JP4222296B2 - レーザ加工方法とレーザ加工装置 - Google Patents
レーザ加工方法とレーザ加工装置 Download PDFInfo
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- JP4222296B2 JP4222296B2 JP2004336944A JP2004336944A JP4222296B2 JP 4222296 B2 JP4222296 B2 JP 4222296B2 JP 2004336944 A JP2004336944 A JP 2004336944A JP 2004336944 A JP2004336944 A JP 2004336944A JP 4222296 B2 JP4222296 B2 JP 4222296B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
- B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
Description
={λ/(n−1)}1/2{m1/2+(m−1)1/2}/{2R}1/2
={2λR/(n−1)}1/2[{m1/2+(m−1)1/2}/2]/R(8)
ΔxΔp≧h (22)
(2πε2)−1/2exp(−ω2/2ε2) (23)
と表現される。
(2πη2)−1/2exp(−t2/2η2) (24)
=(2π)−1/2exp(−t2ε2/2) (25)
Δω=2(ln2)1/2ε (28)
(35)
=(4ln2)λf2/π(Δi)2 (42)
しかしΔFがδzより大きいと焦点深度を2倍以上に延ばせるということである。つまりΔFがδzよりずっと大きいと焦点深度を実効的に何倍にも増大させることができる。ΔF/δzの比をqとすると焦点深度は実効的にq+1倍に延ばせる。ここでは反対に、ZパラメータZpを
0<Zp≦1 (46)
が好適な範囲である。
Δτ/Δt=Δi2/8fc/Δt=1/4Zp=0.25/Zp (51)
というふうに屈折率を半径方向に変化させれば厚み変化屈折型レンズと等価な屈折変化レンズが設計できる。上の式を回折型にかえるために、輪帯に分割してゆかなければならない。分割の刻みが(n−1)dにたいしてはλであるから、
とすれば良いのである。d(r)、nは基準となるべき屈折型レンズの厚み、屈折率である。d(r)は半径rの関数であるが、nは定数である。dfは求める対象となる屈折率変化型レンズの厚み(一定)である。n0は求める対象となる屈折率変化型レンズの基底屈折率である。
(61)
本発明は、パルス幅の短いレ−ザビームを用い回折型レンズを使い焦点距離の変動幅を増加させることによって焦点深度を増大させるものである。本発明は回折型レンズのすべてに適用することができる。屈折を一部に利用するフレネル型レンズや、その曲面を離散値にステップ化した回折レンズにも適用できる。さらに屈折率変調型のレンズにも本発明は有用である。いずれにおいても本発明は極短幅のパルスをもちいて回折型レンズの焦点距離の変動を有効利用することによって焦点深度を深めている。高次のフレネル型レンズのばあいは、回折効率が少し低下するが焦点深度が長くなるので有用度が増す。さらに種類の異なる回折型レンズを組み合わせても本発明を実施できる。フレネル型レンズ+屈折率変調型レンズの組み合わせ(同じ場所に二つのレンズを重ね合わせること)によって同様に焦点深度を深めることができる。同じ種類の回折型レンズをふたつ組み合わせることもできる。ある半径を境にして内側は1次のフレネル型レンズ、外側を2次のフレネル型レンズ、或いはその反対に、というように内外に異なる次数のフレネル型レンズを組み合わせ1枚の回折型レンズとすることも可能である。そのような内外に次数のことなるレンズの組み合わせは離散段階回折レンズ、屈折率変調レンズでも可能である。そのようにどのような回折型レンズを使っても本発明を実施することができる。有用な発明である。
レーザ パルス幅 Δt=120fs(1.2×10−13s)
入射ビーム径 Δi=4.7mm
レンズ 回折レンズと屈折レンズ
焦点距離 f=100mm
Zパラメータ 2f0cΔt/Δi2=0.32
Claims (16)
- 極短パルスレーザの波長λ、パルス幅Δt(半値全幅)、ビーム直径Δi(半値全幅)のパルスレーザ光を、波長λに対する焦点距離fを有しZパラメータZp=2fcΔt/Δi2(cは光速)が1以下となるような回折型レンズで集光し、焦点距離の位置に置いた被加工物に対して照射し、パルスレーザ光によって被加工物を穴開け、切断、溶接するようにしたことを特徴とするレーザ加工方法。
- パルス幅Δt(半値全幅)が20ps以下であることを特徴とする請求項1に記載のレーザ加工方法。
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数をg、基準厚みをh0とし、屈折率nfの回折型レンズの表面厚さhg(r)を関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数を2、基準厚みをh0とし、屈折率nfの回折型レンズの表面厚さを関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数g、基底屈折率n0で一様厚みdfの屈折率変調型の回折型レンズの半径rに依存する屈折率の変化ng(r)を次の関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数2、基底屈折率n0で一様厚みdfの屈折率変調型の回折型レンズの半径rに依存する屈折率変化n2(r)を次の関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数g、基底厚みをh0とし、屈折率nfの回折型レンズの半径rに依存する表面厚さh(r)を関数
h(r)=mod{(n−1)d(r),λ}/(nf−1)+h0
によって与える事を特徴とする請求項1に記載のレーザ加工方法。 - ZパラメータZpが0.25≦Zp≦1であることを特徴とする請求項1に記載のレーザ加工方法。
- 上記被加工物、上記レーザ光に対し、透明であることを特徴とする請求項1に記載のレーザ加工方法。
- 上記の透明な被加工物は、樹脂であることを特徴とする請求項9に記載のレーザ加工方法。
- 波長λ、パルス幅Δt(半値全幅)、ビーム直径Δi(半値全幅)で被加工物を穴開け、切断、溶接するパルスレ−ザ光を発生する極短パルスレーザと、波長λに対する焦点距離fを有しレ−ザ光を集光して焦点距離fの位置に置かれた被加工物に照射するための焦点距離fの回折型レンズとを含み、ZパラメータZp=2fcΔt/Δi2(cは光速)が1以下となるようにしたことを特徴とするレーザ加工装置。
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数をg、基準厚みをh0とし、屈折率nfの回折型レンズの表面厚さhg(r)を関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数を2、基準厚みをh0とし、屈折率nfの回折型レンズの表面厚さを関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数g、基底屈折率n0で一様厚みdfの屈折率変調型の回折型レンズの半径rに依存する屈折率の変化ng(r)を次の関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数2、基底屈折率n0で一様厚みdfの屈折率変調型の回折型レンズの半径rに依存する屈折率変化n2(r)を次の関数
- 屈折率n、焦点距離fをもつ屈折型レンズの表面の厚さdを半径rの関数として与える厚さ関数をd(r)とし、分割数g、基底厚みをh0とし、屈折率nfの回折型レンズの半径rに依存する表面厚さh(r)を関数
h(r)=mod{(n−1)d(r),λ}/(nf−1)+h0
によって与える事を特徴とする請求項11に記載のレーザ加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004336944A JP4222296B2 (ja) | 2004-11-22 | 2004-11-22 | レーザ加工方法とレーザ加工装置 |
US11/260,198 US7807942B2 (en) | 2004-11-22 | 2005-10-28 | Laser processing method and laser processing apparatus |
GB0523099A GB2420306B (en) | 2004-11-22 | 2005-11-11 | Laser processing method and laser processing apparatus |
DE102005055421A DE102005055421B4 (de) | 2004-11-22 | 2005-11-21 | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung |
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JP2004336944A JP4222296B2 (ja) | 2004-11-22 | 2004-11-22 | レーザ加工方法とレーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006142342A JP2006142342A (ja) | 2006-06-08 |
JP4222296B2 true JP4222296B2 (ja) | 2009-02-12 |
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US (1) | US7807942B2 (ja) |
JP (1) | JP4222296B2 (ja) |
DE (1) | DE102005055421B4 (ja) |
GB (1) | GB2420306B (ja) |
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