KR101184259B1 - 레이저 가공 방법 및 레이저 가공 장치 - Google Patents

레이저 가공 방법 및 레이저 가공 장치 Download PDF

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Publication number
KR101184259B1
KR101184259B1 KR1020100039844A KR20100039844A KR101184259B1 KR 101184259 B1 KR101184259 B1 KR 101184259B1 KR 1020100039844 A KR1020100039844 A KR 1020100039844A KR 20100039844 A KR20100039844 A KR 20100039844A KR 101184259 B1 KR101184259 B1 KR 101184259B1
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KR
South Korea
Prior art keywords
brittle material
laser
laser beam
laser light
pulsed laser
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Expired - Fee Related
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KR1020100039844A
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English (en)
Korean (ko)
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KR20100119515A (ko
Inventor
켄지 후쿠하라
세이지 시미즈
코우지 야마모토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20100119515A publication Critical patent/KR20100119515A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020100039844A 2009-04-30 2010-04-29 레이저 가공 방법 및 레이저 가공 장치 Expired - Fee Related KR101184259B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009110316 2009-04-30
JPJP-P-2009-110316 2009-04-30
JPJP-P-2010-094721 2010-04-16
JP2010094721A JP2010274328A (ja) 2009-04-30 2010-04-16 レーザ加工方法及びレーザ加工装置

Publications (2)

Publication Number Publication Date
KR20100119515A KR20100119515A (ko) 2010-11-09
KR101184259B1 true KR101184259B1 (ko) 2012-09-21

Family

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KR1020100039844A Expired - Fee Related KR101184259B1 (ko) 2009-04-30 2010-04-29 레이저 가공 방법 및 레이저 가공 장치

Country Status (5)

Country Link
US (1) US20100276404A1 (enExample)
EP (1) EP2246146B1 (enExample)
JP (1) JP2010274328A (enExample)
KR (1) KR101184259B1 (enExample)
CN (1) CN101875156B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10310648B2 (en) 2016-03-30 2019-06-04 Samsung Display Co., Ltd. Method for fabricating reinforced glass substrate, method for fabricating display device and the display device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5536713B2 (ja) * 2011-05-19 2014-07-02 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP5494592B2 (ja) * 2011-08-30 2014-05-14 三星ダイヤモンド工業株式会社 Ｌｅｄパターン付き基板の加工方法
JP6035127B2 (ja) * 2012-11-29 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工方法及びレーザ加工装置
DE102013212577A1 (de) 2013-06-28 2014-12-31 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
JP2015062927A (ja) * 2013-09-25 2015-04-09 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法および加工装置
CN104070513B (zh) * 2013-12-09 2016-04-27 北京航星机器制造有限公司 薄壁异型铸造舱体的精密划线方法
DE102014109791B4 (de) * 2014-07-11 2024-10-24 Schott Ag Verfahren zur Laserablation und Element aus sprödhartem Material
CN104377280B (zh) * 2014-11-14 2017-11-10 邬志芸 一种在衬底晶圆上制作沟槽结构的方法
JP2022026724A (ja) * 2020-07-31 2022-02-10 三星ダイヤモンド工業株式会社 スクライブライン形成方法、脆性基板の分断方法、スクライブライン形成装置、及び、小基板

Citations (2)

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JP2002324768A (ja) 2001-02-21 2002-11-08 Nec Machinery Corp 基板切断方法
JP2005314127A (ja) * 2004-04-27 2005-11-10 Japan Steel Works Ltd:The ガラスの切断方法及びその装置

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JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
JP3867102B2 (ja) * 2000-09-13 2007-01-10 浜松ホトニクス株式会社 半導体材料基板の切断方法
AU2003211581A1 (en) * 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US6960813B2 (en) * 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
JP4422473B2 (ja) * 2003-01-20 2010-02-24 パナソニック株式会社 Ｉｉｉ族窒化物基板の製造方法
TWI248244B (en) * 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
JP2005271563A (ja) 2004-03-26 2005-10-06 Daitron Technology Co Ltd 硬脆材料板体の分割加工方法及び装置
US7804043B2 (en) * 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
CN102006964B (zh) * 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
JP5693705B2 (ja) * 2010-03-30 2015-04-01 イムラ アメリカ インコーポレイテッド レーザベースの材料加工装置及び方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324768A (ja) 2001-02-21 2002-11-08 Nec Machinery Corp 基板切断方法
JP2005314127A (ja) * 2004-04-27 2005-11-10 Japan Steel Works Ltd:The ガラスの切断方法及びその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10310648B2 (en) 2016-03-30 2019-06-04 Samsung Display Co., Ltd. Method for fabricating reinforced glass substrate, method for fabricating display device and the display device

Also Published As

Publication number Publication date
KR20100119515A (ko) 2010-11-09
CN101875156B (zh) 2015-07-08
EP2246146B1 (en) 2016-11-09
JP2010274328A (ja) 2010-12-09
CN101875156A (zh) 2010-11-03
US20100276404A1 (en) 2010-11-04
EP2246146A1 (en) 2010-11-03

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