KR101193872B1 - 취성재료기판의 챔퍼링 방법 - Google Patents

취성재료기판의 챔퍼링 방법 Download PDF

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Publication number
KR101193872B1
KR101193872B1 KR1020080070954A KR20080070954A KR101193872B1 KR 101193872 B1 KR101193872 B1 KR 101193872B1 KR 1020080070954 A KR1020080070954 A KR 1020080070954A KR 20080070954 A KR20080070954 A KR 20080070954A KR 101193872 B1 KR101193872 B1 KR 101193872B1
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KR
South Korea
Prior art keywords
substrate
laser
chamfering
crack
laser light
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Expired - Fee Related
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KR1020080070954A
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English (en)
Korean (ko)
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KR20090027565A (ko
Inventor
세이지 시미즈
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미쓰보시 다이야몬도 고교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020080070954A 2007-09-12 2008-07-22 취성재료기판의 챔퍼링 방법 Expired - Fee Related KR101193872B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007236581A JP5113462B2 (ja) 2007-09-12 2007-09-12 脆性材料基板の面取り方法
JPJP-P-2007-00236581 2007-09-12

Publications (2)

Publication Number Publication Date
KR20090027565A KR20090027565A (ko) 2009-03-17
KR101193872B1 true KR101193872B1 (ko) 2012-10-26

Family

ID=40476173

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080070954A Expired - Fee Related KR101193872B1 (ko) 2007-09-12 2008-07-22 취성재료기판의 챔퍼링 방법

Country Status (4)

Country Link
JP (1) JP5113462B2 (enExample)
KR (1) KR101193872B1 (enExample)
CN (1) CN101386466B (enExample)
TW (1) TWI426057B (enExample)

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US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5536534B2 (ja) * 2010-05-17 2014-07-02 株式会社ディスコ ガラス板の分割方法
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
KR101345587B1 (ko) * 2012-01-09 2013-12-27 주식회사 라미넥스 유리 모서리 가공 방법 및 장치
JP5840958B2 (ja) * 2012-01-12 2016-01-06 特定非営利活動法人ナノフォトニクス工学推進機構 ガラスディスクの表面平坦化方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR20150037816A (ko) * 2012-07-09 2015-04-08 아사히 가라스 가부시키가이샤 강화 유리판의 절단 방법
KR101405442B1 (ko) * 2012-08-01 2014-06-13 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
JP6039306B2 (ja) * 2012-08-24 2016-12-07 浜松ホトニクス株式会社 レーザ加工方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6014490B2 (ja) * 2012-12-27 2016-10-25 三星ダイヤモンド工業株式会社 分断方法、及び分断装置
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
RU2543222C1 (ru) * 2013-08-23 2015-02-27 Общество С Ограниченной Ответственностью "Ласком" Способ притупления острых кромок стеклоизделий
KR101399838B1 (ko) * 2013-10-08 2014-05-29 주식회사 고려반도체시스템 표시 장치용 투명 기판의 측면 가공 방법 및 이를 이용한 가공 장치
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
KR101454451B1 (ko) * 2013-12-17 2014-10-23 동우 화인켐 주식회사 강화 유리의 절단 방법 및 면취 방법
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
JP6324719B2 (ja) * 2013-12-27 2018-05-16 三星ダイヤモンド工業株式会社 ガラス基板の面取り方法及びレーザ加工装置
JP6439703B2 (ja) * 2013-12-27 2018-12-19 Ａｇｃ株式会社 ガラス板、およびガラス板の加工方法
JP5816717B1 (ja) * 2014-05-02 2015-11-18 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
KR102218981B1 (ko) * 2014-05-19 2021-02-23 동우 화인켐 주식회사 유리기판의 모서리 가공방법 및 가공장치
KR101574934B1 (ko) * 2014-05-27 2015-12-08 로체 시스템즈(주) 취성재료의 면취 방법
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
EP3169635B2 (en) 2014-07-14 2025-11-12 4JET microtech GmbH Method and system for forming perforations
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
JP6578900B2 (ja) 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
WO2017192835A1 (en) 2016-05-06 2017-11-09 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
CN110121398B (zh) 2016-08-30 2022-02-08 康宁股份有限公司 透明材料的激光加工
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
CN110167891A (zh) 2016-10-24 2019-08-23 康宁股份有限公司 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7272921B2 (ja) * 2019-09-25 2023-05-12 ファナック株式会社 バリ取り装置
JP7217409B2 (ja) * 2020-01-24 2023-02-03 株式会社東京精密 亀裂進展装置及び亀裂進展方法
JPWO2023228617A1 (enExample) * 2022-05-27 2023-11-30
EP4632795A1 (en) * 2023-01-25 2025-10-15 Tokyo Seimitsu Co., Ltd. Chamfering method and chamfering device

Citations (2)

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JP2002241141A (ja) 2001-02-08 2002-08-28 Nippon Steel Techno Research Corp レーザによるガラスの加工方法及び装置
KR100985428B1 (ko) 2006-02-15 2010-10-05 아사히 가라스 가부시키가이샤 유리 기판의 모따기 방법 및 장치

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JP2003137578A (ja) * 2001-11-02 2003-05-14 Seiko Epson Corp 脆性材料の割断加工方法およびその加工装置、並びに電子部品の製造方法
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Patent Citations (2)

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JP2002241141A (ja) 2001-02-08 2002-08-28 Nippon Steel Techno Research Corp レーザによるガラスの加工方法及び装置
KR100985428B1 (ko) 2006-02-15 2010-10-05 아사히 가라스 가부시키가이샤 유리 기판의 모따기 방법 및 장치

Also Published As

Publication number Publication date
KR20090027565A (ko) 2009-03-17
JP2009066851A (ja) 2009-04-02
CN101386466B (zh) 2013-05-08
CN101386466A (zh) 2009-03-18
TW200920704A (en) 2009-05-16
JP5113462B2 (ja) 2013-01-09
TWI426057B (zh) 2014-02-11

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