|
US1790397A
(en)
|
|
1931-01-27 |
|
Glass workins machine |
|
US1529243A
(en)
|
1924-01-30 |
1925-03-10 |
Libbey Owens Sheet Glass Co |
Flattening table for continuous sheet glass
|
|
US1626396A
(en)
|
1926-08-02 |
1927-04-26 |
Libbey Owens Sheet Glass Co |
Sheet-glass-drawing apparatus
|
|
US2754956A
(en)
|
1951-05-02 |
1956-07-17 |
Sommer & Maca Glass Machinery |
Conveyor structure for flat glass edging beveling and polishing apparatus
|
|
US2682134A
(en)
|
1951-08-17 |
1954-06-29 |
Corning Glass Works |
Glass sheet containing translucent linear strips
|
|
US2749794A
(en)
|
1953-04-24 |
1956-06-12 |
Corning Glass Works |
Illuminating glassware and method of making it
|
|
US2932087A
(en)
|
1954-05-10 |
1960-04-12 |
Libbey Owens Ford Glass Co |
Template cutting apparatus for bent sheets of glass or the like
|
|
GB1242172A
(en)
|
1968-02-23 |
1971-08-11 |
Ford Motor Co |
A process for chemically cutting glass
|
|
US3647410A
(en)
|
1969-09-09 |
1972-03-07 |
Owens Illinois Inc |
Glass ribbon machine blow head mechanism
|
|
US3729302A
(en)
|
1970-01-02 |
1973-04-24 |
Owens Illinois Inc |
Removal of glass article from ribbon forming machine by vibrating force
|
|
US3775084A
(en)
|
1970-01-02 |
1973-11-27 |
Owens Illinois Inc |
Pressurizer apparatus for glass ribbon machine
|
|
US3673900A
(en)
|
1970-08-10 |
1972-07-04 |
Shatterproof Glass Corp |
Glass cutting apparatus
|
|
US3695497A
(en)
|
1970-08-26 |
1972-10-03 |
Ppg Industries Inc |
Method of severing glass
|
|
US3695498A
(en)
|
1970-08-26 |
1972-10-03 |
Ppg Industries Inc |
Non-contact thermal cutting
|
|
DE2231330A1
(de)
|
1972-06-27 |
1974-01-10 |
Agfa Gevaert Ag |
Verfahren und vorrichtung zur erzeugung eines scharfen fokus
|
|
US3947093A
(en)
*
|
1973-06-28 |
1976-03-30 |
Canon Kabushiki Kaisha |
Optical device for producing a minute light beam
|
|
GB1500207A
(en)
|
1975-10-29 |
1978-02-08 |
Pilkington Brothers Ltd |
Breaking flat glass into cullet
|
|
JPS5318756A
(en)
|
1976-07-31 |
1978-02-21 |
Izawa Seimen Koujiyou Yuugen |
Production of boiled noodle with long preservetivity
|
|
DE2757890C2
(de)
|
1977-12-24 |
1981-10-15 |
Fa. Karl Lutz, 6980 Wertheim |
Verfahren und Vorrichtung zum Herstellen von Behältnissen aus Röhrenglas, insbesondere Ampullen
|
|
JPS54136045A
(en)
|
1978-04-07 |
1979-10-22 |
Inoue Gomu Kogyo Kk |
Preparation of elastic bumper for automobile* to which ornamental lace body is integrally installed
|
|
JPS5713480A
(en)
|
1980-06-26 |
1982-01-23 |
Hitachi Ltd |
Crt display unit
|
|
US4441008A
(en)
|
1981-09-14 |
1984-04-03 |
Ford Motor Company |
Method of drilling ultrafine channels through glass
|
|
US4546231A
(en)
|
1983-11-14 |
1985-10-08 |
Group Ii Manufacturing Ltd. |
Creation of a parting zone in a crystal structure
|
|
US4618056A
(en)
|
1984-03-23 |
1986-10-21 |
Omega Castings, Inc. |
Link conveyor belt for heat treating apparatus
|
|
JPS6174794A
(ja)
|
1984-09-17 |
1986-04-17 |
Mitsubishi Electric Corp |
レ−ザ加工装置の加工ヘツド
|
|
US4623776A
(en)
|
1985-01-03 |
1986-11-18 |
Dow Corning Corporation |
Ring of light laser optics system
|
|
US4642439A
(en)
|
1985-01-03 |
1987-02-10 |
Dow Corning Corporation |
Method and apparatus for edge contouring lenses
|
|
JPS6246930A
(ja)
|
1985-08-21 |
1987-02-28 |
Bandou Kiko Kk |
ガラス板の割断装置
|
|
US4646308A
(en)
|
1985-09-30 |
1987-02-24 |
Spectra-Physics, Inc. |
Synchronously pumped dye laser using ultrashort pump pulses
|
|
JPS6318756A
(ja)
|
1986-07-09 |
1988-01-26 |
Fujiwara Jiyouki Sangyo Kk |
生物育成、微生物培養工程における制御温度の監視方法及びその装置
|
|
US4749400A
(en)
|
1986-12-12 |
1988-06-07 |
Ppg Industries, Inc. |
Discrete glass sheet cutting
|
|
EP0272582B1
(en)
|
1986-12-18 |
1994-05-18 |
Sumitomo Chemical Company, Limited |
Light control sheets
|
|
JP2691543B2
(ja)
|
1986-12-18 |
1997-12-17 |
住友化学工業株式会社 |
光制御板およびその製造方法
|
|
JPS63192561A
(ja)
|
1987-02-04 |
1988-08-09 |
Nkk Corp |
マルチ切断装置
|
|
US5104523A
(en)
|
1987-05-29 |
1992-04-14 |
Nippon Sheet Glass Co., Ltd. |
Glass-plate sorting system
|
|
US4918751A
(en)
|
1987-10-05 |
1990-04-17 |
The University Of Rochester |
Method for optical pulse transmission through optical fibers which increases the pulse power handling capacity of the fibers
|
|
IL84255A
(en)
|
1987-10-23 |
1993-02-21 |
Galram Technology Ind Ltd |
Process for removal of post- baked photoresist layer
|
|
JPH01179770A
(ja)
|
1988-01-12 |
1989-07-17 |
Hiroshima Denki Gakuen |
金属とセラミックスとの接合方法
|
|
US4764930A
(en)
|
1988-01-27 |
1988-08-16 |
Intelligent Surgical Lasers |
Multiwavelength laser source
|
|
US4907586A
(en)
|
1988-03-31 |
1990-03-13 |
Intelligent Surgical Lasers |
Method for reshaping the eye
|
|
US4929065A
(en)
|
1988-11-03 |
1990-05-29 |
Isotec Partners, Ltd. |
Glass plate fusion for macro-gradient refractive index materials
|
|
US4891054A
(en)
|
1988-12-30 |
1990-01-02 |
Ppg Industries, Inc. |
Method for cutting hot glass
|
|
US5112722A
(en)
|
1989-04-12 |
1992-05-12 |
Nippon Sheet Glass Co., Ltd. |
Method of producing light control plate which induces scattering of light at different angles
|
|
US5104210A
(en)
|
1989-04-24 |
1992-04-14 |
Monsanto Company |
Light control films and method of making
|
|
US5035918A
(en)
|
1989-04-26 |
1991-07-30 |
Amp Incorporated |
Non-flammable and strippable plating resist and method of using same
|
|
US4951457A
(en)
|
1989-11-08 |
1990-08-28 |
Deal Douglas O |
Narrow pitch articulated chain and links therefor
|
|
US4997250A
(en)
|
1989-11-17 |
1991-03-05 |
General Electric Company |
Fiber output coupler with beam shaping optics for laser materials processing system
|
|
ES2096118T3
(es)
|
1990-01-31 |
1997-03-01 |
Bando Kiko Co |
Maquina para trabajar una placa de cristal.
|
|
US5040182A
(en)
|
1990-04-24 |
1991-08-13 |
Coherent, Inc. |
Mode-locked laser
|
|
IE912667A1
(en)
|
1991-07-29 |
1993-02-10 |
Trinity College Dublin |
Laser Profiling of Lens Edge
|
|
US5256853A
(en)
|
1991-07-31 |
1993-10-26 |
Bausch & Lomb Incorporated |
Method for shaping contact lens surfaces
|
|
RU94030810A
(ru)
|
1991-11-06 |
1996-06-20 |
Т.Лай Шуй |
Импульсный лазерный аппарат, способ для обеспечения гладкой абляции вещества, лазерный аппарат и способ роговичной хирургии
|
|
US5265107A
(en)
|
1992-02-05 |
1993-11-23 |
Bell Communications Research, Inc. |
Broadband absorber having multiple quantum wells of different thicknesses
|
|
US5410567A
(en)
|
1992-03-05 |
1995-04-25 |
Corning Incorporated |
Optical fiber draw furnace
|
|
JPH05274085A
(ja)
|
1992-03-26 |
1993-10-22 |
Sanyo Electric Co Ltd |
入力および表示装置
|
|
JPH05300544A
(ja)
|
1992-04-23 |
1993-11-12 |
Sony Corp |
映像表示装置
|
|
JPH05323110A
(ja)
|
1992-05-22 |
1993-12-07 |
Hitachi Koki Co Ltd |
多ビーム発生素子
|
|
US5475197A
(en)
|
1992-06-17 |
1995-12-12 |
Carl-Zeiss-Stiftung |
Process and apparatus for the ablation of a surface
|
|
US6016223A
(en)
|
1992-08-31 |
2000-01-18 |
Canon Kabushiki Kaisha |
Double bessel beam producing method and apparatus
|
|
JP3553986B2
(ja)
|
1992-08-31 |
2004-08-11 |
キヤノン株式会社 |
２重ベッセルビーム発生方法及び装置
|
|
CA2112843A1
(en)
|
1993-02-04 |
1994-08-05 |
Richard C. Ujazdowski |
Variable repetition rate picosecond laser
|
|
DE69418248T2
(de)
|
1993-06-03 |
1999-10-14 |
Hamamatsu Photonics Kk |
Optisches Laser-Abtastsystem mit Axikon
|
|
JP3293136B2
(ja)
|
1993-06-04 |
2002-06-17 |
セイコーエプソン株式会社 |
レーザ加工装置及びレーザ加工方法
|
|
US6489589B1
(en)
|
1994-02-07 |
2002-12-03 |
Board Of Regents, University Of Nebraska-Lincoln |
Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
|
|
JP3531199B2
(ja)
*
|
1994-02-22 |
2004-05-24 |
三菱電機株式会社 |
光伝送装置
|
|
US5436925A
(en)
|
1994-03-01 |
1995-07-25 |
Hewlett-Packard Company |
Colliding pulse mode-locked fiber ring laser using a semiconductor saturable absorber
|
|
US5400350A
(en)
|
1994-03-31 |
1995-03-21 |
Imra America, Inc. |
Method and apparatus for generating high energy ultrashort pulses
|
|
US5778016A
(en)
|
1994-04-01 |
1998-07-07 |
Imra America, Inc. |
Scanning temporal ultrafast delay methods and apparatuses therefor
|
|
US5656186A
(en)
*
|
1994-04-08 |
1997-08-12 |
The Regents Of The University Of Michigan |
Method for controlling configuration of laser induced breakdown and ablation
|
|
DE19513354A1
(de)
|
1994-04-14 |
1995-12-14 |
Zeiss Carl |
Materialbearbeitungseinrichtung
|
|
JP2526806B2
(ja)
|
1994-04-26 |
1996-08-21 |
日本電気株式会社 |
半導体レ―ザおよびその動作方法
|
|
WO1995031023A1
(en)
|
1994-05-09 |
1995-11-16 |
Massachusetts Institute Of Technology |
Dispersion-compensated laser using prismatic end elements
|
|
US5434875A
(en)
|
1994-08-24 |
1995-07-18 |
Tamar Technology Co. |
Low cost, high average power, high brightness solid state laser
|
|
US6016324A
(en)
|
1994-08-24 |
2000-01-18 |
Jmar Research, Inc. |
Short pulse laser system
|
|
US5776220A
(en)
|
1994-09-19 |
1998-07-07 |
Corning Incorporated |
Method and apparatus for breaking brittle materials
|
|
US5541774A
(en)
|
1995-02-27 |
1996-07-30 |
Blankenbecler; Richard |
Segmented axial gradient lens
|
|
US5696782A
(en)
|
1995-05-19 |
1997-12-09 |
Imra America, Inc. |
High power fiber chirped pulse amplification systems based on cladding pumped rare-earth doped fibers
|
|
AT402195B
(de)
|
1995-05-29 |
1997-02-25 |
Lisec Peter |
Vorrichtung zum fördern von glastafeln
|
|
DE19535392A1
(de)
|
1995-09-23 |
1997-03-27 |
Zeiss Carl Fa |
Radial polarisationsdrehende optische Anordnung und Mikrolithographie-Projektionsbelichtungsanlage damit
|
|
US5854490A
(en)
|
1995-10-03 |
1998-12-29 |
Fujitsu Limited |
Charged-particle-beam exposure device and charged-particle-beam exposure method
|
|
JPH09106243A
(ja)
|
1995-10-12 |
1997-04-22 |
Dainippon Printing Co Ltd |
ホログラムの複製方法
|
|
JP3125180B2
(ja)
|
1995-10-20 |
2001-01-15 |
新東工業株式会社 |
シート状樹脂成型設備
|
|
US5715346A
(en)
|
1995-12-15 |
1998-02-03 |
Corning Incorporated |
Large effective area single mode optical waveguide
|
|
US5692703A
(en)
|
1996-05-10 |
1997-12-02 |
Mcdonnell Douglas Corporation |
Multiple application wheel well design
|
|
US5736709A
(en)
|
1996-08-12 |
1998-04-07 |
Armco Inc. |
Descaling metal with a laser having a very short pulse width and high average power
|
|
US5854751A
(en)
|
1996-10-15 |
1998-12-29 |
The Trustees Of Columbia University In The City Of New York |
Simulator and optimizer of laser cutting process
|
|
US7353829B1
(en)
|
1996-10-30 |
2008-04-08 |
Provectus Devicetech, Inc. |
Methods and apparatus for multi-photon photo-activation of therapeutic agents
|
|
US6301932B1
(en)
|
1996-11-13 |
2001-10-16 |
Corning Incorporated |
Method for forming an internally channeled glass article
|
|
US5781684A
(en)
|
1996-12-20 |
1998-07-14 |
Corning Incorporated |
Single mode optical waveguide having large effective area
|
|
CA2231096A1
(en)
|
1997-03-25 |
1998-09-25 |
Duane E. Hoke |
Optical fiber dual spindle winder with automatic threading and winding
|
|
US6033583A
(en)
|
1997-05-05 |
2000-03-07 |
The Regents Of The University Of California |
Vapor etching of nuclear tracks in dielectric materials
|
|
US6156030A
(en)
|
1997-06-04 |
2000-12-05 |
Y-Beam Technologies, Inc. |
Method and apparatus for high precision variable rate material removal and modification
|
|
BE1011208A4
(fr)
|
1997-06-11 |
1999-06-01 |
Cuvelier Georges |
Procede de decalottage de pieces en verre.
|
|
DE19728766C1
(de)
|
1997-07-07 |
1998-12-17 |
Schott Rohrglas Gmbh |
Verwendung eines Verfahrens zur Herstellung einer Sollbruchstelle bei einem Glaskörper
|
|
JPH1179770A
(ja)
|
1997-07-10 |
1999-03-23 |
Yamaha Corp |
スクライブ装置及び劈開方法
|
|
US6078599A
(en)
|
1997-07-22 |
2000-06-20 |
Cymer, Inc. |
Wavelength shift correction technique for a laser
|
|
US6003418A
(en)
|
1997-07-31 |
1999-12-21 |
International Business Machines Corporation |
Punched slug removal system
|
|
JP3264224B2
(ja)
|
1997-08-04 |
2002-03-11 |
キヤノン株式会社 |
照明装置及びそれを用いた投影露光装置
|
|
US6520057B1
(en)
|
1997-09-30 |
2003-02-18 |
Eastman Machine Company |
Continuous system and method for cutting sheet material
|
|
JP3185869B2
(ja)
|
1997-10-21 |
2001-07-11 |
日本電気株式会社 |
レーザ加工方法
|
|
DE19750320C1
(de)
|
1997-11-13 |
1999-04-01 |
Max Planck Gesellschaft |
Verfahren und Vorrichtung zur Lichtpulsverstärkung
|
|
AU3908099A
(en)
|
1997-12-05 |
1999-06-28 |
Thermolase Corporation |
Skin enhancement using laser light
|
|
US6501578B1
(en)
|
1997-12-19 |
2002-12-31 |
Electric Power Research Institute, Inc. |
Apparatus and method for line of sight laser communications
|
|
JPH11197498A
(ja)
|
1998-01-13 |
1999-07-27 |
Japan Science & Technology Corp |
無機材料内部の選択的改質方法及び内部が選択的に改質された無機材料
|
|
US6272156B1
(en)
|
1998-01-28 |
2001-08-07 |
Coherent, Inc. |
Apparatus for ultrashort pulse transportation and delivery
|
|
JPH11240730A
(ja)
|
1998-02-27 |
1999-09-07 |
Nec Kansai Ltd |
脆性材料の割断方法
|
|
JPH11269683A
(ja)
|
1998-03-18 |
1999-10-05 |
Armco Inc |
金属表面から酸化物を除去する方法及び装置
|
|
US6160835A
(en)
|
1998-03-20 |
2000-12-12 |
Rocky Mountain Instrument Co. |
Hand-held marker with dual output laser
|
|
DE69931690T2
(de)
|
1998-04-08 |
2007-06-14 |
Asml Netherlands B.V. |
Lithographischer Apparat
|
|
EP0949541B1
(en)
|
1998-04-08 |
2006-06-07 |
ASML Netherlands B.V. |
Lithography apparatus
|
|
US6256328B1
(en)
|
1998-05-15 |
2001-07-03 |
University Of Central Florida |
Multiwavelength modelocked semiconductor diode laser
|
|
US6308055B1
(en)
|
1998-05-29 |
2001-10-23 |
Silicon Laboratories, Inc. |
Method and apparatus for operating a PLL for synthesizing high-frequency signals for wireless communications
|
|
JPH11347861A
(ja)
|
1998-06-03 |
1999-12-21 |
Amada Co Ltd |
レーザ加工機における複合加工方法およびレーザ加工機における複合加工システム
|
|
JPH11347758A
(ja)
|
1998-06-10 |
1999-12-21 |
Mitsubishi Heavy Ind Ltd |
超精密加工装置
|
|
TW419867B
(en)
|
1998-08-26 |
2001-01-21 |
Samsung Electronics Co Ltd |
Laser cutting apparatus and method
|
|
DE19851353C1
(de)
|
1998-11-06 |
1999-10-07 |
Schott Glas |
Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff
|
|
JP3178524B2
(ja)
|
1998-11-26 |
2001-06-18 |
住友重機械工業株式会社 |
レーザマーキング方法と装置及びマーキングされた部材
|
|
US6259058B1
(en)
|
1998-12-01 |
2001-07-10 |
Accudyne Display And Semiconductor Systems, Inc. |
Apparatus for separating non-metallic substrates
|
|
US7649153B2
(en)
|
1998-12-11 |
2010-01-19 |
International Business Machines Corporation |
Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam
|
|
US6445491B2
(en)
|
1999-01-29 |
2002-09-03 |
Irma America, Inc. |
Method and apparatus for optical sectioning and imaging using time-gated parametric image amplification
|
|
JP2000225485A
(ja)
|
1999-02-04 |
2000-08-15 |
Fine Machining Kk |
レーザ加工装置のステージ
|
|
US6381391B1
(en)
|
1999-02-19 |
2002-04-30 |
The Regents Of The University Of Michigan |
Method and system for generating a broadband spectral continuum and continuous wave-generating system utilizing same
|
|
JP2000247668A
(ja)
|
1999-02-25 |
2000-09-12 |
Bando Kiko Kk |
ガラス板の加工機械
|
|
DE19908630A1
(de)
|
1999-02-27 |
2000-08-31 |
Bosch Gmbh Robert |
Abschirmung gegen Laserstrahlen
|
|
WO2000053365A1
(en)
|
1999-03-05 |
2000-09-14 |
Mitsubishi Denki Kabushiki Kaisha |
Laser machining apparatus
|
|
US6501576B1
(en)
|
1999-03-24 |
2002-12-31 |
Intel Corporation |
Wireless data transfer using a remote media interface
|
|
US6484052B1
(en)
|
1999-03-30 |
2002-11-19 |
The Regents Of The University Of California |
Optically generated ultrasound for enhanced drug delivery
|
|
TWI223581B
(en)
|
1999-04-02 |
2004-11-01 |
Murata Manufacturing Co |
Method for machining ceramic green sheet and apparatus for machining the same
|
|
US6137632A
(en)
|
1999-04-19 |
2000-10-24 |
Iomega Corporation |
Method and apparatus for lossless beam shaping to obtain high-contrast imaging in photon tunneling methods
|
|
JP2000327349A
(ja)
|
1999-05-24 |
2000-11-28 |
China Glaze Co Ltd |
結晶化ガラス板の曲げ加工方法
|
|
US6373565B1
(en)
|
1999-05-27 |
2002-04-16 |
Spectra Physics Lasers, Inc. |
Method and apparatus to detect a flaw in a surface of an article
|
|
CN2388062Y
(zh)
|
1999-06-21 |
2000-07-19 |
郭广宗 |
一层有孔一层无孔双层玻璃车船窗
|
|
US6449301B1
(en)
|
1999-06-22 |
2002-09-10 |
The Regents Of The University Of California |
Method and apparatus for mode locking of external cavity semiconductor lasers with saturable Bragg reflectors
|
|
US6185051B1
(en)
|
1999-06-23 |
2001-02-06 |
Read-Rite Corporation |
High numerical aperture optical focusing device for use in data storage systems
|
|
CN1100494C
(zh)
|
1999-07-06 |
2003-02-05 |
王仁丁 |
糊香风味均质豆腐的制备方法
|
|
US6259151B1
(en)
|
1999-07-21 |
2001-07-10 |
Intersil Corporation |
Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors
|
|
US6573026B1
(en)
|
1999-07-29 |
2003-06-03 |
Corning Incorporated |
Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses
|
|
US6452117B2
(en)
|
1999-08-26 |
2002-09-17 |
International Business Machines Corporation |
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
|
|
CN1144005C
(zh)
|
1999-09-24 |
2004-03-31 |
彼得·福瑞斯特·汤普森 |
热泵流体加热系统
|
|
JP2001130921A
(ja)
|
1999-10-29 |
2001-05-15 |
Mitsuboshi Diamond Industrial Co Ltd |
脆性基板の加工方法及び装置
|
|
DE19952331C1
(de)
|
1999-10-29 |
2001-08-30 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
|
|
JP2001138083A
(ja)
|
1999-11-18 |
2001-05-22 |
Seiko Epson Corp |
レーザー加工装置及びレーザー照射方法
|
|
JP4592855B2
(ja)
|
1999-12-24 |
2010-12-08 |
株式会社半導体エネルギー研究所 |
半導体装置の作製方法
|
|
CN1291224C
(zh)
|
1999-12-28 |
2006-12-20 |
康宁股份有限公司 |
光纤抽拉过程中筛选光纤的方法、光纤抽拉设备及对光纤进行拉伸筛选检验的方法
|
|
US6339208B1
(en)
|
2000-01-19 |
2002-01-15 |
General Electric Company |
Method of forming cooling holes
|
|
US6552301B2
(en)
|
2000-01-25 |
2003-04-22 |
Peter R. Herman |
Burst-ultrafast laser machining method
|
|
JP2001236673A
(ja)
|
2000-02-17 |
2001-08-31 |
Minolta Co Ltd |
光ヘッド及び光記録・再生装置
|
|
DE10010131A1
(de)
|
2000-03-03 |
2001-09-06 |
Zeiss Carl |
Mikrolithographie - Projektionsbelichtung mit tangentialer Polarisartion
|
|
DE60136703D1
(de)
|
2000-05-04 |
2009-01-08 |
Schott Donnelly Llc |
Verfahren zur Herstellung einer electrochromen Tafel
|
|
JP3530114B2
(ja)
|
2000-07-11 |
2004-05-24 |
忠弘 大見 |
単結晶の切断方法
|
|
JP2002040330A
(ja)
|
2000-07-25 |
2002-02-06 |
Olympus Optical Co Ltd |
光学素子切換え制御装置
|
|
JP4659300B2
(ja)
|
2000-09-13 |
2011-03-30 |
浜松ホトニクス株式会社 |
レーザ加工方法及び半導体チップの製造方法
|
|
JP4964376B2
(ja)
|
2000-09-13 |
2012-06-27 |
浜松ホトニクス株式会社 |
レーザ加工装置及びレーザ加工方法
|
|
JP3626442B2
(ja)
*
|
2000-09-13 |
2005-03-09 |
浜松ホトニクス株式会社 |
レーザ加工方法
|
|
KR100673073B1
(ko)
|
2000-10-21 |
2007-01-22 |
삼성전자주식회사 |
레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
|
|
SE0004096D0
(sv)
|
2000-11-08 |
2000-11-08 |
Nira Automotive Ab |
Positioning system
|
|
US20020110639A1
(en)
|
2000-11-27 |
2002-08-15 |
Donald Bruns |
Epoxy coating for optical surfaces
|
|
US6611647B2
(en)
|
2000-12-12 |
2003-08-26 |
Corning Incorporated |
Large effective area optical fiber
|
|
US20020082466A1
(en)
|
2000-12-22 |
2002-06-27 |
Jeongho Han |
Laser surgical system with light source and video scope
|
|
JP4880820B2
(ja)
|
2001-01-19 |
2012-02-22 |
株式会社レーザーシステム |
レーザ支援加工方法
|
|
DE10103256A1
(de)
|
2001-01-25 |
2002-08-08 |
Leica Microsystems |
Sicherheitsvorrichtung für Mikroskope mit einem Laserstrahl als Beleuchtungsquelle
|
|
JP2002228818A
(ja)
|
2001-02-05 |
2002-08-14 |
Taiyo Yuden Co Ltd |
レーザー加工用回折光学素子、レーザー加工装置及びレーザー加工方法
|
|
JP3445250B2
(ja)
|
2001-02-20 |
2003-09-08 |
ゼット株式会社 |
靴 底
|
|
EA004167B1
(ru)
|
2001-03-01 |
2004-02-26 |
Общество С Ограниченной Ответственностью "Лазтекс" |
Способ резки стекла
|
|
DE10124803A1
(de)
|
2001-05-22 |
2002-11-28 |
Zeiss Carl |
Polarisator und Mikrolithographie-Projektionsanlage mit Polarisator
|
|
US7015491B2
(en)
|
2001-06-01 |
2006-03-21 |
Asml Netherlands B.V. |
Lithographic apparatus, device manufacturing method and device manufactured thereby, control system
|
|
JP4401060B2
(ja)
|
2001-06-01 |
2010-01-20 |
エーエスエムエル ネザーランズ ビー．ブイ． |
リトグラフ装置、およびデバイス製造方法
|
|
JP3725805B2
(ja)
|
2001-07-04 |
2005-12-14 |
三菱電線工業株式会社 |
ファイバ配線シートおよびその製造方法
|
|
SG108262A1
(en)
|
2001-07-06 |
2005-01-28 |
Inst Data Storage |
Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
|
|
US6754429B2
(en)
|
2001-07-06 |
2004-06-22 |
Corning Incorporated |
Method of making optical fiber devices and devices thereof
|
|
SE0202159D0
(sv)
|
2001-07-10 |
2002-07-09 |
Coding Technologies Sweden Ab |
Efficientand scalable parametric stereo coding for low bitrate applications
|
|
TWI224382B
(en)
|
2001-07-12 |
2004-11-21 |
Hitachi Ltd |
Wiring glass substrate and manufacturing method thereof, conductive paste and semiconductor module used for the same, and conductor forming method
|
|
JP3775250B2
(ja)
|
2001-07-12 |
2006-05-17 |
セイコーエプソン株式会社 |
レーザー加工方法及びレーザー加工装置
|
|
JP3823108B2
(ja)
|
2001-08-10 |
2006-09-20 |
三星ダイヤモンド工業株式会社 |
脆性材料基板の面取り方法
|
|
JP3795778B2
(ja)
|
2001-08-24 |
2006-07-12 |
株式会社ノリタケカンパニーリミテド |
水添ビスフェノールａ型エポキシ樹脂を用いたレジノイド研削砥石
|
|
JP4397571B2
(ja)
*
|
2001-09-25 |
2010-01-13 |
株式会社半導体エネルギー研究所 |
レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法
|
|
JP2003114400A
(ja)
|
2001-10-04 |
2003-04-18 |
Sumitomo Electric Ind Ltd |
レーザ光学システムおよびレーザ加工方法
|
|
JP2003124491A
(ja)
|
2001-10-15 |
2003-04-25 |
Sharp Corp |
薄膜太陽電池モジュール
|
|
EP1306196A1
(de)
|
2001-10-24 |
2003-05-02 |
Telsonic AG |
Haltevorrichtung, Vorrichtung zum Verschweissen von Werkstücken und Verfahren zum Bereitstellen einer Haltevorrichtung
|
|
JP2003154517A
(ja)
|
2001-11-21 |
2003-05-27 |
Seiko Epson Corp |
脆性材料の割断加工方法およびその装置、並びに電子部品の製造方法
|
|
US6720519B2
(en)
|
2001-11-30 |
2004-04-13 |
Matsushita Electric Industrial Co., Ltd. |
System and method of laser drilling
|
|
US6973384B2
(en)
|
2001-12-06 |
2005-12-06 |
Bellsouth Intellectual Property Corporation |
Automated location-intelligent traffic notification service systems and methods
|
|
JP2003238178A
(ja)
|
2002-02-21 |
2003-08-27 |
Toshiba Ceramics Co Ltd |
ガス導入用シャワープレート及びその製造方法
|
|
AU2003211581A1
(en)
|
2002-03-12 |
2003-09-22 |
Hamamatsu Photonics K.K. |
Method of cutting processed object
|
|
US6744009B1
(en)
|
2002-04-02 |
2004-06-01 |
Seagate Technology Llc |
Combined laser-scribing and laser-breaking for shaping of brittle substrates
|
|
US6787732B1
(en)
|
2002-04-02 |
2004-09-07 |
Seagate Technology Llc |
Method for laser-scribing brittle substrates and apparatus therefor
|
|
US7565820B2
(en)
|
2002-04-30 |
2009-07-28 |
Corning Incorporated |
Methods and apparatus for forming heat treated optical fiber
|
|
DE10219514A1
(de)
|
2002-04-30 |
2003-11-13 |
Zeiss Carl Smt Ag |
Beleuchtungssystem, insbesondere für die EUV-Lithographie
|
|
FR2839508B1
(fr)
|
2002-05-07 |
2005-03-04 |
Saint Gobain |
Vitrage decoupe sans rompage
|
|
JP3559827B2
(ja)
|
2002-05-24 |
2004-09-02 |
独立行政法人理化学研究所 |
透明材料内部の処理方法およびその装置
|
|
US7116283B2
(en)
|
2002-07-30 |
2006-10-03 |
Ncr Corporation |
Methods and apparatus for improved display of visual data for point of sale terminals
|
|
CA2396831A1
(en)
*
|
2002-08-02 |
2004-02-02 |
Femtonics Corporation |
Microstructuring optical wave guide devices with femtosecond optical pulses
|
|
DE10240033B4
(de)
|
2002-08-28 |
2005-03-10 |
Jenoptik Automatisierungstech |
Anordnung zum Einbringen von Strahlungsenergie in ein Werkstück aus einem schwach absorbierenden Material
|
|
US6737345B1
(en)
|
2002-09-10 |
2004-05-18 |
Taiwan Semiconductor Manufacturing Company |
Scheme to define laser fuse in dual damascene CU process
|
|
US20040051982A1
(en)
|
2002-09-13 |
2004-03-18 |
Perchak Robert M. |
Wide angle surface generator & target
|
|
JP3929393B2
(ja)
|
2002-12-03 |
2007-06-13 |
株式会社日本エミック |
切断装置
|
|
JP2004209675A
(ja)
|
2002-12-26 |
2004-07-29 |
Kashifuji:Kk |
押圧切断装置及び押圧切断方法
|
|
KR100497820B1
(ko)
|
2003-01-06 |
2005-07-01 |
로체 시스템즈(주) |
유리판절단장치
|
|
TWI319412B
(en)
|
2003-01-15 |
2010-01-11 |
Sumitomo Rubber Ind |
Polymeric-type antistatic agent and antistatic polymer composition and fabricating method thereof
|
|
JP2004217492A
(ja)
|
2003-01-17 |
2004-08-05 |
Murakami Corp |
ガラス板材の切抜方法
|
|
EP1586407A4
(en)
|
2003-01-21 |
2008-08-06 |
Toyota Steel Ct Co Ltd |
LASER CUTTING DEVICE, LASER CUTTING METHOD AND LASER CUTTING SYSTEM
|
|
JP3775410B2
(ja)
|
2003-02-03 |
2006-05-17 |
セイコーエプソン株式会社 |
レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
|
|
WO2004080643A1
(ja)
|
2003-03-12 |
2004-09-23 |
Hamamatsu Photonics K.K. |
レーザ加工方法
|
|
US7617167B2
(en)
|
2003-04-09 |
2009-11-10 |
Avisere, Inc. |
Machine vision system for enterprise management
|
|
ATE496012T1
(de)
|
2003-04-22 |
2011-02-15 |
Coca Cola Co |
Verfahren und vorrichtung zur verfestigung von glas
|
|
US6952519B2
(en)
|
2003-05-02 |
2005-10-04 |
Corning Incorporated |
Large effective area high SBS threshold optical fiber
|
|
US6904218B2
(en)
|
2003-05-12 |
2005-06-07 |
Fitel U.S.A. Corporation |
Super-large-effective-area (SLA) optical fiber and communication system incorporating the same
|
|
DE10322376A1
(de)
|
2003-05-13 |
2004-12-02 |
Carl Zeiss Smt Ag |
Axiconsystem und Beleuchtungssystem damit
|
|
US7511886B2
(en)
|
2003-05-13 |
2009-03-31 |
Carl Zeiss Smt Ag |
Optical beam transformation system and illumination system comprising an optical beam transformation system
|
|
FR2855084A1
(fr)
|
2003-05-22 |
2004-11-26 |
Air Liquide |
Optique de focalisation pour le coupage laser
|
|
JP2005000952A
(ja)
|
2003-06-12 |
2005-01-06 |
Nippon Sheet Glass Co Ltd |
レーザー加工方法及びレーザー加工装置
|
|
US7492948B2
(en)
|
2003-06-26 |
2009-02-17 |
Denmarks Tekniske Universitet |
Generation of a desired wavefront with a plurality of phase contrast filters
|
|
EP2332687B1
(en)
|
2003-07-18 |
2015-02-18 |
Hamamatsu Photonics K.K. |
Method of laser beam machining a machining target using pulsed laser beam and expanded tape for cutting a machining target
|
|
WO2005024516A2
(de)
|
2003-08-14 |
2005-03-17 |
Carl Zeiss Smt Ag |
Beleuchtungseinrichtung für eine mikrolithographische projektionsbelichtungsanlage
|
|
JP2005104819A
(ja)
|
2003-09-10 |
2005-04-21 |
Nippon Sheet Glass Co Ltd |
合せガラスの切断方法及び合せガラス切断装置
|
|
US7408616B2
(en)
|
2003-09-26 |
2008-08-05 |
Carl Zeiss Smt Ag |
Microlithographic exposure method as well as a projection exposure system for carrying out the method
|
|
US20050205778A1
(en)
|
2003-10-17 |
2005-09-22 |
Gsi Lumonics Corporation |
Laser trim motion, calibration, imaging, and fixturing techniques
|
|
JP2005135964A
(ja)
*
|
2003-10-28 |
2005-05-26 |
Disco Abrasive Syst Ltd |
ウエーハの分割方法
|
|
JP2005138143A
(ja)
*
|
2003-11-06 |
2005-06-02 |
Disco Abrasive Syst Ltd |
レーザ光線を利用する加工装置
|
|
US7172067B2
(en)
|
2003-11-10 |
2007-02-06 |
Johnson Level & Tool Mfg. Co., Inc. |
Level case with positioning indentations
|
|
JP2005144487A
(ja)
|
2003-11-13 |
2005-06-09 |
Seiko Epson Corp |
レーザ加工装置及びレーザ加工方法
|
|
JP3962718B2
(ja)
|
2003-12-01 |
2007-08-22 |
キヤノン株式会社 |
情報処理装置及びその制御方法、プログラム
|
|
US7057709B2
(en)
|
2003-12-04 |
2006-06-06 |
International Business Machines Corporation |
Printing a mask with maximum possible process window through adjustment of the source distribution
|
|
EP1690660A1
(en)
|
2003-12-04 |
2006-08-16 |
Mitsuboshi Diamond Industrial Co., Ltd. |
Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism
|
|
JP2005179154A
(ja)
|
2003-12-22 |
2005-07-07 |
Shibuya Kogyo Co Ltd |
脆性材料の割断方法およびその装置
|
|
US7633033B2
(en)
|
2004-01-09 |
2009-12-15 |
General Lasertronics Corporation |
Color sensing for laser decoating
|
|
US8270077B2
(en)
|
2004-01-16 |
2012-09-18 |
Carl Zeiss Smt Gmbh |
Polarization-modulating optical element
|
|
US20070019179A1
(en)
|
2004-01-16 |
2007-01-25 |
Damian Fiolka |
Polarization-modulating optical element
|
|
CN101793993B
(zh)
|
2004-01-16 |
2013-04-03 |
卡尔蔡司Smt有限责任公司 |
光学元件、光学布置及系统
|
|
JP4951241B2
(ja)
|
2004-01-16 |
2012-06-13 |
独立行政法人科学技術振興機構 |
微細加工方法
|
|
JP4074589B2
(ja)
|
2004-01-22 |
2008-04-09 |
Ｔｄｋ株式会社 |
レーザ加工装置及びレーザ加工方法
|
|
TWI395068B
(zh)
|
2004-01-27 |
2013-05-01 |
尼康股份有限公司 |
光學系統、曝光裝置以及曝光方法
|
|
JP2005219960A
(ja)
|
2004-02-05 |
2005-08-18 |
Nishiyama Stainless Chem Kk |
ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
|
|
EP1721695A4
(en)
|
2004-03-05 |
2009-04-01 |
Olympus Corp |
LASER PROCESSING FACILITY
|
|
JP5074658B2
(ja)
|
2004-03-15 |
2012-11-14 |
キヤノン株式会社 |
最適化方法、最適化装置、及びプログラム
|
|
JP2005271563A
(ja)
*
|
2004-03-26 |
2005-10-06 |
Daitron Technology Co Ltd |
硬脆材料板体の分割加工方法及び装置
|
|
JP4418282B2
(ja)
*
|
2004-03-31 |
2010-02-17 |
株式会社レーザーシステム |
レーザ加工方法
|
|
US7486705B2
(en)
*
|
2004-03-31 |
2009-02-03 |
Imra America, Inc. |
Femtosecond laser processing system with process parameters, controls and feedback
|
|
US20050231651A1
(en)
|
2004-04-14 |
2005-10-20 |
Myers Timothy F |
Scanning display system
|
|
US7187833B2
(en)
|
2004-04-29 |
2007-03-06 |
Corning Incorporated |
Low attenuation large effective area optical fiber
|
|
KR100626554B1
(ko)
|
2004-05-11 |
2006-09-21 |
주식회사 탑 엔지니어링 |
비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법
|
|
US7123348B2
(en)
|
2004-06-08 |
2006-10-17 |
Asml Netherlands B.V |
Lithographic apparatus and method utilizing dose control
|
|
GB0412974D0
(en)
|
2004-06-10 |
2004-07-14 |
Syngenta Participations Ag |
Method of applying active ingredients
|
|
JP4890746B2
(ja)
*
|
2004-06-14 |
2012-03-07 |
株式会社ディスコ |
ウエーハの加工方法
|
|
US7804043B2
(en)
*
|
2004-06-15 |
2010-09-28 |
Laserfacturing Inc. |
Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
|
|
DE102005030543A1
(de)
|
2004-07-08 |
2006-02-02 |
Carl Zeiss Smt Ag |
Polarisatoreinrichtung zur Erzeugung einer definierten Ortsverteilung von Polarisationszuständen
|
|
US7283209B2
(en)
|
2004-07-09 |
2007-10-16 |
Carl Zeiss Smt Ag |
Illumination system for microlithography
|
|
US7231786B2
(en)
|
2004-07-29 |
2007-06-19 |
Corning Incorporated |
Process and device for manufacturing glass sheet
|
|
US7259354B2
(en)
|
2004-08-04 |
2007-08-21 |
Electro Scientific Industries, Inc. |
Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
|
|
US7136227B2
(en)
|
2004-08-06 |
2006-11-14 |
Matsushita Electric Industrial Co., Ltd. |
Fresnel zone plate based on elastic materials
|
|
KR101273740B1
(ko)
|
2004-09-22 |
2013-06-12 |
가부시키가이샤 니콘 |
조명 장치, 노광 장치 및 마이크로 디바이스의 제조 방법
|
|
JP3887394B2
(ja)
|
2004-10-08 |
2007-02-28 |
芝浦メカトロニクス株式会社 |
脆性材料の割断加工システム及びその方法
|
|
TW200621661A
(en)
|
2004-10-25 |
2006-07-01 |
Mitsuboshi Diamond Ind Co Ltd |
Method and device for forming crack
|
|
JP4692717B2
(ja)
*
|
2004-11-02 |
2011-06-01 |
澁谷工業株式会社 |
脆性材料の割断装置
|
|
JP4222296B2
(ja)
|
2004-11-22 |
2009-02-12 |
住友電気工業株式会社 |
レーザ加工方法とレーザ加工装置
|
|
JP4564343B2
(ja)
|
2004-11-24 |
2010-10-20 |
大日本印刷株式会社 |
導電材充填スルーホール基板の製造方法
|
|
JP2006150385A
(ja)
|
2004-11-26 |
2006-06-15 |
Canon Inc |
レーザ割断方法
|
|
US7201965B2
(en)
|
2004-12-13 |
2007-04-10 |
Corning Incorporated |
Glass laminate substrate having enhanced impact and static loading resistance
|
|
KR101096733B1
(ko)
|
2004-12-27 |
2011-12-21 |
엘지디스플레이 주식회사 |
기판의 절단장치 및 이를 이용한 기판의 절단방법
|
|
JP5037138B2
(ja)
|
2005-01-05 |
2012-09-26 |
Ｔｈｋ株式会社 |
ワークのブレイク方法及び装置、スクライブ及びブレイク方法、並びにブレイク機能付きスクライブ装置
|
|
US7542013B2
(en)
|
2005-01-31 |
2009-06-02 |
Asml Holding N.V. |
System and method for imaging enhancement via calculation of a customized optimal pupil field and illumination mode
|
|
WO2006082738A1
(ja)
|
2005-02-03 |
2006-08-10 |
Nikon Corporation |
オプティカルインテグレータ、照明光学装置、露光装置、および露光方法
|
|
JP2006248885A
(ja)
|
2005-02-08 |
2006-09-21 |
Takeji Arai |
超短パルスレーザによる石英の切断方法
|
|
DE102005013783B4
(de)
|
2005-03-22 |
2007-08-16 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
|
|
US20070228616A1
(en)
|
2005-05-11 |
2007-10-04 |
Kyu-Yong Bang |
Device and method for cutting nonmetalic substrate
|
|
US20060261118A1
(en)
|
2005-05-17 |
2006-11-23 |
Cox Judy K |
Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
|
|
JP4173151B2
(ja)
|
2005-05-23 |
2008-10-29 |
株式会社椿本チエイン |
コンベヤチェーン
|
|
US7402773B2
(en)
*
|
2005-05-24 |
2008-07-22 |
Disco Corporation |
Laser beam processing machine
|
|
JP4199820B2
(ja)
|
2005-06-01 |
2008-12-24 |
フェトン株式会社 |
レーザー加工装置及びレーザー加工方法
|
|
DE102005042072A1
(de)
|
2005-06-01 |
2006-12-14 |
Forschungsverbund Berlin E.V. |
Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern
|
|
WO2006136353A1
(en)
|
2005-06-21 |
2006-12-28 |
Carl Zeiss Smt Ag |
A double-facetted illumination system with attenuator elements on the pupil facet mirror
|
|
JP4841873B2
(ja)
|
2005-06-23 |
2011-12-21 |
大日本スクリーン製造株式会社 |
熱処理用サセプタおよび熱処理装置
|
|
US7566914B2
(en)
|
2005-07-07 |
2009-07-28 |
Intersil Americas Inc. |
Devices with adjustable dual-polarity trigger- and holding-voltage/current for high level of electrostatic discharge protection in sub-micron mixed signal CMOS/BiCMOS integrated circuits
|
|
JP4490883B2
(ja)
|
2005-07-19 |
2010-06-30 |
株式会社レーザーシステム |
レーザ加工装置およびレーザ加工方法
|
|
US7934172B2
(en)
|
2005-08-08 |
2011-04-26 |
Micronic Laser Systems Ab |
SLM lithography: printing to below K1=.30 without previous OPC processing
|
|
DE102005039833A1
(de)
|
2005-08-22 |
2007-03-01 |
Rowiak Gmbh |
Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen
|
|
KR20070023958A
(ko)
|
2005-08-25 |
2007-03-02 |
삼성전자주식회사 |
액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법
|
|
US7244906B2
(en)
|
2005-08-30 |
2007-07-17 |
Electro Scientific Industries, Inc. |
Energy monitoring or control of individual vias formed during laser micromachining
|
|
DE102006042280A1
(de)
|
2005-09-08 |
2007-06-06 |
IMRA America, Inc., Ann Arbor |
Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
|
|
US9138913B2
(en)
|
2005-09-08 |
2015-09-22 |
Imra America, Inc. |
Transparent material processing with an ultrashort pulse laser
|
|
EP1950019B1
(en)
|
2005-09-12 |
2011-12-21 |
Nippon Sheet Glass Company Limited |
Interlayer film separation method
|
|
US20070068648A1
(en)
*
|
2005-09-28 |
2007-03-29 |
Honeywell International, Inc. |
Method for repairing die cast dies
|
|
KR100792593B1
(ko)
*
|
2005-10-12 |
2008-01-09 |
한국정보통신대학교 산학협력단 |
극초단 펄스 레이저를 이용한 단일 펄스 패턴 형성방법 및시스템
|
|
US20070111119A1
(en)
*
|
2005-11-15 |
2007-05-17 |
Honeywell International, Inc. |
Method for repairing gas turbine engine compressor components
|
|
JP2007142000A
(ja)
|
2005-11-16 |
2007-06-07 |
Denso Corp |
レーザ加工装置およびレーザ加工方法
|
|
US7838331B2
(en)
|
2005-11-16 |
2010-11-23 |
Denso Corporation |
Method for dicing semiconductor substrate
|
|
JP4816390B2
(ja)
*
|
2005-11-16 |
2011-11-16 |
株式会社デンソー |
半導体チップの製造方法および半導体チップ
|
|
KR100858983B1
(ko)
|
2005-11-16 |
2008-09-17 |
가부시키가이샤 덴소 |
반도체 장치 및 반도체 기판 다이싱 방법
|
|
US20070111480A1
(en)
|
2005-11-16 |
2007-05-17 |
Denso Corporation |
Wafer product and processing method therefor
|
|
US7977601B2
(en)
|
2005-11-28 |
2011-07-12 |
Electro Scientific Industries, Inc. |
X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
|
|
CN101331592B
(zh)
|
2005-12-16 |
2010-06-16 |
株式会社半导体能源研究所 |
激光照射设备、激光照射方法和半导体装置的制造方法
|
|
GB0600022D0
(en)
|
2006-01-03 |
2006-02-08 |
Pilkington Plc |
Glazings
|
|
JP4483793B2
(ja)
|
2006-01-27 |
2010-06-16 |
セイコーエプソン株式会社 |
微細構造体の製造方法及び製造装置
|
|
US7418181B2
(en)
|
2006-02-13 |
2008-08-26 |
Adc Telecommunications, Inc. |
Fiber optic splitter module
|
|
WO2007094160A1
(ja)
|
2006-02-15 |
2007-08-23 |
Asahi Glass Company, Limited |
ガラス基板の面取り方法および装置
|
|
US7535634B1
(en)
|
2006-02-16 |
2009-05-19 |
The United States Of America As Represented By The National Aeronautics And Space Administration |
Optical device, system, and method of generating high angular momentum beams
|
|
US20090013724A1
(en)
|
2006-02-22 |
2009-01-15 |
Nippon Sheet Glass Company, Limited |
Glass Processing Method Using Laser and Processing Device
|
|
JP4672689B2
(ja)
|
2006-02-22 |
2011-04-20 |
日本板硝子株式会社 |
レーザを用いたガラスの加工方法および加工装置
|
|
US20090176034A1
(en)
|
2006-02-23 |
2009-07-09 |
Picodeon Ltd. Oy |
Surface Treatment Technique and Surface Treatment Apparatus Associated With Ablation Technology
|
|
DE102006012034A1
(de)
|
2006-03-14 |
2007-09-20 |
Carl Zeiss Smt Ag |
Optisches System, insbesondere in einer Beleuchtungseinrichtung einer Projektionsbelichtungsanlage
|
|
JP2007253203A
(ja)
|
2006-03-24 |
2007-10-04 |
Sumitomo Electric Ind Ltd |
レーザ加工用光学装置
|
|
JP2009530222A
(ja)
|
2006-03-24 |
2009-08-27 |
ケー−エング カンパニー リミテッド |
ベンディング部を有するガラス切断装置及びこれを利用したガラス切断方法
|
|
WO2007119740A1
(ja)
|
2006-04-13 |
2007-10-25 |
Toray Engineering Co., Ltd. |
スクライブ方法、スクライブ装置、及びこの方法または装置を用いて割断した割断基板
|
|
US7794904B2
(en)
|
2006-04-24 |
2010-09-14 |
Stc.Unm |
Method and apparatus for producing interferometric lithography patterns with circular symmetry
|
|
US20070298529A1
(en)
|
2006-05-31 |
2007-12-27 |
Toyoda Gosei, Co., Ltd. |
Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
|
|
GB2439962B
(en)
|
2006-06-14 |
2008-09-24 |
Exitech Ltd |
Process and apparatus for laser scribing
|
|
US7897487B2
(en)
|
2006-07-03 |
2011-03-01 |
Hamamatsu Photonics K.K. |
Laser processing method and chip
|
|
JP2008018547A
(ja)
|
2006-07-11 |
2008-01-31 |
Seiko Epson Corp |
基体の製造方法、ｔｆｔ基板の製造方法、多層構造基板の製造方法、表示装置の製造方法
|
|
DE102006035555A1
(de)
|
2006-07-27 |
2008-01-31 |
Eliog-Kelvitherm Industrieofenbau Gmbh |
Anordnung und Verfahren zur Verformung von Glasscheiben
|
|
FR2904437B1
(fr)
|
2006-07-28 |
2008-10-24 |
Saint Gobain |
Dispositif actif a proprietes energetiques/optiques variables
|
|
JP2008037943A
(ja)
|
2006-08-03 |
2008-02-21 |
Nitto Denko Corp |
衝撃吸収粘着剤シートおよびその製造方法
|
|
US8168514B2
(en)
|
2006-08-24 |
2012-05-01 |
Corning Incorporated |
Laser separation of thin laminated glass substrates for flexible display applications
|
|
US8035803B2
(en)
|
2006-09-06 |
2011-10-11 |
Carl Zeiss Smt Gmbh |
Subsystem of an illumination system of a microlithographic projection exposure apparatus
|
|
CN101516566B
(zh)
|
2006-09-19 |
2012-05-09 |
浜松光子学株式会社 |
激光加工方法和激光加工装置
|
|
US7867907B2
(en)
|
2006-10-17 |
2011-01-11 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing semiconductor device
|
|
DE102006051105B3
(de)
*
|
2006-10-25 |
2008-06-12 |
Lpkf Laser & Electronics Ag |
Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlung
|
|
GB0622232D0
(en)
|
2006-11-08 |
2006-12-20 |
Rumsby Philip T |
Method and apparatus for laser beam alignment for solar panel scribing
|
|
GB0623511D0
(en)
|
2006-11-24 |
2007-01-03 |
Council Cent Lab Res Councils |
Raman detection of container contents
|
|
JP2008132616A
(ja)
|
2006-11-27 |
2008-06-12 |
Shibuya Kogyo Co Ltd |
脆性材料の割断方法とその装置
|
|
EP2105239B1
(en)
|
2006-11-30 |
2016-01-13 |
Sumitomo Electric Industries, Ltd. |
Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material
|
|
US8041127B2
(en)
|
2006-11-30 |
2011-10-18 |
Intuit Inc. |
Method and system for obscuring and securing financial data in an online banking application
|
|
US20080158529A1
(en)
|
2006-12-28 |
2008-07-03 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
|
US8952832B2
(en)
|
2008-01-18 |
2015-02-10 |
Invensense, Inc. |
Interfacing application programs and motion sensors of a device
|
|
AT504726A1
(de)
|
2007-01-05 |
2008-07-15 |
Lisec Maschb Gmbh |
Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe
|
|
JP2008168327A
(ja)
|
2007-01-15 |
2008-07-24 |
Shinko Seisakusho:Kk |
レーザ切断装置
|
|
CN103345128B
(zh)
|
2007-02-06 |
2017-04-12 |
卡尔蔡司Smt有限责任公司 |
微光刻投射曝光设备的照明系统
|
|
US20100029460A1
(en)
|
2007-02-22 |
2010-02-04 |
Nippon Sheet Glass Company, Limited |
Glass for anodic bonding
|
|
EP2130234B1
(en)
|
2007-02-27 |
2014-10-29 |
Carl Zeiss Laser Optics GmbH |
Continuous coating installation and method for producing crystalline thin films
|
|
TWI424972B
(zh)
|
2007-03-02 |
2014-02-01 |
Nippon Electric Glass Co |
強化板玻璃
|
|
ITMI20070528A1
(it)
|
2007-03-16 |
2008-09-17 |
Piaggio & C Spa |
Sistema di propulsione e di trasmissione ibrida per motoveicoli
|
|
US8937706B2
(en)
|
2007-03-30 |
2015-01-20 |
Asml Netherlands B.V. |
Lithographic apparatus and method
|
|
US9250536B2
(en)
|
2007-03-30 |
2016-02-02 |
Asml Netherlands B.V. |
Lithographic apparatus and method
|
|
WO2008119794A1
(en)
|
2007-04-03 |
2008-10-09 |
Carl Zeiss Smt Ag |
Optical system, in particular illumination device or projection objective of a microlithographic projection exposure apparatus
|
|
WO2008126742A1
(ja)
|
2007-04-05 |
2008-10-23 |
Cyber Laser Inc. |
レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
|
|
FR2914751B1
(fr)
|
2007-04-06 |
2009-07-03 |
Draka Comteq France |
Fibre optique monomode
|
|
EP1983154B1
(en)
|
2007-04-17 |
2013-12-25 |
Services Pétroliers Schlumberger |
In-situ correction of triaxial accelerometer and magnetometer measurements made in a well
|
|
JP4863168B2
(ja)
|
2007-04-17 |
2012-01-25 |
日本電気硝子株式会社 |
フラットパネルディスプレイ用ガラス基板およびその製造方法
|
|
JP2008288577A
(ja)
|
2007-04-18 |
2008-11-27 |
Fujikura Ltd |
基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品
|
|
DE102007018674A1
(de)
|
2007-04-18 |
2008-10-23 |
Lzh Laserzentrum Hannover E.V. |
Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas
|
|
WO2008136918A2
(en)
|
2007-05-07 |
2008-11-13 |
Corning Incorporated |
Large effective area fiber
|
|
US8236116B2
(en)
|
2007-06-06 |
2012-08-07 |
Centre Luxembourgeois De Recherches Pour Le Verre Et Al Ceramique S.A. (C.R.V.C.) |
Method of making coated glass article, and intermediate product used in same
|
|
US8374472B2
(en)
|
2007-06-15 |
2013-02-12 |
Ofs Fitel, Llc |
Bend insensitivity in single mode optical fibers
|
|
US8076605B2
(en)
|
2007-06-25 |
2011-12-13 |
Electro Scientific Industries, Inc. |
Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
|
|
DE112008001873A5
(de)
|
2007-07-21 |
2010-06-10 |
Du, Keming, Dr. |
Optische Anordnung zur Erzeugung von Multistrahlen
|
|
US8169587B2
(en)
|
2007-08-16 |
2012-05-01 |
Apple Inc. |
Methods and systems for strengthening LCD modules
|
|
JP2009056482A
(ja)
|
2007-08-31 |
2009-03-19 |
Seiko Epson Corp |
基板分割方法、及び表示装置の製造方法
|
|
JP5113462B2
(ja)
|
2007-09-12 |
2013-01-09 |
三星ダイヤモンド工業株式会社 |
脆性材料基板の面取り方法
|
|
US20100276505A1
(en)
|
2007-09-26 |
2010-11-04 |
Roger Earl Smith |
Drilling in stretched substrates
|
|
JP2009084089A
(ja)
|
2007-09-28 |
2009-04-23 |
Omron Laserfront Inc |
ガラス切断装置及び方法
|
|
DE102008041593A1
(de)
|
2007-10-09 |
2009-04-16 |
Carl Zeiss Smt Ag |
Beleuchtungsoptik für die Mikrolithographie
|
|
KR101235617B1
(ko)
|
2007-10-16 |
2013-02-28 |
미쓰보시 다이야몬도 고교 가부시키가이샤 |
취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
|
|
JP5326259B2
(ja)
|
2007-11-08 |
2013-10-30 |
株式会社ニコン |
照明光学装置、露光装置、およびデバイス製造方法
|
|
DE102007055567A1
(de)
|
2007-11-20 |
2009-05-28 |
Carl Zeiss Smt Ag |
Optisches System
|
|
KR100949152B1
(ko)
|
2007-11-23 |
2010-03-25 |
삼성코닝정밀유리 주식회사 |
유리 기판 레이저 절단 장치
|
|
JP4710897B2
(ja)
|
2007-11-28 |
2011-06-29 |
セイコーエプソン株式会社 |
接合体の剥離方法
|
|
KR20090057161A
(ko)
|
2007-12-01 |
2009-06-04 |
주식회사 이엔팩 |
초발수성 좌변기 시트
|
|
JP2009142886A
(ja)
|
2007-12-18 |
2009-07-02 |
Agt:Kk |
レーザー穴開け加工方法
|
|
CN101462822B
(zh)
|
2007-12-21 |
2012-08-29 |
鸿富锦精密工业（深圳）有限公司 |
具有通孔的脆性非金属工件及其加工方法
|
|
US8358868B2
(en)
|
2007-12-25 |
2013-01-22 |
Nec Corporation |
Image processing apparatus, image processing method, image extending apparatus, image compressing apparatus, image transmitting system, and storage medium
|
|
US7842583B2
(en)
|
2007-12-27 |
2010-11-30 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
|
|
US20090183764A1
(en)
|
2008-01-18 |
2009-07-23 |
Tenksolar, Inc |
Detachable Louver System
|
|
JP5098665B2
(ja)
*
|
2008-01-23 |
2012-12-12 |
株式会社東京精密 |
レーザー加工装置およびレーザー加工方法
|
|
JP2009178725A
(ja)
|
2008-01-29 |
2009-08-13 |
Sunx Ltd |
レーザ加工装置及びレーザ加工方法
|
|
KR101303542B1
(ko)
|
2008-02-11 |
2013-09-03 |
엘지디스플레이 주식회사 |
평판표시패널 절단장치
|
|
GB0802944D0
(en)
|
2008-02-19 |
2008-03-26 |
Rumsby Philip T |
Apparatus for laser processing the opposite sides of thin panels
|
|
CN102105256B
(zh)
|
2008-02-20 |
2014-12-31 |
激光线圈技术有限公司 |
用于高速切削的渐进激光切料装置
|
|
US20100319898A1
(en)
|
2008-03-13 |
2010-12-23 |
Underwood Patrick K |
Thermal interconnect and integrated interface systems, methods of production and uses thereof
|
|
CN102006964B
(zh)
|
2008-03-21 |
2016-05-25 |
Imra美国公司 |
基于激光的材料加工方法和系统
|
|
JP5333816B2
(ja)
|
2008-03-26 |
2013-11-06 |
旭硝子株式会社 |
ガラス板の切線加工装置及び切線加工方法
|
|
US8237080B2
(en)
|
2008-03-27 |
2012-08-07 |
Electro Scientific Industries, Inc |
Method and apparatus for laser drilling holes with Gaussian pulses
|
|
JP5345334B2
(ja)
|
2008-04-08 |
2013-11-20 |
株式会社レミ |
脆性材料の熱応力割断方法
|
|
JP5274085B2
(ja)
|
2008-04-09 |
2013-08-28 |
株式会社アルバック |
レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法
|
|
US8358888B2
(en)
|
2008-04-10 |
2013-01-22 |
Ofs Fitel, Llc |
Systems and techniques for generating Bessel beams
|
|
JP2009255114A
(ja)
|
2008-04-15 |
2009-11-05 |
Linkstar Japan Co Ltd |
脆性材料基板の加工装置および切断方法
|
|
US8035901B2
(en)
|
2008-04-30 |
2011-10-11 |
Corning Incorporated |
Laser scoring with curved trajectory
|
|
JP5539625B2
(ja)
|
2008-05-08 |
2014-07-02 |
ミヤチテクノス株式会社 |
レーザ加工方法
|
|
HUE037068T2
(hu)
|
2008-05-14 |
2018-08-28 |
Gerresheimer Glas Gmbh |
Eljárás és berendezés automatikus gyártórendszeren szennyezõ szemcsék tartályokból való eltávolítására
|
|
US8061128B2
(en)
|
2008-05-15 |
2011-11-22 |
Ford Global Technologies, Llc |
Diesel particulate filter overstress mitigation
|
|
US8053704B2
(en)
|
2008-05-27 |
2011-11-08 |
Corning Incorporated |
Scoring of non-flat materials
|
|
GB2460648A
(en)
|
2008-06-03 |
2009-12-09 |
M Solv Ltd |
Method and apparatus for laser focal spot size control
|
|
JP2009297734A
(ja)
|
2008-06-11 |
2009-12-24 |
Nitto Denko Corp |
レーザー加工用粘着シート及びレーザー加工方法
|
|
US8514476B2
(en)
|
2008-06-25 |
2013-08-20 |
View, Inc. |
Multi-pane dynamic window and method for making same
|
|
US8268913B2
(en)
|
2008-06-30 |
2012-09-18 |
Fina Technology, Inc. |
Polymeric blends and methods of using same
|
|
US7810355B2
(en)
|
2008-06-30 |
2010-10-12 |
Apple Inc. |
Full perimeter chemical strengthening of substrates
|
|
US8390788B2
(en)
|
2008-07-11 |
2013-03-05 |
Asml Netherlands B.V. |
Spectral purity filters for use in a lithographic apparatus
|
|
JP2010017990A
(ja)
|
2008-07-14 |
2010-01-28 |
Seiko Epson Corp |
基板分割方法
|
|
US7773848B2
(en)
|
2008-07-30 |
2010-08-10 |
Corning Incorporated |
Low bend loss single mode optical fiber
|
|
TWI484563B
(zh)
|
2008-08-01 |
2015-05-11 |
Moohan Co Ltd |
薄膜電晶體之製造方法與設備
|
|
KR101499651B1
(ko)
|
2008-08-01 |
2015-03-06 |
주식회사 무한 |
박막 트랜지스터 어레이 기판의 제조방법 및 제조장치
|
|
JP5071868B2
(ja)
|
2008-08-11 |
2012-11-14 |
オムロン株式会社 |
レーザ加工方法、レーザ加工装置、光学素子の製造方法、および光学素子
|
|
TW201009525A
(en)
|
2008-08-18 |
2010-03-01 |
Ind Tech Res Inst |
Laser marking method and laser marking system
|
|
JP5155774B2
(ja)
|
2008-08-21 |
2013-03-06 |
株式会社ノリタケカンパニーリミテド |
プラトー面加工用レジノイド超砥粒砥石ホイール
|
|
JP2010075991A
(ja)
|
2008-09-29 |
2010-04-08 |
Fujifilm Corp |
レーザ加工装置
|
|
JP5435267B2
(ja)
|
2008-10-01 |
2014-03-05 |
日本電気硝子株式会社 |
ガラスロール、ガラスロールの製造装置、及びガラスロールの製造方法
|
|
US8123515B2
(en)
|
2008-10-02 |
2012-02-28 |
Robert Frank Schleelein |
System and method for producing composite materials with variable shapes
|
|
US7869210B2
(en)
|
2008-10-08 |
2011-01-11 |
Dell Products L.P. |
Temperature control for an information handling system rack
|
|
JP5297139B2
(ja)
|
2008-10-09 |
2013-09-25 |
新光電気工業株式会社 |
配線基板及びその製造方法
|
|
US8895892B2
(en)
|
2008-10-23 |
2014-11-25 |
Corning Incorporated |
Non-contact glass shearing device and method for scribing or cutting a moving glass sheet
|
|
US8092739B2
(en)
|
2008-11-25 |
2012-01-10 |
Wisconsin Alumni Research Foundation |
Retro-percussive technique for creating nanoscale holes
|
|
US8131494B2
(en)
|
2008-12-04 |
2012-03-06 |
Baker Hughes Incorporated |
Rotatable orientation independent gravity sensor and methods for correcting systematic errors
|
|
US20110253544A1
(en)
|
2008-12-08 |
2011-10-20 |
University Of South Australia |
Formation Of Nanoporous Materials
|
|
JP2010134328A
(ja)
|
2008-12-08 |
2010-06-17 |
Disco Abrasive Syst Ltd |
偏光素子およびレーザーユニット
|
|
US9346130B2
(en)
|
2008-12-17 |
2016-05-24 |
Electro Scientific Industries, Inc. |
Method for laser processing glass with a chamfered edge
|
|
US20110240476A1
(en)
|
2008-12-17 |
2011-10-06 |
Ding Wang |
Fabrication of conductive nanostructures on a flexible substrate
|
|
EP2202545A1
(en)
|
2008-12-23 |
2010-06-30 |
Karlsruher Institut für Technologie |
Beam transformation module with an axicon in a double-pass mode
|
|
KR101020621B1
(ko)
|
2009-01-15 |
2011-03-09 |
연세대학교 산학협력단 |
광섬유를 이용하는 광소자 제조 방법, 광섬유를 이용하는 광소자 및 이를 이용한 광 트위저
|
|
KR20110121605A
(ko)
|
2009-02-02 |
2011-11-07 |
아사히 가라스 가부시키가이샤 |
반도체 디바이스 부재용 유리 기판 및 반도체 디바이스 부재용 유리 기판의 제조 방법
|
|
CN102307699B
(zh)
*
|
2009-02-09 |
2015-07-15 |
浜松光子学株式会社 |
加工对象物的切断方法
|
|
US8347651B2
(en)
|
2009-02-19 |
2013-01-08 |
Corning Incorporated |
Method of separating strengthened glass
|
|
US8327666B2
(en)
|
2009-02-19 |
2012-12-11 |
Corning Incorporated |
Method of separating strengthened glass
|
|
US8341976B2
(en)
|
2009-02-19 |
2013-01-01 |
Corning Incorporated |
Method of separating strengthened glass
|
|
US8245540B2
(en)
|
2009-02-24 |
2012-08-21 |
Corning Incorporated |
Method for scoring a sheet of brittle material
|
|
WO2010098186A1
(ja)
|
2009-02-25 |
2010-09-02 |
日亜化学工業株式会社 |
半導体素子の製造方法
|
|
US8218929B2
(en)
|
2009-02-26 |
2012-07-10 |
Corning Incorporated |
Large effective area low attenuation optical fiber
|
|
CN201357287Y
(zh)
|
2009-03-06 |
2009-12-09 |
苏州德龙激光有限公司 |
新型皮秒激光加工装置
|
|
CN101502914A
(zh)
|
2009-03-06 |
2009-08-12 |
苏州德龙激光有限公司 |
用于喷油嘴微孔加工的皮秒激光加工装置
|
|
JP5300544B2
(ja)
|
2009-03-17 |
2013-09-25 |
株式会社ディスコ |
光学系及びレーザ加工装置
|
|
KR101041140B1
(ko)
|
2009-03-25 |
2011-06-13 |
삼성모바일디스플레이주식회사 |
기판 절단 방법
|
|
US20100252959A1
(en)
|
2009-03-27 |
2010-10-07 |
Electro Scientific Industries, Inc. |
Method for improved brittle materials processing
|
|
US9723723B2
(en)
|
2009-03-31 |
2017-08-01 |
View, Inc. |
Temperable electrochromic devices
|
|
US8574487B2
(en)
|
2009-04-07 |
2013-11-05 |
Trumpf, Inc. |
Workpiece processing using a beam
|
|
KR200448519Y1
(ko)
|
2009-04-28 |
2010-04-21 |
남동진 |
돌출형 ⅰｃ 패키지용 방열판
|
|
US20100279067A1
(en)
|
2009-04-30 |
2010-11-04 |
Robert Sabia |
Glass sheet having enhanced edge strength
|
|
CN102422406B
(zh)
|
2009-05-06 |
2014-07-09 |
康宁股份有限公司 |
用于玻璃基片的支承件
|
|
US8539795B2
(en)
|
2009-05-13 |
2013-09-24 |
Corning Incorporated |
Methods for cutting a fragile material
|
|
ATE551304T1
(de)
|
2009-05-13 |
2012-04-15 |
Corning Inc |
Verfahren und anlagen zum formen von endlosen glasscheiben
|
|
US8132427B2
(en)
|
2009-05-15 |
2012-03-13 |
Corning Incorporated |
Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
|
|
JP5340806B2
(ja)
*
|
2009-05-21 |
2013-11-13 |
株式会社ディスコ |
半導体ウエーハのレーザ加工方法
|
|
US8269138B2
(en)
|
2009-05-21 |
2012-09-18 |
Corning Incorporated |
Method for separating a sheet of brittle material
|
|
DE102009023602B4
(de)
|
2009-06-02 |
2012-08-16 |
Grenzebach Maschinenbau Gmbh |
Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl
|
|
US8194170B2
(en)
|
2009-06-02 |
2012-06-05 |
Algonquin College |
Axicon lens array
|
|
WO2010139841A1
(en)
|
2009-06-04 |
2010-12-09 |
Corelase Oy |
Method and apparatus for processing substrates
|
|
US20100332087A1
(en)
|
2009-06-24 |
2010-12-30 |
Mark Robert Claffee |
Remote Vehicle Controller
|
|
JP5416492B2
(ja)
|
2009-06-30 |
2014-02-12 |
三星ダイヤモンド工業株式会社 |
レーザ光によるガラス基板加工装置
|
|
TWI395630B
(zh)
|
2009-06-30 |
2013-05-11 |
Mitsuboshi Diamond Ind Co Ltd |
使用雷射光之玻璃基板加工裝置
|
|
US8592716B2
(en)
|
2009-07-22 |
2013-11-26 |
Corning Incorporated |
Methods and apparatus for initiating scoring
|
|
CN201471092U
(zh)
|
2009-08-07 |
2010-05-19 |
苏州德龙激光有限公司 |
皮秒激光加工设备的高精度z轴载物平台
|
|
CN101637849B
(zh)
|
2009-08-07 |
2011-12-07 |
苏州德龙激光有限公司 |
皮秒激光加工设备的高精度z轴载物平台
|
|
JP5500914B2
(ja)
|
2009-08-27 |
2014-05-21 |
株式会社半導体エネルギー研究所 |
レーザ照射装置
|
|
KR20120073249A
(ko)
|
2009-08-28 |
2012-07-04 |
코닝 인코포레이티드 |
화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
|
|
US8932510B2
(en)
|
2009-08-28 |
2015-01-13 |
Corning Incorporated |
Methods for laser cutting glass substrates
|
|
KR101094284B1
(ko)
*
|
2009-09-02 |
2011-12-19 |
삼성모바일디스플레이주식회사 |
기판 절단 장치 및 이를 이용한 기판 절단 방법
|
|
KR20120098623A
(ko)
|
2009-09-24 |
2012-09-05 |
이에스아이-파이로포토닉스 레이저스, 인코포레이티드 |
바람직한 펄스 형태를 갖는 레이저 펄스의 버스트를 사용하여 박막 물질에 라인을 스크라이빙하는 방법 및 장치
|
|
JP2011079690A
(ja)
|
2009-10-06 |
2011-04-21 |
Leo:Kk |
回折格子を用いた厚板ガラスのレーザ熱応力割断
|
|
US20110088324A1
(en)
|
2009-10-20 |
2011-04-21 |
Wessel Robert B |
Apparatus and method for solar heat gain reduction in a window assembly
|
|
US20110094267A1
(en)
|
2009-10-28 |
2011-04-28 |
Kenneth William Aniolek |
Methods of producing glass sheets
|
|
TWI472494B
(zh)
|
2009-11-03 |
2015-02-11 |
Corning Inc |
對以非固定速度移動的玻璃帶進行雷射刻痕
|
|
US8623496B2
(en)
|
2009-11-06 |
2014-01-07 |
Wisconsin Alumni Research Foundation |
Laser drilling technique for creating nanoscale holes
|
|
JP5809637B2
(ja)
|
2009-11-18 |
2015-11-11 |
エーエスエムエル ネザーランズ ビー．ブイ． |
リソグラフィ装置およびデバイス製造方法
|
|
US20120234807A1
(en)
|
2009-12-07 |
2012-09-20 |
J.P. Sercel Associates Inc. |
Laser scribing with extended depth affectation into a workplace
|
|
US8338745B2
(en)
|
2009-12-07 |
2012-12-25 |
Panasonic Corporation |
Apparatus and methods for drilling holes with no taper or reverse taper
|
|
EP2336823A1
(de)
|
2009-12-18 |
2011-06-22 |
Boegli-Gravures S.A. |
Verfahren und Vorrichtung zur Herstellung von Masken für eine Laseranlage zur Erzeugung von Mikrostrukturen.
|
|
CN102695988B
(zh)
|
2009-12-23 |
2015-09-02 |
Asml荷兰有限公司 |
光刻设备以及器件制造方法
|
|
WO2011082065A2
(en)
|
2009-12-30 |
2011-07-07 |
Gsi Group Corporation |
Link processing with high speed beam deflection
|
|
EP2521226B1
(en)
|
2009-12-30 |
2019-09-11 |
National University Corporation Chiba University |
External resonator laser
|
|
JP5405324B2
(ja)
|
2010-01-04 |
2014-02-05 |
富士フイルム株式会社 |
撮像レンズおよび撮像装置
|
|
JP5461205B2
(ja)
|
2010-01-19 |
2014-04-02 |
日立造船株式会社 |
レーザ加工方法とその装置
|
|
TWI438162B
(zh)
|
2010-01-27 |
2014-05-21 |
Wintek Corp |
強化玻璃切割方法及強化玻璃切割預置結構
|
|
US9234760B2
(en)
|
2010-01-29 |
2016-01-12 |
Blackberry Limited |
Portable mobile transceiver for GPS navigation and vehicle data input for dead reckoning mode
|
|
ITMO20100020A1
(it)
|
2010-02-02 |
2011-08-03 |
Keraglass Engineering S R L |
Dispositivo per la pulizia di rulli.
|
|
WO2011106325A1
(en)
|
2010-02-25 |
2011-09-01 |
The United States Of America, As Represented By The Secretary, Department Of Health And Human Services |
Azicon beam polarization devices
|
|
US8743165B2
(en)
|
2010-03-05 |
2014-06-03 |
Micronic Laser Systems Ab |
Methods and device for laser processing
|
|
JP5249979B2
(ja)
*
|
2010-03-18 |
2013-07-31 |
三星ダイヤモンド工業株式会社 |
脆性材料基板の加工方法およびこれに用いるレーザ加工装置
|
|
EP2550128B8
(de)
|
2010-03-24 |
2018-05-23 |
LIMO GmbH |
Vorrichtung zur beaufschlagung mit laserstrahlung
|
|
US20110238308A1
(en)
|
2010-03-26 |
2011-09-29 |
Isaac Thomas Miller |
Pedal navigation using leo signals and body-mounted sensors
|
|
JP5693705B2
(ja)
|
2010-03-30 |
2015-04-01 |
イムラ アメリカ インコーポレイテッド |
レーザベースの材料加工装置及び方法
|
|
US8654538B2
(en)
|
2010-03-30 |
2014-02-18 |
Ibiden Co., Ltd. |
Wiring board and method for manufacturing the same
|
|
US8951889B2
(en)
|
2010-04-16 |
2015-02-10 |
Qmc Co., Ltd. |
Laser processing method and laser processing apparatus
|
|
WO2011132600A1
(ja)
|
2010-04-20 |
2011-10-27 |
旭硝子株式会社 |
半導体デバイス貫通電極用のガラス基板
|
|
JP2013144613A
(ja)
|
2010-04-20 |
2013-07-25 |
Asahi Glass Co Ltd |
半導体デバイス貫通電極形成用のガラス基板の製造方法
|
|
JP5514955B2
(ja)
|
2010-04-21 |
2014-06-04 |
エルジー・ケム・リミテッド |
ガラスシート切断装置
|
|
DE202010006047U1
(de)
|
2010-04-22 |
2010-07-22 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Strahlformungseinheit zur Fokussierung eines Laserstrahls
|
|
KR100984727B1
(ko)
|
2010-04-30 |
2010-10-01 |
유병소 |
대상물 가공 방법 및 대상물 가공 장치
|
|
US8245539B2
(en)
|
2010-05-13 |
2012-08-21 |
Corning Incorporated |
Methods of producing glass sheets
|
|
CN102892833B
(zh)
|
2010-05-19 |
2016-01-06 |
三菱化学株式会社 |
卡用片及卡
|
|
JP5488907B2
(ja)
|
2010-05-20 |
2014-05-14 |
日本電気硝子株式会社 |
ガラスフィルムの回収装置及び回収方法
|
|
EP2571520B1
(en)
|
2010-05-21 |
2018-04-04 |
Seqirus UK Limited |
Influenza virus reassortment method
|
|
GB2481190B
(en)
|
2010-06-04 |
2015-01-14 |
Plastic Logic Ltd |
Laser ablation
|
|
CN108395078B
(zh)
|
2010-06-29 |
2020-06-05 |
康宁股份有限公司 |
利用溢流下拉熔合法通过共拉制制备的多层玻璃片
|
|
DE102010025967B4
(de)
|
2010-07-02 |
2015-12-10 |
Schott Ag |
Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
|
|
DE102010025965A1
(de)
|
2010-07-02 |
2012-01-05 |
Schott Ag |
Verfahren zur spannungsarmen Herstellung von gelochten Werkstücken
|
|
DE102010025966B4
(de)
|
2010-07-02 |
2012-03-08 |
Schott Ag |
Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
|
|
DE202010013161U1
(de)
|
2010-07-08 |
2011-03-31 |
Oerlikon Solar Ag, Trübbach |
Laserbearbeitung mit mehreren Strahlen und dafür geeigneter Laseroptikkopf
|
|
KR102088722B1
(ko)
|
2010-07-12 |
2020-03-17 |
로핀-시나르 테크놀로지스 엘엘씨 |
레이저 필라멘테이션에 의한 재료 가공 방법
|
|
JP5772827B2
(ja)
|
2010-07-12 |
2015-09-02 |
旭硝子株式会社 |
インプリントモールド用ＴｉＯ２含有石英ガラス基材およびその製造方法
|
|
FR2962818B1
(fr)
|
2010-07-13 |
2013-03-08 |
Saint Gobain |
Dispositif electrochimique a proprietes de transmission optique et/ou energetique electrocommandables.
|
|
KR20120015366A
(ko)
|
2010-07-19 |
2012-02-21 |
엘지디스플레이 주식회사 |
강화유리 절단방법 및 절단장치
|
|
JP5580129B2
(ja)
|
2010-07-20 |
2014-08-27 |
株式会社アマダ |
固体レーザ加工装置
|
|
JP2012024983A
(ja)
|
2010-07-21 |
2012-02-09 |
Shibuya Kogyo Co Ltd |
脆性材料の面取り方法とその装置
|
|
JP5669001B2
(ja)
|
2010-07-22 |
2015-02-12 |
日本電気硝子株式会社 |
ガラスフィルムの割断方法、ガラスロールの製造方法、及びガラスフィルムの割断装置
|
|
WO2012014722A1
(ja)
|
2010-07-26 |
2012-02-02 |
浜松ホトニクス株式会社 |
基板加工方法
|
|
CN103025478B
(zh)
|
2010-07-26 |
2015-09-30 |
浜松光子学株式会社 |
基板加工方法
|
|
JP2012031018A
(ja)
|
2010-07-30 |
2012-02-16 |
Asahi Glass Co Ltd |
強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法
|
|
US8604380B2
(en)
|
2010-08-19 |
2013-12-10 |
Electro Scientific Industries, Inc. |
Method and apparatus for optimally laser marking articles
|
|
US8584354B2
(en)
|
2010-08-26 |
2013-11-19 |
Corning Incorporated |
Method for making glass interposer panels
|
|
TWI513670B
(zh)
|
2010-08-31 |
2015-12-21 |
Corning Inc |
分離強化玻璃基板之方法
|
|
TWI402228B
(zh)
|
2010-09-15 |
2013-07-21 |
Wintek Corp |
強化玻璃切割方法、強化玻璃薄膜製程、強化玻璃切割預置結構及強化玻璃切割件
|
|
TWI576320B
(zh)
|
2010-10-29 |
2017-04-01 |
康寧公司 |
用於裁切玻璃帶之方法與設備
|
|
WO2012061304A1
(en)
|
2010-11-02 |
2012-05-10 |
Georgia Tech Research Corporation |
Ultra-thin interposer assemblies with through vias
|
|
US9958750B2
(en)
|
2010-11-08 |
2018-05-01 |
View, Inc. |
Electrochromic window fabrication methods
|
|
US8164818B2
(en)
|
2010-11-08 |
2012-04-24 |
Soladigm, Inc. |
Electrochromic window fabrication methods
|
|
JP5617556B2
(ja)
|
2010-11-22 |
2014-11-05 |
日本電気硝子株式会社 |
帯状ガラスフィルム割断装置及び帯状ガラスフィルム割断方法
|
|
JP2012119098A
(ja)
|
2010-11-29 |
2012-06-21 |
Gigaphoton Inc |
光学装置、レーザ装置および極端紫外光生成装置
|
|
US8616024B2
(en)
|
2010-11-30 |
2013-12-31 |
Corning Incorporated |
Methods for forming grooves and separating strengthened glass substrate sheets
|
|
JP5905899B2
(ja)
|
2010-11-30 |
2016-04-20 |
コーニング インコーポレイテッド |
ガラスに孔の高密度アレイを形成する方法
|
|
US8607590B2
(en)
|
2010-11-30 |
2013-12-17 |
Corning Incorporated |
Methods for separating glass articles from strengthened glass substrate sheets
|
|
EP2457881B1
(en)
|
2010-11-30 |
2019-05-08 |
Corning Incorporated |
Method and apparatus for bending a sheet of material into a shaped article
|
|
EP2649490B1
(en)
|
2010-12-08 |
2018-07-11 |
View, Inc. |
Improved spacers for insulated glass units
|
|
TW201226345A
(en)
|
2010-12-27 |
2012-07-01 |
Liefco Optical Inc |
Method of cutting tempered glass
|
|
KR101298019B1
(ko)
|
2010-12-28 |
2013-08-26 |
(주)큐엠씨 |
레이저 가공 장치
|
|
KR20130130769A
(ko)
|
2011-01-05 |
2013-12-02 |
가부시키가이샤 유키기쥬츠소고 |
빔 가공 장치
|
|
WO2012096053A1
(ja)
|
2011-01-11 |
2012-07-19 |
旭硝子株式会社 |
強化ガラス板の切断方法
|
|
CN102248302A
(zh)
|
2011-01-13 |
2011-11-23 |
苏州德龙激光有限公司 |
超短脉冲激光异形切割钢化玻璃的装置及其方法
|
|
JP2012159749A
(ja)
|
2011-02-01 |
2012-08-23 |
Nichia Chem Ind Ltd |
ベッセルビーム発生装置
|
|
US8539794B2
(en)
|
2011-02-01 |
2013-09-24 |
Corning Incorporated |
Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
|
|
US8475507B2
(en)
|
2011-02-01 |
2013-07-02 |
Solta Medical, Inc. |
Handheld apparatus for use by a non-physician consumer to fractionally resurface the skin of the consumer
|
|
EP2656961A1
(en)
*
|
2011-02-08 |
2013-10-30 |
Fujikura Ltd. |
Method for manufacturing substrate having micropore, and substrate
|
|
US8933367B2
(en)
|
2011-02-09 |
2015-01-13 |
Sumitomo Electric Industries, Ltd. |
Laser processing method
|
|
WO2012108052A1
(ja)
|
2011-02-10 |
2012-08-16 |
信越ポリマー株式会社 |
単結晶基板製造方法および内部改質層形成単結晶部材
|
|
WO2012108054A1
(ja)
|
2011-02-10 |
2012-08-16 |
信越ポリマー株式会社 |
単結晶基板の製造方法および内部改質層形成単結晶部材の製造方法
|
|
DE102011000768B4
(de)
|
2011-02-16 |
2016-08-18 |
Ewag Ag |
Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung
|
|
JP5649592B2
(ja)
|
2011-02-17 |
2015-01-07 |
Hoya株式会社 |
携帯電子機器用カバーガラスのガラス基板の製造方法、携帯電子機器用カバーガラスのガラス基板および携帯電子機器
|
|
US8584490B2
(en)
|
2011-02-18 |
2013-11-19 |
Corning Incorporated |
Laser cutting method
|
|
JP5193326B2
(ja)
|
2011-02-25 |
2013-05-08 |
三星ダイヤモンド工業株式会社 |
基板加工装置および基板加工方法
|
|
US8776547B2
(en)
|
2011-02-28 |
2014-07-15 |
Corning Incorporated |
Local strengthening of glass by ion exchange
|
|
JP2012187618A
(ja)
|
2011-03-11 |
2012-10-04 |
V Technology Co Ltd |
ガラス基板のレーザ加工装置
|
|
NL2006418C2
(nl)
|
2011-03-18 |
2012-09-19 |
Rexnord Flattop Europe Bv |
Transportsysteem, alsmede gebruik van een ten opzichte van een kunststof module binnenwaarts reikende kamer in een transportsysteem.
|
|
KR101927543B1
(ko)
|
2011-03-31 |
2018-12-10 |
아반스트레이트 가부시키가이샤 |
유리판의 제조 방법
|
|
EP2696312A4
(en)
|
2011-04-07 |
2015-04-22 |
Nethom |
WIRELESS IDENTIFICATION LABEL, ELECTRONIC PRODUCT PCB INCLUDING THE LABEL, AND ELECTRONIC PRODUCT MANAGEMENT SYSTEM
|
|
US8857215B2
(en)
|
2011-05-18 |
2014-10-14 |
Corning Incorporated |
Apparatus and method for heat treating glass sheets
|
|
US8986072B2
(en)
|
2011-05-26 |
2015-03-24 |
Corning Incorporated |
Methods of finishing an edge of a glass sheet
|
|
US20120299219A1
(en)
|
2011-05-27 |
2012-11-29 |
Hamamatsu Photonics K.K. |
Laser processing method
|
|
TWI547454B
(zh)
|
2011-05-31 |
2016-09-01 |
康寧公司 |
於玻璃中高速製造微孔洞的方法
|
|
WO2012172960A1
(ja)
|
2011-06-15 |
2012-12-20 |
旭硝子株式会社 |
ガラス板の切断方法
|
|
JP2013007842A
(ja)
|
2011-06-23 |
2013-01-10 |
Toyo Seikan Kaisha Ltd |
構造体形成装置、構造体形成方法及び構造体
|
|
JP5765421B2
(ja)
|
2011-06-28 |
2015-08-19 |
株式会社Ihi |
脆性的な部材を切断する装置、方法、および切断された脆性的な部材
|
|
TWI572480B
(zh)
|
2011-07-25 |
2017-03-01 |
康寧公司 |
經層壓及離子交換之強化玻璃疊層
|
|
DE112012003162T5
(de)
|
2011-07-29 |
2014-04-17 |
Ats Automation Tooling Systems Inc. |
Systeme und Verfahren zum Herstellen dünner Siliziumstäbe
|
|
JP5729873B2
(ja)
|
2011-08-05 |
2015-06-03 |
株式会社マキタ |
集塵装置
|
|
KR101120471B1
(ko)
|
2011-08-05 |
2012-03-05 |
(주)지엘코어 |
다중 초점 방식의 펄스 레이저를 이용한 취성 재료 절단 장치
|
|
US8635887B2
(en)
|
2011-08-10 |
2014-01-28 |
Corning Incorporated |
Methods for separating glass substrate sheets by laser-formed grooves
|
|
JP2013043808A
(ja)
|
2011-08-25 |
2013-03-04 |
Asahi Glass Co Ltd |
強化ガラス板切断用保持具及び強化ガラス板の切断方法
|
|
US20130047671A1
(en)
|
2011-08-29 |
2013-02-28 |
Jeffrey T. Kohli |
Apparatus and method for forming glass sheets
|
|
DE112012003605T5
(de)
|
2011-08-29 |
2014-06-12 |
Asahi Glass Co., Ltd. |
Verfahren zum Schneiden einer Glasplatte mit erhöhter Festigkeit und Vorrichtung zum Schneiden einer Glasplatte mit erhöhter Festigkeit
|
|
KR20140053256A
(ko)
|
2011-08-31 |
2014-05-07 |
아사히 가라스 가부시키가이샤 |
강화 유리판의 절단 방법 및 강화 유리판 절단 장치
|
|
CN102992600B
(zh)
|
2011-09-09 |
2016-04-06 |
Hoya株式会社 |
离子交换玻璃制品的制造方法
|
|
KR101949777B1
(ko)
|
2011-09-15 |
2019-02-19 |
니폰 덴키 가라스 가부시키가이샤 |
유리판 절단방법 및 유리판 절단장치
|
|
US9010151B2
(en)
|
2011-09-15 |
2015-04-21 |
Nippon Electric Glass Co., Ltd. |
Glass sheet cutting method
|
|
JP5861864B2
(ja)
|
2011-09-15 |
2016-02-16 |
日本電気硝子株式会社 |
ガラス板切断方法およびガラス板切断装置
|
|
JP6063670B2
(ja)
|
2011-09-16 |
2017-01-18 |
株式会社アマダホールディングス |
レーザ切断加工方法及び装置
|
|
WO2013043173A1
(en)
|
2011-09-21 |
2013-03-28 |
Raydiance, Inc. |
Systems and processes that singulate materials
|
|
US8687932B2
(en)
|
2011-09-21 |
2014-04-01 |
Ofs Fitel, Llc |
Optimized ultra large area optical fibers
|
|
US10239160B2
(en)
|
2011-09-21 |
2019-03-26 |
Coherent, Inc. |
Systems and processes that singulate materials
|
|
US8768129B2
(en)
|
2011-09-21 |
2014-07-01 |
Ofs Fitel, Llc |
Optimized ultra large area optical fibers
|
|
US8718431B2
(en)
|
2011-09-21 |
2014-05-06 |
Ofs Fitel, Llc |
Optimized ultra large area optical fibers
|
|
JP5931389B2
(ja)
|
2011-09-29 |
2016-06-08 |
川崎重工業株式会社 |
搬送システム
|
|
JP5864988B2
(ja)
|
2011-09-30 |
2016-02-17 |
浜松ホトニクス株式会社 |
強化ガラス板切断方法
|
|
FR2980859B1
(fr)
|
2011-09-30 |
2013-10-11 |
Commissariat Energie Atomique |
Procede et dispositif de lithographie
|
|
DE102011084128A1
(de)
|
2011-10-07 |
2013-04-11 |
Schott Ag |
Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
|
|
JP2013091578A
(ja)
|
2011-10-25 |
2013-05-16 |
Mitsuboshi Diamond Industrial Co Ltd |
ガラス基板のスクライブ方法
|
|
KR20130049080A
(ko)
|
2011-11-03 |
2013-05-13 |
삼성디스플레이 주식회사 |
회전식 박막 증착 장치 및 그것을 이용한 박막 증착 방법
|
|
KR101269474B1
(ko)
|
2011-11-09 |
2013-05-30 |
주식회사 모린스 |
강화글라스 절단 방법
|
|
US20130129947A1
(en)
|
2011-11-18 |
2013-05-23 |
Daniel Ralph Harvey |
Glass article having high damage resistance
|
|
US8677783B2
(en)
|
2011-11-28 |
2014-03-25 |
Corning Incorporated |
Method for low energy separation of a glass ribbon
|
|
US8666214B2
(en)
|
2011-11-30 |
2014-03-04 |
Corning Incorporated |
Low bend loss optical fiber
|
|
JP5963038B2
(ja)
|
2011-12-05 |
2016-08-03 |
株式会社リコー |
穿孔装置、用紙処理装置及び画像形成装置
|
|
WO2013084879A1
(ja)
|
2011-12-07 |
2013-06-13 |
旭硝子株式会社 |
強化ガラス板の切断方法、及び強化ガラス板切断装置
|
|
WO2013084877A1
(ja)
|
2011-12-07 |
2013-06-13 |
旭硝子株式会社 |
強化ガラス板の切断方法、および強化ガラス板切断装置
|
|
KR20130065051A
(ko)
|
2011-12-09 |
2013-06-19 |
삼성코닝정밀소재 주식회사 |
강화 글라스의 절단 방법 및 이를 이용한 터치스크린패널의 제조방법
|
|
CN103732549A
(zh)
|
2011-12-12 |
2014-04-16 |
日本电气硝子株式会社 |
平板玻璃的切割分离方法、及平板玻璃的切割分离装置
|
|
CN103635438B
(zh)
|
2011-12-12 |
2016-08-17 |
日本电气硝子株式会社 |
平板玻璃的切割分离方法
|
|
US8724937B2
(en)
|
2011-12-20 |
2014-05-13 |
International Business Machines Corporation |
Fiber to wafer interface
|
|
JP5910075B2
(ja)
|
2011-12-27 |
2016-04-27 |
三星ダイヤモンド工業株式会社 |
被加工物の加工方法
|
|
JP5887929B2
(ja)
|
2011-12-28 |
2016-03-16 |
三星ダイヤモンド工業株式会社 |
被加工物の分断方法および光学素子パターン付き基板の分断方法
|
|
CN103182894A
(zh)
|
2011-12-29 |
2013-07-03 |
深圳富泰宏精密工业有限公司 |
玻璃件及其制作方法
|
|
JP2013152986A
(ja)
|
2012-01-24 |
2013-08-08 |
Disco Abrasive Syst Ltd |
ウエーハの加工方法
|
|
JP5685208B2
(ja)
|
2012-01-24 |
2015-03-18 |
株式会社日立製作所 |
薄板用熱間圧延機の制御装置および薄板用熱間圧延機の制御方法
|
|
JP5964607B2
(ja)
|
2012-02-14 |
2016-08-03 |
株式会社カネカ |
剥離層付き支持体、基板構造、および電子デバイスの製造方法
|
|
US20130222877A1
(en)
|
2012-02-28 |
2013-08-29 |
Sage Electrochromics, Inc. |
Multi-zone electrochromic devices
|
|
WO2013130581A1
(en)
|
2012-02-28 |
2013-09-06 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of strengthened glass and articles produced thereby
|
|
US9895771B2
(en)
|
2012-02-28 |
2018-02-20 |
General Lasertronics Corporation |
Laser ablation for the environmentally beneficial removal of surface coatings
|
|
US10357850B2
(en)
|
2012-09-24 |
2019-07-23 |
Electro Scientific Industries, Inc. |
Method and apparatus for machining a workpiece
|
|
CN104136967B
(zh)
|
2012-02-28 |
2018-02-16 |
伊雷克托科学工业股份有限公司 |
用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品
|
|
CN104114506B
(zh)
|
2012-02-29 |
2017-05-24 |
伊雷克托科学工业股份有限公司 |
加工强化玻璃的方法和装置及藉此制造的物品
|
|
US9082764B2
(en)
|
2012-03-05 |
2015-07-14 |
Corning Incorporated |
Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
|
|
JP2013187247A
(ja)
|
2012-03-06 |
2013-09-19 |
Nippon Hoso Kyokai <Nhk> |
インターポーザおよびその製造方法
|
|
US9341912B2
(en)
|
2012-03-13 |
2016-05-17 |
View, Inc. |
Multi-zone EC windows
|
|
TW201343296A
(zh)
|
2012-03-16 |
2013-11-01 |
Ipg Microsystems Llc |
使一工件中具有延伸深度虛飾之雷射切割系統及方法
|
|
JP5964626B2
(ja)
|
2012-03-22 |
2016-08-03 |
株式会社Ｓｃｒｅｅｎホールディングス |
熱処理装置
|
|
JP2013203630A
(ja)
|
2012-03-29 |
2013-10-07 |
Asahi Glass Co Ltd |
強化ガラス板の切断方法
|
|
JP2013203631A
(ja)
|
2012-03-29 |
2013-10-07 |
Asahi Glass Co Ltd |
強化ガラス板の切断方法、及び強化ガラス板切断装置
|
|
TW201339111A
(zh)
|
2012-03-29 |
2013-10-01 |
Global Display Co Ltd |
強化玻璃的切割方法
|
|
CN104661787A
(zh)
|
2012-04-05 |
2015-05-27 |
Sage电致变色显示有限公司 |
用于电变色装置制造的热激光划线切割方法和设备及相应的切割玻璃面板
|
|
JP2013216513A
(ja)
|
2012-04-05 |
2013-10-24 |
Nippon Electric Glass Co Ltd |
ガラスフィルムの切断方法及びガラスフィルム積層体
|
|
JP2015120604A
(ja)
|
2012-04-06 |
2015-07-02 |
旭硝子株式会社 |
強化ガラス板の切断方法、及び強化ガラス板切断システム
|
|
FR2989294B1
(fr)
|
2012-04-13 |
2022-10-14 |
Centre Nat Rech Scient |
Dispositif et methode de nano-usinage par laser
|
|
US20130288010A1
(en)
|
2012-04-27 |
2013-10-31 |
Ravindra Kumar Akarapu |
Strengthened glass article having shaped edge and method of making
|
|
KR20130124646A
(ko)
|
2012-05-07 |
2013-11-15 |
주식회사 엠엠테크 |
강화 유리 절단 방법
|
|
US9365446B2
(en)
|
2012-05-14 |
2016-06-14 |
Richard Green |
Systems and methods for altering stress profiles of glass
|
|
CN102672355B
(zh)
|
2012-05-18 |
2015-05-13 |
杭州士兰明芯科技有限公司 |
Led衬底的划片方法
|
|
DE102012010635B4
(de)
|
2012-05-18 |
2022-04-07 |
Leibniz-Institut für Oberflächenmodifizierung e.V. |
Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
|
|
JP6009225B2
(ja)
|
2012-05-29 |
2016-10-19 |
浜松ホトニクス株式会社 |
強化ガラス板の切断方法
|
|
FR2991214B1
(fr)
|
2012-06-01 |
2014-06-13 |
Snecma |
Procede de percage d'une piece par impulsions laser
|
|
US9938180B2
(en)
|
2012-06-05 |
2018-04-10 |
Corning Incorporated |
Methods of cutting glass using a laser
|
|
JP6022223B2
(ja)
|
2012-06-14 |
2016-11-09 |
株式会社ディスコ |
レーザー加工装置
|
|
JP5991860B2
(ja)
|
2012-06-19 |
2016-09-14 |
三星ダイヤモンド工業株式会社 |
ガラス基板の加工方法
|
|
US20130344684A1
(en)
|
2012-06-20 |
2013-12-26 |
Stuart Bowden |
Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material
|
|
WO2014010490A1
(ja)
|
2012-07-09 |
2014-01-16 |
旭硝子株式会社 |
強化ガラス板の切断方法
|
|
AT13206U1
(de)
|
2012-07-17 |
2013-08-15 |
Lisec Maschb Gmbh |
Verfahren und Anordnung zum Teilen von Flachglas
|
|
US9462632B2
(en)
|
2012-07-17 |
2016-10-04 |
Qualcomm Incorporated |
Concurrent data streaming using various parameters from the same sensor
|
|
TW201417928A
(zh)
|
2012-07-30 |
2014-05-16 |
Raydiance Inc |
具訂製邊形及粗糙度之脆性材料切割
|
|
US8842358B2
(en)
|
2012-08-01 |
2014-09-23 |
Gentex Corporation |
Apparatus, method, and process with laser induced channel edge
|
|
KR101395054B1
(ko)
|
2012-08-08 |
2014-05-14 |
삼성코닝정밀소재 주식회사 |
강화유리 커팅 방법 및 강화유리 커팅용 스테이지
|
|
KR20140022981A
(ko)
|
2012-08-14 |
2014-02-26 |
(주)하드램 |
기판 에지 보호유닛을 포함한 강화유리 레이저 절단 장치 및 방법
|
|
KR20140022980A
(ko)
|
2012-08-14 |
2014-02-26 |
(주)하드램 |
강화유리 레이저 절단 장치 및 방법
|
|
US9446590B2
(en)
|
2012-08-16 |
2016-09-20 |
Hewlett-Packard Development Company, L.P. |
Diagonal openings in photodefinable glass
|
|
US20140047957A1
(en)
|
2012-08-17 |
2014-02-20 |
Jih Chun Wu |
Robust Torque-Indicating Wrench
|
|
JP5727433B2
(ja)
|
2012-09-04 |
2015-06-03 |
イムラ アメリカ インコーポレイテッド |
超短パルスレーザでの透明材料処理
|
|
CN102923939B
(zh)
|
2012-09-17 |
2015-03-25 |
江西沃格光电股份有限公司 |
强化玻璃的切割方法
|
|
CN102898014A
(zh)
|
2012-09-29 |
2013-01-30 |
江苏太平洋石英股份有限公司 |
无接触激光切割石英玻璃制品的方法及其装置
|
|
US9227886B2
(en)
|
2012-10-12 |
2016-01-05 |
Exxonmobil Chemical Patents Inc. |
Polymerization process
|
|
CN102916081B
(zh)
|
2012-10-19 |
2015-07-08 |
张立国 |
一种薄膜太阳能电池的清边方法
|
|
LT6046B
(lt)
|
2012-10-22 |
2014-06-25 |
Uab "Lidaris" |
Justiruojamų optinių laikiklių pakeitimo įrenginys ir sistema, turinti tokių įrenginių
|
|
US20140110040A1
(en)
|
2012-10-23 |
2014-04-24 |
Ronald Steven Cok |
Imprinted micro-louver structure method
|
|
DE102012110971B4
(de)
|
2012-11-14 |
2025-03-20 |
Schott Ag |
Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
|
|
US9991090B2
(en)
|
2012-11-15 |
2018-06-05 |
Fei Company |
Dual laser beam system used with an electron microscope and FIB
|
|
KR20140064220A
(ko)
|
2012-11-20 |
2014-05-28 |
에스케이씨 주식회사 |
보안필름의 제조방법
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
KR20150109339A
(ko)
|
2012-11-21 |
2015-10-01 |
넥세온 에너지 솔루션즈 엘엘씨 |
에너지 효율화 필름
|
|
JP2014104484A
(ja)
|
2012-11-27 |
2014-06-09 |
Disco Abrasive Syst Ltd |
レーザー加工装置
|
|
CN102962583A
(zh)
|
2012-11-28 |
2013-03-13 |
江苏大学 |
一种基于激光加热的塑料件微结构成形方法和装置
|
|
US9758876B2
(en)
|
2012-11-29 |
2017-09-12 |
Corning Incorporated |
Sacrificial cover layers for laser drilling substrates and methods thereof
|
|
US9346706B2
(en)
|
2012-11-29 |
2016-05-24 |
Corning Incorporated |
Methods of fabricating glass articles by laser damage and etching
|
|
JP6054161B2
(ja)
|
2012-12-13 |
2016-12-27 |
株式会社ディスコ |
レーザ加工方法
|
|
RU2539970C2
(ru)
|
2012-12-17 |
2015-01-27 |
Общество с ограниченной ответственностью "РнД-ИСАН" |
Источник света с лазерной накачкой и способ генерации излучения
|
|
CN203021443U
(zh)
|
2012-12-24 |
2013-06-26 |
深圳大宇精雕科技有限公司 |
玻璃板水射流切割机
|
|
CN103013374B
(zh)
|
2012-12-28 |
2014-03-26 |
吉林大学 |
仿生防粘疏水疏油贴膜
|
|
EP2750447A1
(en)
|
2012-12-28 |
2014-07-02 |
Alcatel Lucent |
Neighboring cell selection for an user equipment using a content delivery service in a mobile network
|
|
US9595283B2
(en)
|
2012-12-29 |
2017-03-14 |
Hoya Corporation |
Glass substrate for magnetic disk and magnetic disk
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
JP2016513016A
(ja)
|
2013-02-04 |
2016-05-12 |
ニューポート コーポレーション |
透明及び半透明な基板をレーザ切断する方法及び装置
|
|
JP6801846B2
(ja)
*
|
2013-02-05 |
2020-12-16 |
マサチューセッツ インスティテュート オブ テクノロジー |
３ｄホログラフィックイメージングフローサイトメトリ
|
|
US9498920B2
(en)
|
2013-02-12 |
2016-11-22 |
Carbon3D, Inc. |
Method and apparatus for three-dimensional fabrication
|
|
JP2014156289A
(ja)
|
2013-02-14 |
2014-08-28 |
Mitsubishi Electric Building Techno Service Co Ltd |
エレベータの主ロープ点検方法
|
|
US9919380B2
(en)
|
2013-02-23 |
2018-03-20 |
Coherent, Inc. |
Shaping of brittle materials with controlled surface and bulk properties
|
|
CN105339316B
(zh)
|
2013-02-25 |
2018-11-09 |
康宁股份有限公司 |
制造薄玻璃块的方法
|
|
DE102013003118B4
(de)
|
2013-02-25 |
2015-03-26 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Entsorgen von einem bei einem Lochungsvorgang eines Hohlprofils enstehenden Butzens
|
|
CN105164581B
(zh)
|
2013-03-08 |
2020-05-01 |
Sage电致变色显示有限公司 |
具有多个独立可控区域和内部母线的电致变色器件
|
|
US10179952B2
(en)
|
2013-03-08 |
2019-01-15 |
Rutgers, The State University Of New Jersey |
Patterned thin films by thermally induced mass displacement
|
|
CN103143841B
(zh)
|
2013-03-08 |
2014-11-26 |
西北工业大学 |
一种利用皮秒激光加工孔的方法
|
|
KR102209964B1
(ko)
|
2013-03-13 |
2021-02-02 |
삼성디스플레이 주식회사 |
피코초 레이저 가공 장치
|
|
WO2014144322A1
(en)
|
2013-03-15 |
2014-09-18 |
Kinestral Technologies, Inc. |
Laser cutting strengthened glass
|
|
JP6061193B2
(ja)
|
2013-03-18 |
2017-01-18 |
大日本印刷株式会社 |
ブランクのストリッパ機構
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
SG11201508042PA
(en)
|
2013-03-27 |
2015-10-29 |
Sumitomo Seika Chemicals |
Water-absorbent resin composition production method
|
|
JP6059059B2
(ja)
|
2013-03-28 |
2017-01-11 |
浜松ホトニクス株式会社 |
レーザ加工方法
|
|
CN105102177B
(zh)
|
2013-04-04 |
2018-02-27 |
Lpkf激光电子股份公司 |
在基板上引入穿孔的方法和装置以及以这种方式制造的基板
|
|
ES2959429T3
(es)
|
2013-04-04 |
2024-02-26 |
Lpkf Laser & Electronics Se |
Procedimiento para la separación de un sustrato
|
|
DE102013103370A1
(de)
|
2013-04-04 |
2014-10-09 |
Lpkf Laser & Electronics Ag |
Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat
|
|
US10190363B2
(en)
|
2013-04-10 |
2019-01-29 |
Cardinal Ig Company |
Multilayer film with electrically switchable optical properties
|
|
CN103224117B
(zh)
|
2013-05-10 |
2016-02-03 |
深圳市华星光电技术有限公司 |
一种自动反馈调节碎玻璃传送张力的系统
|
|
CN103273195B
(zh)
|
2013-05-28 |
2015-03-04 |
江苏大学 |
激光间接冲击下金属薄板的微冲裁自动化装置及其方法
|
|
CN103316990B
(zh)
|
2013-05-28 |
2015-06-10 |
江苏大学 |
脉冲激光驱动飞片加载薄板的微冲裁自动化装置及其方法
|
|
US9365413B2
(en)
|
2013-05-29 |
2016-06-14 |
Freescale Semiconductor, Inc. |
Transducer-including devices, and methods and apparatus for their calibration
|
|
RU2019101249A
(ru)
|
2013-06-18 |
2019-03-05 |
Вью, Инк. |
Электрохромные устройства непрямоугольных форм
|
|
US9776891B2
(en)
|
2013-06-26 |
2017-10-03 |
Corning Incorporated |
Filter and methods for heavy metal remediation of water
|
|
KR101344368B1
(ko)
|
2013-07-08 |
2013-12-24 |
정우라이팅 주식회사 |
수직형 유리관 레이저 절단장치
|
|
CN103359948A
(zh)
|
2013-07-12 |
2013-10-23 |
深圳南玻伟光导电膜有限公司 |
钢化玻璃的切割方法
|
|
KR20150009153A
(ko)
|
2013-07-16 |
2015-01-26 |
동우 화인켐 주식회사 |
강화처리된 유리의 홀 형성 방법
|
|
US9102011B2
(en)
|
2013-08-02 |
2015-08-11 |
Rofin-Sinar Technologies Inc. |
Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
|
|
US9102007B2
(en)
|
2013-08-02 |
2015-08-11 |
Rofin-Sinar Technologies Inc. |
Method and apparatus for performing laser filamentation within transparent materials
|
|
US9790128B2
(en)
|
2013-08-07 |
2017-10-17 |
Corning Incorporated |
Laser controlled ion exchange process and glass articles formed therefrom
|
|
US9296646B2
(en)
|
2013-08-29 |
2016-03-29 |
Corning Incorporated |
Methods for forming vias in glass substrates
|
|
TWI618131B
(zh)
|
2013-08-30 |
2018-03-11 |
半導體能源研究所股份有限公司 |
剝離起點形成裝置及形成方法、疊層體製造裝置
|
|
PL3041804T3
(pl)
|
2013-09-04 |
2017-09-29 |
Saint-Gobain Glass France |
Sposób produkcji szyby z powłoką przewodzącą prąd elektryczny z elektrycznie odizolowanymi defektami
|
|
CN203509350U
(zh)
|
2013-09-27 |
2014-04-02 |
东莞市盛雄激光设备有限公司 |
皮秒激光加工装置
|
|
CN103531414B
(zh)
|
2013-10-14 |
2016-03-02 |
南京三乐电子信息产业集团有限公司 |
一种栅控行波管栅网的皮秒脉冲激光切割制备方法
|
|
US10017410B2
(en)
|
2013-10-25 |
2018-07-10 |
Rofin-Sinar Technologies Llc |
Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
|
|
US20150122656A1
(en)
|
2013-11-04 |
2015-05-07 |
Rofin-Sinar Technologies Inc. |
Mass based filtration devices and method of fabrication using bursts of ultrafast laser pulses
|
|
US20150121960A1
(en)
|
2013-11-04 |
2015-05-07 |
Rofin-Sinar Technologies Inc. |
Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
|
|
US10005152B2
(en)
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
|
US9517929B2
(en)
|
2013-11-19 |
2016-12-13 |
Rofin-Sinar Technologies Inc. |
Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
|
|
US11053156B2
(en)
|
2013-11-19 |
2021-07-06 |
Rofin-Sinar Technologies Llc |
Method of closed form release for brittle materials using burst ultrafast laser pulses
|
|
DE102013223637B4
(de)
|
2013-11-20 |
2018-02-01 |
Trumpf Laser- Und Systemtechnik Gmbh |
Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats
|
|
JP2017501951A
(ja)
|
2013-11-25 |
2017-01-19 |
コーニング インコーポレイテッド |
実質的に柱面を成す鏡面反射面の形状を決定するための方法
|
|
WO2015079613A1
(ja)
|
2013-11-29 |
2015-06-04 |
パナソニックＩｐマネジメント株式会社 |
塗料組成物及び該塗料組成物を用いた光拡散部材
|
|
US10144088B2
(en)
|
2013-12-03 |
2018-12-04 |
Rofin-Sinar Technologies Llc |
Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
|
|
CN103746027B
(zh)
|
2013-12-11 |
2015-12-09 |
西安交通大学 |
一种在ito导电薄膜表面刻蚀极细电隔离槽的方法
|
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US20150165563A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
|
|
US9713799B2
(en)
|
2013-12-17 |
2017-07-25 |
Bayer Cropscience Lp |
Mixing systems, methods, and devices with extendible impellers
|
|
US20150166393A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser cutting of ion-exchangeable glass substrates
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US20160311717A1
(en)
|
2013-12-17 |
2016-10-27 |
Corning Incorporated |
3-d forming of glass
|
|
CN103831539B
(zh)
|
2014-01-10 |
2016-01-20 |
合肥鑫晟光电科技有限公司 |
激光打孔方法及激光打孔系统
|
|
JP6390961B2
(ja)
|
2014-01-28 |
2018-09-19 |
株式会社リコー |
書込ヘッドユニットの組立装置および書込ヘッドユニットの組立方法
|
|
DE102014201739B4
(de)
|
2014-01-31 |
2021-08-12 |
Trumpf Laser- Und Systemtechnik Gmbh |
Laserbearbeitungsvorrichtung sowie Verfahren zum Erzeugen zweier Teilstrahlen
|
|
WO2015127583A1
(en)
|
2014-02-25 |
2015-09-03 |
Schott Ag |
Chemically toughened glass article with low coefficient of thermal expansion
|
|
EP2913137A1
(de)
|
2014-02-26 |
2015-09-02 |
Bystronic Laser AG |
Laserbearbeitungsvorrichtung und Verfahren
|
|
BR112016019541B1
(pt)
|
2014-03-04 |
2021-12-14 |
Saint-Gobain Glass France |
Método para corte de uma camada de vidro ultrafina laminada
|
|
US11780029B2
(en)
|
2014-03-05 |
2023-10-10 |
Panasonic Connect North America, division of Panasonic Corporation of North America |
Material processing utilizing a laser having a variable beam shape
|
|
US11204506B2
(en)
|
2014-03-05 |
2021-12-21 |
TeraDiode, Inc. |
Polarization-adjusted and shape-adjusted beam operation for materials processing
|
|
US20150352671A1
(en)
|
2014-06-09 |
2015-12-10 |
GM Global Technology Operations LLC |
Laser cutting same side slug removal
|
|
EP3158390B1
(en)
|
2014-06-17 |
2023-01-18 |
Sage Electrochromics, Inc. |
Moisture resistant electrochromic device
|
|
US9933682B2
(en)
|
2014-06-17 |
2018-04-03 |
Sage Electrochromics, Inc. |
Controlled switching for electrochromic devices
|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
LT2965853T
(lt)
|
2014-07-09 |
2016-11-25 |
High Q Laser Gmbh |
Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius
|
|
MX2017000440A
(es)
|
2014-07-11 |
2017-08-16 |
Corning Inc |
Sistemas y metodos para cortado de vidrio al inducir perforaciones por láser pulsado en artículos de vidrio.
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
TWI659793B
(zh)
|
2014-07-14 |
2019-05-21 |
美商康寧公司 |
用於使用可調整雷射束焦線來處理透明材料的系統及方法
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
US20160009066A1
(en)
|
2014-07-14 |
2016-01-14 |
Corning Incorporated |
System and method for cutting laminated structures
|
|
DE102014213775B4
(de)
|
2014-07-15 |
2018-02-15 |
Innolas Solutions Gmbh |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
|
|
US9757815B2
(en)
|
2014-07-21 |
2017-09-12 |
Rofin-Sinar Technologies Inc. |
Method and apparatus for performing laser curved filamentation within transparent materials
|
|
DE102014110920C5
(de)
|
2014-07-31 |
2023-08-03 |
Schott Ag |
Geformter Glasartikel mit vorbestimmter Geometrie
|
|
CN104344202A
(zh)
|
2014-09-26 |
2015-02-11 |
张玉芬 |
一种有孔玻璃
|
|
KR102138964B1
(ko)
|
2014-11-19 |
2020-07-28 |
트룸프 레이저-운트 시스템테크닉 게엠베하 |
비대칭 광학 빔 정형을 위한 시스템
|
|
DE102014116958B9
(de)
|
2014-11-19 |
2017-10-05 |
Trumpf Laser- Und Systemtechnik Gmbh |
Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
|
|
US9740063B2
(en)
|
2014-11-28 |
2017-08-22 |
Japan Display Inc. |
Reflective type liquid crystal display device
|
|
US9873628B1
(en)
|
2014-12-02 |
2018-01-23 |
Coherent Kaiserslautern GmbH |
Filamentary cutting of brittle materials using a picosecond pulsed laser
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
US10900885B2
(en)
|
2014-12-19 |
2021-01-26 |
Captl Llc |
Flow cytometry using hydrodynamically planar flow
|
|
JP6005125B2
(ja)
|
2014-12-22 |
2016-10-12 |
イムラ アメリカ インコーポレイテッド |
超短パルスレーザでの透明材料処理
|
|
FR3031102B1
(fr)
|
2014-12-31 |
2017-01-27 |
Saint Gobain |
Procede de rompage d'une forme interieure dans une feuille de verre
|
|
EP3848334A1
(en)
|
2015-03-24 |
2021-07-14 |
Corning Incorporated |
Alkaline earth boro-aluminosilicate glass article with laser cut edge
|
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
US9477037B1
(en)
|
2015-04-22 |
2016-10-25 |
Corning Incorporated |
Optical fiber for silicon photonics
|
|
KR20170006900A
(ko)
|
2015-07-10 |
2017-01-18 |
삼성전자주식회사 |
성형장치 및 이를 이용한 성형방법
|
|
DE102015111490A1
(de)
|
2015-07-15 |
2017-01-19 |
Schott Ag |
Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
|
|
MX2018001587A
(es)
|
2015-08-10 |
2018-05-22 |
Saint Gobain |
Metodo para cortar una capa delgada de vidrio.
|
|
CN105081564B
(zh)
|
2015-08-31 |
2017-03-29 |
大族激光科技产业集团股份有限公司 |
一种强化玻璃内形孔的加工方法
|
|
CN107922259B
(zh)
|
2015-09-04 |
2021-05-07 |
Ａｇｃ株式会社 |
玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置
|
|
WO2017091529A1
(en)
|
2015-11-25 |
2017-06-01 |
Corning Incorporated |
Methods of separating a glass web
|
|
DE102015120950B4
(de)
|
2015-12-02 |
2022-03-03 |
Schott Ag |
Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement
|
|
US20170197868A1
(en)
|
2016-01-08 |
2017-07-13 |
Apple Inc. |
Laser Processing of Electronic Device Structures
|
|
DE102016102768A1
(de)
|
2016-02-17 |
2017-08-17 |
Schott Ag |
Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement
|
|
CN109803934A
(zh)
|
2016-07-29 |
2019-05-24 |
康宁股份有限公司 |
用于激光处理的装置和方法
|
|
WO2018044843A1
(en)
|
2016-08-30 |
2018-03-08 |
Corning Incorporated |
Laser processing of transparent materials
|
|
NL2017998B1
(en)
|
2016-12-14 |
2018-06-26 |
Corning Inc |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
LT3311947T
(lt)
|
2016-09-30 |
2019-12-27 |
Corning Incorporated |
Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
|
|
US20180118602A1
(en)
|
2016-11-01 |
2018-05-03 |
Corning Incorporated |
Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates
|
|
US10668561B2
(en)
|
2016-11-15 |
2020-06-02 |
Coherent, Inc. |
Laser apparatus for cutting brittle material
|
|
KR102270125B1
(ko)
|
2017-04-13 |
2021-06-25 |
시노라 게엠베하 |
유기 분자, 특히 광전자 장치에 사용하기 위한 유기 분자
|