LT2965853T - Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius - Google Patents
Medžiagos apdorojimas, naudojant pailgintuosius lazerio spinduliusInfo
- Publication number
- LT2965853T LT2965853T LTEP14176292.2T LT14176292T LT2965853T LT 2965853 T LT2965853 T LT 2965853T LT 14176292 T LT14176292 T LT 14176292T LT 2965853 T LT2965853 T LT 2965853T
- Authority
- LT
- Lithuania
- Prior art keywords
- processing
- laser beams
- elongated laser
- elongated
- beams
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14176292.2A EP2965853B2 (en) | 2014-07-09 | 2014-07-09 | Processing of material using elongated laser beams |
Publications (1)
Publication Number | Publication Date |
---|---|
LT2965853T true LT2965853T (lt) | 2016-11-25 |
Family
ID=51176164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
LTEP14176292.2T LT2965853T (lt) | 2014-07-09 | 2014-07-09 | Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius |
Country Status (7)
Country | Link |
---|---|
US (1) | US10589384B2 (lt) |
EP (1) | EP2965853B2 (lt) |
JP (1) | JP2017528322A (lt) |
KR (1) | KR20170028888A (lt) |
CN (1) | CN106536119A (lt) |
LT (1) | LT2965853T (lt) |
WO (1) | WO2016005455A1 (lt) |
Families Citing this family (62)
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WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
TWI730945B (zh) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | 用於雷射處理材料的方法與設備 |
CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
EP3552753A3 (en) | 2014-07-14 | 2019-12-11 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
EP3536440A1 (en) | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
DE102014116957A1 (de) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
EP3221727B1 (de) | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
JP2018507154A (ja) | 2015-01-12 | 2018-03-15 | コーニング インコーポレイテッド | マルチフォトン吸収方法を用いた熱強化基板のレーザー切断 |
JP7292006B2 (ja) | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
CN107666983B (zh) | 2015-03-27 | 2020-10-02 | 康宁股份有限公司 | 可透气窗及其制造方法 |
EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
SG11201809797PA (en) | 2016-05-06 | 2018-12-28 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
FR3054151B1 (fr) * | 2016-07-25 | 2018-07-13 | Amplitude Systemes | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
CN110121398B (zh) | 2016-08-30 | 2022-02-08 | 康宁股份有限公司 | 透明材料的激光加工 |
KR102078294B1 (ko) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
US10830943B2 (en) * | 2017-10-31 | 2020-11-10 | Corning Incorporated | Optical fibers and optical systems comprising the same |
WO2019151185A1 (ja) * | 2018-01-31 | 2019-08-08 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法 |
DE102018126381A1 (de) * | 2018-02-15 | 2019-08-22 | Schott Ag | Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
CN110316949A (zh) * | 2018-03-28 | 2019-10-11 | 福州高意光学有限公司 | 一种飞秒激光器切割玻璃的方法 |
JP7123652B2 (ja) * | 2018-06-20 | 2022-08-23 | 株式会社ディスコ | レーザー加工装置 |
WO2020090894A1 (ja) * | 2018-10-30 | 2020-05-07 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
JP7120904B2 (ja) * | 2018-10-30 | 2022-08-17 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
TW202025256A (zh) * | 2018-10-30 | 2020-07-01 | 日商濱松赫德尼古斯股份有限公司 | 雷射加工裝置 |
WO2020090905A1 (ja) * | 2018-10-30 | 2020-05-07 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
WO2020105150A1 (ja) | 2018-11-19 | 2020-05-28 | 株式会社東京精密 | レーザ加工装置及びその制御方法 |
CN110253155B (zh) * | 2019-05-10 | 2021-10-15 | 武汉华工激光工程有限责任公司 | 一种微裂纹控制的激光加工装置 |
US20210024411A1 (en) | 2019-07-26 | 2021-01-28 | Laser Engineering Applications | Method for structuring a transparent substrate with a laser in a burst mode |
JP7391583B2 (ja) * | 2019-09-18 | 2023-12-05 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
DE102019129036A1 (de) * | 2019-10-28 | 2021-04-29 | Schott Ag | Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung |
CN112775539A (zh) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | 激光加工方法及装置 |
JP2021088474A (ja) * | 2019-12-03 | 2021-06-10 | 日本電気硝子株式会社 | ガラス物品の製造方法、及びガラス物品 |
DE102019219462A1 (de) * | 2019-12-12 | 2021-06-17 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines Glaselements und Schneidsystem |
JP2021163914A (ja) * | 2020-04-02 | 2021-10-11 | 浜松ホトニクス株式会社 | レーザ加工装置、レーザ加工方法及びウェハ |
KR20230020498A (ko) * | 2020-06-04 | 2023-02-10 | 코닝 인코포레이티드 | 수정된 펄스 버스트 프로파일을 사용하여 투명 작업편을 레이저 처리하는 방법 |
CN114178710A (zh) * | 2020-08-24 | 2022-03-15 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
DE102020122598A1 (de) | 2020-08-28 | 2022-03-03 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten eines Materials |
DE102020213776A1 (de) * | 2020-11-03 | 2022-05-05 | Q.ant GmbH | Verfahren zum Spalten eines Kristalls |
WO2022185096A1 (en) | 2021-03-03 | 2022-09-09 | Uab Altechna R&B | Laser beam transforming element |
US11782276B2 (en) | 2021-03-17 | 2023-10-10 | Google Llc | Systems and methods to reduce bounce spacing and double-bounce in waveguides |
DE102021109579B4 (de) | 2021-04-16 | 2023-03-23 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und vorrichtung zum ausbilden von modifikationen mit einem laserstrahl in einem material mit einer gekrümmten oberfläche |
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DE102022115711A1 (de) * | 2022-06-23 | 2023-12-28 | Schott Ag | Verfahren und Vorrichtung zum Bearbeiten von Werkstücken |
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AU2001227764A1 (en) * | 2000-01-10 | 2001-07-24 | Electro Scientific Industries, Inc. | Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
JP3867109B2 (ja) * | 2000-09-13 | 2007-01-10 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
DE10330179A1 (de) | 2003-07-02 | 2005-01-20 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Trennen flacher Werkstücke aus Keramik |
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KR101157444B1 (ko) * | 2007-07-06 | 2012-06-22 | 닛토덴코 가부시키가이샤 | 편광판 |
JP5446631B2 (ja) | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
KR100984727B1 (ko) * | 2010-04-30 | 2010-10-01 | 유병소 | 대상물 가공 방법 및 대상물 가공 장치 |
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JP5860228B2 (ja) | 2011-06-13 | 2016-02-16 | 株式会社ディスコ | レーザー加工装置 |
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DE102012110971A1 (de) | 2012-11-14 | 2014-05-15 | Schott Ag | Trennen von transparenten Werkstücken |
JP2014104484A (ja) | 2012-11-27 | 2014-06-09 | Disco Abrasive Syst Ltd | レーザー加工装置 |
KR101547806B1 (ko) | 2013-07-29 | 2015-08-27 | 에이피시스템 주식회사 | 멀티 초점을 가지는 비구면 렌즈를 이용한 취성 기판 가공 장치 |
-
2014
- 2014-07-09 LT LTEP14176292.2T patent/LT2965853T/lt unknown
- 2014-07-09 EP EP14176292.2A patent/EP2965853B2/en active Active
-
2015
- 2015-07-08 JP JP2017500887A patent/JP2017528322A/ja active Pending
- 2015-07-08 CN CN201580037272.1A patent/CN106536119A/zh active Pending
- 2015-07-08 US US15/317,220 patent/US10589384B2/en active Active
- 2015-07-08 KR KR1020167035653A patent/KR20170028888A/ko unknown
- 2015-07-08 WO PCT/EP2015/065615 patent/WO2016005455A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2016005455A1 (en) | 2016-01-14 |
JP2017528322A (ja) | 2017-09-28 |
EP2965853B1 (en) | 2016-09-21 |
EP2965853A1 (en) | 2016-01-13 |
US10589384B2 (en) | 2020-03-17 |
EP2965853B2 (en) | 2020-03-25 |
KR20170028888A (ko) | 2017-03-14 |
CN106536119A (zh) | 2017-03-22 |
US20170120374A1 (en) | 2017-05-04 |
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