2022-02-22 Sharp Kabushiki Kaisha Wiring substrate and display panel
WO2022134029A1 (zh) * 2020-12-25 2022-06-30 京东方科技集团股份有限公司 显示面板、显示面板的制造方法以及显示装置

Family Cites Families (251)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967981A (en) 1971-01-14 1976-07-06 Shumpei Yamazaki Method for manufacturing a semiconductor field effort transistor
JPS5724917A (en) 1980-07-23 1982-02-09 Hitachi Ltd Multilayer liquid crystal panel
JPH0682839B2 (ja) 1984-08-21 1994-10-19 セイコー電子工業株式会社 表示用パネルの製造方法
US4730903A (en) 1985-01-23 1988-03-15 Semiconductor Energy Laboratory Co., Ltd. Ferroelectric crystal display panel and manufacturing method thereof
JPH0618215B2 (ja) 1985-12-03 1994-03-09 セイコー電子工業株式会社 薄膜トランジスタの製造方法
DE3689843T2 (de) 1986-03-06 1994-09-01 Toshiba Kawasaki Kk Steuerschaltung einer Flüssigkristallanzeige.
JPS6344742A (ja) 1986-08-12 1988-02-25 Fujitsu Ltd 半導体装置
JPS6382405A (ja) * 1986-09-27 1988-04-13 Canon Inc 強誘電性液晶素子
US4960719A (en) 1988-02-04 1990-10-02 Seikosha Co., Ltd. Method for producing amorphous silicon thin film transistor array substrate
JPH01210989A (ja) 1988-02-19 1989-08-24 Hitachi Ltd 液晶表示装置
US5231039A (en) 1988-02-25 1993-07-27 Sharp Kabushiki Kaisha Method of fabricating a liquid crystal display device
JPH0242761A (ja) 1988-04-20 1990-02-13 Matsushita Electric Ind Co Ltd アクティブマトリクス基板の製造方法
JP2653099B2 (ja) 1988-05-17 1997-09-10 セイコーエプソン株式会社 アクティブマトリクスパネル，投写型表示装置及びビューファインダー
US5130833A (en) 1989-09-01 1992-07-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device and manufacturing method therefor
KR970009491B1 (ko) 1989-11-30 1997-06-13 가부시끼가이샤 도시바 배선재료와 이를 이용한 전자장치 및 액정표시장치
JP2657429B2 (ja) 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
US5151806A (en) 1990-04-27 1992-09-29 Mitsubishi Denki Kabushiki Kaisha Liquid crystal display apparatus having a series combination of the storage capacitors
JP2875363B2 (ja) 1990-08-08 1999-03-31 株式会社日立製作所 液晶表示装置
US5198694A (en) 1990-10-05 1993-03-30 General Electric Company Thin film transistor structure with improved source/drain contacts
US5849601A (en) 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
KR950001360B1 (ko) 1990-11-26 1995-02-17 가부시키가이샤 한도오따이 에네루기 겐큐쇼 전기 광학장치와 그 구동방법
US5261156A (en) 1991-02-28 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of electrically connecting an integrated circuit to an electric device
JP2564728B2 (ja) 1991-02-28 1996-12-18 株式会社半導体エネルギー研究所 半導体集積回路チップの実装方法
JP3255942B2 (ja) 1991-06-19 2002-02-12 株式会社半導体エネルギー研究所 逆スタガ薄膜トランジスタの作製方法
US5391920A (en) 1991-07-09 1995-02-21 Yamaha Corporation Semiconductor device having peripheral metal wiring
JPH0534717A (ja) 1991-07-26 1993-02-12 Sanyo Electric Co Ltd 液晶表示装置およびその製造方法
JP2866516B2 (ja) 1991-10-30 1999-03-08 京セラ株式会社 アクティブマトリックス基板およびその製造方法
US5739882A (en) 1991-11-18 1998-04-14 Semiconductor Energy Laboratory Co., Ltd. LCD polymerized column spacer formed on a modified substrate, from an acrylic resin, on a surface having hydrophilic and hydrophobic portions, or at regular spacings
JPH05142558A (ja) 1991-11-26 1993-06-11 Fujitsu Ltd 液晶表示装置
JPH05175500A (ja) 1991-12-26 1993-07-13 Kyocera Corp アクティブマトリックス基板の製造方法
GB9200839D0 (en) 1992-01-15 1992-03-11 Emi Plc Thorn Optical modulation device
JP3066192B2 (ja) * 1992-07-10 2000-07-17 シャープ株式会社 反射型アクティブマトリクス基板の製造方法
US5418635A (en) 1992-02-19 1995-05-23 Sharp Kabushiki Kaisha Liquid crystal device with a reflective substrate with bumps of photosensitive resin which have 2 or more heights and random configuration
JPH05265020A (ja) 1992-03-18 1993-10-15 Hitachi Ltd テープキャリアパッケージ
GB9206086D0 (en) 1992-03-20 1992-05-06 Philips Electronics Uk Ltd Manufacturing electronic devices comprising,e.g.tfts and mims
JP2793076B2 (ja) 1992-05-20 1998-09-03 シャープ株式会社 反射型液晶表示装置およびその製造方法
JPH0682754A (ja) 1992-07-16 1994-03-25 Toshiba Corp アクティブマトリクス型表示装置
JP3120200B2 (ja) 1992-10-12 2000-12-25 セイコーインスツルメンツ株式会社 光弁装置、立体画像表示装置および画像プロジェクタ
JP2988159B2 (ja) 1992-11-13 1999-12-06 日本電気株式会社 液晶表示装置
JPH06194615A (ja) 1992-12-24 1994-07-15 Casio Comput Co Ltd 強誘電性液晶素子の製造方法
JPH06250210A (ja) 1993-02-23 1994-09-09 Hitachi Ltd 液晶表示装置およびその製造方法
US5821622A (en) 1993-03-12 1998-10-13 Kabushiki Kaisha Toshiba Liquid crystal display device
FR2702882B1 (fr) 1993-03-16 1995-07-28 Thomson Lcd Procédé de fabrication de transistors à couches minces étagés directs.
JP3512849B2 (ja) 1993-04-23 2004-03-31 株式会社東芝 薄膜トランジスタおよびそれを用いた表示装置
US5346833A (en) * 1993-04-05 1994-09-13 Industrial Technology Research Institute Simplified method of making active matrix liquid crystal display
JPH07152024A (ja) 1993-05-17 1995-06-16 Sharp Corp 液晶表示素子
GB9311129D0 (en) 1993-05-28 1993-07-14 Philips Electronics Uk Ltd Electronic devices with-film circuit elements forming a sampling circuit
JPH0713196A (ja) * 1993-06-21 1995-01-17 Toshiba Corp アクティブマトリックス型液晶表示装置
US6190933B1 (en) * 1993-06-30 2001-02-20 The United States Of America As Represented By The Secretary Of The Navy Ultra-high resolution liquid crystal display on silicon-on-sapphire
EP0843194B1 (en) 1993-07-27 2005-03-16 Sharp Kabushiki Kaisha Liquid crystal display
JPH07335904A (ja) 1994-06-14 1995-12-22 Semiconductor Energy Lab Co Ltd 薄膜半導体集積回路
JPH07131030A (ja) 1993-11-05 1995-05-19 Sony Corp 表示用薄膜半導体装置及びその製造方法
US7081938B1 (en) 1993-12-03 2006-07-25 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
JPH07159776A (ja) 1993-12-07 1995-06-23 Casio Comput Co Ltd 反射型液晶表示装置
JPH07191348A (ja) 1993-12-27 1995-07-28 Rohm Co Ltd 液晶表示装置の製法
JP2738289B2 (ja) * 1993-12-30 1998-04-08 日本電気株式会社 液晶表示装置の製造方法
US5822026A (en) 1994-02-17 1998-10-13 Seiko Epson Corporation Active matrix substrate and color liquid crystal display
KR0139346B1 (ko) 1994-03-03 1998-06-15 김광호 박막 트랜지스터 액정표시장치의 제조방법
US5668651A (en) 1994-03-18 1997-09-16 Sharp Kabushiki Kaisha Polymer-wall LCD having liquid crystal molecules having a plane-symmetrical bend orientation
US5729312A (en) 1994-03-18 1998-03-17 Sharp Kabushiki Kaisha LCD and method for producing the same in which a larger number of substrate gap control materials is larger in the polymer walls than in the liquid crystal regions
DE69525558T2 (de) 1994-04-22 2002-08-22 Nec Corp., Tokio/Tokyo Methode zur Herstellung eines Dünnfilm-Transistors mit invertierter Struktur
JP3402400B2 (ja) 1994-04-22 2003-05-06 株式会社半導体エネルギー研究所 半導体集積回路の作製方法
TW269743B (enExample) 1994-04-26 1996-02-01 Toshiba Eng Co
JPH07318975A (ja) 1994-05-25 1995-12-08 Sanyo Electric Co Ltd 液晶表示装置
JP3253808B2 (ja) 1994-07-07 2002-02-04 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JPH0864829A (ja) * 1994-08-24 1996-03-08 Hitachi Ltd 半導体装置とこれを用いた液晶表示装置
TW321731B (enExample) * 1994-07-27 1997-12-01 Hitachi Ltd
JP3122003B2 (ja) 1994-08-24 2001-01-09 シャープ株式会社 アクティブマトリクス基板
JPH0864828A (ja) 1994-08-24 1996-03-08 Oki Electric Ind Co Ltd 薄膜トランジスタの製造方法
JPH0887030A (ja) 1994-09-16 1996-04-02 Hitachi Ltd 液晶表示装置の製造方法
JP3238020B2 (ja) 1994-09-16 2001-12-10 株式会社東芝 アクティブマトリクス表示装置の製造方法
JP3097945B2 (ja) * 1994-10-03 2000-10-10 シャープ株式会社 反射型液晶表示装置の製造方法
TW344043B (en) 1994-10-21 1998-11-01 Hitachi Ltd Liquid crystal display device with reduced frame portion surrounding display area
KR100336554B1 (ko) 1994-11-23 2002-11-23 주식회사 하이닉스반도체 반도체소자의배선층형성방법
JPH08201853A (ja) 1994-11-24 1996-08-09 Toshiba Electron Eng Corp 電極基板および平面表示装置
JPH08220562A (ja) 1994-12-14 1996-08-30 Toshiba Corp 表示装置用アレイ基板およびその製造方法
JPH08228011A (ja) 1994-12-14 1996-09-03 Toshiba Corp 半導体装置およびその製造方法
JP3364081B2 (ja) 1995-02-16 2003-01-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH08227283A (ja) 1995-02-21 1996-09-03 Seiko Epson Corp 液晶表示装置、その駆動方法及び表示システム
US5757456A (en) 1995-03-10 1998-05-26 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating involving peeling circuits from one substrate and mounting on other
US5834327A (en) 1995-03-18 1998-11-10 Semiconductor Energy Laboratory Co., Ltd. Method for producing display device
JP3499327B2 (ja) 1995-03-27 2004-02-23 株式会社半導体エネルギー研究所 表示装置の作製方法
US5706064A (en) * 1995-03-31 1998-01-06 Kabushiki Kaisha Toshiba LCD having an organic-inorganic hybrid glass functional layer
KR0139346Y1 (ko) 1995-05-03 1999-03-20 김광호 강제대류형 로타리 히터의 방열장치
KR100303134B1 (ko) 1995-05-09 2002-11-23 엘지.필립스 엘시디 주식회사 액정표시소자및그제조방법.
US5539219A (en) 1995-05-19 1996-07-23 Ois Optical Imaging Systems, Inc. Thin film transistor with reduced channel length for liquid crystal displays
US5532180A (en) 1995-06-02 1996-07-02 Ois Optical Imaging Systems, Inc. Method of fabricating a TFT with reduced channel length
US6124606A (en) 1995-06-06 2000-09-26 Ois Optical Imaging Systems, Inc. Method of making a large area imager with improved signal-to-noise ratio
US5994721A (en) 1995-06-06 1999-11-30 Ois Optical Imaging Systems, Inc. High aperture LCD with insulating color filters overlapping bus lines on active substrate
JPH095767A (ja) 1995-06-22 1997-01-10 Sanyo Electric Co Ltd 液晶パネルの入力端構造
JPH0915621A (ja) 1995-06-29 1997-01-17 Kyocera Corp 液晶表示装置
JP3744980B2 (ja) 1995-07-27 2006-02-15 株式会社半導体エネルギー研究所 半導体装置
JP2990046B2 (ja) 1995-08-16 1999-12-13 日本電気株式会社 反射型液晶表示装置及びその製造方法
KR100338480B1 (ko) 1995-08-19 2003-01-24 엘지.필립스 엘시디 주식회사 액정표시장치및그제조방법
JPH0964366A (ja) 1995-08-23 1997-03-07 Toshiba Corp 薄膜トランジスタ
KR100204071B1 (ko) 1995-08-29 1999-06-15 구자홍 박막트랜지스터-액정표시장치 및 제조방법
JPH0974257A (ja) 1995-09-01 1997-03-18 Dainippon Printing Co Ltd 厚膜配線およびその製造方法
JP3474975B2 (ja) 1995-09-06 2003-12-08 株式会社 日立ディスプレイズ 液晶表示装置およびその製造方法
KR100412933B1 (ko) 1995-09-14 2004-03-22 가부시끼가이샤 히다치 세이사꾸쇼 액티브매트릭스형액정표시장치
JP3199215B2 (ja) 1995-09-14 2001-08-13 シャープ株式会社 液晶表示素子およびその製造方法
JPH0990397A (ja) 1995-09-28 1997-04-04 Sharp Corp アクティブマトリクス基板およびそれを用いた表示装置
JPH09127551A (ja) 1995-10-31 1997-05-16 Sharp Corp 半導体装置およびアクティブマトリクス基板
US5959599A (en) 1995-11-07 1999-09-28 Semiconductor Energy Laboratory Co., Ltd. Active matrix type liquid-crystal display unit and method of driving the same
TW329500B (en) 1995-11-14 1998-04-11 Handotai Energy Kenkyusho Kk Electro-optical device
JPH09146108A (ja) 1995-11-17 1997-06-06 Semiconductor Energy Lab Co Ltd 液晶表示装置およびその駆動方法
KR0175409B1 (ko) 1995-11-20 1999-02-18 김광호 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법
KR0175410B1 (ko) 1995-11-21 1999-02-01 김광호 액정 표시 장치용 박막 트랜지스터 기판 및 그 제조 방법
DE69635239T2 (de) 1995-11-21 2006-07-06 Samsung Electronics Co., Ltd., Suwon Verfahren zur Herstellung einer Flüssigkristall-Anzeige
KR100219118B1 (ko) 1996-08-30 1999-09-01 구자홍 박막트랜지스터 액정표시장치 및 그 제조방법
KR0161466B1 (ko) 1995-11-29 1999-01-15 김광호 액정표시장치의 제조방법
JPH09152626A (ja) 1995-11-29 1997-06-10 Kyocera Corp 液晶表示装置およびその製造方法
JPH09153618A (ja) 1995-11-30 1997-06-10 Sanyo Electric Co Ltd 液晶表示装置の製造方法
US5739880A (en) 1995-12-01 1998-04-14 Hitachi, Ltd. Liquid crystal display device having a shielding film for shielding light from a light source
US6097458A (en) * 1995-12-11 2000-08-01 Sharp Kabushiki Kaisha Reflector, reflective liquid crystal display incorporating the same and method for fabricating the same
JPH09160071A (ja) 1995-12-12 1997-06-20 Toshiba Corp 液晶表示装置
JP3963974B2 (ja) 1995-12-20 2007-08-22 株式会社半導体エネルギー研究所 液晶電気光学装置
KR100195269B1 (ko) * 1995-12-22 1999-06-15 윤종용 액정표시장치의 제조방법
KR100190041B1 (ko) * 1995-12-28 1999-06-01 윤종용 액정표시장치의 제조방법
JPH09203890A (ja) 1996-01-25 1997-08-05 Sharp Corp 入力機能付き液晶表示素子および反射型入力機能付き液晶表示素子、並びにそれらの製造方法
US6055028A (en) 1996-02-14 2000-04-25 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal electro-optical device
US6697129B1 (en) 1996-02-14 2004-02-24 Semiconductor Energy Laboratory Co., Ltd. Guest-host mode liquid crystal display device of lateral electric field driving type
US5793072A (en) 1996-02-28 1998-08-11 International Business Machines Corporation Non-photosensitive, vertically redundant 2-channel α-Si:H thin film transistor
US5986724A (en) 1996-03-01 1999-11-16 Kabushiki Kaisha Toshiba Liquid crystal display with liquid crystal layer and ferroelectric layer connected to drain of TFT
JP3708620B2 (ja) 1996-03-01 2005-10-19 株式会社半導体エネルギー研究所 アクティブマトリクス型液晶電気光学装置
JP3597305B2 (ja) 1996-03-05 2004-12-08 株式会社半導体エネルギー研究所 液晶表示装置およびその作製方法
JPH09304757A (ja) * 1996-03-11 1997-11-28 Sharp Corp 液晶表示素子及びその製造方法
KR100213969B1 (ko) 1996-03-15 1999-08-02 구자홍 액티브 매트릭스의 제조방법 및 구조
US6911962B1 (en) 1996-03-26 2005-06-28 Semiconductor Energy Laboratory Co., Ltd. Driving method of active matrix display device
US5847687A (en) 1996-03-26 1998-12-08 Semiconductor Energy Laboratory Co., Ltd. Driving method of active matrix display device
JPH09265113A (ja) 1996-03-28 1997-10-07 Nec Corp アクティブマトリクス型液晶表示装置およびその製造方 法
JPH09274444A (ja) 1996-04-04 1997-10-21 Hitachi Ltd 液晶表示装置
JPH1010583A (ja) * 1996-04-22 1998-01-16 Sharp Corp アクティブマトリクス基板の製造方法、およびそのアクティブマトリクス基板
KR100223158B1 (ko) 1996-06-07 1999-10-15 구자홍 액티브매트릭스기판 및 그 제조방법
US6188452B1 (en) * 1996-07-09 2001-02-13 Lg Electronics, Inc Active matrix liquid crystal display and method of manufacturing same
KR100196336B1 (en) 1996-07-27 1999-06-15 Lg Electronics Inc Method of manufacturing thin film transistor
JP3622934B2 (ja) 1996-07-31 2005-02-23 エルジー フィリップス エルシーディー カンパニー リミテッド 薄膜トランジスタ型液晶表示装置
US6054975A (en) 1996-08-01 2000-04-25 Hitachi, Ltd. Liquid crystal display device having tape carrier packages
JP3657702B2 (ja) 1996-08-06 2005-06-08 株式会社東芝 液晶表示装置
JPH1068931A (ja) 1996-08-28 1998-03-10 Sharp Corp アクティブマトリクス型液晶表示装置
US6437844B1 (en) 1996-09-04 2002-08-20 Matsushita Electric Industrial Co., Ltd. Liquid crystal display device and associated fabrication method
JPH10104663A (ja) 1996-09-27 1998-04-24 Semiconductor Energy Lab Co Ltd 電気光学装置およびその作製方法
KR100268103B1 (ko) 1996-10-11 2000-10-16 윤종용 질화크롬을사용한배선및그제조방법,이를이용한액정표시장치및그제조방법
TW451284B (en) 1996-10-15 2001-08-21 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
JPH10123574A (ja) 1996-10-17 1998-05-15 Hitachi Ltd アクティブマトリクス基板
EP1801641B1 (en) 1996-10-22 2012-10-10 Seiko Epson Corporation Reflective liquid crystal panel substrate
JP3043638B2 (ja) 1996-11-05 2000-05-22 日本電気株式会社 反射型液晶表示装置およびその製造方法
JPH10144928A (ja) 1996-11-08 1998-05-29 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
KR100212284B1 (ko) 1996-11-13 1999-08-02 윤종용 채널 보호형 박막 트랜지스터 기판
JP3788649B2 (ja) 1996-11-22 2006-06-21 株式会社半導体エネルギー研究所 液晶表示装置
US6184946B1 (en) 1996-11-27 2001-02-06 Hitachi, Ltd. Active matrix liquid crystal display
US6266121B1 (en) 1996-11-28 2001-07-24 Sharp Kabushiki Kaisha Liquid crystal display element and method of manufacturing same
KR100244182B1 (ko) 1996-11-29 2000-02-01 구본준 액정표시장치
JPH10170959A (ja) * 1996-12-16 1998-06-26 Casio Comput Co Ltd 液晶表示装置
US6075257A (en) 1996-12-23 2000-06-13 Samsung Electronics Co., Ltd. Thin film transistor substrate for a liquid crystal display having a silicide prevention insulating layer in the electrode structure
JPH10198292A (ja) 1996-12-30 1998-07-31 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP3883244B2 (ja) 1997-01-23 2007-02-21 エルジー フィリップス エルシーディー カンパニー リミテッド 液晶表示装置
US5831710A (en) 1997-02-06 1998-11-03 International Business Machines Corporation Liquid crystal display
JPH10221704A (ja) 1997-02-07 1998-08-21 Sharp Corp 反射型液晶表示装置およびその製造方法
KR100537020B1 (ko) 1997-03-03 2006-03-03 삼성전자주식회사 Ips모드박막트랜지스터용액정표시소자제조방법
JPH10253983A (ja) * 1997-03-14 1998-09-25 Toshiba Corp 反射型液晶表示装置および反射電極
JPH10307288A (ja) 1997-05-09 1998-11-17 Minolta Co Ltd 液晶素子及びその製造方法
KR100257370B1 (ko) 1997-05-19 2000-05-15 구본준 횡전계방식액정표시장치
US6465268B2 (en) 1997-05-22 2002-10-15 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing an electro-optical device
KR100268006B1 (ko) 1997-05-22 2000-10-16 구본준 액정표시소자용반사판의제조방법
KR100262953B1 (ko) 1997-06-11 2000-08-01 구본준 액정 표시 장치 및 그 액정 표시 장치의 제조 방법
EP1413915B1 (en) 1997-06-12 2009-04-15 Sharp Kabushiki Kaisha Vertically-aligned (VA) liquid crystal display device
JP3297372B2 (ja) * 1997-06-17 2002-07-02 シャープ株式会社 反射型液晶表示装置の製造方法
US5943559A (en) 1997-06-23 1999-08-24 Nec Corporation Method for manufacturing liquid crystal display apparatus with drain/source silicide electrodes made by sputtering process
JPH1124063A (ja) * 1997-07-03 1999-01-29 Seiko Instr Inc 反射型液晶表示装置およびその製造方法
KR100257976B1 (ko) 1997-07-22 2000-06-01 구본준, 론 위라하디락사 횡전계방식액정표시장치
KR100510439B1 (ko) 1997-08-20 2005-10-21 삼성전자주식회사 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 패키징 방법
US6177968B1 (en) 1997-09-01 2001-01-23 Canon Kabushiki Kaisha Optical modulation device with pixels each having series connected electrode structure
US6218219B1 (en) 1997-09-29 2001-04-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
JPH11109372A (ja) 1997-09-30 1999-04-23 Toshiba Electronic Engineering Corp 液晶表示素子用基板の製造方法、液晶表示素子の製造方法、液晶表示素子用基板及び液晶表示素子
US6265889B1 (en) 1997-09-30 2001-07-24 Kabushiki Kaisha Toshiba Semiconductor test circuit and a method for testing a semiconductor liquid crystal display circuit
JP3907804B2 (ja) 1997-10-06 2007-04-18 株式会社半導体エネルギー研究所 液晶表示装置
KR100476622B1 (ko) 1997-10-13 2005-08-23 삼성전자주식회사 몰리브덴-텅스턴합금을사용한배선을이용한액정표시장치및그제조방법
US6359672B2 (en) 1997-10-20 2002-03-19 Guardian Industries Corp. Method of making an LCD or X-ray imaging device with first and second insulating layers
US6133977A (en) 1997-10-21 2000-10-17 Samsung Electronics Co., Ltd. Liquid crystal displays having common electrode overlap with one or more data lines
JP4131297B2 (ja) 1997-10-24 2008-08-13 エルジー ディスプレイ カンパニー リミテッド 液晶表示装置の製造方法
US5907380A (en) 1997-10-30 1999-05-25 International Business Machines Corporation Liquid crystal cell employing thin wall for pre-tilt control
AU9652098A (en) 1997-11-18 1999-06-07 Mitsubishi Chemical Corporation Chemical conversion fluid for forming metal oxide film
US6215541B1 (en) 1997-11-20 2001-04-10 Samsung Electronics Co., Ltd. Liquid crystal displays and manufacturing methods thereof
JP3934236B2 (ja) 1998-01-14 2007-06-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US7202497B2 (en) 1997-11-27 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JPH11160734A (ja) 1997-11-28 1999-06-18 Semiconductor Energy Lab Co Ltd 液晶電気光学装置
JP4014710B2 (ja) 1997-11-28 2007-11-28 株式会社半導体エネルギー研究所 液晶表示装置
JP4217287B2 (ja) 1997-11-28 2009-01-28 三菱電機株式会社 Ｔｆｔアレイ基板およびこれを用いた液晶表示装置
JPH11183915A (ja) 1997-12-22 1999-07-09 Nec Corp アクティブマトリクス型液晶表示装置
JP3481843B2 (ja) 1997-12-26 2003-12-22 シャープ株式会社 液晶表示装置
KR100269518B1 (ko) * 1997-12-29 2000-10-16 구본준 박막트랜지스터 제조방법
JPH11264991A (ja) 1998-01-13 1999-09-28 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法
TWI226470B (en) 1998-01-19 2005-01-11 Hitachi Ltd LCD device
KR100612984B1 (ko) * 1998-01-30 2006-10-31 삼성전자주식회사 박막 트랜지스터의 제조 방법
US6617648B1 (en) * 1998-02-25 2003-09-09 Semiconductor Energy Laboratory Co., Ltd. Projection TV
JP3019831B2 (ja) * 1998-03-11 2000-03-13 日本電気株式会社 反射型液晶表示装置及びその製造方法
JPH11258625A (ja) * 1998-03-12 1999-09-24 Toshiba Corp 表示装置用アレイ基板及びその製造方法
KR100502805B1 (ko) 1998-03-12 2005-11-21 삼성전자주식회사 액정 표시 장치 및 그 제조 방법
KR100320007B1 (ko) 1998-03-13 2002-01-10 니시무로 타이죠 표시장치용 어레이기판의 제조방법
JP3050199B2 (ja) 1998-03-18 2000-06-12 日本電気株式会社 配線端子およびその形成方法
KR19990075407A (ko) 1998-03-20 1999-10-15 윤종용 박막 트랜지스터 기판의 제조 방법
JPH11271718A (ja) 1998-03-25 1999-10-08 Sharp Corp 液晶表示装置、プラズマアドレス型液晶表示装置及びその製造方法
JPH11352322A (ja) * 1998-04-07 1999-12-24 Toray Ind Inc カラ―フィルタ及びそれを用いたカラ―液晶表示装置
KR100320661B1 (ko) 1998-04-17 2002-01-17 니시무로 타이죠 액정표시장치, 매트릭스 어레이기판 및 그 제조방법
TW530180B (en) 1998-04-27 2003-05-01 Hitachi Ltd Active matrix type liquid crystal display
JPH11337961A (ja) * 1998-05-26 1999-12-10 Sharp Corp 反射型液晶表示装置およびその製造方法
JP3726495B2 (ja) 1998-05-27 2005-12-14 セイコーエプソン株式会社 ２端子型非線形素子、その非線形素子を用いた液晶表示パネルおよび電子機器
US6317185B1 (en) 1998-05-29 2001-11-13 Hitachi, Ltd. Liquid crystal display apparatus
KR100301803B1 (ko) 1998-06-05 2001-09-22 김영환 박막트랜지스터 및 그의 제조방법
JP2000002886A (ja) 1998-06-16 2000-01-07 Mitsubishi Electric Corp 液晶表示装置の製造方法
JP4190089B2 (ja) 1998-06-30 2008-12-03 シャープ株式会社 液晶表示装置およびその製造方法
KR100333180B1 (ko) 1998-06-30 2003-06-19 주식회사 현대 디스플레이 테크놀로지 Tft-lcd제조방법
JP3335578B2 (ja) 1998-06-30 2002-10-21 シャープ株式会社 液晶表示装置およびその製造方法
JP3565547B2 (ja) 1998-07-31 2004-09-15 シャープ株式会社 カラー液晶表示装置およびその製造方法
JP3526532B2 (ja) 1998-08-26 2004-05-17 シャープ株式会社 液晶表示装置
US6297519B1 (en) 1998-08-28 2001-10-02 Fujitsu Limited TFT substrate with low contact resistance and damage resistant terminals
JP3104687B2 (ja) 1998-08-28 2000-10-30 日本電気株式会社 液晶表示装置
CN1139837C (zh) 1998-10-01 2004-02-25 三星电子株式会社 液晶显示器用薄膜晶体管阵列基板及其制造方法
JP3775071B2 (ja) * 1998-10-08 2006-05-17 セイコーエプソン株式会社 電気光学装置用基板、電気光学装置及び電気光学装置の製造方法、ならびに電気光学装置を用いた電子機器
JP3406242B2 (ja) * 1998-10-15 2003-05-12 シャープ株式会社 液晶表示装置
US5998230A (en) 1998-10-22 1999-12-07 Frontec Incorporated Method for making liquid crystal display device with reduced mask steps
EP2309482A3 (en) 1998-10-30 2013-04-24 Semiconductor Energy Laboratory Co, Ltd. Field sequantial liquid crystal display device and driving method thereof, and head mounted display
US6519018B1 (en) 1998-11-03 2003-02-11 International Business Machines Corporation Vertically aligned liquid crystal displays and methods for their production
US6617644B1 (en) 1998-11-09 2003-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
KR100556345B1 (ko) 1998-11-24 2006-04-21 엘지.필립스 엘시디 주식회사 횡전계방식 액정표시소자의 제조방법
EP1006589B1 (en) 1998-12-03 2012-04-11 Semiconductor Energy Laboratory Co., Ltd. MOS thin film transistor and method of fabricating same
JP2000180891A (ja) 1998-12-11 2000-06-30 Hitachi Ltd 液晶表示装置
TW413949B (en) 1998-12-12 2000-12-01 Samsung Electronics Co Ltd Thin film transistor array panels for liquid crystal displays and methods of manufacturing the same
JP2000193984A (ja) 1998-12-25 2000-07-14 Sony Corp 液晶ライトバルブ装置
US6287899B1 (en) 1998-12-31 2001-09-11 Samsung Electronics Co., Ltd. Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same
JP4215905B2 (ja) * 1999-02-15 2009-01-28 シャープ株式会社 液晶表示装置
JP3763381B2 (ja) 1999-03-10 2006-04-05 シャープ株式会社 液晶表示装置の製造方法
TWI255957B (en) 1999-03-26 2006-06-01 Hitachi Ltd Liquid crystal display device and method of manufacturing the same
US6861670B1 (en) 1999-04-01 2005-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having multi-layer wiring
US6630977B1 (en) 1999-05-20 2003-10-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with capacitor formed around contact hole
US6218221B1 (en) * 1999-05-27 2001-04-17 Chi Mei Optoelectronics Corp. Thin film transistor with a multi-metal structure and a method of manufacturing the same
JP3787041B2 (ja) 1999-06-01 2006-06-21 日本放送協会 回り込みキャンセラ
US6583065B1 (en) 1999-08-03 2003-06-24 Applied Materials Inc. Sidewall polymer forming gas additives for etching processes
JP2001085698A (ja) 1999-09-16 2001-03-30 Toshiba Corp 半導体装置の製造方法
US6493050B1 (en) 1999-10-26 2002-12-10 International Business Machines Corporation Wide viewing angle liquid crystal with ridge/slit pretilt, post spacer and dam structures and method for fabricating same
US6363866B1 (en) * 2000-01-20 2002-04-02 Hou Technology Inc. Table construction
JP4118484B2 (ja) * 2000-03-06 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001257350A (ja) 2000-03-08 2001-09-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4118485B2 (ja) 2000-03-13 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4700160B2 (ja) 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
JP4683688B2 (ja) 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4393662B2 (ja) 2000-03-17 2010-01-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
US6900084B1 (en) 2000-05-09 2005-05-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a display device
JP3384397B2 (ja) * 2000-05-25 2003-03-10 セイコーエプソン株式会社 液晶装置、その製造方法および電子機器
US7071037B2 (en) 2001-03-06 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9054206B2 (en) * 2007-08-17 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device

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US20150346530A1 (en) 2015-12-03
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US7323715B2 (en) 2008-01-29
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