JP6059059B2 - レーザ加工方法 - Google Patents
レーザ加工方法 Download PDFInfo
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- JP6059059B2 JP6059059B2 JP2013069431A JP2013069431A JP6059059B2 JP 6059059 B2 JP6059059 B2 JP 6059059B2 JP 2013069431 A JP2013069431 A JP 2013069431A JP 2013069431 A JP2013069431 A JP 2013069431A JP 6059059 B2 JP6059059 B2 JP 6059059B2
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- 238000003672 processing method Methods 0.000 title claims description 47
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- 238000012986 modification Methods 0.000 description 7
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- 239000002184 metal Substances 0.000 description 5
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- 238000003754 machining Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
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- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- 206010061289 metastatic neoplasm Diseases 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Description
[第1実施形態]
[第2実施形態]
Claims (3)
- 互いに積層された第1及び第2の板状部材と、前記第1の板状部材と前記第2の板状部材との間に配置され前記第1の板状部材と前記第2の板状部材とを互いに接合する接合層とを有し、加工予定ラインが設定された加工対象物を用意する第1の工程と、
前記第1の板状部材における前記接合層と反対側の面である前記加工対象物の表面をレーザ光の入射面として、前記加工予定ラインに沿って前記第1の板状部材にレーザ光を照射することにより、前記加工予定ラインに沿って前記第1の板状部材に改質領域を形成する第2の工程と、
前記加工対象物の前記表面をレーザ光の入射面として、前記加工予定ラインに沿って前記接合層にレーザ光を照射することにより、前記加工予定ラインに沿って前記接合層に加工痕を形成する第3の工程と、
前記第1〜3の工程の後に、前記第2の板状部材における前記接合層と反対側の面である前記加工対象物の裏面をレーザ光の入射面として、前記加工予定ラインに沿って前記第2の板状部材にレーザ光を照射することにより、前記加工予定ラインに沿って前記第2の板状部材に改質領域を形成する第4の工程と、を備え、
前記第4の工程においては、前記接合層に形成された前記加工痕を、前記第2の板状部材に対するレーザ光の照射位置のアライメントの基準として用いることにより、前記加工予定ラインに沿って前記第2の板状部材にレーザ光を照射する、
ことを特徴とするレーザ加工方法。 - 前記第3の工程を実施して前記接合層に前記加工痕を形成した後に、前記第2の工程を実施して前記第1の板状部材に改質領域を形成する、ことを特徴とする請求項1に記載のレーザ加工方法。
- 前記第2の工程を実施する際に、前記第1の板状部材に照射されるレーザ光の漏れ光を前記接合層に照射して前記接合層に前記加工痕を形成することにより、前記第3の工程を実施する、ことを特徴とする請求項1に記載のレーザ加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013069431A JP6059059B2 (ja) | 2013-03-28 | 2013-03-28 | レーザ加工方法 |
KR1020157025375A KR102130746B1 (ko) | 2013-03-28 | 2014-03-18 | 레이저 가공 방법 |
US14/779,652 US9764421B2 (en) | 2013-03-28 | 2014-03-18 | Laser processing method |
DE112014001692.6T DE112014001692T5 (de) | 2013-03-28 | 2014-03-18 | Laserverarbeitungsverfahren |
CN201480018959.6A CN105189020B (zh) | 2013-03-28 | 2014-03-18 | 激光加工方法 |
PCT/JP2014/057324 WO2014156828A1 (ja) | 2013-03-28 | 2014-03-18 | レーザ加工方法 |
TW103111053A TWI652130B (zh) | 2013-03-28 | 2014-03-25 | Laser processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013069431A JP6059059B2 (ja) | 2013-03-28 | 2013-03-28 | レーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014188581A JP2014188581A (ja) | 2014-10-06 |
JP6059059B2 true JP6059059B2 (ja) | 2017-01-11 |
Family
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JP2013069431A Active JP6059059B2 (ja) | 2013-03-28 | 2013-03-28 | レーザ加工方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9764421B2 (ja) |
JP (1) | JP6059059B2 (ja) |
KR (1) | KR102130746B1 (ja) |
CN (1) | CN105189020B (ja) |
DE (1) | DE112014001692T5 (ja) |
TW (1) | TWI652130B (ja) |
WO (1) | WO2014156828A1 (ja) |
Families Citing this family (27)
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WO2011018989A1 (ja) * | 2009-08-11 | 2011-02-17 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
CN106687419A (zh) | 2014-07-08 | 2017-05-17 | 康宁股份有限公司 | 用于激光处理材料的方法和设备 |
EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
KR102546692B1 (ko) | 2015-03-24 | 2023-06-22 | 코닝 인코포레이티드 | 디스플레이 유리 조성물의 레이저 절단 및 가공 |
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JP6571437B2 (ja) * | 2015-07-29 | 2019-09-04 | リンテック株式会社 | 半導体装置の製造方法 |
CN105336732B (zh) * | 2015-10-16 | 2017-09-29 | 厦门市三安光电科技有限公司 | 半导体器件及其制备方法 |
JP6779486B2 (ja) * | 2016-08-16 | 2020-11-04 | 国立大学法人埼玉大学 | 基板加工方法および基板加工装置 |
KR102078294B1 (ko) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
EP3848333A1 (en) | 2016-10-24 | 2021-07-14 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
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JP7182362B2 (ja) * | 2018-01-12 | 2022-12-02 | 日東電工株式会社 | 複合材の分断方法 |
KR20200130816A (ko) * | 2018-03-14 | 2020-11-20 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템, 기판 처리 방법 및 컴퓨터 기억 매체 |
JPWO2020090893A1 (ja) * | 2018-10-30 | 2021-09-16 | 浜松ホトニクス株式会社 | レーザ加工方法 |
WO2020105150A1 (ja) * | 2018-11-19 | 2020-05-28 | 株式会社東京精密 | レーザ加工装置及びその制御方法 |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
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CN111696968B (zh) * | 2019-03-14 | 2022-06-24 | 长鑫存储技术有限公司 | 半导体结构的制造方法 |
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-
2013
- 2013-03-28 JP JP2013069431A patent/JP6059059B2/ja active Active
-
2014
- 2014-03-18 CN CN201480018959.6A patent/CN105189020B/zh active Active
- 2014-03-18 KR KR1020157025375A patent/KR102130746B1/ko active IP Right Grant
- 2014-03-18 US US14/779,652 patent/US9764421B2/en active Active
- 2014-03-18 WO PCT/JP2014/057324 patent/WO2014156828A1/ja active Application Filing
- 2014-03-18 DE DE112014001692.6T patent/DE112014001692T5/de active Pending
- 2014-03-25 TW TW103111053A patent/TWI652130B/zh active
Also Published As
Publication number | Publication date |
---|---|
US9764421B2 (en) | 2017-09-19 |
KR20150133717A (ko) | 2015-11-30 |
KR102130746B1 (ko) | 2020-07-06 |
WO2014156828A1 (ja) | 2014-10-02 |
CN105189020A (zh) | 2015-12-23 |
CN105189020B (zh) | 2017-07-11 |
US20160039044A1 (en) | 2016-02-11 |
TW201509581A (zh) | 2015-03-16 |
DE112014001692T5 (de) | 2015-12-10 |
TWI652130B (zh) | 2019-03-01 |
JP2014188581A (ja) | 2014-10-06 |
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