JP6422033B2 - レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 - Google Patents
レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24471—Crackled, crazed or slit
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
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Description
a)低バンドギャップの半導体およびアイソレータでは、例えば(材料内の不純物の跡に起因する、またはレーザ機械加工前の温度で既に熱的に励起された電荷担体に起因する)低い残存吸収に基づき、最初のわずかなレーザパルス持続時間内での急速な加熱がさらなる電荷担体の熱励起につながり、これがさらに吸収の増加につながって、結果として焦線でのレーザ吸収の累積増加につながる。
1a、1b 表面
2a レーザビーム
2b レーザビーム焦線
2c 延在部分
3 レーザ
6 光学配置
7、11 集束光学素子
8 隔壁
9、10 アキシコン
12 平凸コリメートレンズ
Claims (20)
- パルスレーザビームを、ビーム伝搬方向に沿って見て0.1mmから100mmの間の範囲内の長さを有するレーザビーム焦線へと集束させるステップ、および、
前記レーザビーム焦線を、材料内へ、該材料の表面に対してある入射角度で向けるステップであって、当該レーザビーム焦線は前記材料内に誘起吸収を生じさせ、当該誘起吸収は前記レーザビーム焦線に沿って前記材料内に材料改質を作り出す、ステップ、
を有し、
前記パルスレーザビームはバーストパルスレーザビームであり、各バーストパルスは複数のパルスを含むものである、方法。 - 前記材料および前記レーザビームを互いに対して並進させ、それにより、前記材料を少なくとも2つの片に分離させるように間隔を空けた複数の材料改質を、前記材料内に生じさせるステップをさらに含むことを特徴とする請求項1記載の方法。
- 前記材料で測定された前記レーザビームの平均レーザエネルギーは400μJ未満であることを特徴とする請求項1または2記載の方法。
- 前記複数のパルスの各々が10ピコ秒超から100ピコ秒未満の間の範囲にあるパルス持続時間を有することを特徴とする請求項1から3のいずれか一項に記載の方法。
- 前記レーザビームのパルス繰返し周波数が10kHzから1000kHzの間の範囲内であることを特徴とする請求項1から4のいずれか一項に記載の方法。
- 前記レーザビーム焦線の前記入射角度は、前記材料の前記表面に対して45°以下であることを特徴とする請求項1から5のいずれか一項に記載の方法。
- 前記レーザビーム焦線の前記入射角度は、前記材料の前記表面に対して垂直であり、前記レーザビーム焦線は前記材料内に完全に含有され、当該材料のいずれの表面へも延在しないことを特徴とする請求項1から5のいずれか一項に記載の方法。
- 前記パルスレーザビームは、前記材料が実質的に透明であるように選択された波長を有することを特徴とする請求項1から7のいずれか一項に記載の方法。
- 前記レーザビーム焦線は、0.5μmから5μmの間の範囲内の平均スポット径を有することを特徴とする請求項1から8のいずれか一項に記載の方法。
- 前記集束させるステップは、少なくとも1つのアキシコンを含む光学配置によって行われることを特徴とする請求項1から9のいずれか一項に記載の方法。
- 前記光学配置は、1つのアキシコンと1つの集束レンズを含むことを特徴とする請求項10に記載の方法。
- 前記集束させるステップは、環状放射によって照射される少なくとも1つのレンズ部品によって行われることを特徴とする請求項1から9のいずれか一項に記載の方法。
- 系において、
パルスレーザと、
前記レーザのビーム路内に位置付けされた光学アセンブリと、
を備え、
該光学アセンブリが、レーザビームを該光学アセンブリのビーム発生側で、ビーム伝搬方向に沿って見て0.1mmと100mmの間の範囲内の長さを有するレーザビーム焦線へと変形するように構成されており、該光学アセンブリが、前記レーザビーム焦線を発生させるように構成された球面収差を有する集束光学素子を含み、前記レーザビーム焦線が前記材料内に誘起吸収を生じさせるように適合されており、前記誘起吸収が前記レーザビーム焦線に沿って前記材料内に材料改質を作り出すものであり、
前記レーザは、前記レーザビームとしてバーストパルスレーザビームを生成するよう適合されたバーストパルスレーザであり、各バーストパルスは複数のパルスを含むことを特徴とする、系。 - 前記レーザがCO2レーザであることを特徴とする、請求項13に記載の系。
- 前記パルスのパルス持続時間は10ピコ秒超から100ピコ秒未満の間の範囲にあり、前記レーザビームのパルス繰返し周波数は10kHzから1000kHzの間の範囲内であることを特徴とする、請求項13または14に記載の系。
- 前記光学アセンブリが、前記レーザの前記ビーム路内で前記集束光学素子の前に位置付けられた環状開口を含み、前記環状開口は、前記レーザビームの中心の外側の周辺光線のみが前記集束光学素子に入射するよう、前記レーザビームの前記中心の1以上の光線を遮断し、それによって、ビーム方向に沿って見て単一の前記レーザビーム焦線のみが前記パルスレーザビームの各パルスに対して生成されるよう、構成されていることを特徴とする、請求項13から15のいずれか一項に記載の系。
- 前記集束光学要素は、1つの球面カット凸レンズであることを特徴とする請求項13から16のいずれか一項に記載の系。
- 前記光学アセンブリが、1つのアキシコンと1つの集束レンズを含むことを特徴とする請求項13から17のいずれか一項に記載の系。
- 前記光学アセンブリが、環状のレーザビームによって照射される少なくとも1つの光学部品を含むことを特徴とする請求項13から17のいずれか一項に記載の系。
- ガラス材料を切断することにより、所望の形状のガラス物品を製造する方法であって、
パルスレーザビームを、ビーム伝搬方向に沿って見て0.1mmから100mmの間の範囲内の長さを有するレーザビーム焦線へと集束させるステップであって、前記パルスレーザビームはバーストパルスレーザビームであり、各バーストパルスは複数のパルスを含むものであるステップ、
前記レーザビーム焦線を、前記ガラス材料内へ、該ガラス材料の表面に対してある入射角度で向けるステップであって、当該レーザビーム焦線は前記ガラス材料内に誘起吸収を生じさせ、当該誘起吸収は前記レーザビーム焦線に沿って前記ガラス材料内に材料改質を作り出す、ステップ、
前記ガラス材料および前記パルスレーザビームを互いに対して並進させ、それにより、前記ガラス材料を少なくとも2つの片に分離させるように間隔を空けた複数の材料改質を、前記ガラス材料内に生じさせるステップ、および
前記複数の材料改質に沿って亀裂を生じさせて、所望の分離面を生成するステップ、
を含むことを特徴とする方法。
Applications Claiming Priority (5)
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US201361752489P | 2013-01-15 | 2013-01-15 | |
EP13151296.4 | 2013-01-15 | ||
US61/752,489 | 2013-01-15 | ||
EP13151296.4A EP2754524B1 (de) | 2013-01-15 | 2013-01-15 | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
PCT/IB2014/000035 WO2014111794A1 (en) | 2013-01-15 | 2014-01-14 | Method of and device for the laser-based machining of sheet-like substrates using a laser beam focal line |
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JP2015553188A Active JP6422033B2 (ja) | 2013-01-15 | 2014-01-14 | レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 |
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EP (3) | EP2754524B1 (ja) |
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KR (2) | KR102230762B1 (ja) |
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EP2593266A4 (en) | 2010-07-12 | 2017-04-26 | Rofin-Sinar Technologies, Inc. | Method of material processing by laser filamentation |
CN106425129B (zh) | 2010-11-30 | 2018-07-17 | 康宁股份有限公司 | 在玻璃中形成高密度孔阵列的方法 |
TWI547454B (zh) * | 2011-05-31 | 2016-09-01 | 康寧公司 | 於玻璃中高速製造微孔洞的方法 |
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WO2014111385A1 (de) | 2014-07-24 |
US10421683B2 (en) | 2019-09-24 |
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KR20160010397A (ko) | 2016-01-27 |
US20150360991A1 (en) | 2015-12-17 |
LT2945769T (lt) | 2017-09-25 |
US20190352215A1 (en) | 2019-11-21 |
KR20160010396A (ko) | 2016-01-27 |
CN106170365A (zh) | 2016-11-30 |
EP2945770A1 (en) | 2015-11-25 |
EP2754524B1 (de) | 2015-11-25 |
LT2945770T (lt) | 2019-04-25 |
TW201436914A (zh) | 2014-10-01 |
EP2945769A1 (de) | 2015-11-25 |
EP2754524A1 (de) | 2014-07-16 |
TW201446379A (zh) | 2014-12-16 |
CA2898371A1 (en) | 2014-07-24 |
CA2898256A1 (en) | 2014-07-24 |
TWI639479B (zh) | 2018-11-01 |
TWI630969B (zh) | 2018-08-01 |
US11345625B2 (en) | 2022-05-31 |
CN105209218B (zh) | 2018-07-06 |
JP2016513024A (ja) | 2016-05-12 |
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