JP4776911B2 - レーザ加工装置およびレーザ加工方法 - Google Patents

レーザ加工装置およびレーザ加工方法 Download PDF

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Publication number
JP4776911B2
JP4776911B2 JP2004335395A JP2004335395A JP4776911B2 JP 4776911 B2 JP4776911 B2 JP 4776911B2 JP 2004335395 A JP2004335395 A JP 2004335395A JP 2004335395 A JP2004335395 A JP 2004335395A JP 4776911 B2 JP4776911 B2 JP 4776911B2
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JP
Japan
Prior art keywords
processing
laser beam
optical system
laser
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004335395A
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English (en)
Japanese (ja)
Other versions
JP2006147817A5 (enExample
JP2006147817A (ja
Inventor
正行 西脇
潤一郎 井利
源次 稲田
定之 須釜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004335395A priority Critical patent/JP4776911B2/ja
Priority to US11/283,262 priority patent/US7807940B2/en
Publication of JP2006147817A publication Critical patent/JP2006147817A/ja
Publication of JP2006147817A5 publication Critical patent/JP2006147817A5/ja
Application granted granted Critical
Publication of JP4776911B2 publication Critical patent/JP4776911B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2004335395A 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法 Expired - Fee Related JP4776911B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004335395A JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法
US11/283,262 US7807940B2 (en) 2004-11-19 2005-11-17 Laser processing apparatus and laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004335395A JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2006147817A JP2006147817A (ja) 2006-06-08
JP2006147817A5 JP2006147817A5 (enExample) 2008-01-10
JP4776911B2 true JP4776911B2 (ja) 2011-09-21

Family

ID=36460013

Family Applications (1)

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JP2004335395A Expired - Fee Related JP4776911B2 (ja) 2004-11-19 2004-11-19 レーザ加工装置およびレーザ加工方法

Country Status (2)

Country Link
US (1) US7807940B2 (enExample)
JP (1) JP4776911B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103506A (ja) * 2014-11-27 2016-06-02 株式会社ディスコ 透過レーザービームの検出方法

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JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
JP4710732B2 (ja) * 2006-06-21 2011-06-29 セイコーエプソン株式会社 基板及びその分断方法、電気光学装置及びその製造方法、ならびに電子機器
KR101235617B1 (ko) * 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
WO2012063348A1 (ja) * 2010-11-11 2012-05-18 パイオニア株式会社 レーザ加工方法及び装置
CN102338989B (zh) * 2011-07-06 2013-02-27 中国科学院上海光学精密机械研究所 延长焦深的并行激光直写装置
CN102299201A (zh) * 2011-08-25 2011-12-28 上海市激光技术研究所 太阳电池前电极激光加工方法及装置
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
CN102814591B (zh) * 2012-05-23 2016-06-01 苏州德龙激光股份有限公司 激光加工方法和激光加工设备
US9517929B2 (en) * 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
CN106132627B (zh) 2015-01-13 2018-09-07 罗芬-新纳技术有限责任公司 用于对脆性材料进行划割并随后进行化学蚀刻的方法和系统
JP6576211B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP7657047B2 (ja) 2020-12-18 2025-04-04 株式会社ディスコ レーザー加工装置
KR20230060340A (ko) * 2021-10-27 2023-05-04 삼성전자주식회사 기판 처리 방법
CN116441715A (zh) * 2023-04-25 2023-07-18 梁杰坤 一种全自动多功能MiniLED激光修复设备

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US3769963A (en) * 1972-03-31 1973-11-06 L Goldman Instrument for performing laser micro-surgery and diagnostic transillumination of living human tissue
JPS51113596A (en) * 1975-03-31 1976-10-06 Hitachi Ltd Lasar-processing apparatus
JPH01186293A (ja) * 1988-01-22 1989-07-25 Nec Corp レーザ溶接方法
JPH01313195A (ja) * 1988-06-10 1989-12-18 Toshiba Corp レーザマーキング装置
JP2771571B2 (ja) * 1989-01-31 1998-07-02 株式会社アマダ 折曲げ・溶接複合加工装置
US5656229A (en) * 1990-02-20 1997-08-12 Nikon Corporation Method for removing a thin film layer
JPH09168881A (ja) * 1995-12-19 1997-06-30 Nikon Corp レーザ加工装置
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3626442B2 (ja) * 2000-09-13 2005-03-09 浜松ホトニクス株式会社 レーザ加工方法
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP3903761B2 (ja) * 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
JP2004188422A (ja) 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103506A (ja) * 2014-11-27 2016-06-02 株式会社ディスコ 透過レーザービームの検出方法
CN105643118A (zh) * 2014-11-27 2016-06-08 株式会社迪思科 透射激光束的检测方法
TWI655048B (zh) * 2014-11-27 2019-04-01 日商迪思科股份有限公司 穿透雷射光束的檢測方法
CN105643118B (zh) * 2014-11-27 2019-04-26 株式会社迪思科 透射激光束的检测方法

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US20060108339A1 (en) 2006-05-25
US7807940B2 (en) 2010-10-05
JP2006147817A (ja) 2006-06-08

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