JP2006147817A5 - - Google Patents

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Publication number
JP2006147817A5
JP2006147817A5 JP2004335395A JP2004335395A JP2006147817A5 JP 2006147817 A5 JP2006147817 A5 JP 2006147817A5 JP 2004335395 A JP2004335395 A JP 2004335395A JP 2004335395 A JP2004335395 A JP 2004335395A JP 2006147817 A5 JP2006147817 A5 JP 2006147817A5
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JP
Japan
Prior art keywords
optical system
laser beam
cut
laser
condensing position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004335395A
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English (en)
Japanese (ja)
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JP2006147817A (ja
JP4776911B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2004335395A priority Critical patent/JP4776911B2/ja
Priority claimed from JP2004335395A external-priority patent/JP4776911B2/ja
Priority to US11/283,262 priority patent/US7807940B2/en
Publication of JP2006147817A publication Critical patent/JP2006147817A/ja
Publication of JP2006147817A5 publication Critical patent/JP2006147817A5/ja
Application granted granted Critical
Publication of JP4776911B2 publication Critical patent/JP4776911B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004335395A 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法 Expired - Fee Related JP4776911B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004335395A JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法
US11/283,262 US7807940B2 (en) 2004-11-19 2005-11-17 Laser processing apparatus and laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004335395A JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2006147817A JP2006147817A (ja) 2006-06-08
JP2006147817A5 true JP2006147817A5 (enExample) 2008-01-10
JP4776911B2 JP4776911B2 (ja) 2011-09-21

Family

ID=36460013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004335395A Expired - Fee Related JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法

Country Status (2)

Country Link
US (1) US7807940B2 (enExample)
JP (1) JP4776911B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
JP4710732B2 (ja) * 2006-06-21 2011-06-29 セイコーエプソン株式会社 基板及びその分断方法、電気光学装置及びその製造方法、ならびに電子機器
EP2199007A4 (en) * 2007-10-16 2011-02-09 Mitsuboshi Diamond Ind Co Ltd METHOD OF MACHINING A U-SHAPED GROOVE OF A FRAGILE MATERIAL SUBSTRATE, REMOVAL METHOD, DRILLING METHOD, AND CHAMFREINING METHOD USING THE SAME
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
JPWO2012063348A1 (ja) * 2010-11-11 2014-05-12 パイオニア株式会社 レーザ加工方法及び装置
CN102338989B (zh) * 2011-07-06 2013-02-27 中国科学院上海光学精密机械研究所 延长焦深的并行激光直写装置
CN102299201A (zh) * 2011-08-25 2011-12-28 上海市激光技术研究所 太阳电池前电极激光加工方法及装置
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
CN102814591B (zh) * 2012-05-23 2016-06-01 苏州德龙激光股份有限公司 激光加工方法和激光加工设备
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US9517929B2 (en) * 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
JP6433264B2 (ja) * 2014-11-27 2018-12-05 株式会社ディスコ 透過レーザービームの検出方法
KR101972466B1 (ko) 2015-01-13 2019-04-25 로핀-시나르 테크놀로지스 엘엘씨 취성 재료를 묘각하고 화학 식각하는 방법 및 시스템
JP6576211B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP7657047B2 (ja) 2020-12-18 2025-04-04 株式会社ディスコ レーザー加工装置
KR20230060340A (ko) * 2021-10-27 2023-05-04 삼성전자주식회사 기판 처리 방법
CN116441715A (zh) * 2023-04-25 2023-07-18 梁杰坤 一种全自动多功能MiniLED激光修复设备

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US3769963A (en) * 1972-03-31 1973-11-06 L Goldman Instrument for performing laser micro-surgery and diagnostic transillumination of living human tissue
JPS51113596A (en) * 1975-03-31 1976-10-06 Hitachi Ltd Lasar-processing apparatus
JPH01186293A (ja) * 1988-01-22 1989-07-25 Nec Corp レーザ溶接方法
JPH01313195A (ja) * 1988-06-10 1989-12-18 Toshiba Corp レーザマーキング装置
JP2771571B2 (ja) * 1989-01-31 1998-07-02 株式会社アマダ 折曲げ・溶接複合加工装置
US5656229A (en) * 1990-02-20 1997-08-12 Nikon Corporation Method for removing a thin film layer
JPH09168881A (ja) * 1995-12-19 1997-06-30 Nikon Corp レーザ加工装置
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3626442B2 (ja) * 2000-09-13 2005-03-09 浜松ホトニクス株式会社 レーザ加工方法
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP3903761B2 (ja) * 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
JP2004188422A (ja) 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置

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