JP2016528048A5 - - Google Patents

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Publication number
JP2016528048A5
JP2016528048A5 JP2016534879A JP2016534879A JP2016528048A5 JP 2016528048 A5 JP2016528048 A5 JP 2016528048A5 JP 2016534879 A JP2016534879 A JP 2016534879A JP 2016534879 A JP2016534879 A JP 2016534879A JP 2016528048 A5 JP2016528048 A5 JP 2016528048A5
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JP
Japan
Prior art keywords
layer
substrate
laser
structures
microns
Prior art date
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Application number
JP2016534879A
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English (en)
Japanese (ja)
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JP2016528048A (ja
JP6474810B2 (ja
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Application filed filed Critical
Priority claimed from PCT/US2014/051349 external-priority patent/WO2015023984A1/en
Publication of JP2016528048A publication Critical patent/JP2016528048A/ja
Publication of JP2016528048A5 publication Critical patent/JP2016528048A5/ja
Application granted granted Critical
Publication of JP6474810B2 publication Critical patent/JP6474810B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016534879A 2013-08-16 2014-08-15 薄層の内部にマーキングするためのレーザシステム並びに方法及びこれにより作製される対象物 Expired - Fee Related JP6474810B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361866705P 2013-08-16 2013-08-16
US61/866,705 2013-08-16
PCT/US2014/051349 WO2015023984A1 (en) 2013-08-16 2014-08-15 Laser systems and methods for internally marking thin layers, and articles produced thereby

Publications (3)

Publication Number Publication Date
JP2016528048A JP2016528048A (ja) 2016-09-15
JP2016528048A5 true JP2016528048A5 (enExample) 2017-09-14
JP6474810B2 JP6474810B2 (ja) 2019-02-27

Family

ID=52467046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016534879A Expired - Fee Related JP6474810B2 (ja) 2013-08-16 2014-08-15 薄層の内部にマーキングするためのレーザシステム並びに方法及びこれにより作製される対象物

Country Status (7)

Country Link
US (1) US9463528B2 (enExample)
EP (1) EP3033198A4 (enExample)
JP (1) JP6474810B2 (enExample)
KR (1) KR20160044464A (enExample)
CN (1) CN105451927A (enExample)
TW (1) TWI633642B (enExample)
WO (1) WO2015023984A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102540188B1 (ko) * 2015-06-22 2023-06-07 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 다중 축 공작기계 및 이를 제어하는 방법
US10704841B2 (en) * 2017-01-03 2020-07-07 Titan Tensor LLC Monolithic bicontinuous labyrinth structures and methods for their manufacture
CN111417487A (zh) * 2018-01-24 2020-07-14 极光先进雷射株式会社 激光加工方法和激光加工系统
KR20200075531A (ko) * 2018-12-18 2020-06-26 삼성전자주식회사 기판 처리 장치
EP3712717A1 (fr) 2019-03-19 2020-09-23 Comadur S.A. Methode pour marquer une glace de montre en saphir
TWI860382B (zh) * 2019-07-18 2024-11-01 日商東京威力科創股份有限公司 處理裝置及處理方法
CN112935530B (zh) * 2021-04-25 2022-12-13 山东大学深圳研究院 一种确定脉冲激光焦点位置的方法及装置
US11766874B2 (en) * 2021-11-19 2023-09-26 Xerox Corporation Matrix addressable, line laser, marking system using laser additives

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US7838794B2 (en) * 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US6483071B1 (en) 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US6751033B2 (en) * 2001-10-12 2004-06-15 Intralase Corp. Closed-loop focal positioning system and method
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7133186B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing transducers to modulate different axes
JP2006007619A (ja) * 2004-06-25 2006-01-12 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
US7363180B2 (en) 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
JP5365063B2 (ja) 2008-05-07 2013-12-11 株式会社Ｓｕｍｃｏ シリコンウェーハの製造方法
JP5525601B2 (ja) * 2009-06-04 2014-06-18 コアレイズ オーワイ レーザを用いた基板加工方法
US10071583B2 (en) 2009-10-16 2018-09-11 Apple Inc. Marking of product housings
US8379679B2 (en) 2010-02-11 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
US8379678B2 (en) 2010-02-11 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
US8451873B2 (en) * 2010-02-11 2013-05-28 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
US8389895B2 (en) 2010-06-25 2013-03-05 Electro Scientifix Industries, Inc. Method and apparatus for reliably laser marking articles
WO2012121732A1 (en) * 2011-03-10 2012-09-13 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
DK2548714T3 (da) * 2011-07-21 2013-11-11 Ems Patent Ag Laserstrålesvejsefremgangsmåde og dermed fremstillede formdele
US20140263212A1 (en) 2013-03-15 2014-09-18 Electro Scientific Industries, Inc. Coordination of beam angle and workpiece movement for taper control

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