JP2009066851A5 - - Google Patents

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Publication number
JP2009066851A5
JP2009066851A5 JP2007236581A JP2007236581A JP2009066851A5 JP 2009066851 A5 JP2009066851 A5 JP 2009066851A5 JP 2007236581 A JP2007236581 A JP 2007236581A JP 2007236581 A JP2007236581 A JP 2007236581A JP 2009066851 A5 JP2009066851 A5 JP 2009066851A5
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JP
Japan
Prior art keywords
laser
shows
substrate
shape
chamfering
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JP2007236581A
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English (en)
Japanese (ja)
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JP5113462B2 (ja
JP2009066851A (ja
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Priority to JP2007236581A priority Critical patent/JP5113462B2/ja
Priority claimed from JP2007236581A external-priority patent/JP5113462B2/ja
Priority to TW097125516A priority patent/TWI426057B/zh
Priority to KR1020080070954A priority patent/KR101193872B1/ko
Priority to CN2008102135633A priority patent/CN101386466B/zh
Publication of JP2009066851A publication Critical patent/JP2009066851A/ja
Publication of JP2009066851A5 publication Critical patent/JP2009066851A5/ja
Application granted granted Critical
Publication of JP5113462B2 publication Critical patent/JP5113462B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007236581A 2007-09-12 2007-09-12 脆性材料基板の面取り方法 Expired - Fee Related JP5113462B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007236581A JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法
TW097125516A TWI426057B (zh) 2007-09-12 2008-07-07 The method of stripping angle of brittle material substrate
KR1020080070954A KR101193872B1 (ko) 2007-09-12 2008-07-22 취성재료기판의 챔퍼링 방법
CN2008102135633A CN101386466B (zh) 2007-09-12 2008-09-11 脆性材料基板的倒角方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007236581A JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法

Publications (3)

Publication Number Publication Date
JP2009066851A JP2009066851A (ja) 2009-04-02
JP2009066851A5 true JP2009066851A5 (enExample) 2010-10-14
JP5113462B2 JP5113462B2 (ja) 2013-01-09

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ID=40476173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007236581A Expired - Fee Related JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法

Country Status (4)

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JP (1) JP5113462B2 (enExample)
KR (1) KR101193872B1 (enExample)
CN (1) CN101386466B (enExample)
TW (1) TWI426057B (enExample)

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US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
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US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
KR102260140B1 (ko) * 2013-12-27 2021-06-04 에이지씨 가부시키가이샤 유리판 및 유리판의 가공 방법
JP6324719B2 (ja) * 2013-12-27 2018-05-16 三星ダイヤモンド工業株式会社 ガラス基板の面取り方法及びレーザ加工装置
JP5816717B1 (ja) * 2014-05-02 2015-11-18 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
KR102218981B1 (ko) * 2014-05-19 2021-02-23 동우 화인켐 주식회사 유리기판의 모서리 가공방법 및 가공장치
KR101574934B1 (ko) * 2014-05-27 2015-12-08 로체 시스템즈(주) 취성재료의 면취 방법
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
JP6578900B2 (ja) 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7272921B2 (ja) * 2019-09-25 2023-05-12 ファナック株式会社 バリ取り装置
JP7217409B2 (ja) * 2020-01-24 2023-02-03 株式会社東京精密 亀裂進展装置及び亀裂進展方法
WO2023228617A1 (ja) * 2022-05-27 2023-11-30 日本電気硝子株式会社 ガラス板の製造方法
CN120604323A (zh) * 2023-01-25 2025-09-05 株式会社东京精密 倒角加工方法及倒角加工装置

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