JP2010274328A5 - - Google Patents

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Publication number
JP2010274328A5
JP2010274328A5 JP2010094721A JP2010094721A JP2010274328A5 JP 2010274328 A5 JP2010274328 A5 JP 2010274328A5 JP 2010094721 A JP2010094721 A JP 2010094721A JP 2010094721 A JP2010094721 A JP 2010094721A JP 2010274328 A5 JP2010274328 A5 JP 2010274328A5
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JP
Japan
Prior art keywords
laser
laser beam
brittle material
pulses
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010094721A
Other languages
English (en)
Japanese (ja)
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JP2010274328A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010094721A priority Critical patent/JP2010274328A/ja
Priority claimed from JP2010094721A external-priority patent/JP2010274328A/ja
Priority to US12/768,317 priority patent/US20100276404A1/en
Priority to EP10161268.7A priority patent/EP2246146B1/en
Priority to KR1020100039844A priority patent/KR101184259B1/ko
Priority to CN201010170722.3A priority patent/CN101875156B/zh
Publication of JP2010274328A publication Critical patent/JP2010274328A/ja
Publication of JP2010274328A5 publication Critical patent/JP2010274328A5/ja
Pending legal-status Critical Current

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JP2010094721A 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置 Pending JP2010274328A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010094721A JP2010274328A (ja) 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置
US12/768,317 US20100276404A1 (en) 2009-04-30 2010-04-27 Laser machining method and laser machining apparatus
EP10161268.7A EP2246146B1 (en) 2009-04-30 2010-04-28 Laser machining method
KR1020100039844A KR101184259B1 (ko) 2009-04-30 2010-04-29 레이저 가공 방법 및 레이저 가공 장치
CN201010170722.3A CN101875156B (zh) 2009-04-30 2010-04-30 激光加工方法及激光加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009110316 2009-04-30
JP2010094721A JP2010274328A (ja) 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置

Publications (2)

Publication Number Publication Date
JP2010274328A JP2010274328A (ja) 2010-12-09
JP2010274328A5 true JP2010274328A5 (enExample) 2012-03-22

Family

ID=42540695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010094721A Pending JP2010274328A (ja) 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置

Country Status (5)

Country Link
US (1) US20100276404A1 (enExample)
EP (1) EP2246146B1 (enExample)
JP (1) JP2010274328A (enExample)
KR (1) KR101184259B1 (enExample)
CN (1) CN101875156B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5536713B2 (ja) * 2011-05-19 2014-07-02 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP5494592B2 (ja) * 2011-08-30 2014-05-14 三星ダイヤモンド工業株式会社 Ｌｅｄパターン付き基板の加工方法
JP6035127B2 (ja) * 2012-11-29 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工方法及びレーザ加工装置
DE102013212577A1 (de) 2013-06-28 2014-12-31 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
JP2015062927A (ja) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法および加工装置
CN104070513B (zh) * 2013-12-09 2016-04-27 北京航星机器制造有限公司 薄壁异型铸造舱体的精密划线方法
DE102014109791B4 (de) * 2014-07-11 2024-10-24 Schott Ag Verfahren zur Laserablation und Element aus sprödhartem Material
CN104377280B (zh) * 2014-11-14 2017-11-10 邬志芸 一种在衬底晶圆上制作沟槽结构的方法
KR102481419B1 (ko) 2016-03-30 2022-12-28 삼성디스플레이 주식회사 강화 유리 기판의 제조 방법, 표시 장치의 제조 방법 및 표시 장치
JP2022026724A (ja) * 2020-07-31 2022-02-10 三星ダイヤモンド工業株式会社 スクライブライン形成方法、脆性基板の分断方法、スクライブライン形成装置、及び、小基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
JP3867102B2 (ja) * 2000-09-13 2007-01-10 浜松ホトニクス株式会社 半導体材料基板の切断方法
JP4286488B2 (ja) 2001-02-21 2009-07-01 キヤノンマシナリー株式会社 基板切断方法
AU2003211581A1 (en) * 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US6960813B2 (en) * 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
JP4422473B2 (ja) * 2003-01-20 2010-02-24 パナソニック株式会社 Ｉｉｉ族窒化物基板の製造方法
TWI248244B (en) * 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
JP2005271563A (ja) 2004-03-26 2005-10-06 Daitron Technology Co Ltd 硬脆材料板体の分割加工方法及び装置
JP3908236B2 (ja) * 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
US7804043B2 (en) * 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
CN102006964B (zh) * 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
JP5693705B2 (ja) * 2010-03-30 2015-04-01 イムラ アメリカ インコーポレイテッド レーザベースの材料加工装置及び方法

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