CN114905647A - Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine - Google Patents
Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine Download PDFInfo
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- CN114905647A CN114905647A CN202210533503.XA CN202210533503A CN114905647A CN 114905647 A CN114905647 A CN 114905647A CN 202210533503 A CN202210533503 A CN 202210533503A CN 114905647 A CN114905647 A CN 114905647A
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- horizontal
- adjusting screw
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- 239000013078 crystal Substances 0.000 title claims abstract description 86
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The embodiment of the invention discloses a positioning device for positioning a crystal bar to be subjected to wire cutting, which comprises: a bearing table; the resin plate is borne on the bearing table and used for bonding the crystal bar; and the adjusting assembly is used for adjusting the position of the resin plate relative to the bearing table so as to adjust the crystalline phase of the crystal bar adhered to the resin plate. The crystal phase deviation compensation can be simply and conveniently carried out on the bonded crystal bar through the adjusting assembly, so that a wafer meeting the process requirement is obtained, and the production efficiency is effectively improved.
Description
Technical Field
The invention relates to the field of wafer manufacturing, in particular to a crystalline phase adjusting device for wire cutting and a wire cutting machine.
Background
With the global development of informatization, a semiconductor silicon material, which is about 95% in the production and use of the entire semiconductor material and is mainly produced by slicing a single crystal silicon rod drawn by a Czochralski (Czochralski) method, of which main processes are ingot drawing, rounding, cutting, polishing, cleaning, and the like, is the most widely used semiconductor material so far. Among the above processes, the cutting of a boule is an important process, and generally employs the cutting of a positive crystal phase, and the cutting of a positive crystal phase is a process in which the surface of a silicon wafer is required to be as close as possible to a desired crystallographic plane without deviation so as to prevent the crystal phase error from affecting the device characteristics, and is generally achieved by a crystal phase control technique in order to achieve the above object.
Because the crystal grows according to the crystal phase direction of the seed crystal during the crystal growth, the crystal phase control technology mainly controls the precision of the seed crystal during the crystal pulling process, however, the crystal phase of the seed crystal has certain deviation, the crystal phase angle of the crystal bar can be detected after the crystal growth is finished, and the condition that the crystal phase deviation is too large to exceed the trimming range of the rolling process is avoided. The rolling process of the crystal bar is realized by adjusting and positioning the crystal phase angle of the crystal bar in an eccentric mode and then starting the rolling process, the final crystal phase result of the silicon rod is obtained after the rolling process is finished, and the subsequent crystal phase correction can be realized only by compensating the bonded position deviation.
The method comprises the steps that the self crystal phase deviation of a crystal bar is measured through a measuring device before the crystal bar is bonded, and then the bonding condition for correcting the crystal phase deviation of the crystal bar is obtained after the measurement result is compared with the product requirement. The crystal phase is measured and after the process of comparing with the demand, the crystal bar is bonded on the bonding equipment for cutting according to the bonding condition, and the bonding step bonds the crystal bar, the resin plate and the bearing table together through the bonding glue. The crystal bar can be conveyed to the multi-wire cutting device for cutting after the bonding step is finished, the final crystal phase of the silicon wafer can be confirmed only after the silicon wafer is cut, so that the initial crystal phase of the silicon wafer is preliminarily determined after the crystal bar is bonded, the final crystal phase deviation of the silicon wafer is obtained by the deviation of the crystal bar when the crystal phase deviation of the crystal bar is superposed with the crystal bar bonding and the deviation of the silicon wafer during multi-wire cutting, the crystal phase deviation of the silicon wafer cannot be improved after bonding, and the product requirements of customers are difficult to meet when the crystal phase requirements of the customer products are greater than the capability of a bonding machine table.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention desirably provide a positioning apparatus for positioning a boule to be wire-cut, which realizes compensation of crystal phase deviation of the boule by an adjustment assembly capable of individually adjusting a horizontal position and a vertical position of the boule.
The technical scheme of the invention is realized as follows:
a positioning device for positioning a boule to be wire cut, the positioning device comprising: a bearing platform; the resin plate is borne on the bearing table and used for bonding the crystal bar; and the adjusting assembly is used for adjusting the position of the resin plate relative to the bearing table so as to adjust the crystalline phase of the crystal bar adhered to the resin plate.
The embodiment of the invention provides a positioning device for positioning a crystal bar to be subjected to wire cutting, wherein the positioning device adjusts the crystal phase of the crystal bar bonded on a resin plate through an adjusting assembly arranged between a bearing table and the resin plate, so that the crystal phase deviation of the bonded crystal bar is compensated, and the requirement is met. The positioning device is simple in structure and convenient to operate, the crystal phase of the crystal bar can be adjusted after the crystal bar is bonded, the quality of the wafer after cutting is improved, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of a positioning apparatus for positioning a boule to be wire cut according to an embodiment of the present invention;
FIG. 2 is a left side view of the positioning apparatus of FIG. 1, with the crystal bar and the resin plate not shown;
FIG. 3 is a top view of the positioning apparatus of FIG. 2, wherein the boule and the resin plate are not shown;
FIG. 4 is a schematic structural view illustrating a regulating plate of the positioning apparatus for positioning the ingot to be wire-cut according to the embodiment of the present invention;
FIG. 5 is a schematic diagram of a method of using the positioning apparatus according to the embodiment of the present invention;
FIG. 6 is a schematic view of a positioning device for adjusting an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, a positioning apparatus for positioning a ingot to be wire-cut according to an embodiment of the present invention is capable of compensating for a crystallographic phase deviation of the ingot by combining the crystallographic phase deviation of the bonded ingot with an inherent deviation of a multi-wire saw and feeding back the calculated deviation to an adjustment assembly, and the positioning apparatus 10 includes: a bearing table 4, a resin plate 3 and an adjusting assembly for adjusting the position of the resin plate 3 relative to the bearing table 4, wherein the bearing table 4 is used for bearing all components of the positioning device 10, the resin plate 3 is used for bonding a crystal bar 2 to be cut, the adjusting assembly comprises an adjusting plate 1 fixedly mounted on the surface of the resin plate 3 far away from the crystal bar in a bonding mode, the adjusting plate 1 is provided with a horizontal adjusting screw 12 for adjusting the horizontal position of the adjusting plate 1 relative to the bearing table 4 and a vertical adjusting screw 15 for adjusting the vertical position of the adjusting plate 1 relative to the bearing table 4, see fig. 5, the horizontal adjusting screw 12 comprises a first screw 121 and a second screw 122, and the vertical adjusting screw 15 comprises a third screw 153 and a fourth screw 154. The horizontal adjusting screw 12 and the vertical adjusting screw 15 make corresponding adjustment to the position of the crystal bar 2 based on the calculated deviation so as to realize deviation compensation in the horizontal plane and deviation compensation in the vertical plane of the crystal bar, thereby adjusting the crystal phase of the crystal bar 2 after the crystal bar 2 is bonded on the resin plate 3, improving the quality of cutting wafers and improving the production efficiency.
Referring to fig. 2 to 3, in the present embodiment, the adjusting plate 1 includes a cylindrical plug 11, the center of the bottom surface of the adjusting plate 1 facing the susceptor 4 is provided with an upper groove to partially receive the plug 11 so that the plug 11 protrudes from the bottom surface, the susceptor 4 is provided with a lower groove at the center of the surface opposite to the adjusting plate 1, the lower groove does not completely receive the portion of the plug 11 protruding from the bottom surface, so that the adjusting plate 1 can swing in a vertical plane with the plug 11 as a fixed point, and the position of the adjusting plate 1 in the vertical plane relative to the susceptor 4 is adjusted, thereby adjusting the crystal phase direction of the crystal rod 2 in the vertical plane. In addition, the inner diameters of the upper groove and the lower groove are the same and are larger than the diameter of the bolt 11, so that the adjusting plate can rotate in a horizontal plane by taking the bolt 11 as a pivot shaft, and the position of the adjusting plate 1 relative to the bearing table 4 in the horizontal plane is adjusted, so that the crystal phase direction of the crystal bar 2 in the horizontal plane is adjusted.
Referring to fig. 2 to 3, in the present embodiment, the susceptor 4 is formed with two horizontal adjustment screw holes 14 which are centrally symmetrical with respect to the susceptor 4, the two horizontal adjustment screw holes 14 being aligned along the axial direction of the ingot 2 and extending in the horizontal plane in a direction perpendicular to the ingot 2. Referring to fig. 5, the two horizontal adjusting screw holes 14 are symmetrically arranged at both sides of the plug 11 at a distance D from the plug 11 along the length direction of the crystal bar 2. Referring to fig. 2, the adjusting plate 1 is formed with two through holes configured to be coaxially arranged with the horizontal adjusting screw hole 14. The shaft parts 12b of the two horizontal adjusting screws 12 pass through the through holes and are respectively matched with the horizontal adjusting screw holes 14, wherein the diameter of the head part 12a of each horizontal adjusting screw 12 is larger than the aperture of the through hole, so that the horizontal adjusting screws 12 axially move in the horizontal adjusting screw holes 14 by screwing the horizontal adjusting screws 12, thereby driving the bearing platform 4 to displace relative to the horizontal adjusting screws 12, and the bearing platform 4 and the adjusting plate 1 relatively move because the diameter of the head part 12a of each horizontal adjusting screw 12 is larger than the aperture of the through hole, that is, the adjusting plate 1 is driven to rotate relative to the bearing platform 4 by screwing the horizontal adjusting screws 12 by taking the bolt 11 as a pivot shaft, thereby adjusting the relative position of the adjusting plate 1 relative to the bearing platform 4 and fixing the adjusting plate in a horizontal plane after the adjustment is finished, thereby realizing the deviation compensation of the crystal bar 2 in the horizontal plane. Preferably, the two horizontal adjustment screw holes 14 are located on the same side of the carrier table 4.
In another embodiment, referring to fig. 2-3, the adjusting plate 1 comprises two connecting pieces 13 formed on the side walls, the two connecting pieces 13 are symmetrically arranged on both sides of the pin 11 at a distance D from the pin 11 along the length direction of the ingot 2, the connecting pieces 13 extend from the adjusting plate 1 to the susceptor 4, the through holes are formed on the portions of the connecting pieces 13 protruding from the side walls of the adjusting plate 1, and the through holes are configured to be coaxially arranged with the horizontal adjusting screw holes 14. The shaft portion 12b of the horizontal adjusting screw 12 passes through the through hole, and the head portion 12a thereof presses against the connecting piece 13, and is kept relatively stationary with the adjusting plate 1 by the connecting piece 13. Preferably, the connecting piece 13 is integrally formed with the adjusting plate 1.
Referring to fig. 2-3, in the present embodiment, the adjusting plate 1 is further formed with two vertical adjusting screw holes 16 arranged along the axial direction of the ingot 2 and extending vertically, the two vertical adjusting screw holes 16 are symmetrically arranged at the front and rear ends of the adjusting plate 1 about the plug pin 11, the distance of two vertical adjusting screw holes 16 does the length L of regulating plate 1, adjusting assembly still includes two vertical adjusting screw 15, every vertical adjusting screw 15 with singly vertical adjusting screw hole 16 cooperates, through the selection knob two vertical adjusting screw 15 pass the degree of depth of vertical adjusting screw hole 16 can bolt 11 is the fulcrum fine setting regulating plate 1 is relative in the vertical plane the inclination of plummer 4 to can after the adjustment end regulating plate 1 is at the vertical plane internal fixation. Preferably, the adjustment assembly further comprises a spacer block 17 provided on the carrier table 4 at a position corresponding to each vertical adjustment screw 15 to protect the surface of the carrier table 4.
In another embodiment, the adjusting plate 1 is formed with two sets of vertical adjusting screw holes arranged along an axial direction of the ingot 2 and extending vertically, the two sets of vertical adjusting screw holes are symmetrical with respect to a center of the adjusting plate 1 with an interval of L, each set of vertical adjusting screw holes includes two vertical adjusting screw holes respectively located at both sides of the ingot 2, and the adjusting assembly further includes a vertical adjusting screw engaged with a single vertical adjusting screw hole.
An embodiment of the present invention provides a wire cutting machine including the positioning device 10 provided in the above embodiment.
Referring to fig. 5, a method of using a positioning apparatus 10 for positioning a boule to be wire cut using an embodiment of the present invention is shown, comprising the steps of:
s11, measuring the deviation of the crystal bar adhered to the resin plate and a standard crystal phase by using a crystal phase measuring instrument to obtain the horizontal deviation H1 and the vertical deviation V1 of the crystal bar;
s12, acquiring a fixed horizontal deviation H2 and a fixed vertical deviation V2 of the linear cutting machine;
s13, since the crystal phase measurement after cutting is defined as the relative position when the groove faces downward and the bonding is performed, obtaining the overall horizontal deviation H1-H2 according to the horizontal deviation H1 of the ingot and the fixed horizontal deviation H2, and obtaining the overall vertical deviation V1-V2 according to the vertical deviation V1 of the ingot and the fixed vertical deviation V2;
s14, controlling an adjusting assembly to adjust the relative position of the resin plate relative to the bearing table according to the integral horizontal deviation H and the integral vertical deviation V;
and S15, cutting the crystal bar.
In the above usage method, the S12 is to obtain a fixed horizontal deviation H2 of the linear cutting machine, and the fixed vertical deviation V2 specifically refers to:
s121, acquiring horizontal deviation and vertical deviation of the wafer cut for m times by the linear cutting machine, wherein m is an integer greater than or equal to 5;
and S122, calculating the average value of the m horizontal deviations and the m vertical deviations to obtain the fixed horizontal deviation H2 and the fixed vertical deviation V2.
In the above usage, referring to fig. 6, the S14 controls the adjusting assembly to adjust the relative position of the resin plate 3 with respect to the bearing platform 4 according to the overall horizontal deviation H and the overall vertical deviation V, specifically:
s141, when the overall horizontal deviation H is positive, loosening the second screw 122, adjusting the displacement distance of the first screw 121 to X, where X is TAN (H/180 × PI ()) D, and tightening the second screw 122;
s142, when the overall horizontal deviation H is a negative number, loosening the first screw 121, adjusting the displacement distance of the second screw 122 to X, where X is TAN (H/180 × PI ()) D, and tightening the first screw 121;
s143, when the overall vertical deviation V is positive, loosening the fourth screw 154, adjusting the displacement distance of the third screw 153 to Z, where Z is TAN (V/180 × PI ()) L/2, and tightening the fourth screw 154;
s144, when the overall vertical deviation V is negative, the third screw 153 is loosened, the displacement distance of the fourth screw 154 is adjusted to Z, where Z is TAN (V/180 × PI ()) L/2, and the third screw 153 is tightened.
The positioning device 10 for positioning the crystal bar 2 to be subjected to linear cutting provided by the embodiment of the invention has the advantages of simple structure and convenience in adjustment, not only effectively reduces the cost of manpower and material resources, but also can realize adjustment and compensation aiming at wafer deviation after the crystal bar 2 is bonded, avoids the step of degumming and disassembling the crystal bar 2, prevents the crystal bar 2 from secondary damage, can obtain wafers with good quality after the crystal bar is cut by the positioning device, can effectively improve the production efficiency, and effectively solves the technical problems in the prior art.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A positioning apparatus for positioning a boule to be wire cut, the positioning apparatus comprising:
a bearing table;
the resin plate is borne on the bearing table and used for bonding the crystal bar;
and the adjusting assembly is used for adjusting the position of the resin plate relative to the bearing table so as to adjust the crystalline phase of the crystal bar adhered to the resin plate.
2. The positioning apparatus according to claim 1, wherein the susceptor is formed with two horizontal adjustment screw holes symmetrically arranged on both sides of a center of the susceptor, the two horizontal adjustment screw holes being aligned along an axial direction of the ingot and extending in a horizontal plane in a direction perpendicular to the ingot, and the adjustment assembly further comprises:
an adjusting plate disposed between the resin plate and the carrier table and bonded to the resin plate, the adjusting plate being formed with two through holes;
two horizontal adjusting screws, the rod part of each horizontal adjusting screw passes through a single through hole and is matched with a single horizontal adjusting screw hole, and the diameter of the head part of each horizontal adjusting screw is larger than the hole diameter of the through hole.
3. The positioning apparatus according to claim 2, wherein the adjusting assembly further comprises two connecting pieces fixedly provided on the side walls of the adjusting plate, the two connecting pieces being symmetrically arranged on both sides of the center of the adjusting plate, the connecting pieces extending from the adjusting plate toward the carrier table, the through-holes being formed in portions of the two connecting pieces extending to protrude from the adjusting plate.
4. The positioning device as set forth in claim 2 wherein said two horizontal adjustment screw holes are located on the same side of said adjustment plate side wall.
5. The positioning apparatus according to claim 2, wherein the adjusting plate is formed with two vertical adjusting screw holes arranged along an axial direction of the ingot and extending vertically, the two vertical adjusting screw holes being symmetrically arranged at both ends of a center of the adjusting plate, the adjusting assembly further comprising two vertical adjusting screws, each of the vertical adjusting screws being engaged with a single vertical adjusting screw hole.
6. The positioning apparatus according to claim 2, wherein the adjusting plate is formed with two sets of vertical adjusting screw holes arranged along an axial direction of the boule and extending vertically, the two sets of vertical adjusting screw holes being symmetrically arranged at both ends of a center of the adjusting plate, each set of vertical adjusting screw holes including two vertical adjusting screw holes respectively located at both sides of the boule, and the adjusting assembly further includes a vertical adjusting screw engaged with a single vertical adjusting screw hole.
7. The positioning apparatus of any of claims 2-6 wherein the adjustment assembly further comprises a pin, the adjustment plate having an upper groove centrally disposed to partially receive the pin, the carrier having a lower groove centrally disposed to partially receive a portion of the pin that is not received in the upper groove.
8. A positioning device according to any of claims 5 to 6, wherein the adjustment assembly further comprises a spacer block provided on the carrier at a position corresponding to each vertical adjustment screw.
9. A wire cutting machine characterized in that it comprises a positioning device according to any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210533503.XA CN114905647A (en) | 2022-05-13 | 2022-05-13 | Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine |
| TW111138171A TWI829385B (en) | 2022-05-13 | 2022-10-07 | A positioning device and wire cutting machine for positioning crystal rods to be wire cut |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210533503.XA CN114905647A (en) | 2022-05-13 | 2022-05-13 | Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine |
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| Publication Number | Publication Date |
|---|---|
| CN114905647A true CN114905647A (en) | 2022-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210533503.XA Pending CN114905647A (en) | 2022-05-13 | 2022-05-13 | Positioning device for positioning crystal bar to be subjected to wire cutting and wire cutting machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114905647A (en) |
| TW (1) | TWI829385B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09325124A (en) * | 1996-06-04 | 1997-12-16 | Tokyo Seimitsu Co Ltd | Method and device for crystallographic axis orientation adjustment of ingot using x ray |
| CN103448155A (en) * | 2013-08-21 | 2013-12-18 | 常州贝斯塔德机械科技有限公司 | Angle regulation system used for slicer |
| CN104708721A (en) * | 2015-01-29 | 2015-06-17 | 国电兆晶光电科技江苏有限公司 | Silicon rod bonding device with adjustable cutting deflection angle and adjusting method thereof |
| CN107848092A (en) * | 2015-07-27 | 2018-03-27 | 信越半导体株式会社 | The cutting-off method of work support and workpiece |
| CN110625836A (en) * | 2019-10-18 | 2019-12-31 | 上海新昇半导体科技有限公司 | Crystal bar workpiece plate, crystal bar cutting device and crystal bar cutting method |
| CN111531732A (en) * | 2020-04-28 | 2020-08-14 | 台州市双辉机械设备有限公司 | Multi-wire saw is with workstation assembly and multi-wire saw |
| CN215472273U (en) * | 2021-08-30 | 2022-01-11 | 浙江中晶科技股份有限公司 | Silicon rod crystal orientation angle adjusting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11156849A (en) * | 1997-11-26 | 1999-06-15 | Nippei Toyama Corp | Device for cutting semiconductor ingot |
| TWM549782U (en) * | 2017-06-28 | 2017-10-01 | 環球晶圓股份有限公司 | Ingot slicing apparatus and adjusting device thereof |
-
2022
- 2022-05-13 CN CN202210533503.XA patent/CN114905647A/en active Pending
- 2022-10-07 TW TW111138171A patent/TWI829385B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09325124A (en) * | 1996-06-04 | 1997-12-16 | Tokyo Seimitsu Co Ltd | Method and device for crystallographic axis orientation adjustment of ingot using x ray |
| CN103448155A (en) * | 2013-08-21 | 2013-12-18 | 常州贝斯塔德机械科技有限公司 | Angle regulation system used for slicer |
| CN104708721A (en) * | 2015-01-29 | 2015-06-17 | 国电兆晶光电科技江苏有限公司 | Silicon rod bonding device with adjustable cutting deflection angle and adjusting method thereof |
| CN107848092A (en) * | 2015-07-27 | 2018-03-27 | 信越半导体株式会社 | The cutting-off method of work support and workpiece |
| CN110625836A (en) * | 2019-10-18 | 2019-12-31 | 上海新昇半导体科技有限公司 | Crystal bar workpiece plate, crystal bar cutting device and crystal bar cutting method |
| CN111531732A (en) * | 2020-04-28 | 2020-08-14 | 台州市双辉机械设备有限公司 | Multi-wire saw is with workstation assembly and multi-wire saw |
| CN215472273U (en) * | 2021-08-30 | 2022-01-11 | 浙江中晶科技股份有限公司 | Silicon rod crystal orientation angle adjusting device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202302309A (en) | 2023-01-16 |
| TWI829385B (en) | 2024-01-11 |
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