JP2005138143A - レーザ光線を利用する加工装置 - Google Patents
レーザ光線を利用する加工装置 Download PDFInfo
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- JP2005138143A JP2005138143A JP2003377190A JP2003377190A JP2005138143A JP 2005138143 A JP2005138143 A JP 2005138143A JP 2003377190 A JP2003377190 A JP 2003377190A JP 2003377190 A JP2003377190 A JP 2003377190A JP 2005138143 A JP2005138143 A JP 2005138143A
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- laser beam
- pulse laser
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- 238000003754 machining Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 claims abstract description 57
- 230000010355 oscillation Effects 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 3
- 230000004048 modification Effects 0.000 abstract 3
- 238000012986 modification Methods 0.000 abstract 3
- 230000006735 deficit Effects 0.000 abstract 1
- 230000004075 alteration Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0892—Controlling the laser beam travel length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
Abstract
【解決手段】パルスレーザ光線14の光軸方向、すなわち被加工物2の厚さ方向に変位せしめられた少なくとも2個の集光点34a、34bに若干の時間差(dt、dt1、dt2)を与えてパルスレーザ光線を集光せしめることによって、一方の集光点における変質が他方の集光点におけるパルスレーザ光線の照射を阻害するのを回避する。
【選択図】図1
Description
該伝送・集光手段は、パルスレーザ光線を光軸方向に変位せしめられた少なくとも2個の集光点に、時間差を生成せしめて集光せしめる、ことを特徴とするレーザ光線を利用する加工装置が提供される。
4、104:保持手段
6、106:レーザ照射手段
10、110:パルスレーザ光線発振手段
12,112:伝送・集光手段
14、14a、14b、14c:パルスレーザ光線
16、106、107:ハーフミラー(スプリター)
18、20、118、119、120、121:ミラー
22、122、123:ハーフミラー
24、124、125:径変更手段
26、126、127:光路長増大手段
32、132:集光レンズ
34a、34b、134a、134b、134c:集光点
Claims (7)
- 被加工物を保持するための保持手段と、該保持手段に保持された被加工物に該被加工物を透過し得るパルスレーザ光線を照射して被加工物を変質せしめるためのレーザ光線照射手段とを具備し、該レーザ光線照射手段はパルスレーザ光線発振手段と該パルスレーザ光線発振手段が発振するパルスレーザ光線を伝送し集光せしめる伝送・集光手段とを含んでいる、レーザ光線を利用する加工装置において、
該伝送・集光手段は、パルスレーザ光線を光軸方向に変位せしめられた少なくとも2個の集光点に、時間差を生成せしめて集光せしめる、ことを特徴とするレーザ光線を利用する加工装置。 - 該伝送・集光手段は該パスルレーザ光線発振手段からの距離が近い集光点よりも該パスルレーザ光線発振手段からの距離が遠い集光点に先にレーザ光線を集光せしめる、請求項1記載のレーザ光線を利用する加工装置。
- 光軸方向に隣接する集光点での集光時間差はパルスレーザ光線の1パルス持続時間以上であり、引き続くパルスレーザ光線の間隔時間以下である、請求項2記載のレーザ光線を利用する加工装置。
- 該伝送・集光手段は、該パルスレーザ光線発振手段からのパルスレーザ光線を第一のパルスレーザ光線と第二のパルスレーザ光線とに分割するスプリッタと、該第二のパルスレーザ光線の光軸を該第一のパルスレーザ光線の光軸と合致せしめるための複数個のミラーと、該第一のパルスレーザ光線と該第二のパルスレーザ光線との一方の径を変更せしめる径変更手段と、共通集光レンズとを含んでいる、請求項1から3までのいずれかに記載のレーザ光線を利用する加工装置。
- 該伝送・集光手段は、該第一のパルスレーザ光線と該第二のパルスレーザ光線との一方の光路長を増大せしめる光路長増大手段を含む、請求項4記載のレーザ光線を利用する加工装置。
- 該光路長増大手段は光ファイバを含む、請求項5記載のレーザ光線を利用する加工装置。
- 該光路長増大手段は複数個のミラーを含んでいる、請求項5記載のレーザ構成を利用する加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377190A JP2005138143A (ja) | 2003-11-06 | 2003-11-06 | レーザ光線を利用する加工装置 |
DE102004053329.6A DE102004053329B4 (de) | 2003-11-06 | 2004-11-04 | Bearbeitungsvorrichtung unter Verwendung eines Laserstrahls |
SG200406480A SG112035A1 (en) | 2003-11-06 | 2004-11-04 | Processing apparatus using laser beam |
US10/981,524 US7405376B2 (en) | 2003-11-06 | 2004-11-05 | Processing apparatus using laser beam |
CNB2004101038765A CN100388428C (zh) | 2003-11-06 | 2004-11-05 | 利用激光束的处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377190A JP2005138143A (ja) | 2003-11-06 | 2003-11-06 | レーザ光線を利用する加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005138143A true JP2005138143A (ja) | 2005-06-02 |
JP2005138143A5 JP2005138143A5 (ja) | 2006-09-14 |
Family
ID=34544390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003377190A Pending JP2005138143A (ja) | 2003-11-06 | 2003-11-06 | レーザ光線を利用する加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7405376B2 (ja) |
JP (1) | JP2005138143A (ja) |
CN (1) | CN100388428C (ja) |
DE (1) | DE102004053329B4 (ja) |
SG (1) | SG112035A1 (ja) |
Cited By (10)
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JP2006167804A (ja) * | 2004-11-19 | 2006-06-29 | Canon Inc | レーザ割断方法およびレーザ割断装置 |
JP2007130675A (ja) * | 2005-11-11 | 2007-05-31 | Seiko Epson Corp | レーザスクライブ加工方法 |
US8093530B2 (en) | 2004-11-19 | 2012-01-10 | Canon Kabushiki Kaisha | Laser cutting apparatus and laser cutting method |
JP2013035048A (ja) * | 2011-08-10 | 2013-02-21 | Disco Corp | レーザー加工装置 |
JP2013046924A (ja) * | 2011-07-27 | 2013-03-07 | Toshiba Mach Co Ltd | レーザダイシング方法 |
JP2013193081A (ja) * | 2012-03-15 | 2013-09-30 | Mitsuboshi Diamond Industrial Co Ltd | レーザー加工装置 |
JP2013252526A (ja) * | 2012-06-05 | 2013-12-19 | Disco Corp | レーザー加工装置 |
JP2015057296A (ja) * | 2014-11-19 | 2015-03-26 | 三星ダイヤモンド工業株式会社 | レーザー加工装置 |
JP2016002569A (ja) * | 2014-06-18 | 2016-01-12 | 株式会社ディスコ | レーザー加工装置 |
JP2018523291A (ja) * | 2015-06-01 | 2018-08-16 | エバナ テクノロジーズ ユーエービー | 半導体加工対象物のスクライブ方法 |
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JP2006167804A (ja) * | 2004-11-19 | 2006-06-29 | Canon Inc | レーザ割断方法およびレーザ割断装置 |
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JP2007130675A (ja) * | 2005-11-11 | 2007-05-31 | Seiko Epson Corp | レーザスクライブ加工方法 |
JP2013046924A (ja) * | 2011-07-27 | 2013-03-07 | Toshiba Mach Co Ltd | レーザダイシング方法 |
JP2013035048A (ja) * | 2011-08-10 | 2013-02-21 | Disco Corp | レーザー加工装置 |
JP2013193081A (ja) * | 2012-03-15 | 2013-09-30 | Mitsuboshi Diamond Industrial Co Ltd | レーザー加工装置 |
JP2013252526A (ja) * | 2012-06-05 | 2013-12-19 | Disco Corp | レーザー加工装置 |
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JP2016002569A (ja) * | 2014-06-18 | 2016-01-12 | 株式会社ディスコ | レーザー加工装置 |
JP2015057296A (ja) * | 2014-11-19 | 2015-03-26 | 三星ダイヤモンド工業株式会社 | レーザー加工装置 |
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Also Published As
Publication number | Publication date |
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DE102004053329A1 (de) | 2005-07-28 |
US7405376B2 (en) | 2008-07-29 |
DE102004053329B4 (de) | 2014-02-13 |
CN100388428C (zh) | 2008-05-14 |
CN1619778A (zh) | 2005-05-25 |
US20050098548A1 (en) | 2005-05-12 |
SG112035A1 (en) | 2005-06-29 |
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