CN103359948A - Method for cutting tempered glass - Google Patents

Method for cutting tempered glass Download PDF

Info

Publication number
CN103359948A
CN103359948A CN2013102933884A CN201310293388A CN103359948A CN 103359948 A CN103359948 A CN 103359948A CN 2013102933884 A CN2013102933884 A CN 2013102933884A CN 201310293388 A CN201310293388 A CN 201310293388A CN 103359948 A CN103359948 A CN 103359948A
Authority
CN
China
Prior art keywords
glass
cut
tempered glass
acid
cutting
Prior art date
Application number
CN2013102933884A
Other languages
Chinese (zh)
Inventor
王春平
罗成文
孙官恩
王站娥
马晓健
李一峰
杨利平
廖亮飞
桂政兴
Original Assignee
深圳南玻伟光导电膜有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳南玻伟光导电膜有限公司 filed Critical 深圳南玻伟光导电膜有限公司
Priority to CN2013102933884A priority Critical patent/CN103359948A/en
Publication of CN103359948A publication Critical patent/CN103359948A/en

Links

Abstract

The invention discloses a method for cutting tempered glass. The method comprises the following steps of: providing a piece of tempered glass to be cut, covering acid-resisting protecting films on non-cut parts at the positive side and the back side of the tempered glass to be cut, subsequently spraying a chemical corrosive liquid to the positive side of the tempered glass to be cut, and carrying out chemical etching for 40-80 minutes so as to obtain cut tempered glass. According to the method for cutting the tempered glass, the tempered glass to be cut is cut by spraying the chemical corrosive liquid on the positive side and the back side of the tempered glass to be cut. Compared with the conventional method that the tempered glass is cut in a mechanical or laser mode, the method for cutting the tempered glass prevents the edge of the tempered glass from micro-crack, crack points and crack sides, so that the compressive strength of the edge of the tempered glass is not reduced.

Description

钢化玻璃的切割方法 Tempered glass cutting methods

技术领域 FIELD

[0001] 本发明涉及钢化玻璃加工领域,特别涉及一种钢化玻璃的切割方法。 [0001] The present invention relates to glass processing, and more particularly relates to a method for cutting the glass.

背景技术 Background technique

[0002] 传统的钢化玻璃切割方法主要通过水刀、砂刀、刀轮等机械物理切割的形式或激光切割的方式进行。 [0002] The conventional glass cutting method by means of mainly water jet, sand cutter, cutter wheel and other mechanical and physical form of cutting or laser cutting. 切割完成后,钢化玻璃边缘不可避免的会产生微裂纹、崩点和崩边,从而导致钢化玻璃边缘的抗压强度降低。 After cutting, the edges of glass micro-cracks inevitably, collapse point and chipping, leading to reduction in the compressive strength of glass edge.

发明内容 SUMMARY

[0003] 基于此,有必要提供一种不会导致钢化玻璃边缘的抗压强度降低的钢化玻璃的切割方法。 [0003] Based on this, it is necessary to provide a glass cutting process does not result in compressive strength of glass edges is reduced.

[0004] 一种钢化玻璃的切割方法。 [0004] A method for cutting the glass. 包括如下步骤: Comprising the steps of:

[0005] 提供待切割的钢化玻璃; [0005] Providing glass to be cut;

[0006] 在所述待切割的钢化玻璃的正反面的非切割部位覆盖耐酸保护膜,接着将化学腐蚀液喷洒到所述待切割的钢化玻璃的正反面,化学刻蚀40min〜80min后得到切割好的钢化玻璃。 [0006] The acid resistant protective film covering the front and back surfaces of the non-cutting portion of the glass to be cut, followed by a chemical etching solution is sprayed onto the glass to be cut positive and negative, to obtain chemical etching after cutting 40min~80min good tempered glass.

[0007] 在一个实施例中,所述耐酸保护膜的材料为耐酸树脂。 [0007] In one embodiment, the acid resistant protective film is acid-resistant resin material.

[0008] 在一个实施例中,所述化学腐蚀液为含质量百分比浓度5%〜40%氢氟酸的混酸溶液; [0008] In one embodiment, the chemical etching solution is a mixed acid solution containing a mass concentration of 5% ~ 40% hydrofluoric acid;

[0009] 所述氢氟酸混酸溶液的溶质包括氢氟酸、无机酸和活性剤。 [0009] The hydrofluoric acid mixed solution comprising a solute hydrofluoric acid, an inorganic acid and an active Ji.

[0010] 在一个实施例中,将化学腐蚀液喷洒到所述待切割钢化玻璃的正反面的操作中,所述待切割钢化玻璃水平放置。 [0010] In one embodiment, the chemical etching solution is sprayed onto the front and back operation of the glass to be cut in the glass to be cut horizontally.

[0011] 在一个实施例中,将化学腐蚀液喷洒到所述待切割钢化玻璃的正反面的操作中,所述化学腐蚀液通过喷嘴喷到覆盖耐酸掩膜的玻璃正反面上。 [0011] In one embodiment, the chemical etching solution is sprayed onto the front and back operation of the glass to be cut, the chemical etching solution is sprayed onto the glass covering the front and back sides of the acid through a nozzle mask.

[0012] 在一个实施例中,还包括在得到切割好的钢化玻璃后,进行如下操作: [0012] In one embodiment, further comprising, after the cut glass obtained, the following operations:

[0013] 将所述切割好的钢化玻璃置于化学抛光液中刻蚀抛光IOmin〜25min,对所述切割好的钢化玻璃进行侧面腐蚀和化学抛光。 [0013] The chemical polishing the cut glass was placed in an etching polishing IOmin~25min, the cut glass for the side-etching and chemical polishing.

[0014] 在一个实施例中,所述化学抛光液为质量百分比浓度为5%〜25%的氢氟酸和质量百分比浓度为5%〜30%的盐酸形成的混酸。 [0014] In one embodiment, the chemical polishing solution for the mass concentration of 5% ~ 25% hydrofluoric acid and the mass concentration of the mixed acid 5% ~ 30% hydrochloric acid.

[0015] 在一个实施例中,对所述切割好的钢化玻璃进行侧面腐蚀和化学抛光的操作中,所述切割好的钢化玻璃水平置于所述化学抛光液中。 Operation [0015] In one embodiment, the side surface of the cut glass for chemical etching and polishing, the level of the cut glass is placed in the chemical polishing solution.

[0016] 上述钢化玻璃的切割方法,通过化学腐蚀液喷洒到待切割的钢化玻璃的正反面,来完成待切割的钢化玻璃的切割。 Cutting Method [0016] The tempered glass, by chemical etching solution sprayed onto the glass to be cut sides to complete the cutting of the glass to be cut. 相对于传统的米用机械或激光方式的钢化玻璃的切割方法,这种钢化玻璃的切割方法不会导致钢化玻璃边缘产生微裂纹、崩点和崩边,从而不会导致钢化玻璃边缘的抗压强度降低。 Compared with the traditional method of cutting glass by mechanical or laser rice embodiment, this method of cutting glass edge does not lead to microcracking glass, collapse point and chipping, so as not to cause compressive glass edge strength. 附图说明 BRIEF DESCRIPTION

[0017] 图1为ー实施方式的钢化玻璃的切割方法的流程图; [0017] FIG. 1 is a flowchart of the method of cutting glass ー embodiment;

[0018] 图2为图1示的钢化玻璃的切割方法中将化学腐蚀液喷洒到钢化玻璃的正反面的操作示意图。 [0018] FIG. 2 is a diagram of the tempered glass of FIG. 1 in the chemical etching solution is sprayed onto the cutting operation timing schematic back tempered glass.

具体实施方式 Detailed ways

[0019] 为了便于理解本发明,下面将參照相关附图对本发明进行更全面的描述。 [0019] To facilitate understanding of the present invention, with reference to the following drawings related to the present invention will be more fully described. 附图中给出了本发明的较佳实施例。 The figures given in the preferred embodiment of the present invention. 但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例。 However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. 相反地,提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。 Rather, these embodiments of the object is to be understood that the present disclosure more comprehensible comprehensive.

[0020] 需要说明的是,当元件被称为“固定子”另ー个元件,它可以直接在另ー个元件上或者也可以存在居中的元件。 [0020] Incidentally, when an element is referred to as "stator" Another ー elements, it can be directly on the other element or ー centered on elements may also be present. 当一个元件被认为是“连接”另ー个元件,它可以是直接连接到另ー个元件或者可能同时存在居中元件。 When an element is considered to be "connected" Another ー elements, it can be directly connected to the other elements or ー intervening elements may be present simultaneously. 本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。 As used herein, the term "vertical", "horizontal", "left", "right" and similar expressions are merely for illustrative purposes.

[0021] 除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。 [0021] Unless defined otherwise, the same meaning as all technical and scientific terms and belongs to the technical field of the invention As used herein, the art is generally understood. 本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是g在于限制本发明。 In the description herein the term object of the present invention used in the purpose of describing particular embodiments, and not limit the present invention in that g. 本文所使用的术语“及/或”包括ー个或多个相关的所列项目的任意的和所有的组合。 The term as used herein includes any ー or more of the associated listed items and all combinations of "and / or."

[0022] 如图1和图2所示,ー实施方式的钢化玻璃的切割方法,包括如下步骤: [0022] As shown in FIG. 1 and FIG. 2, the glass cutting method ー embodiment aspect, comprising the steps of:

[0023] S10、提供待切割的钢化玻璃10。 [0023] S10, to provide glass 10 to be cut.

[0024] 待切割的钢化玻璃10·可以为普通钠钙玻璃或硅酸铝玻璃等,厚度可以为0.1mm〜 [0024] 10. toughened glass to be cut may be a common soda lime glass or aluminosilicate glass, the thickness may be 0.1mm~

1.0mm0 1.0mm0

[0025] S20、在待切割的钢化玻璃10的正反面的非切割部位覆盖耐酸保护膜,接着将化学腐蚀液喷洒到待切割的钢化玻璃10的正反面,化学刻蚀40min〜80min后,得到切割好的钢化玻璃。 [0025] S20, the front and back surfaces of the non-cutting portion of the glass to be cut a protective film 10 covering the acid, followed by a chemical etching solution is sprayed onto the front and back glass to be cut, after the chemical etching 10 40min~80min, to give of cut glass.

[0026] 本实施方式中,耐酸保护膜的材料为耐酸树脂。 [0026] In the present embodiment, acid acid-resistant protective film of a resin material.

[0027] 化学刻蚀的时间和温度可以根据玻璃成分及其厚度进行适当的改变,一般选择常温下处理40min〜80min [0027] Chemical etching time and temperature can be appropriately changed depending on the glass composition and thickness, generally at room temperature selection processing 40min~80min

[0028] 本实施方式中,所述化学腐蚀液为含质量百分比浓度5%〜40%氢氟酸的混酸溶液。 [0028] The embodiment according to the present embodiment, the chemical etching solution is a mixed acid solution containing a mass concentration of 5% ~ 40% hydrofluoric acid. 氢氟酸混酸溶液的溶质包括氢氟酸、无机酸和活性剂,其中,氢氟酸的质量百分浓度为5%〜40%。 Hydrofluoric acid mixed solution comprising a solute hydrofluoric acid, an inorganic acid and an active agent, wherein the mass percent concentration of hydrofluoric acid is 5% ~ 40%. 无机酸可以为盐酸或硝酸。 The inorganic acid may be hydrochloric or nitric acid.

[0029] 本实施方式中,将化学腐蚀液喷洒到待切割钢化玻璃10的正反面的操作中,待切割钢化玻璃10水平放置。 [0029] In the present embodiment, the chemical etching solution to be sprayed onto the cutting operation of the front and back glass 10, the glass 10 to be cut horizontally.

[0030] 待切割钢化玻璃10水平放置,可以在化学腐蚀液中产生气泡和喷射流,从而加速化学腐蚀液在待切割钢化玻璃10表面的流动,已达到较快刻蚀速度完成切割待切割钢化玻璃10的效果。 [0030] The level of toughened glass 10 to be cut is placed, and may generate bubbles in the chemical etching solution jet flow to accelerate the flow of the chemical etching solution in the glass surface to be cut 10, has reached a faster etching speed steel cutting is completed to be cut 10 glass effect.

[0031] 结合图2,本实施方式中,将化学腐蚀液喷洒到待切割钢化玻璃10的正反面的操作中,化学腐蚀液通过喷嘴20喷到覆盖耐酸掩膜的待切割钢化玻璃10正反面上,化学腐蚀液进入快速流动状态,増加刻蚀反应速度。 [0031] in conjunction with FIG. 2, the present embodiment described above, the chemical etching solution is sprayed onto the front and back of the operation to be cut glass 10, the chemical etching solution is sprayed onto the acid mask covering glass 10 to be cut through front and back surfaces of the nozzle 20 , the chemical etching solution into the fast flowing state, etching of increase in reaction rate. [0032] 化学腐蚀液通过压紧轮30喷射到待切割钢化玻璃10的正反面,可以得到高钢化深度、边缘缺陷少高强度钢化玻璃。 [0032] Chemical etching solution ejected through the pinch roller 30 to the front and back glass 10 to be cut can be obtained a high depth of steel, high-strength glass edge defects less.

[0033] 本实施方式的钢化玻璃的切割方法,还包括在得到切割好的钢化玻璃后,进行如下操作: [0033] The glass cutting method according to the present embodiment, further comprising, after the cut glass obtained, the following operations:

[0034] 将切割好的钢化玻璃置于化学抛光液中IOmin〜25min,对切割好的钢化玻璃进行侧面腐蚀和化学抛光。 [0034] The chemical polishing the cut glass was placed IOmin~25min, for the side surface of the cut glass polishing and chemical etching. 该操作对切割好的钢化玻璃进行进ー步优化,提高其边缘的抗压強度。 This operation is performed on the cut glass into ー further optimized, the compressive strength of its edge.

[0035] 本实施方式中,化学抛光液为质量百分比浓度为5%〜25%的氢氟酸和质量百分比浓度为5%〜30%的盐酸形成的混酸。 [0035] In the present embodiment, the chemical polishing solution for the mass concentration of 5% ~ 25% hydrofluoric acid and the mass concentration of the mixed acid 5% ~ 30% hydrochloric acid.

[0036] 本实施方式中,对切割好的钢化玻璃进行侧面腐蚀和化学抛光的操作中,切割好的钢化玻璃水平置于化学抛光液中。 [0036] In the present embodiment, the operation of the cut sides of tempered glass and etching the chemical polishing, the cut glass horizontally in a chemical polishing solution.

[0037] 切割好的钢化玻璃水平置于化学抛光液中,可以得到边缘较光滑的钢化玻璃。 [0037] The cut glass horizontally in a chemical polishing solution, a smoother edge may be obtained tempered glass.

[0038] 上述钢化玻璃的切割方法,通过化学腐蚀液喷洒到待切割的钢化玻璃10的正反面,来完成待切割的钢化玻璃10的切割。 Cutting Method [0038] The tempered glass, by chemical etching solution is sprayed to the front and back glass to be cut 10, to complete the glass to be cut 10 is cut. 相对于传统的米用机械或激光方式的钢化玻璃的切割方法,这种钢化玻璃的切割方法不会导致钢化玻璃边缘产生微裂纹、崩点和崩边,从而不会导致钢化玻璃边缘的抗压强度降低。 Compared with the traditional method of cutting glass by mechanical or laser rice embodiment, this method of cutting glass edge does not lead to microcracking glass, collapse point and chipping, so as not to cause compressive glass edge strength.

[0039] 传统的钢化玻璃的切割方法在切割后还需要进行钢化玻璃边缘的強化。 [0039] The conventional cutting method of cutting glass after glass need intensive edges. 这种钢化玻璃的切割方法可以避免对钢化玻璃边缘进行二次強化,从而简化了加工エ艺过程。 This tempered glass cutting method avoids secondary strengthen the glass edge, thus simplifying the process Ester arts process.

[0040] 以上所述实施例仅表达了本发明的一种或几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。 [0040] The above embodiments are merely expresses one or more embodiments of the present invention, and detailed description thereof is more specific, but can not therefore be understood as limiting the scope of the present invention. 应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。 It should be noted that those of ordinary skill in the art, without departing from the spirit of the present invention, can make various changes and modifications, which fall within the protection scope of the present invention. 因此,本发明专利的保护范围应以所附权利要求为准。 Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (8)

1.一种钢化玻璃的切割方法,其特征在于,包括如下步骤: 提供待切割的钢化玻璃; 在所述待切割的钢化玻璃的正反面的非切割部位覆盖耐酸保护膜,接着将化学腐蚀液喷洒到所述待切割的钢化玻璃的正反面,化学刻蚀40min〜80min后得到切割好的钢化玻璃。 1. A glass cutting method, the method comprising the steps of: providing a glass to be cut; acid protective film covering the front and back surfaces of the non-cutting portion of the glass to be cut, followed by a chemical etching solution spraying the glass to be cut in the sides, to give the cut glass chemical etching after 40min~80min.
2.根据权利要求1所述的钢化玻璃的切割方法,其特征在于,所述耐酸保护膜的材料为耐酸树脂。 2. A glass cutting method according to claim 1, wherein the acid resistant protective film is acid-resistant resin material.
3.根据权利要求1所述的钢化玻璃的切割方法,其特征在于,所述化学腐蚀液为含质量百分比浓度5%〜40%氢氟酸的混酸溶液; 所述氢氟酸混酸溶液的溶质包括氢氟酸、无机酸和活性剤。 The glass cutting method according to claim 1, wherein the concentration of the chemical etching solution containing a percentage of 5% ~ 40% by mass hydrofluoric acid solution mixed; the hydrofluoric acid solution mixed solute It includes a hydrofluoric acid, an inorganic acid and an active Ji.
4.根据权利要求1所述的钢化玻璃的切割方法,其特征在于,将化学腐蚀液喷洒到所述待切割钢化玻璃的正反面的操作中,所述待切割钢化玻璃水平放置。 4. The glass cutting method according to claim 1, wherein the chemical etching solution is sprayed onto the front and back operation of the glass to be cut in the glass to be cut horizontally.
5.根据权利要求1所述的钢化玻璃的切割方法,其特征在于,将化学腐蚀液喷洒到所述待切割钢化玻璃的正反面的操作中,所述化学腐蚀液通过喷嘴喷到覆盖耐酸掩膜的玻璃正反面上。 The glass cutting method according to claim 1, wherein the chemical etching solution is sprayed onto the front and back operation of the glass to be cut, the chemical etching solution is sprayed through a nozzle cover covering Acid front and back surfaces of the glass film.
6.根据权利要求1所述的钢化玻璃的切割方法,其特征在于,还包括在得到切割好的钢化玻璃后,进行如下操作: 将所述切割好的钢化玻璃置于化学抛光液中刻蚀抛光IOmin〜25min,对所述切割好的钢化玻璃进行侧面腐蚀和化学抛光。 6. The method of cutting glass as claimed in claim 1, characterized by further comprising, after the cut glass obtained, the following: the chemical polishing the cut glass is placed in an etching solution polishing IOmin~25min, the cut glass for the side-etching and chemical polishing. · ·
7.根据权利要求6所述的钢化玻璃的切割方法,其特征在于,所述化学抛光液为质量百分比浓度为5%〜25%的氢氟酸和质量百分比浓度为5%〜30%的盐酸形成的混酸。 7. The method of cutting glass as claimed in claim 6, wherein the mass percentage of a chemical polishing solution concentration of 5% ~ 25% hydrofluoric acid and the mass concentration of 5% ~ 30% hydrochloric acid forming a mixed acid.
8.根据权利要求6所述的钢化玻璃的切割方法,其特征在干,对所述切割好的钢化玻璃进行侧面腐蚀和化学抛光的操作中,所述切割好的钢化玻璃水平置于所述化学抛光液中。 The glass cutting method according to claim 6, characterized in that the dry, the cut of the side surface of tempered glass and etching the chemical polishing operation, the cut glass horizontally in the said chemical polishing solution.
CN2013102933884A 2013-07-12 2013-07-12 Method for cutting tempered glass CN103359948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013102933884A CN103359948A (en) 2013-07-12 2013-07-12 Method for cutting tempered glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013102933884A CN103359948A (en) 2013-07-12 2013-07-12 Method for cutting tempered glass

Publications (1)

Publication Number Publication Date
CN103359948A true CN103359948A (en) 2013-10-23

Family

ID=49362321

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013102933884A CN103359948A (en) 2013-07-12 2013-07-12 Method for cutting tempered glass

Country Status (1)

Country Link
CN (1) CN103359948A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104628245A (en) * 2014-12-26 2015-05-20 合肥蓝氏特种玻璃有限责任公司 Method for cutting flat tempered glass
CN105271675A (en) * 2015-11-25 2016-01-27 苏州市灵通玻璃制品有限公司 Glass panel cutting method
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102643027A (en) * 2012-04-26 2012-08-22 深圳南玻显示器件科技有限公司 Glass etching liquid and glass etching method
CN102730956A (en) * 2011-04-11 2012-10-17 诺发光电股份有限公司 Processing method of protective glass

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102730956A (en) * 2011-04-11 2012-10-17 诺发光电股份有限公司 Processing method of protective glass
CN102643027A (en) * 2012-04-26 2012-08-22 深圳南玻显示器件科技有限公司 Glass etching liquid and glass etching method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10183885B2 (en) 2013-12-17 2019-01-22 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN104628245A (en) * 2014-12-26 2015-05-20 合肥蓝氏特种玻璃有限责任公司 Method for cutting flat tempered glass
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
CN105271675A (en) * 2015-11-25 2016-01-27 苏州市灵通玻璃制品有限公司 Glass panel cutting method

Similar Documents

Publication Publication Date Title
EP2606012B1 (en) Enhanced strengthening of glass by ion exchange in sodium bath followed by ion exchange in potassium bath
CN103958423B (en) Cover glass for an electronic device
US8852721B2 (en) Method for cutting tempered glass and preparatory tempered glass structure
CN101903301B (en) Cover glass for portable terminal, method for manufacturing cover glass for portable terminal, and portable terminal apparatus
JP2013163637A (en) Method for producing glass substrate of cover glass for portable electronic device
TW201040118A (en) Method of separating strengthened glass
CN106380087A (en) Techniques for strengthening glass covers for portable electronic devices
WO2010101961A2 (en) Techniques for strengthening glass covers for portable electronic devices
TW201536461A (en) Edge chamfering methods
WO2011066337A3 (en) Methods for laser scribing and separating glass substrates
CN101296787A (en) Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
WO2011097314A2 (en) Enhanced chemical strengthening glass of covers for portable electronic devices
CN103241931A (en) Method for processing tempered glass substrate of touch screen
US20080171209A1 (en) Method for cutting glass laminate
WO2015057552A3 (en) Ion exchange process and chemically strengthened glass substrates resulting therefrom
TW201001500A (en) Method for producing silicon substrate for solar cells
IN2014DN08858A (en) Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel
JPWO2009066624A1 (en) Method for etching a glass substrate
CN102923939B (en) Method for cutting tempered glass
TW201246320A (en) Method for cleaning silicon substrate, and method for producing solar cell
JP2009280452A (en) Glass substrate and method for producing the same
JP2011231009A (en) Glass substrate of cover glass for portable equipment
WO2013006750A3 (en) Surface flaw modification for strengthening of glass articles
TW200827315A (en) Glass thinning method
JP5640156B2 (en) Tempered glass and its manufacturing method for a touch panel

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
C53 Correction of patent for invention or patent application
C12 Rejection of a patent application after its publication