KR101652895B1 - Apparatus and method for polishing substrate edge using laser - Google Patents

Apparatus and method for polishing substrate edge using laser Download PDF

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Publication number
KR101652895B1
KR101652895B1 KR1020150046339A KR20150046339A KR101652895B1 KR 101652895 B1 KR101652895 B1 KR 101652895B1 KR 1020150046339 A KR1020150046339 A KR 1020150046339A KR 20150046339 A KR20150046339 A KR 20150046339A KR 101652895 B1 KR101652895 B1 KR 101652895B1
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South Korea
Prior art keywords
polishing
unit
substrate
mirror
laser light
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KR1020150046339A
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Korean (ko)
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민성욱
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(주)하드램
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • B23K26/0075—

Abstract

The present invention relates to an apparatus and method for polishing a substrate edge using a laser, and more particularly, to a laser light source unit for generating and outputting laser light. A polishing scanner unit installed at a rear end of the laser light source unit and adapted to adjust the vertical displacement and the horizontal displacement of the laser light incident from the laser light source unit and reflect the laser light in a desired pattern form; A polishing mirror disposed so as to face the side surface of the target substrate and configured to reflect laser light incident from the polishing scanner to a side surface of the target substrate; A heating block provided on the stage for preheating or heating the substrate to be processed; A stage unit for supporting the heating block unit; And a controller for controlling operations of the laser light source unit, the polishing scanner unit, the polishing mirror unit, the heating block unit, and the stage unit.

Description

[0001] The present invention relates to a polishing apparatus and method for polishing a substrate edge using a laser,

The present invention relates to a substrate edge polishing apparatus and method using a laser, and more particularly, to a substrate edge polishing apparatus and method using a laser for polishing a cut portion by irradiating a laser on an edge region side of a cut glass substrate .

Recently, the functions of these various mobile terminals have been rapidly improved due to the remarkable development of the electronic communication technology. For example, in recent years, the functions of the mobile phones have been equipped with digital cameras, It is possible to wirelessly transmit the data, and a product having a small database function such as schedule management and editing / storing of the document is being released by expanding the memory. Meanwhile, the display screen of the mobile communication terminal is composed of a liquid crystal display device (LCD) capable of providing excellent contrast and color reproducibility and capable of mass production. In recent years, an organic light emitting diode Diodes: OLED). In addition, the mobile communication terminal includes a window plate for protecting a display screen, that is, a liquid crystal display device or an organic light emitting diode. The window plate is mainly formed of glass, and the thickness of the window plate is gradually becoming thinner due to the thinning of the mobile communication terminal and the application of the touch screen.

Further, in the process of manufacturing flat panel display devices such as LCD, PDP, and OLED, the glass substrate of the original plate is cut according to the size of each module after the laminating process of the cell process, or only the glass substrate of the top plate is selectively cut Is carried out.

Generally, the cutting of the glass substrate includes a mechanical cutting method and a laser cutting method. The mechanical cutting method uses a diamond wheel to make a lateral crack on the glass substrate and then cuts off the sharp edges by grinding.

The laser cutting method uses a laser to cut a window plate or a glass substrate. The basic principle of laser cutting is to heat the cutting substrate below the softening point using a laser, It maximizes the force and cuts by minimizing the loss of material. Such a laser thermal cutting method can be largely classified into a laser full cutting method and a scribing and laser breaking method.

In the cut portion of the above-mentioned mechanical or laser-cut glass substrate, sharp edges are generated. The sharp edges are vulnerable to an external impact and have a problem of inhomogeneity in quality. Therefore, the sharp edges should be chamfered through a grinding or polishing process (polishing process).

In the conventional case, generally, an R-edge method is used in which a sharp edge portion is machined, that is, an entire edge surface is rounded by giving a predetermined depth to the entire edge surface. However, the R-edge method increases the possibility of contamination of the glass substrate due to the generation of particles of various sizes as the processing is performed by giving the infeed amount over the whole corners, and the advantages It is difficult to maintain the same.

Another method of polishing the edge region of the glass substrate is to mechanically polish the substrate by using a polishing wheel or a polishing pad (see FIG. 1). However, in the case of mechanical polishing, the processing speed is low, There is a problem that the unit cost of processing the glass substrate increases.

In another method of the prior art, there is a fire polishing method in which a sharp edge surface of a cut glass substrate is fused by using a burner. However, in the case of such a fire polishing, unnecessary heat There is a disadvantage in that the quality of the glass substrate is deteriorated and the processing speed is low.

Korean Patent No. 10-0895830

SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus and method for polishing a substrate edge using a laser.

According to an exemplary embodiment of the present invention, there is provided a laser light source comprising: a laser light source unit for generating and outputting laser light; A polishing scanner unit installed at a rear end of the laser light source unit and adapted to adjust the vertical displacement and the horizontal displacement of the laser light incident from the laser light source unit and reflect the laser light in a desired pattern form; A polishing mirror disposed so as to face the side surface of the target substrate and configured to reflect laser light incident from the polishing scanner to a side surface of the target substrate; A heating block provided on the stage for preheating or heating the substrate to be processed; A stage unit for supporting the heating block unit; And a controller for controlling operations of the laser light source unit, the polishing scanner unit, the polishing mirror unit, the heating block unit, and the stage unit.

And a mirror driver installed on a rear surface of the polishing mirror to rotate the polishing mirror within a predetermined angle while supporting the polishing mirror.

The polishing mirror portion is provided on each of four sides of the substrate to be processed, and the polishing mirror portion is composed of a first polishing mirror, a second polishing mirror, a third polishing mirror, and a fourth polishing mirror.

The length of each polishing mirror is formed longer than the length of the substrate to be processed, and the width of the polishing mirror is formed to be wider than the thickness of the substrate to be processed.

The mirror driver is installed in each polishing mirror, and the mirror driver is composed of a first mirror driver, a second mirror driver, a third mirror driver, and a fourth mirror driver.

The polishing mirror unit may further include a rotation driving unit disposed between the stage unit and the heating block unit to rotate the heating block unit. The polishing mirror unit may be spaced apart from any one of four sides of the substrate to be processed.

The laser light source unit generates and outputs a laser beam having a wavelength of 9 to 11 μm, and the size of the laser light spot is 2 to 30 mm.

According to another aspect of the present invention, there is provided a laser processing apparatus comprising: a laser light source unit for generating and outputting laser light; A plurality of laser beams emitted from the laser light source unit are vertically displaced and horizontally displaced to form a desired pattern on one side of the substrate to be processed, A polishing scanner part for reflecting light; A heating block provided on the stage for preheating or heating the substrate to be processed; A stage unit for supporting the heating block unit; A rotation driving unit installed between the stage unit and the heating block unit and rotating the heating block unit; And a control unit for controlling operations of the laser light source unit, the polishing scanner unit, the heating block unit, the stage unit, and the rotation driving unit.

According to still another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: firstly preheating a substrate to be processed; Secondly preheating the substrate to be processed; Irradiating laser light onto edge sides of the substrate to be processed to perform healing and polishing; And performing annealing and cooling for lowering the temperature of the edge side of the substrate to be processed, wherein the performing of the healing and polishing includes irradiating the polishing scanner unit with the laser light generated in the laser light source unit, And the scanner portion irradiates the edge side surface of the substrate to be processed through the polishing mirror portion.

Wherein the first preheating step firstly preheats the target substrate by heating the heating block part and performs a first preheating at a temperature of 280 to 300 degrees Celsius and the second preheating step heats the target substrate by heating the heating block part, Second preheating, and secondary preheating at 450 to 650 degrees Celsius.

The step of performing the healing and polishing is characterized by elevating the edge side of the substrate to be processed to 700 to 1100 degrees Celsius through laser light irradiation.

As described in the present invention, the localization of the region to be polished is instantaneously performed locally using the laser light to polish the wafer, thereby minimizing the transfer of unnecessary heat to the glass substrate, thereby improving the quality of the glass substrate. Can also be shortened.

1 is a schematic view showing a glass substrate edge polishing process according to the prior art.
2 is a schematic configuration diagram of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention.
3 is a schematic perspective view of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention.
4 is a functional block diagram of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention.
5 is a schematic configuration diagram of a substrate edge polishing apparatus using a laser according to another embodiment of the present invention.
6 is a functional block diagram of a substrate edge polishing apparatus using the laser of FIG.
7 is a schematic configuration diagram of a substrate edge polishing apparatus using a laser according to another embodiment of the present invention.
8 is a flowchart illustrating a polishing process of the substrate edge polishing apparatus using the laser of the present invention.
9 is a view showing a time and temperature profile of the method of polishing a substrate edge using the laser shown in FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a schematic perspective view of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention. FIG. 3 is a schematic perspective view of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention. 4 is a functional block diagram of a substrate edge polishing apparatus using a laser according to an embodiment of the present invention.

2 to 4, a substrate edge polishing apparatus using a laser according to the present embodiment includes a laser light source unit 100, a polishing scanner unit 200, a polishing mirror unit 300, a mirror driving unit 400, Unit 500, a stage unit 600, and a control unit 900. As shown in FIG.

The laser light source unit 100 generates and outputs a laser light. In the case of this embodiment, only the laser light source is described as a constituent element. However, the present invention is not limited thereto, and it may further include a reflection mirror for changing the direction of the laser light or an optical attenuator for outputting the laser light by adjusting the power of the laser light.

In this embodiment, the laser light source unit 100 generates and outputs a laser beam having a wavelength range of 9 to 11 mu m, and a laser light spot having a size of 2 to 30 mm is used.

The polishing scanner unit 200 is installed at the rear end of the laser light source unit 100 and adjusts the vertical displacement and horizontal displacement of the laser light incident from the laser light source unit 100 to move the laser light to the polishing mirror unit 300 in a desired pattern shape Reflection function.

Although the configuration of the polishing scanner unit 200 is not shown in the present embodiment, the polishing scanner unit 200 may be configured by a combination of a first galvanometer scanner and a second galvanometer scanner. The first galvanometer scanner adjusts the displacement of the laser light incident from the laser light source in the first axial direction and the second galvano scanner performs the function of adjusting the displacement in the second axial direction perpendicular to the first axial direction.

The first galvanometer scanner includes a first galvanometer mirror and a first galvanometer mirror driving unit, and the second galvanometer scanner may include a second galvanometer mirror and a second galvanometer mirror driving unit. The first galvanometer mirror is rotatably installed to reflect the laser beam. The first galvanometer mirror driving unit is installed at an end of the first galvanometer mirror to support the first galvanometer mirror, . The second galvanometer mirror is rotatably installed to reflect the laser beam. The second galvanometer mirror driving part is installed at an end of the second galvanometer mirror to support the second galvanometer mirror, Rotate the mirror. The laser light reflected by the first galvano mirror is incident on the second galvano mirror, and the laser light incident on the second galvano mirror is reflected toward the substrate.

The polishing mirror unit 300 is disposed to be spaced apart from the periphery of the target substrate S and is disposed to face the side surface of the target substrate S. The polishing mirror unit 300 functions to reflect the laser light incident from the polishing scanner unit 200 to the side of the substrate S, that is, the area to be polished.

The polishing mirror unit 300 is installed on four sides of the substrate S and the polishing mirror unit 300 includes a first polishing mirror 310, a second polishing mirror 320, A polishing mirror 330 and a fourth polishing mirror 340. Each polishing mirror is spaced apart from the substrate S, and the length of the polishing mirror is longer than the length of the substrate to be processed, and the width of the polishing mirror is larger than the thickness of the substrate to be processed.

The mirror driving unit 400 rotates the polishing mirror unit 300 to adjust the irradiation direction of the laser light. In order to perform polishing using the laser, the laser light is preferably irradiated in a direction perpendicular to the side of the substrate S to be processed. To this end, the mirror driving part 400 rotates the polishing mirror part 300, .

The mirror driving unit 400 is installed on the rear side of the polishing mirror unit 300 and rotates the polishing mirror unit 300 within a predetermined angle range while supporting the polishing mirror unit 300.

In the present embodiment, the mirror driving unit 400 is installed in each polishing mirror, and the mirror driving unit 400 includes a first mirror driving unit 410, a second mirror driving unit 420, a third mirror driving unit (not shown) 4 mirror driver (not shown).

Although not shown in the present embodiment, a sensor unit (not shown) that detects the angle of incidence of the laser beam reflected from the polishing mirror unit 300 and irradiated to the side surface of the substrate S is additionally configured . The sensor unit measures the angle of incidence of the laser light and transmits the measured result to the control unit. The control unit determines the rotation angle of the mirror driving unit 400 based on the measurement result and transmits the rotation control signal to the mirror driving unit 400. The mirror driving unit 400 rotates and drives according to the received rotation control signal, Thereby rotating the part 300. As described above, when the sensor unit is additionally provided, the laser light output from the laser light source unit can be vertically incident on the side surface of the substrate S to be polished even when the environment and conditions are changed during the polishing process, The polishing time can be shortened.

The heating block unit 500 is installed on the stage unit 600 and shortens the polishing time by laser irradiation by preheating or heating the substrate S under the control of the controller 900, (S). The heating block unit 500 is formed smaller than the size of the substrate S or the size of the heating block unit 500 is formed larger than the size of the heating block unit 500, Is disposed so as not to be in contact with the heating block portion (500).

The stage unit 600 performs a function of supporting the heating block unit 500 and the substrate S to be processed.

The control unit 900 controls the operation of the laser light source unit 100, the polishing scanner unit 200, the polishing mirror unit 300, the mirror driving unit 400, the heating block unit 500, and the stage unit 600 .

FIG. 5 is a schematic structural view of a substrate edge polishing apparatus using a laser according to another embodiment of the present invention, and FIG. 6 is a functional block diagram of a substrate edge polishing apparatus using the laser of FIG.

5 and 6, a substrate edge polishing apparatus using a laser according to the present embodiment includes a laser light source unit 100, a polishing scanner unit 200, a polishing mirror unit 300, a mirror driving unit 400, A stage unit 600, a rotation driving unit 700,

The laser light source unit 100 generates and outputs a laser light.

The polishing scanner unit 200 is installed at the rear end of the laser light source unit 100 and is disposed above the substrate S to be processed. And controls the vertical displacement and the horizontal displacement of the laser light incident from the laser light source part 100 to reflect the laser light to the polishing mirror part 300 in a desired pattern shape.

The polishing mirror unit 300 is disposed so as to be spaced apart from one side of the target substrate S and faces the side surface of the target substrate S. The polishing mirror unit 300 functions to reflect the laser light incident from the polishing scanner unit 200 to the side of the substrate S, that is, the area to be polished. In the present embodiment, the polishing mirror unit 300 is disposed to be spaced apart from any one of four sides of the substrate S to be processed.

The mirror driving unit 400 is installed on the rear side of the polishing mirror unit 300 and rotates the polishing mirror unit 300 within a predetermined angle range while supporting the polishing mirror unit 300.

The heating block unit 500 is installed on the stage unit 600 and shortens the polishing time by laser irradiation by preheating or heating the substrate S under the control of the controller 900, And the stage unit 600 performs a function of supporting the heating block unit 500 and the substrate S to be processed.

The rotation driving unit 700 is installed between the stage unit 600 and the heating block unit 500 and rotates the heating block unit 500. When the polishing process of one side edge of the substrate S is completed, the rotation driving unit 700 is rotated to face the adjacent side edge, that is, the planned polishing side, to the polishing mirror unit 300 in order to perform polishing of the adjacent side edge do.

7 is a schematic configuration diagram of a substrate edge polishing apparatus using a laser according to another embodiment of the present invention.

7, a substrate edge polishing apparatus using a laser according to the present embodiment includes a laser light source unit 100, a polishing scanner unit 200, a heating block unit 500, a stage unit 600, a rotation driving unit 700, And a control unit 900.

This embodiment is an example in which the polishing mirror portion and the mirror driving portion are omitted, and the polishing is performed by reflecting the laser light only to the side of the substrate S, that is, the region to be polished, with the polishing scanner alone.

The polishing scanner unit 200 is disposed on one side of the target substrate S so as to face the side surface of the target substrate S. That is, in the case of the present embodiment, the polishing scanner unit 200 is arranged to be spaced apart from any one of four sides of the substrate S to be processed. The polishing scanner unit 200 adjusts the vertical displacement and the horizontal displacement of the laser light incident from the laser light source unit 100 to reflect the laser light to the side of the substrate S to be processed, that is, the area to be polished, .

The rotation driving unit 700 is installed between the stage unit 600 and the heating block unit 500 and rotates the heating block unit 500. When the polishing process of one side edge of the substrate S is completed, the rotation driving unit 700 is rotated to face the adjacent side edge, that is, the planned polishing side, to the polishing scanner unit 200 in order to perform polishing of the adjacent side edge do.

FIG. 8 is a flowchart illustrating a polishing process of the substrate edge polishing apparatus using the laser of the present invention, and FIG. 9 is a view illustrating a time and temperature profile of the substrate edge polishing method using the laser shown in FIG.

Referring to FIGS. 8 and 9, first, a process of preheating a substrate to be processed, that is, a glass substrate, is performed (S100). At this time, the glass substrate is first preheated by heating the heating block, and primary preheating is performed at about 300 degrees centigrade.

Next, a second preheating process is performed on the glass substrate (S200).

In the second preheating step, the temperature of the heating block is increased to secondarily preheat the glass substrate, and the heating is continued for about 20 to 30 seconds to raise the temperature of the glass substrate to about 450 to 650 degrees Celsius.

Then, laser light is irradiated to the edge side of the glass substrate to perform a healing and polishing process (S300). At this time, the laser light source unit causes the generated laser light to enter the polishing scanner unit, and the polishing scanner unit irradiates the edge side of the glass substrate through the polishing mirror unit to perform the healing and polishing process. The edge side of the glass substrate is raised by about 700 to 1100 degrees Celsius through the laser light irradiation to perform the polishing process.

Next, an annealing process for gradually lowering the temperature of the edge side of the glass substrate is performed (S400), and a cooling process for cooling the temperature of the glass substrate is performed (S500).

As described above, the present invention is not limited to the above-described embodiments, and it is to be understood that the present invention is not limited to the above-described embodiments, It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

100: laser light source part
200: Polishing scanner part
300: Polishing mirror part
400: mirror driver
500: Heating block part
600:
700:
900:

Claims (11)

A substrate edge polishing apparatus using a laser,
A laser light source unit for generating and outputting laser light;
A polishing scanner unit installed at a rear end of the laser light source unit and adapted to adjust the vertical displacement and the horizontal displacement of the laser light incident from the laser light source unit and reflect the laser light in a desired pattern form;
A polishing mirror disposed so as to face the side surface of the target substrate and configured to reflect laser light incident from the polishing scanner to a side surface of the target substrate;
A heating block provided on the stage for preheating or heating the substrate to be processed;
A stage unit for supporting the heating block unit;
A rotation driving unit installed between the stage unit and the heating block unit and rotating the heating block unit; And
And a control unit for controlling operations of the laser light source unit, the polishing scanner unit, the polishing mirror unit, the heating block unit, and the stage unit,
Wherein the polishing mirror portion is spaced apart from any one of four sides of the substrate to be processed, the heating block portion is formed to be smaller than the size of the substrate to be processed,
Wherein the laser light source unit generates and outputs a laser beam having a wavelength of 9 to 11 μm, and the size of the laser light spot is 2 to 30 mm.
The method according to claim 1,
Further comprising a mirror driving unit installed on a rear surface of the polishing mirror unit and rotating the polishing mirror unit within a predetermined angle range while supporting the polishing mirror unit.
3. The method of claim 2,
Wherein the polishing mirror portion is provided on each of four sides of the substrate to be processed, and the polishing mirror portion is composed of a first polishing mirror, a second polishing mirror, a third polishing mirror, and a fourth polishing mirror,
The length of each polishing mirror is formed longer than the length of the substrate to be processed, the width of the polishing mirror is formed wider than the thickness of the substrate to be processed,
Wherein the mirror driving unit is installed in each of the polishing mirrors, and the mirror driving unit comprises a first mirror driving unit, a second mirror driving unit, a third mirror driving unit, and a fourth mirror driving unit.
delete delete delete delete delete A method of polishing a substrate edge using a laser using a laser-based substrate edge polishing apparatus according to any one of claims 1 to 3,
A method of polishing a substrate edge using a laser,
Firstly preheating the substrate to be processed;
Secondly preheating the substrate to be processed;
Irradiating laser light onto edge sides of the substrate to be processed to perform healing and polishing; And
And performing annealing and cooling to lower the temperature of the edge side of the substrate to be processed,
Wherein the step of performing the healing and polishing includes irradiating a laser beam generated by the laser light source unit to the polishing scanner unit and causing the polishing scanner unit to irradiate the edge side surface of the substrate to be processed through the polishing mirror unit, Way.
10. The method of claim 9,
Wherein the first preheating step firstly preheats the substrate to be processed by heating the heating block part, performs a first preheating at 280 to 300 degrees Celsius,
Wherein the second preheating step secondarily preheats the substrate by heating the heating block part and performs secondary preheating at 450 to 650 degrees Celsius.
10. The method of claim 9,
Wherein the step of performing the healing and polishing raises the edge side of the substrate to be processed to 700 to 1100 degrees Celsius by laser light irradiation.
KR1020150046339A 2015-04-01 2015-04-01 Apparatus and method for polishing substrate edge using laser KR101652895B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210016493A1 (en) * 2017-11-26 2021-01-21 D. Swarovski Kg Heat treatment of 3d printed parts for improving transparency, smoothness and adhesion of layers
CN112429953A (en) * 2020-11-26 2021-03-02 四川旭虹光电科技有限公司 Glass substrate edge polishing system and method

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007245235A (en) * 2006-02-14 2007-09-27 Shibaura Mechatronics Corp Laser machining apparatus and laser machining method
KR100895830B1 (en) 2007-11-23 2009-05-06 삼성코닝정밀유리 주식회사 Method for cutting the edge of the flat display glass substrate
KR20110008373A (en) * 2009-07-20 2011-01-27 한국과학기술원 Rounding apparatus for glass substrate and rounding method using the rounding apparatus
KR101388181B1 (en) * 2012-09-04 2014-04-30 (주)하드램 Laser cutting apparatus for glass substrate and method for cutting glass substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245235A (en) * 2006-02-14 2007-09-27 Shibaura Mechatronics Corp Laser machining apparatus and laser machining method
KR100895830B1 (en) 2007-11-23 2009-05-06 삼성코닝정밀유리 주식회사 Method for cutting the edge of the flat display glass substrate
KR20110008373A (en) * 2009-07-20 2011-01-27 한국과학기술원 Rounding apparatus for glass substrate and rounding method using the rounding apparatus
KR101388181B1 (en) * 2012-09-04 2014-04-30 (주)하드램 Laser cutting apparatus for glass substrate and method for cutting glass substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210016493A1 (en) * 2017-11-26 2021-01-21 D. Swarovski Kg Heat treatment of 3d printed parts for improving transparency, smoothness and adhesion of layers
CN112429953A (en) * 2020-11-26 2021-03-02 四川旭虹光电科技有限公司 Glass substrate edge polishing system and method

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