LT3311947T - Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas - Google Patents

Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas

Info

Publication number
LT3311947T
LT3311947T LTEP17193886.3T LT17193886T LT3311947T LT 3311947 T LT3311947 T LT 3311947T LT 17193886 T LT17193886 T LT 17193886T LT 3311947 T LT3311947 T LT 3311947T
Authority
LT
Lithuania
Prior art keywords
methods
laser processing
beam spots
axisymmetric beam
transparent workpieces
Prior art date
Application number
LTEP17193886.3T
Other languages
English (en)
Inventor
Garrett Andrew Piech
Sergio Tsuda
James Andrew West
Ravindra Kumar AKARAPU
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59930287&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=LT3311947(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from NL2017998A external-priority patent/NL2017998B1/en
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of LT3311947T publication Critical patent/LT3311947T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
LTEP17193886.3T 2016-09-30 2017-09-28 Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas LT3311947T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662402337P 2016-09-30 2016-09-30
NL2017998A NL2017998B1 (en) 2016-12-14 2016-12-14 Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Publications (1)

Publication Number Publication Date
LT3311947T true LT3311947T (lt) 2019-12-27

Family

ID=59930287

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP17193886.3T LT3311947T (lt) 2016-09-30 2017-09-28 Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas

Country Status (2)

Country Link
EP (2) EP3311947B1 (lt)
LT (1) LT3311947T (lt)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
EP3529214B1 (en) 2016-10-24 2020-12-23 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102018204250B4 (de) * 2018-03-20 2023-10-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Laserstrahlschneiden von Werkstücken
WO2020163051A1 (en) * 2019-02-08 2020-08-13 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching
US11344972B2 (en) * 2019-02-11 2022-05-31 Corning Incorporated Laser processing of workpieces
WO2020236447A1 (en) * 2019-05-17 2020-11-26 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces
WO2021127167A1 (en) * 2019-12-19 2021-06-24 Thermo Scientific Portable Analytical Instruments Inc. Adjustable extended focus raman system
DE102020117213A1 (de) * 2020-06-30 2021-12-30 Schott Ag Glaskeramikartikel, Verfahren zu dessen Herstellung und dessen Verwendung
DE102020132700A1 (de) * 2020-12-08 2022-06-09 Trumpf Laser- Und Systemtechnik Gmbh Hochenergieglasschneiden
DE102020132797A1 (de) * 2020-12-09 2022-06-09 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zum Bearbeiten eines Materials
DE102020134198A1 (de) 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
DE102020134197A1 (de) 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
DE102021100675B4 (de) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Zerteilen eines transparenten Werkstücks
KR20240007769A (ko) 2021-06-02 2024-01-16 트룸프 레이저-운트 시스템테크닉 게엠베하 공작물의 레이저 가공을 위한 방법 및 장치
DE102021123801A1 (de) 2021-06-02 2022-12-08 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
DE102021123962A1 (de) 2021-09-16 2023-03-16 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
DE102021130129A1 (de) 2021-11-18 2023-05-25 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Laserbearbeitung eines Werkstücks
DE102022110353A1 (de) 2022-04-28 2023-11-02 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Trennung eines Werkstücks
WO2023225935A1 (en) 2022-05-26 2023-11-30 Trumpf (China) Co., Ltd. Method for the laser machining of a workpiece
DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
DE102022130022A1 (de) 2022-11-14 2024-05-16 Trumpf Laser Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
DE102022131536A1 (de) 2022-11-29 2024-05-29 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Lasersystem zum Trennen eines Werkstücks
CN115647578A (zh) * 2022-12-28 2023-01-31 歌尔股份有限公司 激光加工方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4880820B2 (ja) * 2001-01-19 2012-02-22 株式会社レーザーシステム レーザ支援加工方法
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
US7626138B2 (en) 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
WO2008069099A1 (ja) 2006-11-30 2008-06-12 Sumitomo Electric Industries, Ltd. 集光光学系、レーザ加工方法及び装置、並びに脆性材料素材の製造方法
CN101772721A (zh) 2007-07-21 2010-07-07 德源光电技术(上海)有限公司 光学多路分光装置
JP5525601B2 (ja) * 2009-06-04 2014-06-18 コアレイズ オーワイ レーザを用いた基板加工方法
FR2989294B1 (fr) 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
DE102014201739B4 (de) 2014-01-31 2021-08-12 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsvorrichtung sowie Verfahren zum Erzeugen zweier Teilstrahlen
EP2913137A1 (de) 2014-02-26 2015-09-02 Bystronic Laser AG Laserbearbeitungsvorrichtung und Verfahren
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
DE102014213775B4 (de) 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
WO2016079275A1 (de) 2014-11-19 2016-05-26 Trumpf Laser- Und Systemtechnik Gmbh System zur asymmetrischen optischen strahlformung
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams

Also Published As

Publication number Publication date
EP3311947A1 (en) 2018-04-25
EP3597353A1 (en) 2020-01-22
EP3311947B1 (en) 2019-11-20

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