JP4951241B2 - 微細加工方法 - Google Patents
微細加工方法Info
- Publication number
- JP4951241B2 JP4951241B2 JP2005517144A JP2005517144A JP4951241B2 JP 4951241 B2 JP4951241 B2 JP 4951241B2 JP 2005517144 A JP2005517144 A JP 2005517144A JP 2005517144 A JP2005517144 A JP 2005517144A JP 4951241 B2 JP4951241 B2 JP 4951241B2
- Authority
- JP
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- plastic material
- processed
- pattern
- processing
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/18—Surface shaping of articles, e.g. embossing; Apparatus therefor by liberation of internal stresses, e.g. plastic memory
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/005—Processes, not specifically provided for elsewhere, for producing decorative surface effects by altering locally the surface material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/009—Using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2025/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/008—Wide strips, e.g. films, webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/722—Decorative or ornamental articles
Landscapes
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laser Beam Processing (AREA)
Description
前記被加工プラスチック材料に対し、ガラス転移温度Tg以上、Tg+50℃以下の温度範囲で加熱処理を行い、形成されたパターンをX軸方向及びY軸方向に略同じく熱収縮により微細化することを特徴とする微細加工方法を提供する。
波長:800nm
パルス幅:225±20フェムト秒
光強度:25TW/cm2
対物レンズ
開口数NA:1.35
倍率:100倍
焦点の寸法
直径:約0.3μm
軸方向長さ:1μm
加熱処理前の回折格子
形状:10スリット格子
格子間隔:2.5μm
また、回折格子が形成されたポリスチレンフィルムの加熱処理は、130℃で120秒間行った。
Claims (5)
- 熱によりガラス相転移を示しかつX軸方向及びY軸方向に略同じく熱収縮性を有する被加工プラスチック材料にパルスレーザー光を照射して、前記被加工プラスチック材料の内部にレーザー加工で改質されたスポット状微小領域の集合体としてパターンを形成した後に、
前記被加工プラスチック材料に対し、ガラス転移温度Tg以上、Tg+50℃以下の温度範囲で加熱処理を行い、形成されたパターンをX軸方向及びY軸方向に略同じく熱収縮により微細化することを特徴とする微細加工方法。 - 形成されたレーザー加工パターンが前記加熱処理により消失しない被加工プラスチック材料を用いることを特徴とする請求の範囲第1項の微細加工方法。
- 形成されたレーザー加工パターンが前記加熱処理によりX軸方向及びY軸方向に略同じく微細化するのみで、そのパターン形状は変化しないことを特徴とする請求の範囲第1項又は第2項の微細加工方法。
- 前記被加工プラスチック材料の加工位置でパルスレーザー光のビームスポット径を100nm〜10μmに集光させて加工を行うことを特徴とする請求の範囲第1項から第3項のいずれかの微細加工方法。
- パルスレーザー光の前記被加工プラスチック材料に対する集光を、開口数0.1〜1.4、倍率5〜100倍の対物レンズを用いて行うことを特徴とする請求の範囲第4項の微細加工方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005517144A JP4951241B2 (ja) | 2004-01-16 | 2005-01-17 | 微細加工方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004009904 | 2004-01-16 | ||
JP2004009904 | 2004-01-16 | ||
JP2005517144A JP4951241B2 (ja) | 2004-01-16 | 2005-01-17 | 微細加工方法 |
PCT/JP2005/000798 WO2005068163A1 (ja) | 2004-01-16 | 2005-01-17 | 微細加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005068163A1 JPWO2005068163A1 (ja) | 2007-09-06 |
JP4951241B2 true JP4951241B2 (ja) | 2012-06-13 |
Family
ID=34792288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005517144A Expired - Fee Related JP4951241B2 (ja) | 2004-01-16 | 2005-01-17 | 微細加工方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080099444A1 (ja) |
JP (1) | JP4951241B2 (ja) |
WO (1) | WO2005068163A1 (ja) |
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JP5002808B2 (ja) * | 2006-03-07 | 2012-08-15 | 国立大学法人北海道大学 | レーザ加工装置及びレーザ加工方法 |
WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
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US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
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US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
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US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
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JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
EP3507057A1 (en) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
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US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59185633A (ja) * | 1983-04-07 | 1984-10-22 | Dainippon Ink & Chem Inc | 網状シ−トの製造方法 |
JP2002249607A (ja) * | 2001-02-26 | 2002-09-06 | Nitto Denko Corp | プラスチック構造体 |
Family Cites Families (3)
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US5338396A (en) * | 1993-11-01 | 1994-08-16 | Motorola, Inc. | Method of fabricating in-mold graphics |
JPH07266695A (ja) * | 1994-03-30 | 1995-10-17 | Rohm Co Ltd | 電子部品及びそのマ−キング方法 |
JP2003136261A (ja) * | 2001-11-02 | 2003-05-14 | Rally Master Kk | レーザーマーキング方法 |
-
2005
- 2005-01-17 JP JP2005517144A patent/JP4951241B2/ja not_active Expired - Fee Related
- 2005-01-17 US US10/585,845 patent/US20080099444A1/en not_active Abandoned
- 2005-01-17 WO PCT/JP2005/000798 patent/WO2005068163A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59185633A (ja) * | 1983-04-07 | 1984-10-22 | Dainippon Ink & Chem Inc | 網状シ−トの製造方法 |
JP2002249607A (ja) * | 2001-02-26 | 2002-09-06 | Nitto Denko Corp | プラスチック構造体 |
Also Published As
Publication number | Publication date |
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JPWO2005068163A1 (ja) | 2007-09-06 |
US20080099444A1 (en) | 2008-05-01 |
WO2005068163A1 (ja) | 2005-07-28 |
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