CN115215538A - Laser hole cutting method and laser cutting device for glass - Google Patents
Laser hole cutting method and laser cutting device for glass Download PDFInfo
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- CN115215538A CN115215538A CN202110408862.8A CN202110408862A CN115215538A CN 115215538 A CN115215538 A CN 115215538A CN 202110408862 A CN202110408862 A CN 202110408862A CN 115215538 A CN115215538 A CN 115215538A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a laser hole cutting method and a laser cutting device for glass, wherein the laser hole cutting method for glass comprises the following steps: cutting the glass workpiece along a preset processing track by using infrared picosecond Bessel laser to form a cutting seam, wherein the cutting seam is a closed loop with a smooth edge and divides the glass workpiece into inner glass positioned in the cutting seam and outer glass positioned outside the cutting seam; forming a preset temperature difference between the inner glass and the outer glass, wherein the temperature of the inner glass is lower than that of the outer glass; and applying pressure to the inner glass along the thickness direction of the inner glass to separate the inner glass and the outer glass along the cutting seams. This scheme of adoption can break away from downthehole cutting waste material fast to realize processing the poroid structure of glass high-efficiently, and guarantee the machining precision of poroid structure.
Description
Technical Field
The invention belongs to the technical field of glass cutting, and particularly relates to a laser hole cutting method and a laser cutting device for glass.
Background
In the production process of some glass products, glass needs to be cut, and the cutting method of the glass is a main factor influencing the processing efficiency, the yield and the cost of the glass.
At present, the main glass cutting processes include an acid etching process, a mechanical cutting process, a laser cutting process and the like. Acid etched glass processes are increasingly being abandoned for efficiency and cost reasons. The mechanical cutting precision is poor, water cooling is needed during cutting, polishing and other treatment are needed after cutting, the operation is complex, and the method is mainly applied to common glass processing with low requirements at present. The problems of the two cutting processes can be avoided due to the characteristics of non-contact processing, no pollution, high precision and the like of laser cutting, the laser processing is very commonly applied to glass cutting, and the laser cutting is also divided into various types, such as ablation type processing, ultra-fast laser etching processing, thermal cracking method cracking and the like.
However, when a hole-shaped structure with high requirement on the machining precision is machined by adopting a common laser cutting process, the production efficiency is low, and the machining precision is difficult to ensure.
Disclosure of Invention
The invention aims to provide a glass laser hole cutting method and a glass laser hole cutting device, which can efficiently process a glass hole structure and ensure the processing precision of the hole structure.
In order to solve the technical problem, the invention provides a method for laser hole cutting of glass, which comprises the following steps:
cutting the glass workpiece along a preset processing track by using infrared picosecond Bessel laser to form a cutting seam, wherein the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece into inner glass positioned in the cutting seam and outer glass positioned outside the cutting seam;
forming a predetermined temperature difference between the inner glass and the outer glass, wherein the temperature of the inner glass is lower than that of the outer glass;
and applying pressure to the inner glass along the thickness direction of the inner glass, so that the inner glass and the outer glass are separated along the cutting seams.
Further, before the cutting the glass workpiece along the predetermined processing track with the infrared picosecond bessel laser to form the kerf, the method further comprises the following steps:
setting cutting parameters of the infrared picosecond Bezier laser, and debugging the focus of the infrared picosecond Bezier laser to the surface of the glass workpiece; the cutting parameters comprise laser power, laser pulse frequency and pulse width, the laser power is 10-100W, the laser pulse frequency is 50-1000KHz, and the pulse width is less than or equal to 15ps.
Further, the forming the predetermined temperature difference between the inner glass and the outer glass, the temperature of the inner glass being lower than the temperature of the outer glass, includes:
heating the inner glass and the outer glass to a first preset temperature;
and cooling the inner glass to a second preset temperature, wherein the preset temperature difference is the difference between the first preset temperature and the second preset temperature, and the preset temperature difference is 100-400 ℃.
Further, heating the inner glass and the outer glass to a first preset temperature; cooling the inner glass to a second predetermined temperature, comprising:
placing the cut glass workpiece on a heating cushion block until the temperature of the glass workpiece reaches the first preset temperature, wherein the first preset temperature is 150-450 ℃;
and attaching a cooling block to one side of the inner side glass until the temperature of the inner side glass reaches the second preset temperature, wherein the second preset temperature is 15-60 ℃.
Further, the applying pressure to the inner glass in a thickness direction thereof includes:
applying a pressure to the cooling block towards the inner glass such that a pressure difference between the inner glass and the outer glass is greater than 10kPa.
Further, before the cutting the glass workpiece along the predetermined processing track with the infrared picosecond bessel laser to form the kerf, the method further comprises the following steps:
preheating a glass workpiece to a third predetermined temperature, wherein the third predetermined temperature is greater than 100 ℃.
Furthermore, the thickness of the glass workpiece is 0.1-2mm, and the expansion coefficient of the glass workpiece is more than 66.7 x 10 ^ －7 A minimum width of the slit profile is 6mm or more/° C.
Further, a laser cutting device is provided, which comprises a machine base, a laser cutting assembly, a heating assembly, a cooling assembly and a pressurizing assembly, wherein the laser cutting assembly, the heating assembly, the cooling assembly and the pressurizing assembly are all assembled on the machine base;
the laser cutting assembly can generate infrared picosecond Bessel laser, the infrared picosecond Bessel laser cuts a glass workpiece along a preset processing track to form a cutting seam, the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece into inner glass positioned in the cutting seam and outer glass positioned outside the cutting seam;
the heating assembly is used for placing the glass workpiece and heating the glass workpiece;
the cooling assembly is used for cooling the inner glass to enable the inner glass and the outer glass to form a preset temperature difference, and the temperature of the inner glass is lower than that of the outer glass;
the pressurizing assembly is used for applying pressure to the inner glass along the thickness direction of the inner glass, so that the inner glass and the outer glass are separated along the cutting seams.
Furthermore, the laser cutting assembly comprises an infrared picosecond laser, a beam conduction structure, a shaping structure and a focusing structure, the infrared picosecond laser is used for generating infrared picosecond laser, the infrared picosecond laser is conducted to the shaping structure through the beam conduction structure, the shaping structure shapes the infrared picosecond laser into infrared picosecond Bessel laser, and the focusing structure is used for adjusting the focus of the infrared picosecond Bessel laser.
Furthermore, the heating assembly comprises a heating furnace and a heating cushion block, the heating furnace is assembled on the base, the heating cushion block is assembled on the heating furnace, the heating furnace is used for heating the heating cushion block, and the heating cushion block is used for bearing the glass workpiece;
the cooling assembly comprises a driving mechanism, a cooling block and a cooling device, the driving mechanism is assembled on the base, the cooling block is connected to the driving mechanism, the driving mechanism is used for driving the cooling block to move on the heating cushion block, the cooling device is assembled on the frame and connected with the cooling block, and the cooling device is used for cooling the cooling block.
Compared with the prior art, the laser hole cutting method and the laser cutting device for glass have the advantages that:
the glass workpiece is cut by the infrared picosecond Bessel laser, the width of a cutting seam is only 1-3um, the cutting shape precision is higher, after the cutting is finished, a preset temperature difference is formed between the inner glass and the outer glass, the temperature of the inner glass is lower than that of the outer glass, and due to different temperatures, the expansion degree of the inner glass is smaller than that of the outer glass, so that the width of the cutting seam can be increased, and then pressure is applied to the inner glass along the thickness direction of the inner glass, so that the inner glass can be separated from the outer glass, and a precise hole-shaped characteristic is formed. This scheme of adoption can break away from downthehole cutting waste material fast to realize the processing to glass pore structure high-efficiently, and guarantee pore structure's machining precision.
Drawings
FIG. 1 is a schematic flow chart of a laser hole cutting method for glass in an embodiment of the present invention;
fig. 2 is a schematic diagram of the position layout of the corresponding components of the laser cutting device in the embodiment of the present invention when the laser cutting device implements the steps of the laser hole cutting method.
In the drawings, each reference numeral indicates: 11. an infrared picosecond laser; 12. a beam conducting structure and a shaping structure; 13. a focusing structure; 21. heating furnace; 22. heating the cushion block; 31. cooling the block; 32. a cooling device; 4. a pressurizing assembly; 10. a glass workpiece; 101. inner side glass; 102. an outer glass.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The embodiment is as follows:
in the production process of glass, the cutting method of the glass is a main factor influencing the processing efficiency, the yield and the cost of the glass. The main glass cutting processes at present include an acid etching process, a mechanical cutting process, laser cutting and the like, and due to efficiency and cost reasons, the acid etching glass process is gradually abandoned, the mechanical cutting precision is poor, water cooling is needed during cutting, polishing and other treatments are needed after cutting, and the method is mainly applied to common glass processing with lower requirements at present. The problems can be avoided by the characteristics of non-contact processing, non-pollution, high precision and the like of laser cutting, the laser processing is widely applied to modern industries, and the application in glass cutting is very common. Laser cutting is also classified into various types, such as ablation type machining, ultrafast laser etching machining, thermal cracking, ultrafast laser bessel cutting. However, the ablation type processing method needs to melt the material, the efficiency is low, the ultrafast laser etching processing and the hot cracking method are not suitable for processing the hole-shaped characteristics, and the efficiency is low, and when the ultrafast laser bessel cuts the round hole, the problem that the center cutting waste is difficult to take down exists because the cutting seam is extremely small, for example, the cutting of the camera hole on the cover plate on the back of the mobile phone, and the yield and the production efficiency of the product are greatly limited by the difficulty in taking the waste.
In this embodiment, in order to solve the above problem, with reference to fig. 1-2, a method for laser drilling glass is provided, including:
cutting the glass workpiece 10 by using infrared picosecond Bessel laser along a preset processing track to form a cutting seam, wherein the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece 10 into inner side glass 101 positioned in the cutting seam and outer side glass 102 positioned outside the cutting seam;
forming a predetermined temperature difference between the inner glass 101 and the outer glass 102, wherein the temperature of the inner glass 101 is lower than that of the outer glass 102;
pressure is applied to the inner glass 101 in the thickness direction thereof, and the inner glass 101 and the outer glass 102 are separated along the cut.
The glass workpiece 10 is cut by the infrared picosecond Bessel laser, the width of a cut seam is only 1-3um, the cutting shape precision is higher, after the cutting is finished, a preset temperature difference is formed between the inner glass 101 and the outer glass 102, the temperature of the inner glass 101 is lower than that of the outer glass 102, the expansion degree of the inner glass 101 is smaller than that of the outer glass 102 due to different temperatures, therefore, the width of the cut seam is increased, and then pressure is applied to the inner glass 101 along the thickness direction of the inner glass 101, so that the inner glass 101 can be separated from the outer glass 102, and a precise hole-shaped characteristic is formed. This scheme of adoption can break away from downthehole cutting waste material fast to realize the processing to glass pore structure high-efficiently, and guarantee pore structure's machining precision.
In the process, the glass workpiece 10 has a thickness of 0.1-2mm, such as 0.3mm, 0.5mm, 0.7mm, 0.9mm, 1.0mm, 1.1mm, 1.3mm, 1.5mm, 1.7mm, 1.9mm, etc., and the expansion coefficient of the glass workpiece 10 is greater than 66.7X 10 ^ －7 V. e.g. 75.8X 10 ^ －7 /℃、80.7×10＾ －7 /℃、90.6×10＾ －7 /℃、107.9×10＾ －7 /° c, etc., minimum width of kerf contour (two parallel lines abutting kerf outer contour in directions approaching each other, two parallel lines abutting kerf outer contourThe minimum distance that can be achieved by parallel lines) is greater than or equal to 6mm, such as 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, etc., so as to ensure the reliability of the hole cutting operation and the subsequent scrap detachment operation, and the laser hole cutting method for the glass of this embodiment will be described in detail below:
s100, preheating the glass workpiece 10 to enable the glass workpiece 10 to reach a third preset temperature, wherein the third preset temperature is higher than 100 ℃;
specifically, in this step, the glass workpiece 10 is placed on the heating pad 22, the heating pad 22 is heated by the heating furnace 21, the heat of the heating pad 22 is conducted to the glass workpiece 10, so that the whole glass workpiece 10 is heated, the third predetermined temperature can be set to 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃, 150 ℃ and the like, the glass workpiece 10 can be heated and expanded by heating the glass workpiece 10 to the third predetermined temperature, so that a certain deformation amount exists, and since the temperature of the glass workpiece 10 is already in a high range, high cutting efficiency can be achieved without using higher power when the glass workpiece 10 is cut by the infrared picosecond bessel laser; in this step, in order to conveniently and accurately monitor the current temperature of the glass workpiece 10, a temperature measuring gun may be used to measure the temperature of the glass workpiece 10 in real time, and when it is detected that the current temperature of the glass workpiece 10 reaches the third predetermined temperature, the next step S200 is performed.
S200, cutting the glass workpiece 10 by using infrared picosecond Bessel laser along a preset processing track to form a cutting seam, wherein the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece 10 into inner side glass 101 positioned in the cutting seam and outer side glass 102 positioned outside the cutting seam;
specifically, the method comprises the following steps:
setting cutting parameters of the infrared picosecond Bezier laser, and debugging the focus of the infrared picosecond Bezier laser to the surface of the glass workpiece 10; the cutting parameters comprise laser power, laser pulse frequency and pulse width, the laser power is 10-100W, the laser pulse frequency is 50-1000KHz, and the pulse width is less than or equal to 15ps; wherein, the laser power can be 20W, 30W, 40W, 50W, 60W, 70W, 80W, 90W, etc.; the laser pulse frequency may be 100KHZ, 200KHZ, 300KHZ, 400KHZ, 500KHZ, 600KHZ, 700KHZ, 800KHZ, 900KHZ, etc., and the pulse width may be 1ps, 2ps, 3ps, 4ps, 5ps, 6ps, 7ps, 8ps, 9ps, 10ps, 11ps, 12ps, 13ps, 14ps, etc. By adopting the infrared picosecond Bessel laser with the parameters, the cutting seam for cutting glass can be smaller under the condition of ensuring the cutting efficiency, so that the precision of the processed hole structure is higher.
The method is characterized in that the infrared picosecond Bessel laser cuts the glass workpiece 10 along a preset processing track to form a cutting seam, in the scheme, the cutting seam is preferably circular or oval, the cutting seam can also be in a polygonal shape with inner angles larger than 90 degrees and corners having round chamfers, particularly a regular polygon with the number of sides larger than 5, it should be understood that the preset processing track is a pattern corresponding to the cutting seam to be processed, the preset processing track can be preset in a controller of the laser cutting equipment, in the cutting process, the glass workpiece 10 is kept on a heating cushion block 22, abdicating holes are formed in the heating cushion block 22, and a cut area of the glass workpiece 10 is opposite to the abdicating holes, so that interference cannot be generated in the laser cutting process, and the laser cutting process is reliable.
S300, forming a preset temperature difference between the inner glass 101 and the outer glass 102, wherein the temperature of the inner glass 101 is lower than that of the outer glass 102;
this step includes raising the temperature of the inside glass 101 and the outside glass 102 to a first predetermined temperature; cooling the inner glass 101 to a second predetermined temperature, wherein the predetermined temperature difference is the difference between the first predetermined temperature and the second predetermined temperature, and the predetermined temperature difference is 100-400 ℃.
Specifically, the cut glass workpiece 10 is placed on the heating pad 22 until the temperature of the glass workpiece 10 reaches a first predetermined temperature, wherein the first predetermined temperature is 150-450 ℃, and the first predetermined temperature can be 200 ℃, 250 ℃, 300 ℃, 350 ℃, 400 ℃ and the like; it should be understood that the glass workpiece 10 can be placed on different heating blocks 22 respectively from the processes of preheating, cutting and cutting, each heating block 22 can be kept at a different temperature, and the glass workpiece 10 can be transferred to the corresponding heating block 22 in different processes, so that each process can keep the glass workpiece 10 in a stable temperature range, the temperature of the glass workpiece 10 can be kept near a certain first preset temperature value during the cutting process, for example, at plus or minus 2 ℃ of the first preset temperature value, for example, 300 ℃, the temperature of the glass workpiece 10 can be kept between 298 ℃ and 302 ℃ during the cutting process, the expansion degree of each part of the glass workpiece 10 is uniform in the stable temperature range, and therefore, the cutting shape precision is higher; of course, in order to improve the efficiency of hole cutting and simplify the structure of the laser cutting apparatus, the glass workpiece 10 can be placed on the heating pad 22 all the time from the processes of preheating, cutting and cutting of the glass workpiece 10, so that the temperature of the glass workpiece 10 can be kept in a rising state all the time, the cutting operation can be started when the glass workpiece 10 reaches a certain first predetermined temperature, and the temperature of the glass workpiece 10 is still within the range of the first predetermined temperature during the final action of cutting, so that the glass workpiece 10 is still heated during the cutting, the operation of the glass workpiece 10 does not need to be transferred, the process flow can be reduced, the process time can be shortened, and the efficiency can be improved.
The cooling block 31 is attached to one side of the inner glass 101 until the temperature of the inner glass 101 reaches a second predetermined temperature, which is 15-60 ℃.
Specifically, the cooling block 31 may be connected to a water cooling device, so that when the cooling block 31 is attached to one side of the inner glass 101, the inner glass 101 may be cooled to a second predetermined temperature, which may be 20 ℃, 25 ℃, 30 ℃, 35 ℃, 40 ℃, 45 ℃, 50 ℃, 55 ℃ or the like, the difference between the first predetermined temperature and the second predetermined temperature is a predetermined temperature difference, the predetermined temperature difference is preferably 200 ℃ to 240 ℃, such as 210 ℃, 220 ℃, 230 ℃ or the like, and the inner glass 101 and the outer glass 102 may be more easily separated within the predetermined temperature difference range.
S400, applying pressure to the inner glass 101 along the thickness direction of the inner glass, and separating the inner glass 101 and the outer glass 102 along the cutting seams.
Applying a pressure toward the inner glass 101 to the cooling block 31 so that the pressure difference between the inner glass 101 and the outer glass 102 is greater than 10kPa, the pressure difference may be 20kPa, 30kPa, 40kPa, 50kPa, 60kPa, 70kPa, 80kPa, etc., in this step, the cooling block 31 may be a chilled copper block, and the cooling block 31 itself has a weight, so that the weight of the cooling block 31 itself may be appropriately set so that the pressure difference between the inner glass 101 and the outer glass 102 reaches a value enabling disengagement when the cooling block 31 presses the inner glass 101, which may simplify the apparatus structure; in the case where the mass of the cooling block 31 is insufficient to detach the inside glass 101, the pressure to the inside glass 101 may be increased by applying pressure to the cooling block 31 by the pressurizing cylinder to detach the inside glass 101 and the outside glass 102.
By adopting the laser hole cutting method, hole-shaped characteristics such as round holes, elliptical holes and the like can be conveniently and quickly processed on the glass, the hole cutting efficiency can be improved under the condition of ensuring the processing precision, and the laser hole cutting method is suitable for industrial application.
Further, a laser cutting device is provided for realizing the laser hole cutting method, the laser cutting device comprises a machine base, a laser cutting assembly, a heating assembly, a cooling assembly and a pressurizing assembly 4, and the laser cutting assembly, the heating assembly, the cooling assembly and the pressurizing assembly 4 are all assembled on the machine base;
the laser cutting assembly can generate infrared picosecond Bessel laser, the infrared picosecond Bessel laser cuts the glass workpiece 10 along a preset processing track to form a cutting seam, the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece 10 into inner side glass 101 positioned in the cutting seam and outer side glass 102 positioned outside the cutting seam;
the heating assembly is used for placing the glass workpiece 10 and heating the glass workpiece 10;
the cooling assembly is used for cooling the inner glass 101 to enable the inner glass 101 and the outer glass 102 to form a preset temperature difference, and the temperature of the inner glass 101 is lower than that of the outer glass 102;
the pressing unit 4 is configured to apply a pressure to the inner glass 101 in the thickness direction thereof to separate the inner glass 101 and the outer glass 102 along the slit.
Specifically, the laser cutting assembly comprises an infrared picosecond laser 11, a beam conduction structure, a shaping structure 12 and a focusing structure 13, wherein the infrared picosecond laser 11 is used for generating infrared picosecond laser, the infrared picosecond laser is conducted to the shaping structure through the beam conduction structure, the shaping structure shapes the infrared picosecond laser into infrared picosecond Bezier laser, and the focusing structure 13 is used for adjusting the focus of the infrared picosecond Bezier laser.
The heating assembly comprises a heating furnace 21 and a heating cushion block 22, the heating furnace 21 is assembled on the base, the heating cushion block 22 is assembled on the heating furnace 21, the heating furnace 21 is used for heating the heating cushion block 22, the heating cushion block 22 is used for bearing the glass workpiece 10, the heating cushion block 22 is made of alumina blocks, and the heating cushion block 22 is provided with abdicating holes;
the cooling assembly comprises a driving mechanism, a cooling block 31 and a cooling device 32, the driving mechanism is assembled on the base, the cooling block 31 is connected to the driving mechanism, the driving mechanism is used for driving the cooling block 31 to move on the heating cushion block 22, the cooling device 32 is assembled on the frame and connected with the cooling block 31, and the cooling device 32 is used for cooling the cooling block 31. The cooling block 31 is made of a refrigerating copper block, the cooling device 32 is made of a water cooling device, and the driving mechanism can move the cooling block 31 to the position above the inner side glass 101, so that the cooling block 31 is attached to one side of the inner side glass 101.
The pressurizing assembly 4 may adopt a pressurizing cylinder, and the laser cutting device may further include a temperature measuring gun for monitoring the current temperature of the glass workpiece 10 to determine the cutting time, the cooling time and the pressurizing time.
The glass adopted by the laser hole cutting method comprises first-generation Corning, second-generation Corning, third-generation Corning, fourth-generation Corning, fifth-generation Corning, sixth-generation Corning and seventh-generation Corning glass and the like, and the method can be used as long as the parameter requirements on the glass in the process are met.
An example of the application of the laser via cutting method to corning third generation glass is provided below:
in step S100, a heating furnace is used to heat the heating pad, and then the glass to be cut is placed on the heating pad to reach a set temperature, and a temperature measuring gun can be used to monitor the temperature.
Table one: variation between heating time and heating temperature
According to the temperature change relationship among the heating furnace, the heating mat and the glass in the first table, the step S200 may be performed when the glass is heated to 100 ℃, that is, 6 minutes, or the step S200 may be performed when the glass reaches 100 ℃ as measured by a thermometer.
In the step S200, the infrared picosecond laser emits an infrared 1064nm laser beam, which is shaped by the beam guide structure and the shaping structure, and then focused on the glass by the focusing structure to cut the glass, thereby forming a circular hole.
The scheme adopts 1.5 mm-thick kangning third-generation glass, the beam conduction structure and the shaping structure comprise an infrared reflection device, a beam expanding device and a Fourier lens device, wherein the multiple of the beam expanding lens is 2-8 times, the size of a light spot focused by the focusing structure is 1-3um, and the cutting point distance of laser pulse in the cutting process is 1-10um.
In the step S300, the heating furnace is used for continuously heating the aluminum alloy heating cushion block, the cut glass is placed on the aluminum alloy cushion block and is uniformly heated until the temperature of the glass monitored by the temperature measuring gun reaches 220 degrees, namely, the heating is carried out for 23 minutes, the refrigerating machine is started to enable water flow to circulate in the refrigerating device, the cooling block is placed in the cutting hole to cool the glass, so that the glass generates a thermal expansion and cold contraction effect, waste materials in the hole shrink by cooling to a certain size, and the gap width of the glass which can be blanked through the step S400 is reached.
Specifically, in this example, the parameters of the glass used are as follows:
density: 2.39g/cm 3
Young's modulus: 70GPa
Poisson ratio: 0.22
Shear modulus: 28.5GPa
Unreinforced vickers hardness (200 g load): 555kgf/mm 2
Enhanced vickers hardness (200 g load): 653kgf/mm 2
Fracture toughness: 0.66MPam 0.5
Coefficient of expansion (0-300 ℃): 75.8X 10 －7 /℃
The glass is heated to 220 degrees from the room temperature of 20 degrees, and then the hole is cooled to 20 degrees to shrink the round hole, so that a certain seam width is generated. The expansion size can be calculated by cutting a 15mm round hole and is 22.7um, the single-side 11.35um seam width can be generated after the glass in the hole is cooled, and the blanking is enough for the step S400.
In the step S400, the periphery heating and the in-hole cooling in the step S300 are maintained, and the pressure cylinder is used to generate pressure to the cooling block, so that the waste material in the hole can automatically fall down.
In one embodiment of the method, the refrigeration block is a cylindrical copper block with the diameter of 8mm. When the mass of the copper block reaches 53.08g, the refrigeration copper block is placed in the hole and can be automatically blanked without pressurizing by a pressurizing cylinder, the surface pressure of the glass is = mg/s =1.034 & ltu & gt 4Pa, and then the pressurizing cylinder only needs to pressurize to 1 & ltu & gt 4Pa to realize automatic and rapid blanking.
The above examples are only for understanding the laser hole cutting method of glass, and the parameters and specific operations of the respective steps of the method can be adaptively adjusted according to the characteristics of glass, the conditions of production equipment, etc. in practical use under the concept of the method.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method for laser hole cutting of glass is characterized by comprising the following steps:
cutting the glass workpiece (10) along a preset processing track by using infrared picosecond Bessel laser to form a cutting seam, wherein the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece (10) into inner side glass (101) positioned in the cutting seam and outer side glass (102) positioned outside the cutting seam;
forming a predetermined temperature difference between the inner glass (101) and the outer glass (102), the temperature of the inner glass (101) being lower than the temperature of the outer glass (102);
and applying pressure to the inner glass (101) along the thickness direction of the inner glass, so that the inner glass (101) and the outer glass (102) are separated along the cutting seams.
2. The method of laser hole cutting of glass as defined in claim 1, further comprising, prior to said slitting the glass workpiece (10) along the predetermined processing trajectory with an infrared picosecond bessel laser:
setting cutting parameters of the infrared picosecond Bezier laser, and debugging the focus of the infrared picosecond Bezier laser to the surface of the glass workpiece (10); the cutting parameters comprise laser power, laser pulse frequency and pulse width, the laser power is 10-100W, the laser pulse frequency is 50-1000KHz, and the pulse width is less than or equal to 15ps.
3. The method for laser hole cutting of glass according to claim 1, wherein said forming the inner glass (101) and the outer glass (102) to a predetermined temperature difference, the temperature of the inner glass (101) being lower than the temperature of the outer glass (102), comprises:
-heating the inner glass (101) and the outer glass (102) to a first predetermined temperature;
cooling the inner glass (101) to a second predetermined temperature, wherein the predetermined temperature difference is the difference between the first predetermined temperature and the second predetermined temperature, and the predetermined temperature difference is 100-400 ℃.
4. A method for laser drilling of glass according to claim 3, characterized in that the inner glass (101) and the outer glass (102) are heated to a first predetermined temperature; -cooling the inner glass (101) to a second predetermined temperature comprising:
placing the cut glass workpiece (10) on a heating cushion block (22) until the temperature of the glass workpiece (10) reaches the first preset temperature, wherein the first preset temperature is 150-450 ℃;
and attaching a cooling block (31) to one side of the inner glass (101) until the temperature of the inner glass (101) reaches the second predetermined temperature, wherein the second predetermined temperature is 15-60 ℃.
5. The method for laser hole cutting of glass according to claim 4, wherein said applying pressure to said inner glass (101) in its thickness direction comprises:
applying a pressure towards the inner glass (101) to the cooling block (31) such that the pressure difference between the inner glass (101) and the outer glass (102) is greater than 10kPa.
6. The method of laser hole cutting of glass as claimed in any of claims 1-5, further comprising, prior to said slitting the glass workpiece (10) along a predetermined processing trajectory with an infrared picosecond Bessel laser:
preheating a glass workpiece (10) to bring the glass workpiece (10) to a third predetermined temperature, the third predetermined temperature being greater than 100 ℃.
7. Method for laser drilling of a hole in glass according to claim 6, characterized in that the thickness of the glass piece (10) is between 0.1 and 2mm, and the coefficient of expansion of the glass piece (10) is greater than 66.7 x 10 ^ －7 A minimum width of the slit profile is 6mm or more/° C.
8. The laser cutting device is characterized by comprising a machine base, a laser cutting assembly, a heating assembly, a cooling assembly and a pressurizing assembly (4), wherein the laser cutting assembly, the heating assembly, the cooling assembly and the pressurizing assembly (4) are assembled on the machine base;
the laser cutting assembly can generate infrared picosecond Bessel laser, the infrared picosecond Bessel laser cuts a glass workpiece (10) along a preset processing track to form a cutting seam, the cutting seam is a closed loop with a smooth edge, and the cutting seam divides the glass workpiece (10) into inner glass (101) located in the cutting seam and outer glass (102) located outside the cutting seam;
the heating assembly is used for placing the glass workpiece (10) and heating the glass workpiece (10);
the cooling assembly is used for cooling the inner glass (101) to enable the inner glass (101) and the outer glass (102) to form a preset temperature difference, and the temperature of the inner glass (101) is lower than that of the outer glass (102);
the pressurizing assembly (4) is used for applying pressure to the inner glass (101) along the thickness direction of the inner glass, so that the inner glass (101) and the outer glass (102) are separated along the cutting seams.
9. The laser cutting device for glass according to claim 8, characterized in that the laser cutting assembly comprises an infrared picosecond laser (11), a beam-conducting structure and shaping structure (12) and a focusing structure (13), the infrared picosecond laser (11) being adapted to generate an infrared picosecond laser which is conducted through the beam-conducting structure to the shaping structure, the shaping structure being adapted to shape the infrared picosecond laser into an infrared picosecond bessel laser, the focusing structure (13) being adapted to adjust the focus of the infrared picosecond bessel laser.
10. The glass laser cutting device according to claim 8, characterized in that the heating assembly comprises a heating furnace (21) and a heating cushion block (22), the heating furnace (21) is assembled on the machine base, the heating cushion block (22) is assembled on the heating furnace (21), the heating furnace (21) is used for heating the heating cushion block (22), and the heating cushion block (22) is used for bearing the glass workpiece (10);
the cooling assembly comprises a driving mechanism, a cooling block (31) and a cooling device (32), the driving mechanism is assembled on the base, the cooling block (31) is connected to the driving mechanism, the driving mechanism is used for driving the cooling block (31) to move on the heating cushion block (22), the cooling device (32) is assembled on the frame and connected with the cooling block (31), and the cooling device (32) is used for cooling the cooling block (31).
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| CN202110408862.8A CN115215538A (en) | 2021-04-15 | 2021-04-15 | Laser hole cutting method and laser cutting device for glass |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110408862.8A CN115215538A (en) | 2021-04-15 | 2021-04-15 | Laser hole cutting method and laser cutting device for glass |
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Application publication date: 20221021 |