JP2012187618A - ガラス基板のレーザ加工装置 - Google Patents
ガラス基板のレーザ加工装置 Download PDFInfo
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Abstract
【解決手段】レーザ光源から、波長が300〜400nmのパルスレーザ光10を出射し、レーザ光10を矩形(正方形又は長方形)のビーム形状にしてガラス基板2に照射する。このレーザ光10のガラス基板2に対する照射位置を切断予定線に沿って移動させることにより、レーザ光10を間欠的に直線上に照射し、加工痕12を直線上に形成する。光学系は、レーザ光10の焦点位置を、ガラス基板2の厚さ方向の内部とし、焦点深度を前記ガラス基板の厚さよりも短く設定する。これにより、加工痕12はガラス基板2の内部に形成される。
【選択図】図2
Description
2:ガラス基板
3:移動部材
4:支持部材
5:対物レンズ
6:パルスレーザ光源
10、20:レーザ光
11、21:ビーム形状
12,22:加工痕
31:カメラ
32:ライン照明
Claims (4)
- 波長が300〜400nmのパルスレーザ光を出射するレーザ光源と、前記レーザ光を矩形のビーム形状にしてガラス基板に照射する光学系と、前記光学系と前記ガラス基板とを相対的に移動させて前記レーザ光の前記ガラス基板に対する照射位置を切断予定線に沿って移動させる駆動装置と、前記レーザ光の照射位置が前記切断予定線に沿って点在するように前記レーザ光を間欠的に前記ガラス基板に照射させる制御装置と、を有し、前記光学系は、前記レーザ光の焦点位置を、前記ガラス基板の厚さ方向の内部とし、焦点深度を前記ガラス基板の厚さよりも短く設定することを特徴とするガラス基板のレーザ加工装置。
- 前記光学系は、前記レーザ光のビーム形状を前記切断予定線に沿って細長くなるように成形するシリンドリカルレンズを有することを特徴とする請求項1に記載のガラス基板のレーザ加工装置。
- 前記レーザ光の前記ガラス基板に対する移動方向の後方に配置され、従前のレーザ光の照射による加工痕を検出するカメラと、このカメラにより検出された従前の加工痕の位置を基に、前記レーザ光の次順の照射に関し、その照射位置をレーザ光移動方向に直角方向に関して調節すると共に、その照射タイミングを調節する調節部と、を有することを特徴とする請求項2に記載のガラス基板のレーザ加工装置。
- 前記ガラス基板は、表面強化ガラス基板であり、前記光学系は、前記レーザ光の焦点位置を、前記表面強化ガラス基板の厚さ方向の内部であって、前記表面強化ガラス基板の表面強化層よりも深い位置に設定することを特徴とする請求項1乃至3のいずれか1項に記載のガラス基板のレーザ加工装置。
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CN104625433A (zh) * | 2014-12-31 | 2015-05-20 | 武汉华工激光工程有限责任公司 | 一种用于切割led灯丝透明材料支架的方法 |
CN106029286A (zh) * | 2013-12-17 | 2016-10-12 | 康宁股份有限公司 | 在玻璃中进行快速激光钻孔的方法和由其制备的产品 |
US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
US10179748B2 (en) | 2013-12-17 | 2019-01-15 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
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US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
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JP2009018344A (ja) * | 2007-06-15 | 2009-01-29 | Mitsubishi Electric Corp | 基板加工方法 |
WO2010096359A1 (en) * | 2009-02-19 | 2010-08-26 | Corning Incorporated | Method of separating strengthened glass |
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2011
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Patent Citations (5)
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JPH1110374A (ja) * | 1997-06-25 | 1999-01-19 | Souei Tsusho Kk | 割断加工方法 |
JP2003025323A (ja) * | 2001-07-18 | 2003-01-29 | Seiko Epson Corp | レーザ割断装置及び方法、並びに電気光学パネルの割断方法 |
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WO2010096359A1 (en) * | 2009-02-19 | 2010-08-26 | Corning Incorporated | Method of separating strengthened glass |
Cited By (43)
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US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
US11028003B2 (en) | 2013-01-15 | 2021-06-08 | Corning Laser Technologies GmbH | Method and device for laser-based machining of flat substrates |
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
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US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
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