TWI426057B - The method of stripping angle of brittle material substrate - Google Patents
The method of stripping angle of brittle material substrate Download PDFInfo
- Publication number
- TWI426057B TWI426057B TW097125516A TW97125516A TWI426057B TW I426057 B TWI426057 B TW I426057B TW 097125516 A TW097125516 A TW 097125516A TW 97125516 A TW97125516 A TW 97125516A TW I426057 B TWI426057 B TW I426057B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- laser
- crack
- laser light
- edge line
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 156
- 238000000034 method Methods 0.000 title claims description 53
- 239000000463 material Substances 0.000 title claims description 34
- 239000011521 glass Substances 0.000 claims description 59
- 238000009826 distribution Methods 0.000 claims description 47
- 230000008646 thermal stress Effects 0.000 claims description 32
- 238000012545 processing Methods 0.000 claims description 24
- 239000000835 fiber Substances 0.000 claims description 4
- 238000005336 cracking Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000002679 ablation Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 21
- 230000035882 stress Effects 0.000 description 20
- 230000008569 process Effects 0.000 description 18
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000001238 wet grinding Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007236581A JP5113462B2 (ja) | 2007-09-12 | 2007-09-12 | 脆性材料基板の面取り方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200920704A TW200920704A (en) | 2009-05-16 |
| TWI426057B true TWI426057B (zh) | 2014-02-11 |
Family
ID=40476173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097125516A TWI426057B (zh) | 2007-09-12 | 2008-07-07 | The method of stripping angle of brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5113462B2 (enExample) |
| KR (1) | KR101193872B1 (enExample) |
| CN (1) | CN101386466B (enExample) |
| TW (1) | TWI426057B (enExample) |
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| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| JP5536534B2 (ja) * | 2010-05-17 | 2014-07-02 | 株式会社ディスコ | ガラス板の分割方法 |
| US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| US8677783B2 (en) | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| KR101345587B1 (ko) * | 2012-01-09 | 2013-12-27 | 주식회사 라미넥스 | 유리 모서리 가공 방법 및 장치 |
| JP5840958B2 (ja) * | 2012-01-12 | 2016-01-06 | 特定非営利活動法人ナノフォトニクス工学推進機構 | ガラスディスクの表面平坦化方法 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| WO2014010490A1 (ja) * | 2012-07-09 | 2014-01-16 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
| KR101405442B1 (ko) * | 2012-08-01 | 2014-06-13 | 주식회사 라미넥스 | 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치 |
| JP6039306B2 (ja) * | 2012-08-24 | 2016-12-07 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| KR101355807B1 (ko) * | 2012-09-11 | 2014-02-03 | 로체 시스템즈(주) | 비금속 재료의 곡선 절단방법 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| JP6014490B2 (ja) * | 2012-12-27 | 2016-10-25 | 三星ダイヤモンド工業株式会社 | 分断方法、及び分断装置 |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| RU2543222C1 (ru) * | 2013-08-23 | 2015-02-27 | Общество С Ограниченной Ответственностью "Ласком" | Способ притупления острых кромок стеклоизделий |
| KR101399838B1 (ko) * | 2013-10-08 | 2014-05-29 | 주식회사 고려반도체시스템 | 표시 장치용 투명 기판의 측면 가공 방법 및 이를 이용한 가공 장치 |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| KR101454451B1 (ko) * | 2013-12-17 | 2014-10-23 | 동우 화인켐 주식회사 | 강화 유리의 절단 방법 및 면취 방법 |
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| US10442719B2 (en) * | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| JP6324719B2 (ja) * | 2013-12-27 | 2018-05-16 | 三星ダイヤモンド工業株式会社 | ガラス基板の面取り方法及びレーザ加工装置 |
| JP6439703B2 (ja) | 2013-12-27 | 2018-12-19 | Ａｇｃ株式会社 | ガラス板、およびガラス板の加工方法 |
| JP5816717B1 (ja) * | 2014-05-02 | 2015-11-18 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法及びレーザ加工装置 |
| KR102218981B1 (ko) * | 2014-05-19 | 2021-02-23 | 동우 화인켐 주식회사 | 유리기판의 모서리 가공방법 및 가공장치 |
| KR101574934B1 (ko) * | 2014-05-27 | 2015-12-08 | 로체 시스템즈(주) | 취성재료의 면취 방법 |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
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| JP6303950B2 (ja) * | 2014-09-19 | 2018-04-04 | 旭硝子株式会社 | ガラス板の加工方法 |
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| JP7272921B2 (ja) * | 2019-09-25 | 2023-05-12 | ファナック株式会社 | バリ取り装置 |
| JP7217409B2 (ja) * | 2020-01-24 | 2023-02-03 | 株式会社東京精密 | 亀裂進展装置及び亀裂進展方法 |
| JPWO2023228617A1 (enExample) * | 2022-05-27 | 2023-11-30 | ||
| WO2024157659A1 (ja) * | 2023-01-25 | 2024-08-02 | 株式会社東京精密 | 面取り加工方法、及び、面取り加工装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225665A (ja) * | 1996-02-22 | 1997-09-02 | Seiko Epson Corp | ガラス基板面取り方法及びその方法を用いた液晶パネル用ガラス基板及び液晶パネル |
| JPH09278474A (ja) * | 1996-04-08 | 1997-10-28 | Nippon Sheet Glass Co Ltd | ガラスホイルカッタおよびガラス板切断方法 |
| JP2006159747A (ja) * | 2004-12-09 | 2006-06-22 | Japan Steel Works Ltd:The | レーザ加工方法及びその装置 |
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01108006A (ja) * | 1987-10-21 | 1989-04-25 | Nagasaki Pref Gov | 脆性材料の割断加工方法 |
| JP2612332B2 (ja) * | 1989-03-13 | 1997-05-21 | 株式会社東海理化電機製作所 | ガラス部材の面取り方法 |
| JP2002241141A (ja) * | 2001-02-08 | 2002-08-28 | Nippon Steel Techno Research Corp | レーザによるガラスの加工方法及び装置 |
| TWI252788B (en) * | 2001-08-10 | 2006-04-11 | Mitsuboshi Diamond Ind Co Ltd | Brittle material substrate chamfering method and chamfering device |
| JP2003137578A (ja) * | 2001-11-02 | 2003-05-14 | Seiko Epson Corp | 脆性材料の割断加工方法およびその加工装置、並びに電子部品の製造方法 |
| JP4179314B2 (ja) * | 2005-09-13 | 2008-11-12 | 株式会社レミ | 脆性材料のフルカット割断装置 |
| KR100985428B1 (ko) | 2006-02-15 | 2010-10-05 | 아사히 가라스 가부시키가이샤 | 유리 기판의 모따기 방법 및 장치 |
-
2007
- 2007-09-12 JP JP2007236581A patent/JP5113462B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125516A patent/TWI426057B/zh not_active IP Right Cessation
- 2008-07-22 KR KR1020080070954A patent/KR101193872B1/ko not_active Expired - Fee Related
- 2008-09-11 CN CN2008102135633A patent/CN101386466B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225665A (ja) * | 1996-02-22 | 1997-09-02 | Seiko Epson Corp | ガラス基板面取り方法及びその方法を用いた液晶パネル用ガラス基板及び液晶パネル |
| JPH09278474A (ja) * | 1996-04-08 | 1997-10-28 | Nippon Sheet Glass Co Ltd | ガラスホイルカッタおよびガラス板切断方法 |
| JP2006159747A (ja) * | 2004-12-09 | 2006-06-22 | Japan Steel Works Ltd:The | レーザ加工方法及びその装置 |
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101386466A (zh) | 2009-03-18 |
| CN101386466B (zh) | 2013-05-08 |
| JP5113462B2 (ja) | 2013-01-09 |
| TW200920704A (en) | 2009-05-16 |
| JP2009066851A (ja) | 2009-04-02 |
| KR101193872B1 (ko) | 2012-10-26 |
| KR20090027565A (ko) | 2009-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |