CN101875156B - 激光加工方法及激光加工装置 - Google Patents

激光加工方法及激光加工装置 Download PDF

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Publication number
CN101875156B
CN101875156B CN201010170722.3A CN201010170722A CN101875156B CN 101875156 B CN101875156 B CN 101875156B CN 201010170722 A CN201010170722 A CN 201010170722A CN 101875156 B CN101875156 B CN 101875156B
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CN
China
Prior art keywords
laser
pulse
aforementioned
pulse laser
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201010170722.3A
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English (en)
Chinese (zh)
Other versions
CN101875156A (zh
Inventor
福原健司
清水政二
山本幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN101875156A publication Critical patent/CN101875156A/zh
Application granted granted Critical
Publication of CN101875156B publication Critical patent/CN101875156B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN201010170722.3A 2009-04-30 2010-04-30 激光加工方法及激光加工装置 Expired - Fee Related CN101875156B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009110316 2009-04-30
JP2009-110316 2009-04-30
JP2010094721A JP2010274328A (ja) 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置
JP2010-094721 2010-04-16

Publications (2)

Publication Number Publication Date
CN101875156A CN101875156A (zh) 2010-11-03
CN101875156B true CN101875156B (zh) 2015-07-08

Family

ID=42540695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010170722.3A Expired - Fee Related CN101875156B (zh) 2009-04-30 2010-04-30 激光加工方法及激光加工装置

Country Status (5)

Country Link
US (1) US20100276404A1 (enExample)
EP (1) EP2246146B1 (enExample)
JP (1) JP2010274328A (enExample)
KR (1) KR101184259B1 (enExample)
CN (1) CN101875156B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5536713B2 (ja) * 2011-05-19 2014-07-02 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP5494592B2 (ja) * 2011-08-30 2014-05-14 三星ダイヤモンド工業株式会社 Ｌｅｄパターン付き基板の加工方法
JP6035127B2 (ja) * 2012-11-29 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工方法及びレーザ加工装置
DE102013212577A1 (de) * 2013-06-28 2014-12-31 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
JP2015062927A (ja) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法および加工装置
CN104070513B (zh) * 2013-12-09 2016-04-27 北京航星机器制造有限公司 薄壁异型铸造舱体的精密划线方法
DE102014109791B4 (de) * 2014-07-11 2024-10-24 Schott Ag Verfahren zur Laserablation und Element aus sprödhartem Material
CN104377280B (zh) * 2014-11-14 2017-11-10 邬志芸 一种在衬底晶圆上制作沟槽结构的方法
KR102481419B1 (ko) 2016-03-30 2022-12-28 삼성디스플레이 주식회사 강화 유리 기판의 제조 방법, 표시 장치의 제조 방법 및 표시 장치
JP2022026724A (ja) * 2020-07-31 2022-02-10 三星ダイヤモンド工業株式会社 スクライブライン形成方法、脆性基板の分断方法、スクライブライン形成装置、及び、小基板
JP7865055B2 (ja) * 2022-03-25 2026-05-26 株式会社プロテリアル セラミックス回路基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87106576A (zh) * 1986-09-26 1988-05-18 株式会社半导体能源研究所 激光划线装置和方法
EP1498216A1 (en) * 2002-03-12 2005-01-19 Hamamatsu Photonics K.K. Method of cutting processed object

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JP3867102B2 (ja) * 2000-09-13 2007-01-10 浜松ホトニクス株式会社 半導体材料基板の切断方法
JP4286488B2 (ja) 2001-02-21 2009-07-01 キヤノンマシナリー株式会社 基板切断方法
US7067763B2 (en) * 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6960813B2 (en) * 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
JP4422473B2 (ja) * 2003-01-20 2010-02-24 パナソニック株式会社 Ｉｉｉ族窒化物基板の製造方法
TWI248244B (en) * 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
JP2005271563A (ja) 2004-03-26 2005-10-06 Daitron Technology Co Ltd 硬脆材料板体の分割加工方法及び装置
JP3908236B2 (ja) 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
US7804043B2 (en) * 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
CN102006964B (zh) * 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
KR20130059337A (ko) * 2010-03-30 2013-06-05 아이엠알에이 아메리카, 인코포레이티드. 레이저 기반 재료 가공 장치 및 방법들

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87106576A (zh) * 1986-09-26 1988-05-18 株式会社半导体能源研究所 激光划线装置和方法
EP1498216A1 (en) * 2002-03-12 2005-01-19 Hamamatsu Photonics K.K. Method of cutting processed object

Also Published As

Publication number Publication date
CN101875156A (zh) 2010-11-03
EP2246146A1 (en) 2010-11-03
JP2010274328A (ja) 2010-12-09
EP2246146B1 (en) 2016-11-09
KR101184259B1 (ko) 2012-09-21
KR20100119515A (ko) 2010-11-09
US20100276404A1 (en) 2010-11-04

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Granted publication date: 20150708