KR20140022980A - Laser cutting apparatus for tempered glass and method for cutting tempered glass - Google Patents

Laser cutting apparatus for tempered glass and method for cutting tempered glass Download PDF

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Publication number
KR20140022980A
KR20140022980A KR1020120088772A KR20120088772A KR20140022980A KR 20140022980 A KR20140022980 A KR 20140022980A KR 1020120088772 A KR1020120088772 A KR 1020120088772A KR 20120088772 A KR20120088772 A KR 20120088772A KR 20140022980 A KR20140022980 A KR 20140022980A
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KR
South Korea
Prior art keywords
tempered glass
glass substrate
unit
initial
initial crack
Prior art date
Application number
KR1020120088772A
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Korean (ko)
Inventor
민성욱
송치영
박대출
김종민
Original Assignee
(주)하드램
동우 화인켐 주식회사
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Application filed by (주)하드램, 동우 화인켐 주식회사 filed Critical (주)하드램
Priority to KR1020120088772A priority Critical patent/KR20140022980A/en
Publication of KR20140022980A publication Critical patent/KR20140022980A/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/072—Armoured glass, i.e. comprising reinforcement
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Abstract

The present invention relates to a tempered glass laser cutting device and method, comprising: a laser light source unit for generating and outputting a laser beam; A scanner unit for adjusting the vertical displacement and the horizontal displacement of the laser beam incident from the laser light source unit to reflect the laser light onto the tempered glass substrate in a predetermined pattern; An initial crack generating unit generating initial cracks through physical impact at one end of a line to be cut of the tempered glass substrate; And a control unit for controlling the operation of the laser light source unit, the scanner unit, and the initial crack generation.

Description

Tempered Glass Laser Cutting Apparatus and Method {LASER CUTTING APPARATUS FOR TEMPERED GLASS AND METHOD FOR CUTTING TEMPERED GLASS}

The present invention relates to an apparatus and method for cutting a tempered glass, and more particularly, to generate initial cracks and scribing lines at a position spaced apart from an edge line of a tempered glass substrate, thereby eliminating damage to the tempered glass, and The present invention relates to a tempered glass laser cutting device and method capable of improving quality.

Thanks to the recent rapid development of electronic communication technology, the functions of these various mobile terminals are rapidly improving. For example, a mobile phone has recently been equipped with a digital camera as well as an internet connection to take pictures and videos. Its wireless transmission is possible, and its memory has been expanded to provide products with functions of a small database such as schedule management and document editing / storage. Meanwhile, the display screen of the mobile communication terminal is composed of a liquid crystal display device (LCD) capable of providing excellent contrast and color reproducibility and capable of mass production. In recent years, an organic light emitting diode Diodes: OLED).

Protective film is used to protect the display screen used in such mobile terminals (mobile phones, PDAs), LCD TVs, LCD monitors, navigation, MP3, PMP, notebooks and the like. If a problem occurs on the screen while using a display product, it can be replaced, but since it is expensive and cumbersome, a lot of protective films are used to prevent such problems.

As a protective film, a transparent substrate or film made of plastic such as PVC, PE, acrylic, PET, etc. is used, but this is weak in physical properties such as heat resistance and hardness due to the characteristics of the plastic material, and recently, polyurethane multi-coated film, etc. Although more reinforced plastic protective film is being released, this situation does not meet the needs of consumers due to its weak physical properties.

In order to solve this problem, a thin tempered glass is used, and the thickness and strength of the tempered glass are being increased at various angles. The production method of tempered glass can be divided into physical strengthening and chemical strengthening. Chemical strengthening method is to strengthen glass through ion exchange, and it can be strengthened both in thin glass and glass of complex shape. Almost no precision.

In addition, it is superior in physical strength in terms of strength, there is an advantage that can be cut and chamfered after chemical strengthening treatment. The chemical strengthening of the glass immerses the heated glass containing alkali in a molten salt bath and modifies the chemical composition of the glass surface through ion exchange between the glass and the molten salt, which forms a compressive layer on the glass surface to improve the strength of the glass. Improve.

1 is a schematic block diagram of a laser cutting device according to the prior art. The laser cutting device shown in FIG. 1 is composed of a wheel 10, a laser unit 20, and a cooling device 30. The wheel 10 mechanically forms micro cracks, and the laser unit 20 radiates and heats the laser along the micro cracks. Then, the cooling device 30 is used to spray the cooling fluid along the scribing line irradiated with the laser to cause the secondary crack to cut.

However, when cutting the chemically strengthened glass as described above using a laser cutting device according to the prior art, it was difficult to process using a laser due to the problem that the edge portion of the tempered glass is damaged or the tempered glass is broken. . Therefore, it is inevitable to perform the process of reinforcing after cutting to the desired size or the size of the product to be used before chemically strengthening process, and due to the limitation of this cutting process, it is inevitably produced in a simple form such as a square, the shape of tempered glass There were many restrictions.

In addition, since the glass may be deformed or stressed due to mechanical processing or the like by the cutting process, it may adversely affect the reliability of the product, and there is a problem in that productivity is lowered because there is a part discarded by the cutting failure.

Korea Patent Registration No. 10-0562423

The present invention is to overcome the above-mentioned conventional problems, the problem to be solved by the present invention in more detail to generate the initial crack and scribing line at a position spaced apart from the edge line of the tempered glass substrate of the tempered glass It is an object of the present invention to provide a tempered glass laser cutting device and method capable of removing damage and improving the quality of a tempered glass cut surface.

According to an aspect of the invention, the laser light source unit for generating and outputting a laser beam; A scanner unit for adjusting the vertical displacement and the horizontal displacement of the laser beam incident from the laser light source unit to reflect the laser light onto the tempered glass substrate in a predetermined pattern; An initial crack generating unit generating initial cracks through physical impact at one end of a line to be cut of the tempered glass substrate; And a control unit for controlling the operation of the laser light source unit, the scanner unit, and the initial crack generation.

The outermost line of the line to be cut is formed spaced apart from the edge line of the tempered glass substrate at a predetermined interval.

The initial crack is generated at a position spaced apart from the edge line of the tempered glass substrate by a predetermined interval, and is formed deeper than the thickness of the compressed layer of the tempered glass substrate.

The depth of the initial crack is formed from 0.1t to 0.4t when the total thickness of the tempered glass substrate is t.

It is installed on the stage for supporting the tempered glass substrate, and further comprises a transfer unit for transferring the scanner unit and the initial crack generating unit in the first axis and second axis direction on the stage.

The initial crack generating unit may include a body part installed in the transfer unit; A crack generation probe unit installed at one end of the body part and forming a crack in the tempered glass substrate; And a body driving part installed in the body part and driving the body part in a vertical direction with respect to the tempered glass substrate.

The apparatus further includes an initial crack position measurement unit configured to measure a position of the initial crack generated on the tempered glass substrate and transmit the measured result to the controller.

The control unit compares the position of the initial crack received from the initial crack position measuring unit with the position of the initial laser beam to be irradiated onto the tempered glass substrate through the scanner unit, and adjusts the initial laser beam irradiation position to adjust the initial position. Control to match the crack position.

And a camera unit for photographing whether or not the initial crack position and the initial laser beam irradiation position are aligned.

The dummy substrate may further include a dummy substrate disposed on the tempered glass substrate on which the initial crack is generated so that the laser beam irradiated through the scanner unit is not directly irradiated onto the tempered glass substrate. Determine whether or not, and adjust the alignment.

According to another aspect of the present invention, setting a cutting schedule line on the tempered glass substrate, wherein the cutting schedule line is set at a predetermined distance from the edge line of the tempered glass substrate; Generating an initial crack at a position corresponding to a starting point of a cut schedule line set on the tempered glass substrate; Measuring a position of initial crack generated on the tempered glass substrate; Determining whether the initial crack position coincides with the initial irradiation position of the laser beam; And judging, if the two are inconsistent, adjusting the initial irradiation position of the laser beam, and if the two are coincident, irradiating the laser beam along the line to be cut using the initial crack position of the tempered glass substrate as a starting point. A tempered glass laser cutting method is provided.

According to the present invention, initial cracks and scribing lines are generated at positions spaced apart from the edge lines of the tempered glass substrate to cut the tempered glass, thereby eliminating damage to the tempered glass and improving the quality of the tempered glass cut surface. .

1 is a schematic configuration diagram of a laser cutting device according to the prior art.
2 is a schematic cross-sectional view of a tempered glass substrate.
Figure 3 is a schematic view showing a cutting schedule line formed on a tempered glass substrate by using a method of cutting a tempered glass laser according to the present invention.
4 is a schematic perspective view of a tempered glass laser cutting device according to an embodiment of the present invention.
5 is a partially enlarged perspective view of a tempered glass laser cutting device according to another embodiment of the present invention.
6 is a functional block diagram of a tempered glass laser cutting device according to another embodiment of the present invention.
Figure 7 is a schematic diagram showing the position of the initial crack generated on the tempered glass substrate by using a method of cutting the tempered glass laser according to the present invention.
8A and 8B are schematic diagrams showing depths of initial cracks generated on a tempered glass substrate.
9 is a flowchart illustrating a method of cutting a tempered glass laser according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

In general, tempered glass is divided into physical tempered glass manufactured by physical strengthening and chemical tempered glass manufactured by chemical strengthening. Physically tempered glass is a method mainly used in the manufacture of glass doors and automotive glass in a manner of strengthening the internal strength of the glass by quenching after heating the glass of 5.0 mm or more to a temperature between 550 ℃ to 700 ℃. However, such physical reinforcement due to high temperature is not applicable to thin glass of 3.0 mm or less, where there is little temperature difference between the glass surface layer and the center layer, and it is difficult to strengthen even in the case of glass having a small thermal expansion coefficient, In the case of glass, not only a temperature difference occurs for each part but also deformation and breakage are likely to occur due to heat treatment by high temperature heating and rapid cooling.

On the other hand, chemically tempered glass replaces sodium ions having a small ionic radius and potassium ions having a large ionic radius in the glass by immersing the thin glass in a heat treatment furnace containing a solution such as potassium nitrate for 3 hours or more. It is used to reinforce glass by generating compressive stress on the glass surface layer. Therefore, it is mainly used for display products used in touch screen products such as mobile terminals (mobile phones, PDAs), LCD TVs, LCD monitors, navigation, MP3, PMP, notebooks, and the like.

2 is a schematic cross-sectional view of a tempered glass substrate, which is a cross-sectional view of a chemically strengthened glass produced by a chemical strengthening method.

Referring to FIG. 2, the tempered glass substrate 50 includes the compression layers 52 and 53 and the internal extension layer 51. The tempered glass substrate 50 is composed of an inner stretched layer 51 present in the inner region and compressive layers 52 and 53 present on the surface of the tempered glass, that is, the upper and lower surfaces of the inner stretched layer 51. . The compressed layers 52 and 53 maintain the compressive stress state by changing the chemical composition of the glass surface through ion exchange between the glass and the molten salt. The inner stretch layer 51 maintains the stretch stress state to balance the force and compensate for the compressive stress of the compressive layer so that the tempered glass does not break. The damage resistance of the chemically strengthened glass substrate is the result of the compression layers 52, 53 formed on the glass substrate during the strengthening process, such as the ion exchange strengthening process. The chemical strengthening process involves exchanging ions in the surface layer of the glass substrate with ions of different sizes such that the glass substrate causes surface compressive stress at the use temperature.

The tempered glass substrate cut by the embodiments of the method described herein is reinforced with a tempering process, such as an ion exchange chemical tempering process, thermal tempering, or laminated glass structure. Although the embodiments are described in connection with a chemically strengthened glass substrate, it may also be applied to other types of toughened glass substrate cutting.

Figure 3 is a schematic view showing a cutting schedule line formed on a tempered glass substrate by using a method of cutting a tempered glass laser according to the present invention.

3 shows a cut schedule line for cutting the tempered glass disc into four unit cell substrates. In the present embodiment, cutting to four unit cell substrates is described as an example, but the number of unit cell substrates to be cut is not limited thereto and may be variously modified.

According to the present invention, a border line of a cutting schedule line (dotted line) is formed to be spaced apart from the edge lines E 1 to E 4 of the tempered glass disc at a predetermined interval a 1 to a 4 , and the cross of the cutting schedule line The line extends from one edge line to the other edge line. In the case of tempered glass, when the laser beam is irradiated to the edge line point of the tempered glass disc, the tempered glass may be broken and thus the entire disc may not be used. Therefore, in the embodiment of the present invention, the cut line is formed to be spaced apart from the edge line of the tempered glass disc so that the laser beam is not irradiated to the edge line of the tempered glass disc.

4 is a schematic perspective view of a tempered glass laser cutting device according to an embodiment of the present invention, Figure 5 is a partially enlarged perspective view of a tempered glass laser cutting device according to another embodiment of the present invention.

4, the tempered glass laser cutting device according to the present embodiment includes a laser light source unit (not shown), a scanner unit 300, an initial crack generating unit 400, a cooling unit 500, and a transfer unit 600. And stage 700.

The initial crack generating unit 400 performs a function of generating an initial crack by physically impacting one end of a line to be cut of the tempered glass substrate 50.

The scanner unit 300 receives the laser beam generated by the laser light source unit and irradiates the laser beam to a line to be cut on the tempered glass substrate.

The transfer unit 600 is installed on the stage 700, and the scanner unit 300, the cooling unit 500, and the initial crack generating unit 400 are mounted on the stage 700 in the first and second axes Y. It performs the function of feeding in the direction of axial direction and X axis direction.

In this embodiment, the transfer unit 600 includes a first transfer guide 610, a second transfer guide 620, and a second transfer guide block 630. The first conveyance guide 610 is disposed above the stage 700 and extends in the first axis direction (Y-axis direction in this embodiment). The second conveyance guide 620 is also disposed above the stage 700, extends in a second axis direction (that is, the X axis direction) intersecting the first axis direction, and is disposed in the first axis direction (Y axis direction). It is coupled to the first transfer guide 610 so as to move along. The second transfer guide block 630 is coupled to the second transfer guide 620 so as to be movable along the second transfer guide 620 along the second axis direction (X-axis direction). The initial crack generating unit 400, the scanner unit 300, and the cooling unit 500 are installed in the second transfer guide block 630, and according to the operation of the transfer unit 600, the first and second axes Y are provided. Along the axial direction and the X-axis direction).

The cooling unit 500 sprays the cooling fluid along the line to be cut of the tempered glass substrate 50 to form cracks. As a result, a scribing line is formed along the line to be cut on the tempered glass substrate 50. .

Referring to FIG. 5, the initial crack generating unit 400 of the tempered glass laser cutting device according to the present embodiment includes a body part 410, a body driving part 420, and a crack generating probe part 430.

The body 410 is installed in the second transfer guide block 630 of the transfer unit 600 illustrated in FIG. 4, and according to the operation of the transfer unit 600, the first and second axes (Y-axis direction and Along the X-axis direction) is moved above the stage 600. The crack generating probe part 430 is installed at one end of the body part 410 and is formed in a pointed end. The crack generation probe 430 is formed of a material having a relatively stronger strength than the compressed layer of the tempered glass substrate.

The body driving part 420 is installed in the body part 410 and performs a function of driving the body part 410 in the z-axis direction, that is, in the vertical direction. When the initial crack generating unit 400 is positioned by the transfer unit 600 at the start point of the line to be cut of the tempered glass substrate, that is, the initial crack, the body driving unit 420 moves downward toward the tempered glass substrate to generate cracks. The probe portion 430 contacts the tempered glass substrate to form initial cracks.

6 is a functional block diagram of a tempered glass laser cutting device according to another embodiment of the present invention.

Referring to FIG. 6, the tempered glass laser cutting device according to the present embodiment may include a laser light source unit 100, an optical unit 200, a scanner unit 300, an initial crack generating unit 400, a cooling unit 500, The transfer unit 600, the stage 700, the initial crack position measuring unit 800 and the control unit 900 are included.

The laser light source unit 100 generates and outputs a laser beam. As shown in FIG. 5, a laser beam power regulator 150 installed at the rear end of the laser light source unit 100 to adjust and output power of the laser beam may be added.

The optical unit 200 adjusts the optical path of the laser beam emitted from the laser light source unit 100 or adjusts the focus of the laser beam.

The optical unit 200 includes a mirror unit 210 and a focus lens unit 230, and the mirror unit 210 is installed at the rear end of the laser light source unit 100 or the laser beam power regulator 150, thereby providing a laser light source. The laser beam incident from the unit 100 or the laser beam power regulator 150 is reflected to the scanner unit 200. The focus lens unit 230 is installed at the rear end of the scanner unit 200 and the upper portion of the stage 600, and adjusts the laser beam incident from the scanner unit 200 to focus on the substrate 10.

The scanner unit 300 adjusts the vertical and horizontal displacements of the laser beam incident from the laser light source unit 100 or the laser beam power regulator 150 to reflect the laser light onto the substrate in a desired pattern form. In this case, the scanner unit 300 is driven according to the control signal of the controller based on the cutting schedule line stored in the laser beam pattern information unit (not shown) and the laser beam scan line information of the scanner unit.

The scanner unit 300 includes a combination of a first scanner unit (not shown) and a second scanner unit (not shown), and the first scanner unit includes a first axial direction of the laser beam incident from the laser light source unit 100. For example, the displacement of the x-axis) is adjusted, and the second scanner unit adjusts the displacement of the second axis direction (eg, the y-axis) perpendicular to the first axis direction. The first scanner unit includes a first galvano mirror and a first galvano mirror driver for driving the second galvano mirror, and the second scanner unit includes a second galvano mirror and a second galvano mirror driver for driving the same.

The cooling unit 500 sprays a cooling fluid along a line to be cut of the tempered glass substrate 50 to form cracks. As a result, a scribing line is formed along the line to be cut on the substrate 50.

The transfer unit 600 is installed on the stage 700, and the scanner unit 300, the cooling unit 500, and the initial crack generating unit 400 are mounted on the stage 700 in the first and second axes Y. Axial direction and X axis direction).

The breaking unit (not shown) serves to cut the substrate along the scribing line formed on the substrate. The braking unit may be formed integrally with the laser cutting device, but may be installed as a separate device.

Such a breaking unit may be embodied in the form of breaking by applying mechanical external force to the scribing line formed on the substrate, or by breaking by using thermal deformation due to temperature difference or by irradiating a laser along the scribing line. There is also.

The stage 700 supports the tempered glass substrate 50 and is configured to move the tempered glass substrate 50 in a predetermined direction.

The initial crack position measuring unit 800 measures the position of the initial crack generated on the tempered glass substrate 50, and transmits the measured result to the controller 900.

The controller 900 compares the position of the initial crack received from the initial crack position measuring unit 800 with the position of the initial laser beam to be irradiated onto the tempered glass substrate 50 through the scanner unit 300. As a result of comparison, when the initial laser beam irradiation position is different from the initial crack position generated on the tempered glass substrate, the initial laser beam may be modified by modifying pattern information of the laser beam provided to the scanner unit 300 or adjusting the position of the stage. Match the irradiation position of the beam and the initial crack position.

On the other hand, the camera unit for photographing whether the position of the initial crack and the irradiation position of the initial laser beam is aligned can be further configured. At this time, the dummy substrate is disposed on the tempered glass substrate 50 where the initial crack is generated so that the laser beam irradiated through the scanner unit 300 is not directly irradiated onto the tempered glass substrate, and then the laser beam is placed on the tempered glass substrate. Investigate to determine whether to align, and perform alignment.

7 is a schematic view showing the position of the initial crack generated on the tempered glass substrate by using the tempered glass laser cutting method of the present invention, Figures 8a and 8b shows the depth of the initial crack generated on the tempered glass substrate. Schematic diagram.

7 to 8B, the initial crack A is formed spaced apart from the edge line of the tempered glass substrate by a predetermined distance a, and is formed at the starting point of the cutting schedule line L 1 .

In addition, the depth d of the initial crack A is formed deeper than the thickness of the upper compressive layer 52, and extends to the upper region of the inner extension layer 51. When the total thickness of the tempered glass substrate is t, the depth d of the initial crack A is preferably formed to be 0.1t to 0.4t. If the depth of the initial crack (A) is shallower than the thickness of the upper compressive layer 52, even if the laser beam is irradiated is not transmitted to the inner extension layer 51, the scribing line is not properly formed on the tempered glass substrate There is this. On the other hand, when the depth of the initial crack (A) is formed deeper than the center of the inner extension layer 51 may cause a problem that the tempered glass substrate is ruptured because the inner extension layer 51 is beyond the impact range to withstand. .

9 is a flowchart illustrating a method of cutting a tempered glass laser according to the present invention.

Referring to Figure 9, looking at the tempered glass laser cutting method according to this embodiment, the tempered glass substrate is loaded on the tempered glass laser cutting device (S10).

A cutting schedule line is set on the loaded tempered glass substrate (S20). At this time, the line to be cut is formed to be spaced apart from the edge line of the tempered glass substrate by a predetermined interval.

A process of generating an initial crack at a position corresponding to the starting point of the cutting schedule line set on the tempered glass substrate is performed (S30). Next, the position of the initial crack produced on the tempered glass substrate is measured (S40).

Thereafter, a process of determining whether the initial crack position coincides with the initial irradiation position of the laser beam is performed (S50). As a result of the determination, when the two do not match, after performing the step S60 of adjusting the initial irradiation position of the laser beam, the process S50 is performed again.

On the other hand, when the initial crack position of the initial laser beam coincides with the initial crack position in step S50, the process of irradiating the laser beam along the cutting schedule line using the initial crack position of the tempered glass substrate as a starting point (S70). .

After irradiating the laser beam to form a scribing line by spraying the coolant through the cooling unit (S80). Then, the substrate is cut through the breaking process (S90).

What has been described above is merely an exemplary embodiment of a tempered glass laser cutting device and method according to the present invention, the present invention is not limited to the above-described embodiment, as claimed in the claims below, Without departing from the gist of the present invention, one of ordinary skill in the art will have the technical spirit of the present invention to the extent that various modifications can be made.

100: laser light source unit
200: optical unit
300: scanner unit
400: initial crack generation unit
500: Cooling unit
600: transfer unit
700 stage
800: initial crack position measuring unit
900:

Claims (11)

In the tempered glass laser cutting device,
A laser light source unit generating and outputting a laser beam;
A scanner unit for adjusting the vertical displacement and the horizontal displacement of the laser beam incident from the laser light source unit to reflect the laser light onto the tempered glass substrate in a predetermined pattern;
An initial crack generating unit generating initial cracks through physical impact at one end of a line to be cut of the tempered glass substrate; And
And a control unit for controlling the operation of the laser light source unit, the scanner unit, and the initial crack generation.
The method according to claim 1,
And the outermost line of the cut line is formed at a predetermined interval from the edge line of the tempered glass substrate.
The method according to claim 1,
The initial crack is generated at a position spaced apart from the edge line of the tempered glass substrate by a predetermined interval, the tempered glass laser cutting device, characterized in that formed deeper than the thickness of the compressed layer of the tempered glass substrate.
The method according to claim 3,
The depth of the initial crack is tempered glass laser cutting device, characterized in that when the total thickness of the tempered glass substrate is t, 0.1t ~ 0.4t.
The method according to claim 1,
A tempered glass laser installed on an upper part of the stage supporting the tempered glass substrate, and further comprising a conveying unit configured to convey the scanner unit and the initial crack generating unit in the first and second axis directions on the stage. Cutting device.
The method according to claim 5,
The initial crack generation unit,
A body part installed in the transfer unit;
A crack generation probe unit installed at one end of the body part and forming a crack in the tempered glass substrate; And
And a body driving part installed in the body part and driving the body part in an up and down direction based on the tempered glass substrate.
The method according to claim 5,
Tempered glass laser cutting device further comprises an initial crack position measuring unit for measuring the position of the initial crack generated on the tempered glass substrate, and transmits the measured result to the controller.
The method of claim 7,
The control unit compares the position of the initial crack received from the initial crack position measuring unit with the position of the initial laser beam to be irradiated onto the tempered glass substrate through the scanner unit, and adjusts the initial laser beam irradiation position to adjust the initial position. Tempered glass laser cutting device characterized in that the control to match the crack position.
The method according to claim 5,
And a camera unit for photographing whether the initial crack position is aligned with the initial laser beam irradiation position.
The method of claim 9,
The dummy substrate may further include a dummy substrate disposed on the tempered glass substrate on which the initial crack is generated so that the laser beam irradiated through the scanner unit is not directly irradiated onto the tempered glass substrate. The glass cutting device for tempered glass, characterized in that for determining whether or not to adjust the alignment.
In the tempered glass laser cutting method,
Setting a cut schedule line on a tempered glass substrate, wherein the cut schedule line is set at a predetermined distance from an edge line of the tempered glass substrate;
Generating an initial crack at a position corresponding to a starting point of a cut schedule line set on the tempered glass substrate;
Measuring a position of initial crack generated on the tempered glass substrate;
Determining whether the initial crack position coincides with the initial irradiation position of the laser beam; And
As a result of the determination, if the two are inconsistent, adjusting the initial irradiation position of the laser beam, and if the two are matched, irradiating the laser beam along a cutting schedule line with the initial crack position of the tempered glass substrate as a starting point. Tempered glass laser cutting method characterized in that.
KR1020120088772A 2012-08-14 2012-08-14 Laser cutting apparatus for tempered glass and method for cutting tempered glass KR20140022980A (en)

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KR1020120088772A KR20140022980A (en) 2012-08-14 2012-08-14 Laser cutting apparatus for tempered glass and method for cutting tempered glass

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KR1020120088772A KR20140022980A (en) 2012-08-14 2012-08-14 Laser cutting apparatus for tempered glass and method for cutting tempered glass

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