JP5113462B2 - 脆性材料基板の面取り方法 - Google Patents

脆性材料基板の面取り方法 Download PDF

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Publication number
JP5113462B2
JP5113462B2 JP2007236581A JP2007236581A JP5113462B2 JP 5113462 B2 JP5113462 B2 JP 5113462B2 JP 2007236581 A JP2007236581 A JP 2007236581A JP 2007236581 A JP2007236581 A JP 2007236581A JP 5113462 B2 JP5113462 B2 JP 5113462B2
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JP
Japan
Prior art keywords
substrate
laser
chamfering
crack
brittle material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007236581A
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English (en)
Japanese (ja)
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JP2009066851A5 (enExample
JP2009066851A (ja
Inventor
政二 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2007236581A priority Critical patent/JP5113462B2/ja
Priority to TW097125516A priority patent/TWI426057B/zh
Priority to KR1020080070954A priority patent/KR101193872B1/ko
Priority to CN2008102135633A priority patent/CN101386466B/zh
Publication of JP2009066851A publication Critical patent/JP2009066851A/ja
Publication of JP2009066851A5 publication Critical patent/JP2009066851A5/ja
Application granted granted Critical
Publication of JP5113462B2 publication Critical patent/JP5113462B2/ja
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2007236581A 2007-09-12 2007-09-12 脆性材料基板の面取り方法 Expired - Fee Related JP5113462B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007236581A JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法
TW097125516A TWI426057B (zh) 2007-09-12 2008-07-07 The method of stripping angle of brittle material substrate
KR1020080070954A KR101193872B1 (ko) 2007-09-12 2008-07-22 취성재료기판의 챔퍼링 방법
CN2008102135633A CN101386466B (zh) 2007-09-12 2008-09-11 脆性材料基板的倒角方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007236581A JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法

Publications (3)

Publication Number Publication Date
JP2009066851A JP2009066851A (ja) 2009-04-02
JP2009066851A5 JP2009066851A5 (enExample) 2010-10-14
JP5113462B2 true JP5113462B2 (ja) 2013-01-09

Family

ID=40476173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007236581A Expired - Fee Related JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法

Country Status (4)

Country Link
JP (1) JP5113462B2 (enExample)
KR (1) KR101193872B1 (enExample)
CN (1) CN101386466B (enExample)
TW (1) TWI426057B (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5536534B2 (ja) * 2010-05-17 2014-07-02 株式会社ディスコ ガラス板の分割方法
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
KR101345587B1 (ko) * 2012-01-09 2013-12-27 주식회사 라미넥스 유리 모서리 가공 방법 및 장치
JP5840958B2 (ja) * 2012-01-12 2016-01-06 特定非営利活動法人ナノフォトニクス工学推進機構 ガラスディスクの表面平坦化方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
WO2014010490A1 (ja) * 2012-07-09 2014-01-16 旭硝子株式会社 強化ガラス板の切断方法
KR101405442B1 (ko) * 2012-08-01 2014-06-13 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
JP6039306B2 (ja) * 2012-08-24 2016-12-07 浜松ホトニクス株式会社 レーザ加工方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6014490B2 (ja) * 2012-12-27 2016-10-25 三星ダイヤモンド工業株式会社 分断方法、及び分断装置
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
RU2543222C1 (ru) * 2013-08-23 2015-02-27 Общество С Ограниченной Ответственностью "Ласком" Способ притупления острых кромок стеклоизделий
KR101399838B1 (ko) * 2013-10-08 2014-05-29 주식회사 고려반도체시스템 표시 장치용 투명 기판의 측면 가공 방법 및 이를 이용한 가공 장치
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
KR101454451B1 (ko) * 2013-12-17 2014-10-23 동우 화인켐 주식회사 강화 유리의 절단 방법 및 면취 방법
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
JP6324719B2 (ja) * 2013-12-27 2018-05-16 三星ダイヤモンド工業株式会社 ガラス基板の面取り方法及びレーザ加工装置
JP6439703B2 (ja) 2013-12-27 2018-12-19 Ａｇｃ株式会社 ガラス板、およびガラス板の加工方法
JP5816717B1 (ja) * 2014-05-02 2015-11-18 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
KR102218981B1 (ko) * 2014-05-19 2021-02-23 동우 화인켐 주식회사 유리기판의 모서리 가공방법 및 가공장치
KR101574934B1 (ko) * 2014-05-27 2015-12-08 로체 시스템즈(주) 취성재료의 면취 방법
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
LT3169477T (lt) 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
JP6578900B2 (ja) 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7272921B2 (ja) * 2019-09-25 2023-05-12 ファナック株式会社 バリ取り装置
JP7217409B2 (ja) * 2020-01-24 2023-02-03 株式会社東京精密 亀裂進展装置及び亀裂進展方法
JPWO2023228617A1 (enExample) * 2022-05-27 2023-11-30
WO2024157659A1 (ja) * 2023-01-25 2024-08-02 株式会社東京精密 面取り加工方法、及び、面取り加工装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01108006A (ja) * 1987-10-21 1989-04-25 Nagasaki Pref Gov 脆性材料の割断加工方法
JP2612332B2 (ja) * 1989-03-13 1997-05-21 株式会社東海理化電機製作所 ガラス部材の面取り方法
JPH09225665A (ja) * 1996-02-22 1997-09-02 Seiko Epson Corp ガラス基板面取り方法及びその方法を用いた液晶パネル用ガラス基板及び液晶パネル
JPH09278474A (ja) * 1996-04-08 1997-10-28 Nippon Sheet Glass Co Ltd ガラスホイルカッタおよびガラス板切断方法
JP2002241141A (ja) * 2001-02-08 2002-08-28 Nippon Steel Techno Research Corp レーザによるガラスの加工方法及び装置
TWI252788B (en) * 2001-08-10 2006-04-11 Mitsuboshi Diamond Ind Co Ltd Brittle material substrate chamfering method and chamfering device
JP2003137578A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp 脆性材料の割断加工方法およびその加工装置、並びに電子部品の製造方法
JP2006159747A (ja) * 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
KR101081613B1 (ko) * 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
JP4179314B2 (ja) * 2005-09-13 2008-11-12 株式会社レミ 脆性材料のフルカット割断装置
KR100985428B1 (ko) 2006-02-15 2010-10-05 아사히 가라스 가부시키가이샤 유리 기판의 모따기 방법 및 장치

Also Published As

Publication number Publication date
CN101386466A (zh) 2009-03-18
CN101386466B (zh) 2013-05-08
TW200920704A (en) 2009-05-16
JP2009066851A (ja) 2009-04-02
TWI426057B (zh) 2014-02-11
KR101193872B1 (ko) 2012-10-26
KR20090027565A (ko) 2009-03-17

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