SG10201603356WA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10201603356WA
SG10201603356WA SG10201603356WA SG10201603356WA SG10201603356WA SG 10201603356W A SG10201603356W A SG 10201603356WA SG 10201603356W A SG10201603356W A SG 10201603356WA SG 10201603356W A SG10201603356W A SG 10201603356WA SG 10201603356W A SG10201603356W A SG 10201603356WA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
cutting
Prior art date
Application number
SG10201603356WA
Inventor
Matsuyama Toshifumi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201603356WA publication Critical patent/SG10201603356WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/12—Means for treating work or cutting member to facilitate cutting by sharpening the cutting member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
SG10201603356WA 2015-05-20 2016-04-27 Cutting apparatus SG10201603356WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015102531A JP6486770B2 (en) 2015-05-20 2015-05-20 Cutting equipment

Publications (1)

Publication Number Publication Date
SG10201603356WA true SG10201603356WA (en) 2016-12-29

Family

ID=57231780

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201603356WA SG10201603356WA (en) 2015-05-20 2016-04-27 Cutting apparatus

Country Status (7)

Country Link
US (1) US9925682B2 (en)
JP (1) JP6486770B2 (en)
KR (1) KR102434876B1 (en)
CN (1) CN106166692B (en)
DE (1) DE102016208188A1 (en)
SG (1) SG10201603356WA (en)
TW (1) TWI680030B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6486770B2 (en) * 2015-05-20 2019-03-20 株式会社ディスコ Cutting equipment
JP6873712B2 (en) * 2017-01-17 2021-05-19 株式会社ディスコ Dressing board, cutting blade dressing method and cutting equipment
JP6846657B2 (en) * 2017-01-20 2021-03-24 株式会社ディスコ Cutting equipment
JP7007816B2 (en) * 2017-06-08 2022-01-25 株式会社ディスコ Chuck table
JP6938087B2 (en) * 2017-09-21 2021-09-22 株式会社ディスコ Cutting blade mounting mechanism
JP7132706B2 (en) * 2017-10-06 2022-09-07 株式会社ディスコ Steam separation tank
JP2019072776A (en) * 2017-10-12 2019-05-16 株式会社ディスコ Holding method for plate-like object
CN109571782A (en) * 2018-10-26 2019-04-05 广州市昊志机电股份有限公司 A kind of rotatable quick-clamping module of high-precision
CN110217976B (en) * 2019-05-14 2021-11-02 Tcl华星光电技术有限公司 Supporting platform
JP7305276B2 (en) * 2019-10-16 2023-07-10 株式会社ディスコ Workpiece holding method
CN112518612A (en) * 2020-11-20 2021-03-19 许小清 Movable clamping device special for slate processing

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Publication number Priority date Publication date Assignee Title
US4527346A (en) * 1983-09-14 1985-07-09 Macpherson, Inc. Sheet material stacking, conveying and cutting method and apparatus
GB9102381D0 (en) * 1991-02-04 1991-03-20 Smith Alexander Bristle cleaner for carpet cutters
JP3177728B2 (en) * 1993-08-23 2001-06-18 東京エレクトロン株式会社 Processing device and processing method
US5699707A (en) * 1995-02-01 1997-12-23 Automated Solutions, Llc High speed sheet material cutter and method of using same
JP3601153B2 (en) * 1995-12-27 2004-12-15 東京エレクトロン株式会社 Cleaning method for processing gas supply device
JP3275303B2 (en) * 1998-11-25 2002-04-15 株式会社東京精密 Dicing equipment
JP2002103262A (en) * 2000-09-27 2002-04-09 Nippei Toyama Corp Semiconductor wafer adsorbing device
JP4756295B2 (en) * 2000-11-09 2011-08-24 日本電気硝子株式会社 Adsorption holding device and adsorption holding method for glass plate
JP4451739B2 (en) * 2004-07-30 2010-04-14 株式会社島精機製作所 Suction type mounting table sealing device
JP4785549B2 (en) * 2006-02-07 2011-10-05 アピックヤマダ株式会社 Adsorption device and cutting device
KR100682621B1 (en) * 2006-08-18 2007-02-16 신종수 Liquid collector
KR200462370Y1 (en) * 2007-08-13 2012-09-07 주식회사 케이씨텍 Gas-liquid separating device
DE102007061427B4 (en) * 2007-12-20 2009-11-12 Airbus Deutschland Gmbh Apparatus for cutting and handling a substantially planar blank from a CFRP semi-finished product and method
ITMI20080286A1 (en) * 2008-02-22 2009-08-23 Comelz Spa LEATHER CUTTING MACHINE, WITH CUTTING TABLE FOR SIMPLIFIED ACCESS.
JP5276338B2 (en) * 2008-02-27 2013-08-28 東レエンジニアリング株式会社 Coating device
JP5160297B2 (en) * 2008-05-02 2013-03-13 日東電工株式会社 Cutter blade cleaning method, cutter blade cleaning device, and adhesive tape attaching device having the same
JP2010098029A (en) * 2008-10-15 2010-04-30 Disco Abrasive Syst Ltd Drainage mechanism of processing apparatus
JP2010099733A (en) * 2008-10-27 2010-05-06 Disco Abrasive Syst Ltd Laser beam machining apparatus
JP5350908B2 (en) 2009-06-24 2013-11-27 株式会社ディスコ Dressboard holding table and cutting device
JP5136522B2 (en) * 2009-07-07 2013-02-06 日産自動車株式会社 Gas-liquid separator for vehicles
JP5530815B2 (en) 2010-06-08 2014-06-25 株式会社ディスコ Dress board holding table
JP5717571B2 (en) 2011-07-25 2015-05-13 株式会社ディスコ Cutting equipment
JP6132547B2 (en) * 2012-12-25 2017-05-24 株式会社ディスコ Negative pressure generator
JP2014233796A (en) * 2013-06-03 2014-12-15 株式会社ディスコ Processing device
CN104057387B (en) * 2014-06-05 2017-03-15 苏州凯锝微电子有限公司 A kind of diced system with vacuum voltage regulation device
JP6486770B2 (en) * 2015-05-20 2019-03-20 株式会社ディスコ Cutting equipment

Also Published As

Publication number Publication date
JP2016215314A (en) 2016-12-22
CN106166692B (en) 2019-11-19
CN106166692A (en) 2016-11-30
KR20160137370A (en) 2016-11-30
TWI680030B (en) 2019-12-21
TW201701991A (en) 2017-01-16
US9925682B2 (en) 2018-03-27
DE102016208188A1 (en) 2016-11-24
JP6486770B2 (en) 2019-03-20
KR102434876B1 (en) 2022-08-19
US20160339596A1 (en) 2016-11-24

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