SG11201800299PA - Workpiece holder and method for slicing workpiece - Google Patents

Workpiece holder and method for slicing workpiece

Info

Publication number
SG11201800299PA
SG11201800299PA SG11201800299PA SG11201800299PA SG11201800299PA SG 11201800299P A SG11201800299P A SG 11201800299PA SG 11201800299P A SG11201800299P A SG 11201800299PA SG 11201800299P A SG11201800299P A SG 11201800299PA SG 11201800299P A SG11201800299P A SG 11201800299PA
Authority
SG
Singapore
Prior art keywords
workpiece
slicing
holder
workpiece holder
slicing workpiece
Prior art date
Application number
SG11201800299PA
Inventor
Shiroyasu Watanabe
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201800299PA publication Critical patent/SG11201800299PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201800299PA 2015-07-27 2016-07-12 Workpiece holder and method for slicing workpiece SG11201800299PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015148107A JP6272801B2 (en) 2015-07-27 2015-07-27 Work holder and work cutting method
PCT/JP2016/003287 WO2017017919A1 (en) 2015-07-27 2016-07-12 Workpiece holder and workpiece cutting method

Publications (1)

Publication Number Publication Date
SG11201800299PA true SG11201800299PA (en) 2018-02-27

Family

ID=57884150

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201800299PA SG11201800299PA (en) 2015-07-27 2016-07-12 Workpiece holder and method for slicing workpiece

Country Status (8)

Country Link
US (1) US10596724B2 (en)
JP (1) JP6272801B2 (en)
KR (1) KR102545512B1 (en)
CN (1) CN107848092B (en)
DE (1) DE112016002951T5 (en)
SG (1) SG11201800299PA (en)
TW (1) TWI684489B (en)
WO (1) WO2017017919A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6923067B2 (en) * 2018-02-27 2021-08-18 株式会社Sumco Semiconductor single crystal ingot slicing method
JP6969579B2 (en) * 2019-01-15 2021-11-24 信越半導体株式会社 Work cutting method and wire saw
JP7148437B2 (en) 2019-03-01 2022-10-05 信越半導体株式会社 Work cutting method and work cutting device
CN111761745B (en) * 2020-06-01 2022-08-30 徐州鑫晶半导体科技有限公司 Crystal orientation deviation detection method of wire cutting machine, rod sticking method and storage medium
CN114551638A (en) * 2022-01-21 2022-05-27 无锡松煜科技有限公司 Quartz boat sheet inserting method and sheet taking method
CN114714526A (en) * 2022-04-01 2022-07-08 宁夏中欣晶圆半导体科技有限公司 Bonding method for two-dimensionally adjusting crystal orientation of single crystal silicon rod
CN114905647A (en) * 2022-05-13 2022-08-16 西安奕斯伟材料科技有限公司 Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
CA1119811A (en) * 1980-01-25 1982-03-16 Cominco Ltd. Cutting apparatus for semi-conductor materials
JP2909945B2 (en) * 1992-10-09 1999-06-23 コマツ電子金属株式会社 Seed bar cutting method
CH690845A5 (en) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd A method for positioning a workpiece, and apparatus therefor.
TW355151B (en) * 1995-07-07 1999-04-01 Tokyo Seimitsu Co Ltd A method for cutting single chip material by the steel saw
CH692331A5 (en) * 1996-06-04 2002-05-15 Tokyo Seimitsu Co Ltd Wire saw and cutting method using the same.
WO1998000273A1 (en) * 1996-06-28 1998-01-08 Crystal Systems, Inc. Method and apparatus to produce a radial cut profile
JPH10321564A (en) * 1997-05-20 1998-12-04 Tokyo Seimitsu Co Ltd Wafer recovery device
JP3242050B2 (en) * 1997-11-17 2001-12-25 株式会社日平トヤマ Workpiece crystal orientation adjustment method
DE19825051A1 (en) 1998-06-04 1999-12-09 Wacker Siltronic Halbleitermat Method and device for producing a cylindrical single crystal and method for separating semiconductor wafers
JP2000153517A (en) * 1998-11-20 2000-06-06 Tokyo Seimitsu Co Ltd Wire saw
JP2001050912A (en) * 1999-08-11 2001-02-23 Rigaku Corp Support apparatus for single-crystal ingot and apparatus, and method for measurement of single-crystal ingot
CH697024A5 (en) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Wire sawing device.
JP2002337137A (en) * 2001-05-16 2002-11-27 Nippei Toyama Corp Work mounting method, wire saw and support plate
DE10128630A1 (en) * 2001-06-13 2003-01-02 Freiberger Compound Mat Gmbh Device and method for determining the orientation of a crystallographic plane relative to a crystal surface and device and method for separating a single crystal in a separating machine
JP2004262180A (en) * 2003-03-04 2004-09-24 Sumitomo Electric Ind Ltd Cutting method using slicer and equipment therefor
CH696431A5 (en) * 2003-04-01 2007-06-15 Hct Shaping Systems Sa Process and wire sawing device.
DE102004011991B4 (en) * 2004-03-11 2008-04-17 Siltronic Ag Wire saw for cutting off slices from a workpiece and method for cutting slices
JP5590001B2 (en) * 2011-10-04 2014-09-17 信越半導体株式会社 Work cutting method and wire saw
KR101449572B1 (en) * 2013-03-25 2014-10-13 한국생산기술연구원 Wire Saw with Lift-Up swing mechanism
JP6132621B2 (en) 2013-03-29 2017-05-24 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Method for slicing semiconductor single crystal ingot
JP6448181B2 (en) * 2013-08-30 2019-01-09 株式会社Sumco Method and apparatus for bonding ingot and work holder
CN203510499U (en) * 2013-09-30 2014-04-02 洛阳鸿泰半导体有限公司 Device for adjusting crystal orientation deviation degree of silicon rod
CN204196015U (en) * 2014-06-06 2015-03-11 云南蓝晶科技股份有限公司 Crystal bar axis positioning device

Also Published As

Publication number Publication date
CN107848092A (en) 2018-03-27
WO2017017919A1 (en) 2017-02-02
JP6272801B2 (en) 2018-01-31
TWI684489B (en) 2020-02-11
KR102545512B1 (en) 2023-06-20
US10596724B2 (en) 2020-03-24
JP2017024145A (en) 2017-02-02
KR20180036702A (en) 2018-04-09
DE112016002951T5 (en) 2018-03-15
US20180215075A1 (en) 2018-08-02
TW201703907A (en) 2017-02-01
CN107848092B (en) 2020-04-21

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