JP4692717B2 - Brittle material cleaving device - Google Patents

Brittle material cleaving device Download PDF

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JP4692717B2
JP4692717B2 JP2004319510A JP2004319510A JP4692717B2 JP 4692717 B2 JP4692717 B2 JP 4692717B2 JP 2004319510 A JP2004319510 A JP 2004319510A JP 2004319510 A JP2004319510 A JP 2004319510A JP 4692717 B2 JP4692717 B2 JP 4692717B2
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brittle material
condensing
laser light
line
laser
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JP2006130691A (en
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良治 小関
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澁谷工業株式会社
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  The present invention relates to a brittle material cleaving method and apparatus, and more particularly to a cleaving method and apparatus for irradiating a brittle material with laser light to cleave it into a required shape.

Conventionally, in order to cleave a plate-like brittle material such as glass or semiconductor material according to a predetermined planned cutting line, the laser beam is focused and irradiated to the brittle material, and the laser beam is moved along the planned cutting line. The method of making it known is known. (Patent Documents 1 to 3)
In these patent documents, a laser beam is condensed inside the brittle material to form a condensing point, and multiphoton absorption is generated at the condensing point portion, so that the portion is cracked or melted. Change to a modified region such as a processing region.
Then, by moving the condensing point along the planned cutting line, the modified region is formed along the planned cutting line, and then an artificial force is applied to the brittle material or left as it is. Thus, cracks propagate to the surface of the brittle material with the modified region as a base point, and the brittle material can be separated along the planned cutting line.
In particular, the cleaving method of Patent Document 3 is a cleaving method in which the condensing point is sequentially moved in the plate thickness direction, and a plurality of the modified regions are formed in the incident direction of the laser beam of the brittle material. Even thick brittle materials can be cleaved.
JP 2003-19582 A JP 2003-236688 A Japanese Patent Laid-Open No. 2002-205180

In the case of the above-mentioned Patent Documents 1 and 2, in order to cleave a brittle material having a large plate thickness, after forming a modified region, a large force is applied to the brittle material, or the output of the laser beam is increased to set the focal point. It is necessary to form a wide modified region at the center and expand the modified region in the thickness direction.
However, when a large force is applied to the brittle material, if the distance between the modified region and the surface of the brittle material is large, cracks from the modified region do not propagate along the planned cutting line and cannot be cleaved accurately. There is a problem.
If a modified region is formed over a wide area, the modified region expands not only in the thickness direction of the brittle material but also in the width direction of the planned cutting line. There is a problem that the surface is distorted and cannot be cleaved with high accuracy.
Furthermore, in the case of the above-mentioned Patent Document 3, in order to form a plurality of modified regions in the plate thickness direction of the brittle material, a plurality of modified regions must be formed in the plate thickness direction at the same position of the planned cutting line. Takes time.
In order to solve such problems, the present invention provides a brittle material cleaving method and apparatus capable of cleaving in a short time with high accuracy even for a brittle material having a large plate thickness. .

The brittle material cleaving apparatus according to the present invention includes a laser oscillator that oscillates laser light, a condensing means that condenses the laser light from the laser oscillator, and a movement that relatively moves the condensing means and the brittle material. A brittle material cleaving apparatus for cleaving the brittle material by moving the laser light collected by the light converging means along the planned fracture line of the plate-shaped brittle material by the moving means.
The condensing means includes an axicon lens formed in a substantially frustoconical shape with a surface at least upstream of the optical path of the laser light having a surface orthogonal to the optical axis of the laser light,
By the axicon lens, by focusing the laser light into a linear shape in the optical axis direction so as to form inside the brittle material condensing light, the light intensity of the formed portion of said population rays of the brittle material It is characterized by being over the absorption threshold to be modified .

According to the above cleaving apparatus , the laser beam is condensed into a linear shape in the optical axis direction to form a condensing line, and this condensing line is formed inside the brittle material. A modified region can be formed in the thickness direction.
For this reason, even with a brittle material with a large plate thickness, the distance from the formed modified region to the surface of the brittle material can be made closer, so that cracks tend to progress and the width of the planned breaking line is increased. Since the reforming region does not widen, the cutting can be performed with high accuracy along the planned cutting line.
Furthermore, since it is sufficient to move the condensing line along the planned cutting line by the moving means, it is not necessary to form a plurality of modified regions in the plate thickness direction, and the cutting can be performed in a short time.

FIG. 1 shows a cleaving apparatus 1 according to the present invention, and this cleaving apparatus 1 cleaves a brittle material 2 such as a transparent liquid crystal glass substrate along a planned cleaving line Q. ing.
The cleaving apparatus 1 includes a processing table 3 that supports a plate-like brittle material 2 and an irradiation unit that is disposed above the processing table 3 and irradiates the brittle material 2 on the processing table 3 with a laser beam L. 4 and a moving means 5 for moving the irradiation means 4 relative to the brittle material 2 on the processing table 3.
As the brittle material 2, in addition to the liquid crystal glass substrate described above, a plate-like brittle material 2 such as a semiconductor wafer can be cleaved. According to the cleaving apparatus 1 of this embodiment, the brittle material 2 Even if the plate thickness exceeds 1000 μm, it is possible to cleave in a short time with high accuracy.
The processing table 3 is fixed at a predetermined position in a factory or the like, and the brittle material 2 is sucked and held from the lower surface so that the brittle material 2 does not shift on the processing table 3.

Next, as shown in FIG. 2, the irradiating means 4 includes a housing 11 fixed to the moving means 5, a laser oscillator 12 that is disposed in the housing 11 and oscillates the laser light L, and condenses the laser light L. Condensing means 13 for performing
The moving means 5 moves the laser oscillator 12 and the condensing means 13 together with the housing 11 in the plane direction and the vertical direction. In addition, since the said moving means 5 is conventionally well-known, detailed description is abbreviate | omitted.
The laser oscillator 12 oscillates a short-pulse UV laser beam. In this embodiment, the laser beam L is adjusted in a range of a wavelength of ultraviolet region, a pulse width of 10 nanoseconds or less, a repetition frequency of 10 kHz or more, and an average output of 2 W or more. It oscillates.
The condensing means 13 is provided on the optical axis of the laser beam L oscillated from the laser oscillator 12, and the condensing means 13 of this embodiment includes three first to third axicon lenses 14A to 14C. And a single convex lens 15.
Each of these lenses can be moved in the vertical direction by an elevating means (not shown), and the condensing of the laser light L is adjusted.

Here, the axicon lens 14 will be described with reference to FIG. 3. The axicon lens 14 of the present embodiment is a lens in which at least one surface is processed into a substantially conical shape. The lens 14 has the other surface processed to be flat.
As shown in FIG. 3, the optical axis of the laser beam L emitted from the laser oscillator 12 and the center of the axicon lens 14 are made to coincide with each other, and the laser beam L is applied to the conical surface of the axicon lens 14 in this state. When irradiated, the laser light L is refracted toward the center of the axicon lens 14 on a conical surface.
The refracted laser light L is collected at the center of the axicon lens 14, and a portion where the light intensity by the light collection is strong extends in the optical axis direction of the laser light L to become a linear light collection line C. The length in the optical axis direction is referred to as the focal depth D.
If the light intensity of the laser beam L in the portion of the condensing line C is set to be equal to or higher than the absorption threshold of the brittle material 2, the brittle material 2 is altered by multiphoton absorption at the position of the condensing line C, and a modified region is formed in the portion A portion where T is formed and the light intensity other than the condensed light line C is equal to or less than the absorption threshold value becomes a non-modified region, and a boundary between the modified region and the non-modified region becomes a crack.
However, if the condensing line C is formed inside the axicon lens 14 as shown in FIG. 3, a portion with high light intensity is located in the axicon lens 14, so that the axicon lens 14 itself is altered. There is a risk of it.

Therefore, in the light condensing means 4 of the present embodiment, the first and second axicon lenses 14A and 14B having substantially the same shape are arranged on the upstream side of the optical path of the laser light L so that the conical surfaces face each other. By doing so, the condensing line C is not formed inside each lens.
That is, by arranging the conical surfaces of the first and second axicon lenses 14A and 14B to face each other, the laser light L refracted by the first axicon lens 14A is diffused in a ring shape and then diffused. The laser light L is refracted by the second axicon lens 14B and becomes a substantially cylindrical laser light L.
The substantially cylindrical laser light L is condensed by a third axicon lens 14C having a conical surface directed toward the second axicon lens 14B and a convex lens 15 having a convex surface directed upstream of the optical path. The light condensing line C is formed.
In this way, once the laser light is diffused by the first and second axicon lenses 14A and 14B and then condensed by the third axicon lens 14C and the convex lens 15, a condensed line is formed in each lens. Is prevented.
Needless to say, even if the convex lens 15 is omitted, the condensing line C can be formed by condensing the laser light L.

The focal depth D of the condensing line C formed in this way is adjusted as appropriate according to the diameter of the laser beam L by the laser oscillator 12 and the distance between the lenses by the elevating means, and further the position of the housing 11 by the moving means 5. Has been adjusted.
In the present embodiment, the position of the condensing line C is set to the approximate center of the brittle material 2, the focal depth D is more than half the plate thickness of the brittle material 2, and the distance between both ends of the condensing line C and the surface of the brittle material is To be equal. In addition, the distance from the both ends of this condensing line C to the surface of a brittle material can be suitably changed with the kind and board thickness of a brittle material.
Then, the moving means 5 moves the irradiation means 4 relative to the brittle material 2 to move the condensing line C along the planned cutting line Q, whereby multiphoton absorption occurs at the position where the condensing line C passes. And a modified region T is formed along the planned cutting line Q.
As a result, depending on the brittle material 2, even if no force is applied to the brittle material 2, the distance between the modified region T and the surface of the brittle material 2 is close, so that cracks grow from both ends of the modified region T. The surface of the brittle material 2 is reached, and the brittle material 2 is cut along the planned cutting line Q.
Even if the crack does not reach the surface of the brittle material 2, the brittle material 2 can be cut along the planned cutting line Q if a slight force is applied to the brittle material 2.

Thus, according to the present embodiment, the laser beam L is focused on the linear focusing line C extending in the thickness direction by the focusing means 13 and the focal depth D of the focusing line C is set to the thickness of the thickness. By making it more than half, the brittle material 2 can be cut along the planned cutting line Q naturally or with a small force only by moving this along the planned cutting line Q.
At this time, since the distance from the modified region T to the surface of the brittle material 2 is short, the crack almost reaches the surface of the brittle material 2 without departing from the planned cutting line Q, so that the brittle material 2 can be cleaved with high accuracy. it can.
Further, in the present embodiment, the modified region T is formed by the linear condensing lines C extending in the plate thickness direction, so the modified region T is not formed so as to extend in the width direction of the planned cutting line Q. Since the crack is generated within the width of the modified region T, the brittle material 2 can be cleaved with high accuracy.
Furthermore, since it is only necessary to move the condensing line C along the planned cutting line Q, there is no movement along the planned cutting line while moving the condensing point in the thickness direction as in the above-mentioned Patent Document 3. The brittle material 2 can be cleaved in a short time.

Next, FIG. 4 shows a second embodiment of the present invention, showing a cross-sectional view of the light condensing means 13, and the light condensing means 13 of this embodiment is constituted by a single axicon lens. Yes.
The axicon lens 14 in this embodiment has a conical surface facing the upstream side of the optical path of the laser light L, and the top of the conical surface is processed into a surface orthogonal to the optical axis of the laser light L. It has a substantially frustoconical shape.
Of the laser light L incident on the axicon lens 14, the laser light L incident on the top surface of the truncated cone advances straight, while the laser light L incident on the inclined surface of the truncated cone is refracted on the inclined surface and is By condensing outside the conlens 14, the condensing line C is formed outside the axicon lens 14.
Thus, by making the surface of the axicon lens 14 on the laser oscillator 12 side into a truncated cone shape, an axicon lens can be used without using three axicon lenses 14 as in the first embodiment. 14 can be formed while preventing damage to 14, and the brittle material 2 can be cleaved in a short time with high accuracy as in the above embodiment.
In this embodiment as well, the convex lens 15 can be provided below the axicon lens 14 to adjust the focal depth D of the condensed light line C.

In the first embodiment, the focusing line C is positioned approximately at the center of the brittle material 2 and the focal depth D is set to be half or more of the plate thickness. However, the present invention is not limited to this.
For example, it is possible to position the end of the condensing line C on the upper surface or the lower surface of the brittle material 2, or to set the focal depth D of the condensing line C to be equal to or greater than the plate thickness of the brittle material 2. The brittle material 2 having a large plate thickness can be cleaved with high accuracy and in a short time.
Furthermore, the above-mentioned modified region can also be formed by causing the condensing means 13 to vibrate in the plate thickness direction of the brittle material 2 while moving the condensing means 13 and the brittle material 2 with the moving means 5. It is also possible to do this.
As a result, a trajectory through which the condensing line C has passed, that is, a modified region T having a substantially waveform trajectory with a width of the focal depth D is formed inside the brittle material 2, and in particular, a modified region located at the apex of the waveform Since T and the surface of the brittle material 2 can be brought close to each other, cracks growing from the position can easily reach the surface of the brittle material 2 and good cleaving can be performed.

The top view which shows the cleaving apparatus which concerns on a present Example. The side view of the irradiation means which concerns on a 1st Example. The side view explaining condensing of the laser beam by an axicon lens. The side view of the condensing means which concerns on a 2nd Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cleaving device 2 Brittle material 12 Laser oscillator 13 Condensing means 14 Axicon lens C Condensing line D Depth of focus L Laser beam Q Fracturing line T Modification area

Claims (2)

  1. A laser oscillator that oscillates the laser beam; a condensing unit that condenses the laser beam from the laser oscillator; and a moving unit that relatively moves the condensing unit and the brittle material. In the brittle material cleaving apparatus that cleaves the brittle material by moving the laser light along the planned cutting line of the plate-shaped brittle material by moving means,
    The condensing means includes an axicon lens formed in a substantially frustoconical shape with a surface at least upstream of the optical path of the laser light having a surface orthogonal to the optical axis of the laser light,
    By the axicon lens, by focusing the laser light into a linear shape in the optical axis direction so as to form inside the brittle material condensing light, the light intensity of the formed portion of said population rays of the brittle material A brittle material cleaving device characterized in that it is equal to or higher than an absorption threshold to be modified .
  2. 2. The brittle material cleaving apparatus according to claim 1, wherein the converging line is formed in the brittle material over a range of half or more of the plate thickness.
JP2004319510A 2004-11-02 2004-11-02 Brittle material cleaving device Expired - Fee Related JP4692717B2 (en)

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US10376986B2 (en) 2013-08-02 2019-08-13 Rofin-Sinar Technologies Llc Method and apparatus for hybrid photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
US10391588B2 (en) 2015-01-13 2019-08-27 Rofin-Sinar Technologies Llc Method and system for scribing brittle material followed by chemical etching
US10010971B1 (en) 2015-06-17 2018-07-03 Rofin Sinar Technologies Llc Method and apparatus for performing laser curved filamentation within transparent materials
CN106914704A (en) * 2015-10-13 2017-07-04 株式会社迪思科 The processing method of optical device wafer

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