SG11201809797PA - Laser cutting and removal of contoured shapes from transparent substrates - Google Patents

Laser cutting and removal of contoured shapes from transparent substrates

Info

Publication number
SG11201809797PA
SG11201809797PA SG11201809797PA SG11201809797PA SG11201809797PA SG 11201809797P A SG11201809797P A SG 11201809797PA SG 11201809797P A SG11201809797P A SG 11201809797PA SG 11201809797P A SG11201809797P A SG 11201809797PA SG 11201809797P A SG11201809797P A SG 11201809797PA
Authority
SG
Singapore
Prior art keywords
removal
laser cutting
transparent substrates
contoured shapes
contoured
Prior art date
Application number
SG11201809797PA
Inventor
Bradley Frederick Bowden
Xiaoju Guo
Thomas Hackert
Garrett Andrew Piech
Kristopher Allen Wieland
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of SG11201809797PA publication Critical patent/SG11201809797PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/072—Armoured glass, i.e. comprising reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Surface Treatment Of Glass (AREA)
SG11201809797PA 2016-05-06 2017-05-04 Laser cutting and removal of contoured shapes from transparent substrates SG11201809797PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662332618P 2016-05-06 2016-05-06
US201662350978P 2016-06-16 2016-06-16
PCT/US2017/031030 WO2017192835A1 (en) 2016-05-06 2017-05-04 Laser cutting and removal of contoured shapes from transparent substrates

Publications (1)

Publication Number Publication Date
SG11201809797PA true SG11201809797PA (en) 2018-12-28

Family

ID=58709610

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201809797PA SG11201809797PA (en) 2016-05-06 2017-05-04 Laser cutting and removal of contoured shapes from transparent substrates

Country Status (9)

Country Link
US (2) US11111170B2 (en)
EP (2) EP3452418B1 (en)
JP (2) JP6938543B2 (en)
KR (2) KR20220078719A (en)
CN (1) CN109311725B (en)
MY (1) MY194570A (en)
SG (1) SG11201809797PA (en)
TW (2) TWI742076B (en)
WO (1) WO2017192835A1 (en)

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CN108161250A (en) * 2018-01-30 2018-06-15 苏州德龙激光股份有限公司 Multifocal DYNAMIC DISTRIBUTION laser machines the method and device of brittle transparent material
US20190263709A1 (en) * 2018-02-26 2019-08-29 Corning Incorporated Methods for laser forming transparent articles from a transparent mother sheet and processing the transparent articles in-situ
WO2019191474A1 (en) * 2018-03-29 2019-10-03 Corning Incorporated Methods for laser processing rough transparent workpieces using pulsed laser beam focal lines and a fluid film
US11059131B2 (en) 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
WO2020021705A1 (en) * 2018-07-27 2020-01-30 Hoya株式会社 Manufacturing method for glass substrate and manufacturing method for magnetic disc
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CN114144383B (en) 2019-07-18 2024-02-02 康宁股份有限公司 Method for separating transparent articles from transparent master using an open pressure assembly
KR20230020498A (en) * 2020-06-04 2023-02-10 코닝 인코포레이티드 Method for laser processing transparent workpieces using a modified pulse burst profile
TWI733604B (en) * 2020-06-10 2021-07-11 財團法人工業技術研究院 Laser processing system and method for glass workpiece
DE102020123787A1 (en) 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Process for separating a transparent material
CN115215538A (en) * 2021-04-15 2022-10-21 大族激光科技产业集团股份有限公司 Laser hole cutting method and laser cutting device for glass
CN113305106B (en) * 2021-06-03 2022-08-02 四川大学 Method for cleaning micro-nano particle pollutants by laser and application
CN114682932B (en) * 2022-04-14 2024-02-09 强一半导体(苏州)股份有限公司 Method for laser processing through holes suitable for green ceramic chips
DE202022105478U1 (en) * 2022-09-28 2022-11-04 4Jet Microtech Gmbh separator

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