TWI829385B - A positioning device and wire cutting machine for positioning crystal rods to be wire cut - Google Patents

Abstract

An embodiment of the present invention discloses a positioning device for positioning a crystal ingot to be wire-cut. The positioning device includes: a carrying platform; a resin plate carried on the carrying platform, and the resin plate is used to bond the crystal ingot; The adjusting element is used to adjust the position of the resin plate relative to the bearing platform to adjust the crystal phase of the crystal rod bonded to the resin plate. Through the above-mentioned adjustment components, the crystal phase deviation of the bonded crystal rod can be simply and conveniently compensated to obtain a wafer that meets the process requirements, effectively improving production efficiency.

Description

A positioning device and wire cutting machine for positioning crystal rods to be wire cut

The invention belongs to the field of wafer manufacturing, and in particular relates to a crystal phase adjustment device for wire cutting and a wire cutting machine.

With the global development of informatization, semiconductor silicon materials are by far the most widely used semiconductor materials. Silicon materials account for about 95% of the entire production and use of semiconductor materials. They are mainly made of single crystals drawn by the Czochralski method. It is manufactured by slicing silicon rods. The main processes of the Czochralski method include ingot drawing, rounding, cutting, polishing, cleaning, etc. Among the above processes, crystal ingot cutting is an important process, and normal crystal phase cutting is generally adopted. The so-called forward cutting means that the surface of the silicon wafer is required to be as close as possible to the required crystallographic plane without deviation, so as to avoid crystal phase errors affecting the device. Characteristics, in order to achieve the above purposes, are generally achieved through crystal phase control technology.

Because the crystal will grow according to the crystal phase orientation of the seed crystal when growing, the crystal phase control technology mainly controls the seed crystal itself accurately during the crystal pulling process. However, there is a certain deviation in the crystal phase of the seed crystal itself, so after the crystal growth is completed, Detect the crystal phase angle of the crystal rod to prevent the crystal phase deviation from being too large beyond the trimming range of the spheronization process. The spheronization process of the crystal ingot is to adjust and position the crystal phase angle of the crystal ingot eccentrically before starting the spheronization process. After the spheronization process is completed, the final crystal phase result of the silicon ingot is obtained, and subsequent crystal phase correction can only be performed. This is achieved by compensating the positional deviation of the bonding.

Before the crystal rod is bonded, the crystal phase deviation of the crystal rod is measured by a measuring device, and then the measurement results are compared with the product requirements to obtain the bonding conditions used to correct the crystal phase deviation of the crystal rod. After the above process of crystal phase measurement and comparison with requirements is completed, the crystal rod is bonded to the bonding equipment for cutting according to the bonding conditions. The above bonding step is to use the bonding glue to combine the crystal rod, the resin plate and the carrying platform. Glued together. After the bonding step is completed, the crystal ingot will be transferred to the multi-wire cutting device for cutting. Since the final crystal phase of the silicon wafer can only be confirmed after the silicon wafer is cut, the crystal phase of the silicon wafer has been preliminarily determined after the crystal ingot is bonded. The preliminary crystal phase, and the final crystal phase deviation of the silicon wafer is obtained by superimposing the crystal phase deviation of the crystal rod itself with the deviation during bonding of the crystal rod and the deviation during multi-line cutting. Therefore, the crystal phase deviation of the silicon wafer changes after bonding. No improvement can be made. When the crystal phase demand of the customer's product is greater than the bonding machine's capacity, it will be difficult to meet the customer's product demand.

In order to solve the above technical problems, embodiments of the present invention are expected to provide a positioning device for positioning a crystal rod to be wire-cut. The positioning device realizes the crystal positioning of the crystal rod through an adjustment element that can independently adjust the horizontal position and vertical position of the crystal rod. Compensation for phase deviation.

The technical solution of the present invention is implemented as follows: a positioning device for positioning a crystal rod to be wire-cut. The positioning device includes: a bearing platform; a resin plate carried on the bearing platform, and the resin plate is used for bonding The crystal rod; an adjusting element, the adjusting element is used to adjust the position of the resin plate relative to the bearing platform to adjust the crystal phase of the crystal rod bonded to the resin plate.

Embodiments of the present invention provide a positioning device for positioning a crystal rod to be wire-cut. The positioning device adjusts the crystal phase of the crystal rod bonded to the resin plate through an adjustment element provided between the bearing platform and the resin plate. , so that the crystal phase deviation of the bonded crystal rod can be compensated and meet the needs. The positioning The device has a simple structure and is easy to operate. The crystal phase of the crystal rod can also be adjusted after the crystal rod is bonded, thereby improving the quality of the cut wafer and improving production efficiency.

1:Adjusting plate

2:crystal rod

3: Resin board

4: Bearing platform

10: Positioning device

11: Cylindrical pin

12: Horizontal adjustment screw

12a:Head

12b: Rod part

13: Connecting piece

14: Horizontal adjustment screw hole

15:Vertical adjustment screw

16: Vertical adjustment screw hole

17: spacer

121:First screw

122:Second screw

153:Third screw

154:Fourth screw

L: length

S11-S15: Steps

Figure 1 is a schematic structural diagram of a positioning device for positioning a crystal ingot to be wire-cut according to an embodiment of the present invention; Figure 2 is a left view of the positioning device in Figure 1, in which the crystal ingot and the resin plate are not shown; Figure 3 is Figure 2 is a top view of the positioning device, in which the crystal rod and the resin plate are not shown; Figure 4 is a structural schematic diagram of the adjustment plate of the positioning device for positioning the crystal rod to be wire-cut according to an embodiment of the present invention; Figure 5 is a schematic view of the positioning device of the present invention. A schematic diagram of the use method of the positioning device according to the embodiment of the invention; Figure 6 is a schematic diagram of adjusting the positioning device according to the embodiment of the invention.

In order to help the review committee understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is described in detail below in the form of embodiments with the accompanying drawings and attachments, and the drawings used therein are , its purpose is only for illustration and auxiliary description, and may not represent the actual proportions and precise configurations after implementation of the present invention. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited to the actual implementation of the present invention. The scope shall be stated first.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical" The directions or positional relationships indicated by "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions shown in the accompanying drawings. or positional relationships are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. .

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In the embodiments of the present invention, unless otherwise expressly stipulated and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Disassembly and connection, or integration; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interaction between two elements. For those with ordinary knowledge in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to FIG. 1 , the positioning device for positioning the crystal rod to be wire-cut according to the embodiment of the present invention can be calculated by combining the crystal phase deviation of the bonded crystal rod with the inherent deviation of the multi-wire cutting machine. The feedback is fed back to the adjustment element to compensate for the crystal phase deviation of the crystal rod. The positioning device 10 includes: a bearing platform 4, a resin plate 3 and an adjustment element used to adjust the position of the resin plate 3 relative to the bearing platform 4. The bearing The stage 4 is used to carry all the components of the positioning device 10, and the resin plate 3 is used to bond the crystal rod 2 to be cut. The adjustment element includes a surface fixedly installed on the surface of the resin plate 3 away from the crystal rod through bonding. adjust The adjustment plate 1 is provided with a horizontal adjustment screw 12 for adjusting the horizontal position of the adjustment plate 1 relative to the bearing platform 4 and a vertical adjustment screw 15 for adjusting the vertical position of the adjustment plate 1 relative to the bearing platform 4 , referring to FIG. 6 , the horizontal adjustment screw 12 includes a first screw 121 and a second screw 122 , and the vertical adjustment screw 15 includes a third screw 153 and a fourth screw 154 . The above-mentioned horizontal adjustment screw 12 and vertical adjustment screw 15 make corresponding adjustments to the position of the crystal rod 2 based on the calculated deviation, so as to realize the deviation compensation in the horizontal plane and the deviation compensation in the vertical plane of the crystal rod, so as to adjust the crystal rod in the crystal rod 2. After the rod 2 is bonded to the resin plate 3, the crystal phase of the crystal rod 2 is adjusted to improve the quality of the cut wafers and improve production efficiency.

Referring to Figures 2 to 3, in this embodiment, the adjustment plate 1 includes a cylindrical latch 11, and an upper groove is provided at the center of the bottom surface of the adjustment plate 1 facing the bearing platform 4 to partially accommodate the latch 11. To make the latch 11 protrude from the bottom surface, the bearing platform 4 is provided with a lower groove at the center of the surface opposite to the adjustment plate 1. The lower groove does not fully accommodate the portion of the latch 11 that protrudes from the bottom surface. So that the adjusting plate 1 can swing in the vertical plane with the pin 11 as the fixed point, and the position of the adjusting plate 1 in the vertical plane relative to the bearing platform 4 is adjusted, thereby adjusting the crystal phase direction of the crystal rod 2 in the vertical plane. . In addition, the inner diameter of the upper groove and the lower groove are the same and larger than the diameter of the latch 11, so that the adjustment plate can rotate in the horizontal plane with the latch 11 as the pivot axis, and adjust the adjustment plate 1 in the horizontal plane relative to the The position of the carrying platform 4 is adjusted to adjust the crystal phase direction of the crystal rod 2 in the horizontal plane.

Referring to FIGS. 2 to 3 , in this embodiment, the bearing platform 4 is formed with two horizontal adjustment screw holes 14 that are symmetrical with respect to the center of the bearing platform 4 . The two horizontal adjustment screw holes 14 are along the edge of the crystal rod 2 are arranged axially and extend in a horizontal plane in a direction perpendicular to the crystal rod 2 . Referring to FIG. 5 , the two horizontal adjustment screw holes 14 are symmetrically arranged on both sides of the plug 11 with a distance D from the plug 11 along the length direction of the crystal rod 2 . Referring to FIG. 2 , two through holes are formed on the adjustment plate 1 , and the through holes are configured to be coaxially arranged with the horizontal adjustment screw hole 14 . The stem portions 12b of the two horizontal adjustment screws 12 pass through the through holes and are respectively It cooperates with the horizontal adjustment screw hole 14 , wherein the diameter of the head 12 a of the horizontal adjustment screw 12 is larger than the diameter of the through hole, so that by twisting the horizontal adjustment screw 12 , the horizontal adjustment screw 12 is in the horizontal adjustment screw hole 14 Make axial movement, thereby driving the bearing platform 4 to move relative to the horizontal adjustment screw 12, because the diameter of the head 12a of the horizontal adjustment screw 12 is larger than the diameter of the through hole, which causes the bearing platform 4 to move relative to the adjustment plate 1, that is, That is, by twisting the horizontal adjustment screw 12, the adjusting plate 1 is driven to rotate relative to the bearing platform 4 with the latch 11 as the pivot axis, thereby adjusting the relative position of the adjusting plate 1 relative to the bearing platform 4, and after the adjustment is completed, the adjusting plate 1 is rotated relative to the bearing platform 4. The adjusting plate is fixed in the horizontal plane, thereby realizing the deviation compensation of the crystal rod 2 in the horizontal plane. Optionally, the two horizontal adjustment screw holes 14 are located on the same side of the bearing platform 4 .

In another embodiment, referring to FIGS. 2 to 3 , the adjustment plate 1 includes two connecting pieces 13 formed on the side walls. The two connecting pieces 13 are at a distance from the plug 11 along the length direction of the crystal rod 2 . The connecting piece 13 is symmetrically arranged on both sides of the plug 11 in the manner of D. The connecting piece 13 extends from the adjusting plate 1 to the bearing platform 4. The above-mentioned through hole is formed on the part of the connecting piece 13 that protrudes from the side wall of the adjusting plate 1. The through hole is configured to be coaxially arranged with the horizontal adjustment screw hole 14 . The rod portion 12b of the horizontal adjustment screw 12 passes through the through hole, and its head 12a presses against the connecting piece 13, and remains relatively stationary with the adjusting plate 1 through the connecting piece 13. Optionally, the connecting piece 13 and the adjusting plate 1 are integrally formed.

Referring to Figures 2 to 3, in this embodiment, the adjustment plate 1 is also formed with two vertical adjustment screw holes 16 arranged along the axial direction of the crystal rod 2 and extending vertically. The vertical adjustment screw holes 16 are symmetrically arranged at the front and rear ends of the adjustment plate 1 with respect to the latch 11 . The distance between the two vertical adjustment screw holes 16 is the length L of the adjustment plate 1 . The adjustment element also includes two Vertical adjustment screws 15, each vertical adjustment screw 15 cooperates with a single vertical adjustment screw hole 16, and the depth of the two vertical adjustment screws 15 passing through the vertical adjustment screw hole 16 can be adjusted. The latch 11 serves as a fulcrum to fine-tune the inclination angle of the adjustment plate 1 relative to the bearing platform 4 in the vertical plane, and after the adjustment is completed, the adjustment plate 1 can be moved in the vertical plane. Internal fixation. Optionally, the adjustment element also includes a pad 17 provided on the bearing platform 4 at a position corresponding to each vertical adjustment screw 15 to protect the surface of the bearing platform 4 .

In another embodiment, the adjustment plate 1 is formed with two sets of vertical adjustment screw holes arranged along the axial direction of the crystal rod 2 and extending in the vertical direction. The two sets of vertical adjustment screw holes are spaced at a distance of L. The way is symmetrical about the center of the adjustment plate 1, each set of vertical adjustment screw holes includes two vertical adjustment screw holes located on both sides of the crystal rod 2, and the adjustment element also includes a single vertical adjustment screw hole. Adjust the screw hole to match the vertical adjustment screw.

An embodiment of the present invention provides a wire cutting machine, which includes the positioning device 10 provided in the above embodiment.

Referring to FIG. 5 , it shows a method of using the positioning device 10 for positioning the crystal rod to be wire-cut according to an embodiment of the present invention, including the following steps: S11: Use a crystal phase measuring instrument to measure the adhesion to the resin. The deviation of the crystal rod of the plate from the standard crystal phase is obtained by obtaining the horizontal deviation H1 of the crystal rod and the vertical deviation V1 of the crystal rod; S12: Obtaining the fixed horizontal deviation H2 and fixed vertical deviation V2 of the wire cutting machine; S13: Measurement of the crystal phase after cutting The instrument is slotted downward and in a relative position during bonding, so based on the horizontal deviation H1 of the crystal rod and the fixed horizontal deviation H2, the overall horizontal deviation H=H1-H2 is obtained, and based on the vertical deviation V1 of the crystal rod and the fixed vertical deviation V2 obtains the overall vertical deviation V=V1-V2; S14: controls the adjusting element to adjust the relative position of the resin plate relative to the bearing platform based on the overall horizontal deviation H and the overall vertical deviation V; S15: cuts the crystal rod.

In the above usage method, the S12 obtains the fixed horizontal deviation H2 of the wire cutting machine, and the fixed vertical deviation V2 specifically refers to: S121: Obtain the horizontal deviation and vertical deviation of the wafer after m cuts of the wire cutting machine, where m is an integer greater than or equal to 5; S122: Calculate the average of m horizontal deviations and vertical deviations to obtain the fixed horizontal deviation H2 and the fixed vertical deviation V2.

In the above method of use, see Figure 6, S14 controls the adjustment element to adjust the relative position of the resin plate 3 relative to the bearing platform 4 based on the overall horizontal deviation H and the overall vertical deviation V, specifically referring to: S141: When the When the overall horizontal deviation H is a positive number, loosen the second screw 122, adjust the displacement distance of the first screw 121 to X, where X=TAN(H/180*PI())*D, and tighten the second screw 122; S142: When the overall horizontal deviation H is a negative number, loosen the first screw 121, adjust the displacement distance of the second screw 122 to X, where X=TAN(H/180*PI())*D, and tighten the first screw 121. One screw 121; S143: When the overall vertical deviation V is a positive number, loosen the fourth screw 154 and adjust the displacement distance of the third screw 153 to Z, where Z=TAN(V/180*PI())*L/ 2. Tighten the fourth screw 154; S144: When the overall vertical deviation V is a negative number, loosen the third screw 153 and adjust the displacement distance of the fourth screw 154 to Z, where Z=TAN(V/180*PI ())*L/2, tighten the third screw 153.

The positioning device 10 provided by the embodiment of the present invention for positioning the crystal rod 2 to be wire-cut has a simple structure and is easy to adjust. It not only effectively reduces the manpower and material costs, but also can still position the wafer after the crystal rod 2 is bonded. The deviation is adjusted and compensated, avoiding the step of degumming and disassembling the crystal rod 2, and preventing secondary damage to the crystal rod 2. The crystal rod adjusted by the above positioning device can obtain good quality wafers after cutting, and can effectively improve production efficiency. Effectively solve technical problems in related technologies.

It should be noted that the technical solutions recorded in the embodiments of the present invention can be combined arbitrarily as long as there is no conflict.

The above are only preferred embodiments of the present invention and are not intended to limit the implementation scope of the present invention. If the present invention is modified or equivalently substituted without departing from the spirit and scope of the present invention, the protection shall be covered by the patent scope of the present invention. within the range.

1:Adjusting plate

2:crystal rod

3: Resin board

4: Bearing platform

10: Positioning device

Claims (9)

A positioning device for positioning a crystal rod to be wire-cut. The positioning device includes: a bearing platform; a resin plate carried on the bearing platform, the resin plate being used to bond the crystal rod; and an adjusting element. Used to adjust the position of the resin plate relative to the bearing platform to adjust the crystal phase of the crystal rod bonded to the resin plate; the adjustment element also includes: disposed between the resin plate and the bearing platform and bonded To the adjustment plate of the resin board, the adjustment plate is provided with a horizontal adjustment screw for adjusting the horizontal position of the adjustment plate relative to the bearing platform and a vertical adjustment screw for adjusting the vertical position of the adjustment plate relative to the bearing platform. The positioning device for positioning the crystal ingot to be wire cut as described in claim 1, wherein the bearing platform is formed with two horizontal adjustment screw holes symmetrically arranged on both sides of the center of the bearing platform. The adjustment screw holes are arranged along the axial direction of the crystal rod and extend in a horizontal plane in a direction perpendicular to the crystal rod. The adjustment plate is formed with two through holes; two horizontal adjustment screws, each of which The rod portion passes through the single through hole and cooperates with the single horizontal adjustment screw hole. The diameter of the head of the horizontal adjustment screw is larger than the diameter of the through hole. The positioning device for positioning the crystal ingot to be wire cut as described in claim 2, wherein the adjustment element further includes two connecting pieces fixedly provided on the side wall of the adjusting plate, and the two connecting pieces are symmetrically arranged. On both sides of the center of the adjustment plate, the connecting piece is The section plate extends toward the bearing platform, and the through hole is formed in the portion of the two connecting pieces extending beyond the adjustment plate. The positioning device for positioning the crystal rod to be wire cut as described in claim 2, wherein the two horizontal adjustment screw holes are located on the same side of the side wall of the adjustment plate. The positioning device for positioning the crystal ingot to be wire cut as described in claim 2, wherein the adjustment plate is formed with two vertical adjustment screws arranged along the axial direction of the crystal ingot and extending vertically. holes, the two vertical adjustment screw holes are symmetrically arranged at both ends of the center of the adjustment plate, the adjustment element also includes two vertical adjustment screws, each of the vertical adjustment screws cooperates with a single vertical adjustment screw hole . The positioning device for positioning the crystal ingot to be wire cut as described in claim 2, wherein the adjustment plate is formed with two sets of vertical adjustment screws arranged along the axial direction of the crystal ingot and extending vertically. holes, the two sets of vertical adjustment screw holes are symmetrically arranged at both ends of the center of the adjustment plate, each group of vertical adjustment screw holes includes two two vertical adjustment screw holes respectively located on both sides of the crystal rod, and The adjustment element also includes a vertical adjustment screw that cooperates with the single vertical adjustment screw hole. The positioning device for positioning the crystal ingot to be wire-cut according to any one of claims 2 to 6, wherein the adjustment element further includes a plug, and the adjustment plate has a center disposed in the center for partially accommodating the plug. The upper groove has an upper groove, and the bearing platform has a lower groove arranged in the center to accommodate the portion of the latch that is not fully accommodated in the upper groove. The positioning device for positioning the crystal ingot to be wire cut as described in claim 5 or 6, wherein the adjustment element further includes a pad disposed on the bearing platform at a position corresponding to each vertical adjustment screw. block. A wire cutting machine comprising a positioning device for positioning a crystal rod to be wire cut according to any one of claims 1 to 8.