FR3054151B1 - Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde - Google Patents
Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde Download PDFInfo
- Publication number
- FR3054151B1 FR3054151B1 FR1657138A FR1657138A FR3054151B1 FR 3054151 B1 FR3054151 B1 FR 3054151B1 FR 1657138 A FR1657138 A FR 1657138A FR 1657138 A FR1657138 A FR 1657138A FR 3054151 B1 FR3054151 B1 FR 3054151B1
- Authority
- FR
- France
- Prior art keywords
- cutting
- femtosecond laser
- laser multi
- beam materials
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/06—Cutting or splitting glass tubes, rods, or hollow products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1657138A FR3054151B1 (fr) | 2016-07-25 | 2016-07-25 | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
US16/320,585 US11883903B2 (en) | 2016-07-25 | 2017-07-25 | Method and appliance for cutting materials by multi-beam femtosecond laser |
CN201780058357.7A CN109789511B (zh) | 2016-07-25 | 2017-07-25 | 通过多光束飞秒激光来切割材料的方法和装置 |
PCT/FR2017/052071 WO2018020144A1 (fr) | 2016-07-25 | 2017-07-25 | Appareil et procédé de découpe de matériau par faisceau laser allongé non diffractif |
EP17748557.0A EP3487656B1 (fr) | 2016-07-25 | 2017-07-25 | Procédé et appareil pour la découpe de matériaux par multi-faisceaux laser femtoseconde |
KR1020197002669A KR102363273B1 (ko) | 2016-07-25 | 2017-07-25 | 다중 빔 펨토초 레이저에 의해 재료를 절단하는 방법 및 장치 |
JP2019504823A JP7190631B2 (ja) | 2016-07-25 | 2017-07-25 | マルチビームフェムト秒レーザによって材料を切断する方法及び器具 |
PCT/FR2017/052072 WO2018020145A1 (fr) | 2016-07-25 | 2017-07-25 | Procédé et appareil pour la découpe de matériaux par multi-faisceaux laser femtoseconde |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1657138A FR3054151B1 (fr) | 2016-07-25 | 2016-07-25 | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
FR1657138 | 2016-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3054151A1 FR3054151A1 (fr) | 2018-01-26 |
FR3054151B1 true FR3054151B1 (fr) | 2018-07-13 |
Family
ID=56990632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1657138A Active FR3054151B1 (fr) | 2016-07-25 | 2016-07-25 | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3054151B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020134751A1 (de) * | 2020-12-22 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Trennen eines Werkstücks |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5446631B2 (ja) * | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
FR2989294B1 (fr) * | 2012-04-13 | 2022-10-14 | Centre Nat Rech Scient | Dispositif et methode de nano-usinage par laser |
WO2014079478A1 (fr) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | Traitement par laser à grande vitesse de matériaux transparents |
LT2965853T (lt) * | 2014-07-09 | 2016-11-25 | High Q Laser Gmbh | Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius |
-
2016
- 2016-07-25 FR FR1657138A patent/FR3054151B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3054151A1 (fr) | 2018-01-26 |
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