JP5747355B2 - 外部共振器レーザ - Google Patents
外部共振器レーザ Download PDFInfo
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
- H01S5/143—Littman-Metcalf configuration, e.g. laser - grating - mirror
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/02—ASE (amplified spontaneous emission), noise; Reduction thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0813—Configuration of resonator
- H01S3/0815—Configuration of resonator having 3 reflectors, e.g. V-shaped resonators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
- H01S3/1055—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length one of the reflectors being constituted by a diffraction grating
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0286—Coatings with a reflectivity that is not constant over the facets, e.g. apertures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
- H01S5/1085—Oblique facets
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
図1は、本実施形態に係る外部共振器レーザ1の光学系の概略を示す図である。本実施形態にかかる外部共振器レーザ1は、光を放出するレーザチップ2と、レーザチップ2から放出された光を回折させる回折格子3と、回折格子3からの光を一部反射し、一部を透過するハーフミラー4と、を有する。なお本実施形態において、レーザチップ2と回折格子3との間には、レーザチップ2から放出された光を平行光にするコリメートレンズ9が配置されている。また本実施形態に係る外部共振器レーザ1は、レーザチップ2、回折格子3及びハーフミラー4から構成される外部共振器がLittman型の共振器配置となっている。
図10は、本実施例において作製した外部共振器レーザの写真図である。本実施例においては、レーザチップ2として、銅のマウントにハンダ層を介してサブマウントを固定し、その上に更にハンダを介して固定されたレーザダイオードを用いた。なおレーザダイオードとしては通常時の利得ピーク波長1060nmの曲がり導波路構造(5°の傾き)のダイオード(オプトエナジー社:SLD−A4010613092)を用いた。またこのスーパールミネッセントダイオードは上記実施形態において示した曲がり導波路構造をなしており、端面に対し傾斜させることで、寄生発振やモードホップの原因となる端面での残留反射を極限まで低減することができる。なお、このダイオードは、限定されるわけではないが“T. Fujimoto,Y. Yamada,Y. Yamada, A. Okubo,Y. Oeda and K. Muro,“High Power InGaAs/AlGaAs Laser Diodes with Decoupled Confinement Heterostructure”,SPIE 3625,p.38〜45(1999)”に記載の方法を用いて作製が可能である。また、本実施例のコリメートレンズ9としては、Geltech(登録商標)成型ガラス非球面レンズで焦点距離8mm、開口数0.50、650〜1050nmで無反射コートされたものを用いた。回折格子3としては1200L/mmのもの(NewPort社製、型番10RG 1200−1000−2)を用い、ハーフミラー4としては反射率50%のもの(CVI社製、型番PR1−1020−50−1025)を用いた。また、レーザチップ2、コリメートレンズ9、及び回折格子3は回転支持体7に固定し、ハーフミラー4は微調整を可能にする形態で、固定支持体5に固定した。また回転支持体7は軸を介して固定支持体5に固定した。なお本実施例において、軸はLittman型の外部共振器配置におけるPivotPoint(回転中心)となるように設計した。また本実施例ではマウントの前端面に、0.6mmのピンホールが形成されたセラミックス(直径1cmの略円形状、厚さ0.5mm)からなる光乱散乱体を配置し、接着部材により貼り付けた。尚、本実施例において、レーザダイオードからのコリメートビームの回折格子への入射角は75度とし、レーザダイオードの配置は回折格子において高い波長分解能が得られる様に、偏平なビームの長手方向が回折方向に一致するようにした。また、この場合レーザ発振の偏光方向が回折効率の低い偏光となったので、1/2波長板10をコリメートレンズ9と回折格子の間に挿入し、回折格子における回折効率が最大になるように配置した。
本実施例では、ほぼ上記実施例1と同じであるが、レーザダイオードの配置が実施例1と異なる。以下詳細に説明する。
本実施例は、ほぼ実施例2と同様であるが、ハーフミラー4に近接してスリット11を設けた点が実施例2と異なる。図19に、配置したスリット11の概略図を示しておく。なお図19(a)は外部共振器レーザの側面概略図を、図19(b)は、ハーフミラー4を正面から見た場合の概略図である。
Claims (7)
- 入射される光を一部反射し、一部を透過するハーフミラーが固定された固定支持体と、
前記固定支持体に軸を介して回転可能に支持され、かつ、光を放出するレーザチップ、前記レーザチップから放出される光をコリメートするコリメートレンズ、及び、前記レンズでコリメートされた光を回折させる回折格子が固定されてなる回転支持体と、を有し、
前記レーザチップ、前記回折格子及び前記ハーフミラーはLittman型の共振器配置となっている外部共振器レーザ。 - 入射される光を一部反射し、一部を透過するハーフミラーが固定された固定支持体と、
前記固定支持体に軸を介して回転可能に支持され、かつ、光を放出するレーザチップ、前記レーザチップから放出される光をコリメートするコリメートレンズ、及び、前記レンズでコリメートされた光を回折させる回折格子が固定されてなる回転支持体と、を有し、
前記コリメートレンズによってコリメートされた楕円形のレーザビームを、回折格子での回折を介して、円形ビームに近い形になるように変換して、ハーフミラーから出力ビームとして取り出す外部共振器レーザ。 - 回転支持体に固定されるペルチェ素子と、該ペルチェ素子に接続されるヒートパイプ付冷却フィンと、を備えた冷却部材と、を有する請求項1又は2記載の外部共振器レーザ。
- 前記レーザチップは、曲がり導波路構造又は斜め導波路構造を用いる請求項1又は2記載外部共振器レーザ。
- 前記レーザチップの前面に光散乱体ビームフィルタを配置してなる請求項1又は2記載の外部共振器レーザ。
- 前記コリメートレンズと前記回折格子の間に1/2波長板を配置してなる請求項1又は2記載の外部共振器レーザ。
- 前記ハーフミラーに近接してスリットを配置してなる請求項1又は2記載の外部共振器レーザ。
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JP2011547736A JP5747355B2 (ja) | 2009-12-30 | 2010-12-30 | 外部共振器レーザ |
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JP2009299284 | 2009-12-30 | ||
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PCT/JP2010/073841 WO2011081212A1 (ja) | 2009-12-30 | 2010-12-30 | 外部共振器レーザ |
JP2011547736A JP5747355B2 (ja) | 2009-12-30 | 2010-12-30 | 外部共振器レーザ |
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JP5747355B2 true JP5747355B2 (ja) | 2015-07-15 |
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EP (1) | EP2521226B1 (ja) |
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JP2013145819A (ja) * | 2012-01-16 | 2013-07-25 | Shimadzu Corp | 半導体レーザ装置 |
JP2013149850A (ja) * | 2012-01-20 | 2013-08-01 | Nippon Telegr & Teleph Corp <Ntt> | 波長可変光源 |
WO2014046161A1 (ja) | 2012-09-21 | 2014-03-27 | 国立大学法人 千葉大学 | 外部共振器レーザ |
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WO2018081031A1 (en) | 2016-10-24 | 2018-05-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
JP6702350B2 (ja) * | 2018-04-04 | 2020-06-03 | ソニー株式会社 | 半導体レーザ装置組立体 |
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JP7323774B2 (ja) * | 2019-06-10 | 2023-08-09 | 日亜化学工業株式会社 | 光源装置および外部共振器型レーザモジュール |
US11892652B1 (en) | 2020-04-07 | 2024-02-06 | Mark Belloni | Lenses for 2D planar and curved 3D laser sheets |
CN116316060A (zh) * | 2023-03-09 | 2023-06-23 | 南京理工大学 | 基于长轴偏振弯曲增益波导的外腔调谐激光器及耦合方法 |
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