JP6846657B2 - Cutting equipment - Google Patents

Cutting equipment Download PDF

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JP6846657B2
JP6846657B2 JP2017008473A JP2017008473A JP6846657B2 JP 6846657 B2 JP6846657 B2 JP 6846657B2 JP 2017008473 A JP2017008473 A JP 2017008473A JP 2017008473 A JP2017008473 A JP 2017008473A JP 6846657 B2 JP6846657 B2 JP 6846657B2
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cutting
cutting blade
elastic wave
detection sensor
dressing
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JP2018117092A (en
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拓也 神長
拓也 神長
智瑛 杉山
智瑛 杉山
沙樹 宮川
沙樹 宮川
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Disco Corp
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Disco Corp
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Priority to JP2017008473A priority Critical patent/JP6846657B2/en
Priority to TW106143675A priority patent/TWI732977B/en
Priority to KR1020180004973A priority patent/KR102315234B1/en
Priority to CN201810047363.9A priority patent/CN108335976B/en
Priority to MYPI2018700216A priority patent/MY198516A/en
Priority to US15/875,242 priority patent/US10361102B2/en
Publication of JP2018117092A publication Critical patent/JP2018117092A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/12—Means for treating work or cutting member to facilitate cutting by sharpening the cutting member
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46—Multiprogramming arrangements
    • G06F9/48—Program initiating; Program switching, e.g. by interrupt
    • G06F9/4806—Task transfer initiation or dispatching
    • G06F9/4843—Task transfer initiation or dispatching by program, e.g. task dispatcher, supervisor, operating system
    • G06F9/485—Task life-cycle, e.g. stopping, restarting, resuming execution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Nonmetal Cutting Devices (AREA)

Description

本発明は、半導体ウエーハ等の板状物を切削ブレードで切削する切削装置に関する。 The present invention relates to a cutting device for cutting a plate-like object such as a semiconductor wafer with a cutting blade.

従来、半導体ウエーハやガラス基板、樹脂基板等の板状物をデバイスチップへ分割する装置として、スピンドルの端部に取り付けられて回転する円形状の切削ブレードを備えた切削装置が利用されている。切削ブレードは、高速回転しながら板状物を切削するが、切削により生じた切削屑等が切削ブレードの先端に付着して目詰まりを起こし、切削加工能力が低下するという問題がある。この問題を解決するために、板状部を切削する合間に、目立てドレッシングボードに切削ブレードを切り込ませて目詰まりを除去する目立てドレスを行っている（例えば、特許文献１参照）。 Conventionally, as a device for dividing a plate-like object such as a semiconductor wafer, a glass substrate, or a resin substrate into a device chip, a cutting device provided with a rotating circular cutting blade attached to an end of a spindle has been used. The cutting blade cuts a plate-like object while rotating at a high speed, but there is a problem that cutting chips and the like generated by cutting adhere to the tip of the cutting blade and cause clogging, resulting in a decrease in cutting ability. In order to solve this problem, a dressing dressing is performed in which a cutting blade is cut into a dressing dressing board between cuttings of a plate-shaped portion to remove clogging (see, for example, Patent Document 1).

特開２０００−４９１２０号公報Japanese Unexamined Patent Publication No. 2000-49120

特許文献１の目立てドレスでは、どの程度ドレスで除去すると、切削能力が改善あるいは復活するかが分かりにくくなっている。現状では、ドレスでの除去量を作業者が経験的に決定しており、このため、切削ブレードを必要以上に無駄に除去する場合が多くなる。この結果、ドレスに要する工程が長時間化したり、切削ブレードの交換サイクルが短くなったりしてしまう、という問題がある。 In the dress dress of Patent Document 1, it is difficult to understand how much the dress should be removed to improve or restore the cutting ability. At present, the operator empirically determines the amount to be removed with the dress, and therefore, the cutting blade is often removed unnecessarily wastefully. As a result, there are problems that the process required for dressing becomes long and the replacement cycle of the cutting blade is shortened.

本発明はかかる点に鑑みてなされたものであり、切削ブレードにおけるドレスにて無駄な除去をなくすことができる切削装置を提供することを目的の１つとする。 The present invention has been made in view of the above points, and one of the objects of the present invention is to provide a cutting apparatus capable of eliminating unnecessary removal by dressing in a cutting blade.

本発明の切削装置は、板状物を保持する保持テーブルと、保持テーブルに保持された板状物を切削するための切れ刃を有する切削ブレードを備えた切削手段と、保持テーブルと切削手段とを相対的に切削送り方向に切削送りする切削送り手段と、保持テーブルと切削手段とを相対的に切削送り方向と直交する割り出し送り方向に割り出し送りする割り出し送り手段とを具備する切削装置において、切削手段又は保持テーブルのいずれか一方に配設され保持テーブルに保持された板状物を切削ブレードにより切削する際に発生する弾性波を検出する弾性波検出センサと、少なくとも切削送り手段及び割り出し送り手段を制御する制御手段とを備え、制御手段は、保持テーブルに保持されたドレッサーボードに切削ブレードで切削してドレスする際に切削ブレードが目立てされるにつれて変化する弾性波検出センサの出力信号の目立てドレスが完了した時の値を閾値として予め記憶する記憶部を備え、閾値は、切削ブレードの種類、ドレッサーボードの種類及びドレスの加工条件に応じて求められ、保持手段で保持されたドレッサーボードにおいて切削ブレードをドレスする際に、弾性波検出センサからの出力信号が記憶部に記憶された閾値に到達したら、切削を停止しドレスを終了することを特徴とする。 The cutting apparatus of the present invention includes a holding table for holding a plate-shaped object, a cutting means including a cutting blade having a cutting edge for cutting the plate-shaped object held on the holding table, and a holding table and a cutting means. In a cutting apparatus including a cutting feed means for relatively cutting and feeding in the cutting feed direction and an indexing and feeding means for indexing and feeding the holding table and the cutting means in the indexing feed direction relatively orthogonal to the cutting feed direction. An elastic wave detection sensor that detects elastic waves generated when a plate-like object placed on either the cutting means or the holding table and held on the holding table is cut by a cutting blade, and at least the cutting feed means and index feed. The control means includes a control means for controlling the means, and the control means of the output signal of the elastic wave detection sensor that changes as the cutting blade is sharpened when the cutting blade is cut and dressed on the dresser board held on the holding table. It is equipped with a storage unit that stores in advance the value when the dressing is completed as a threshold value, and the threshold value is obtained according to the type of cutting blade, the type of dresser board, and the processing conditions of the dress, and is held by the holding means. When the cutting blade is dressed, the cutting is stopped and the dressing is finished when the output signal from the elastic wave detection sensor reaches the threshold value stored in the storage unit.

この構成によれば、ドレスによって切削ブレードが目立てされる際に発生する弾性波を検出し、検出した弾性波が閾値に到達したときにドレスを停止することで、適切なタイミングでドレスを終了することができる。これにより、切削ブレードを無駄に除去させずにドレスを行うことができ、ドレス時間の短時間化を図ることができる上、切削ブレードの交換サイクルを長くすることができる。 According to this configuration, the dress is finished at an appropriate timing by detecting the elastic wave generated when the cutting blade is sharpened by the dress and stopping the dress when the detected elastic wave reaches the threshold value. be able to. As a result, dressing can be performed without wastefully removing the cutting blade, the dressing time can be shortened, and the replacement cycle of the cutting blade can be lengthened.

本発明によれば、ドレス時の弾性波を検出してドレスを適切なタイミングで終了することができるので、切削ブレードにおけるドレスにて無駄な除去をなくすことができる。 According to the present invention, since the elastic wave at the time of dressing can be detected and the dressing can be finished at an appropriate timing, wasteful removal by the dressing in the cutting blade can be eliminated.

本実施の形態の切削装置の斜視図である。It is a perspective view of the cutting apparatus of this embodiment. 本実施の形態の切削手段の分解斜視図である。It is an exploded perspective view of the cutting means of this embodiment. 本実施の形態の切削手段の断面等を模式的に示す図である。It is a figure which shows typically the cross section of the cutting means of this embodiment. 弾性波検出センサの検出結果を示すグラフである。It is a graph which shows the detection result of the elastic wave detection sensor. 変形例のドレッサーボードとサブチャックテーブルの断面模式図である。It is sectional drawing of the dresser board and the sub-chuck table of the modification.

以下、添付図面を参照して、本実施の形態の切削装置について説明する。図１は、本実施の形態の切削装置の斜視図である。なお、切削装置は、本実施の形態のようにドレスの際の弾性波を検出する構造を備えた構成であればよく、図１に示す構成に限定されない。図１においては、説明の便宜上、一部の部材については省略して記載しているが、切削装置が通常備える構成については備えているものとする。 Hereinafter, the cutting apparatus of the present embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view of the cutting device of the present embodiment. The cutting device may be configured as long as it has a structure for detecting elastic waves at the time of dressing as in the present embodiment, and is not limited to the configuration shown in FIG. In FIG. 1, for convenience of explanation, some members are omitted, but the configuration normally provided by the cutting apparatus is assumed to be provided.

図１に示すように、本実施の形態の切削装置１は、切削手段４０の切削ブレード４２と被加工物Ｗを保持するチャックテーブル２０とを相対移動させ、被加工物Ｗを切削するように構成されている。被加工物Ｗの表面は格子状の分割予定ラインＬによって複数の領域に区画されており、分割予定ラインＬに区画された各領域にはデバイスＤが形成されている。また、被加工物Ｗは、リングフレームＦの内側でダイシングテープＴに貼着されており、ダイシングテープＴを介してリングフレームＦに支持された状態で切削装置１に搬入される。 As shown in FIG. 1, in the cutting apparatus 1 of the present embodiment, the cutting blade 42 of the cutting means 40 and the chuck table 20 holding the workpiece W are relatively moved so as to cut the workpiece W. It is configured. The surface of the workpiece W is partitioned into a plurality of regions by a grid-like scheduled division line L, and a device D is formed in each region partitioned by the scheduled division line L. Further, the workpiece W is attached to the dicing tape T inside the ring frame F, and is carried into the cutting device 1 in a state of being supported by the ring frame F via the dicing tape T.

なお、被加工物Ｗは、切削装置１の切削対象となる部材であればよく、特に材質は限定されない。被加工物Ｗは、例えばシリコン、ガリウム砒素等の半導体基板にＩＣ、ＬＳＩ等の半導体デバイスが形成された半導体ウエーハでもよいし、サファイア、炭化ケイ素等の無機材料基板にＬＥＤ等の光デバイスが形成された光デバイスウエーハでもよい。さらに、被加工物Ｗは、ＣＳＰ（Chip Size Package）基板等のパッケージ基板、プリント基板、金属基板等でもよいし、ウエーハの裏面に貼着されるＤＡＦ（Die Attach Film）等の粘着テープでもよい。 The workpiece W may be a member to be cut by the cutting device 1, and the material is not particularly limited. The workpiece W may be a semiconductor wafer in which semiconductor devices such as ICs and LSIs are formed on a semiconductor substrate such as silicon or gallium arsenic, or an optical device such as an LED is formed on an inorganic material substrate such as sapphire or silicon carbide. It may be an optical device wafer. Further, the workpiece W may be a package substrate such as a CSP (Chip Size Package) substrate, a printed circuit board, a metal substrate, or an adhesive tape such as DAF (Die Attach Film) attached to the back surface of the wafer. ..

切削装置１の基台１０の上面には、Ｘ軸方向に延在するように開口が形成されており、この開口はチャックテーブル２０と共に移動可能な移動板１１及び蛇腹状の防水カバー１２に覆われている。チャックテーブル２０の表面には、多孔質のポーラス材によって被加工物Ｗを保持する保持面２１が形成されている。保持面２１はチャックテーブル２０内の流路を通じて吸引源（不図示）に接続されており、保持面２１に生じる負圧によって被加工物Ｗが吸引保持される。防水カバー１２の下方には、チャックテーブル２０をＸ軸方向に切削送りするボールねじ式の切削送り手段２２が設けられている。この切削送り手段２２によって、チャックテーブル２０と切削手段４０とを切削送り方向となるＸ軸方向に相対的に切削送り可能となる。 An opening is formed on the upper surface of the base 10 of the cutting device 1 so as to extend in the X-axis direction, and this opening is covered with a moving plate 11 movable together with the chuck table 20 and a bellows-shaped waterproof cover 12. It has been. On the surface of the chuck table 20, a holding surface 21 for holding the workpiece W is formed by a porous porous material. The holding surface 21 is connected to a suction source (not shown) through a flow path in the chuck table 20, and the workpiece W is sucked and held by the negative pressure generated on the holding surface 21. Below the waterproof cover 12, a ball screw type cutting feed means 22 for cutting and feeding the chuck table 20 in the X-axis direction is provided. The cutting feed means 22 enables the chuck table 20 and the cutting means 40 to be relatively cut and fed in the X-axis direction, which is the cutting feed direction.

移動板１１の上には、チャックテーブル２０の近傍位置にサブチャックテーブル（保持テーブル）２４が更に設置されている。サブチャックテーブル２４には切削ブレード４２の目立てドレスに使用される矩形状のドレッサーボード（板状物）２５が吸引保持されている。 A sub-chuck table (holding table) 24 is further installed on the moving plate 11 at a position near the chuck table 20. A rectangular dresser board (plate-like object) 25 used for the dressing of the cutting blade 42 is suction-held on the sub-chuck table 24.

基台１０上において開口を挟んで、エレベータ手段１５及びスピンナー洗浄機構１６が設けられている。スピンナー洗浄機構１６では、回転中のスピンナーテーブル１６ａに向けて洗浄水が噴射されて被加工物Ｗが洗浄された後、洗浄水の代わりに乾燥エアが吹き付けられて被加工物Ｗが乾燥される。 An elevator means 15 and a spinner cleaning mechanism 16 are provided on the base 10 with an opening interposed therebetween. In the spinner cleaning mechanism 16, after the cleaning water is sprayed toward the rotating spinner table 16a to clean the workpiece W, dry air is blown instead of the cleaning water to dry the workpiece W. ..

基台１０の上面に立設された門型の立壁部１３には、切削手段４０をＹ軸方向に移動する割り出し送り手段３０が設けられている。割り出し送り手段３０は、切削手段４０をＹ軸方向に移動することで、切削手段４０とチャックテーブル２０とを相対的に割り出し送り可能となる。この割り出し送りの方向はＹ軸方向であり、切削送り方向（Ｘ軸方向）と直交する方向となる。割り出し送り手段３０は、立壁部１３の前面に配置されたＹ軸方向に平行な一対のガイドレール３１と、一対のガイドレール３１にスライド可能に設置されたＹ軸テーブル３２とを有している。また、立壁部１３には、各切削手段４０をＺ軸方向に切込み送りする切り込み送り手段３５が更に設けられている。切り込み送り手段３５は、Ｙ軸テーブル３２上に配置されたＺ軸方向に平行な一対のガイドレール３６と、一対のガイドレール３６にスライド可能に設置されたＺ軸テーブル３７とを有している。 The gate-shaped standing wall portion 13 erected on the upper surface of the base 10 is provided with indexing feeding means 30 for moving the cutting means 40 in the Y-axis direction. The indexing feed means 30 can relatively index and feed the cutting means 40 and the chuck table 20 by moving the cutting means 40 in the Y-axis direction. The direction of this indexing feed is the Y-axis direction, which is orthogonal to the cutting feed direction (X-axis direction). The indexing feeding means 30 has a pair of guide rails 31 arranged in front of the vertical wall portion 13 parallel to the Y-axis direction, and a Y-axis table 32 slidably installed on the pair of guide rails 31. .. Further, the vertical wall portion 13 is further provided with a cutting feed means 35 that cuts and feeds each cutting means 40 in the Z-axis direction. The cut feed means 35 has a pair of guide rails 36 arranged on the Y-axis table 32 and parallel to the Z-axis direction, and a Z-axis table 37 slidably installed on the pair of guide rails 36. ..

Ｚ軸テーブル３７の下部には、被加工物Ｗを切削する切削手段４０が設けられている。Ｙ軸テーブル３２およびＺ軸テーブル３７の背面側には、それぞれナット部が形成され、これらナット部にボールネジ３３、３８が螺合されている。Ｙ軸テーブル３２用のボールネジ３３、Ｚ軸テーブル３７用のボールネジ３８の一端部には、それぞれ駆動モータ３４、３９が連結されている。駆動モータ３４、３９により、それぞれのボールネジ３３、３８が回転駆動されることで、切削手段４０がガイドレール３１に沿ってＹ軸方向に移動されると共に、ガイドレール３６に沿ってＺ軸方向に移動される。駆動モータ３４、３９の制御は制御手段８０によって行われる。制御手段８０については後述する。 A cutting means 40 for cutting the workpiece W is provided at the lower part of the Z-axis table 37. Nut portions are formed on the back side of the Y-axis table 32 and the Z-axis table 37, respectively, and ball screws 33 and 38 are screwed into these nut portions. Drive motors 34 and 39 are connected to one end of the ball screw 33 for the Y-axis table 32 and the ball screw 38 for the Z-axis table 37, respectively. By rotationally driving the ball screws 33 and 38 by the drive motors 34 and 39, the cutting means 40 is moved in the Y-axis direction along the guide rail 31 and in the Z-axis direction along the guide rail 36. Will be moved. The drive motors 34 and 39 are controlled by the control means 80. The control means 80 will be described later.

なお、切削送り手段２２、割り出し送り手段３０及び切り込み送り手段３５によって、切削手段４０がチャックテーブル２０に対しＸＹＺ軸方向に相対的に移動可能となり、同様にしてサブチャックテーブル２５に対しても切削手段４０がＸＹＺ軸方向に相対的に移動可能となる。 The cutting feed means 22, the index feed means 30, and the cut feed means 35 allow the cutting means 40 to move relative to the chuck table 20 in the XYZ axis direction, and similarly cut the sub chuck table 25 as well. The means 40 can move relatively in the XYZ axis direction.

切削手段４０は、スピンドルハウジング４１から突出したスピンドル（不図示）の先端に切削ブレード４２を回転可能に装着して構成される。切削ブレード４２は、ダイヤモンド等の砥粒をボンド剤で結合（焼結）して円板状に形成されている。切削手段４０の詳細な構成については後述する。 The cutting means 40 is configured by rotatably mounting a cutting blade 42 on the tip of a spindle (not shown) protruding from the spindle housing 41. The cutting blade 42 is formed in a disk shape by bonding (sintering) abrasive grains such as diamond with a bonding agent. The detailed configuration of the cutting means 40 will be described later.

切削装置１は、制御手段８０を更に備えている。制御手段８０は、少なくとも切削送り手段２２、割り出し送り手段３０及び切り込み送り手段３５を含む装置各部を統括制御する。制御手段８０は、各種処理を実行するプロセッサやメモリ等により構成される。メモリは、用途に応じてＲＯＭ（Read Only Memory）、ＲＡＭ（Random Access Memory）等の一つ又は複数の記憶媒体で構成される。 The cutting device 1 further includes a control means 80. The control means 80 comprehensively controls each part of the device including at least the cutting feed means 22, the index feed means 30, and the cut feed means 35. The control means 80 includes a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the intended use.

次に、上記切削装置１による被加工物Ｗの切削加工方法について説明する。先ず、搬送手段（不図示）によって、ダイシングテープＴを介してリングフレームＦに固定された被加工物Ｗをユニットとしてチャックテーブル２０に搬送し、吸引保持する。次いで、被加工物Ｗをアライメントしてから、チャックテーブル２０をＸ軸方向に移動し、被加工物Ｗを切削手段４０の下方に近付けて位置付ける。また、割り出し送り手段３０では、被加工物Ｗの分割予定ラインに応じて切削手段４０をＹ軸方向に移動して位置付ける。 Next, a method of cutting the workpiece W by the cutting device 1 will be described. First, the workpiece W fixed to the ring frame F via the dicing tape T is conveyed to the chuck table 20 as a unit by a conveying means (not shown) and is sucked and held. Next, after aligning the workpiece W, the chuck table 20 is moved in the X-axis direction to position the workpiece W closer to the lower part of the cutting means 40. Further, in the indexing feed means 30, the cutting means 40 is moved and positioned in the Y-axis direction according to the planned division line of the workpiece W.

その後、切削手段４０を下降し、被加工物Ｗの切り込み深さに応じてＺ軸方向に位置付ける。この位置付け後、高速回転された切削ブレード４２に対してチャックテーブル２０をＸ軸方向に相対移動し、被加工物Ｗの分割予定ラインＬに沿って切削溝を形成する。そして、切削溝を１本形成する毎に、分割予定ラインＬのＹ方向のピッチ間隔分、切削手段４０をＹ方向に移動し、同様の動作を繰り返すことで、切削溝が順次形成される。Ｘ軸と平行な分割予定ライン全てに切削溝を形成後、θテーブル（不図示）を介してチャックテーブル２０を９０°回転し、上記と同様の切削を行うと、すべての分割予定ラインＬに切削溝が形成されて被加工物Ｗが縦横に切削される。 After that, the cutting means 40 is lowered and positioned in the Z-axis direction according to the cutting depth of the workpiece W. After this positioning, the chuck table 20 is relatively moved in the X-axis direction with respect to the cutting blade 42 rotated at high speed to form a cutting groove along the planned division line L of the workpiece W. Then, every time one cutting groove is formed, the cutting means 40 is moved in the Y direction by the pitch interval in the Y direction of the planned division line L, and the same operation is repeated to sequentially form the cutting groove. After forming cutting grooves on all planned division lines parallel to the X-axis, the chuck table 20 is rotated 90 ° via a θ table (not shown), and the same cutting as above is performed to make all planned division lines L. A cutting groove is formed and the workpiece W is cut vertically and horizontally.

このように切削加工が繰り返されると、切削により生じた切削屑等が切削ブレードの先端に付着して目詰まりを起こし、切削加工能力が低下する。このため、切削装置１では、定期的に切削ブレード４２をドレスする。ドレスする際には、サブチャックテーブル２４でドレッサーボード２５を保持する。そして、被加工物Ｗを切削する場合と同様に、サブチャックテーブル２４に対して切削手段４０を相対的に移動し、切削ブレード４２によってドレッサーボード２５を所定深さ切り込む。これにより、切削ブレード４２の切れ刃５８（図３参照）が目立てされ、切れ刃５８のエッジ部分に砥粒が表出して新たな切り刃が形成される。 When the cutting process is repeated in this way, the cutting debris generated by the cutting adheres to the tip of the cutting blade and causes clogging, resulting in a decrease in the cutting processing ability. Therefore, the cutting device 1 periodically dresses the cutting blade 42. When dressing, the dresser board 25 is held by the sub-chuck table 24. Then, as in the case of cutting the workpiece W, the cutting means 40 is relatively moved with respect to the sub-chuck table 24, and the dresser board 25 is cut to a predetermined depth by the cutting blade 42. As a result, the cutting edge 58 (see FIG. 3) of the cutting blade 42 is sharpened, abrasive grains are exposed at the edge portion of the cutting edge 58, and a new cutting edge is formed.

続いて、図２及び図３を参照して、本実施の形態の切削手段について説明する。図２は、本実施の形態の切削手段の分解斜視図である。図３は、本実施の形態の切削手段の断面等を模式的に示す図である。なお、図２及び図３では、説明の便宜上、切削ブレードの外周を覆うホイールカバーを省略して記載している。また、切削手段は、本実施の形態の切削ブレードが装着される構成であればよく、図２及び図３に示す構成に限定されない。 Subsequently, the cutting means of the present embodiment will be described with reference to FIGS. 2 and 3. FIG. 2 is an exploded perspective view of the cutting means of the present embodiment. FIG. 3 is a diagram schematically showing a cross section and the like of the cutting means of the present embodiment. Note that, in FIGS. 2 and 3, for convenience of explanation, the wheel cover covering the outer periphery of the cutting blade is omitted. Further, the cutting means may be configured as long as the cutting blade of the present embodiment is mounted, and is not limited to the configuration shown in FIGS. 2 and 3.

図２及び図３に示すように、切削手段４０は、Ｚ軸テーブル３７（図１参照）の下部に固定されたスピンドルハウジング４１を備えている。スピンドルハウジング４１は、ハウジング本体４４と、ハウジング本体４４の一端側に装着される円筒状のハウジングカバー４５とを備えている。 As shown in FIGS. 2 and 3, the cutting means 40 includes a spindle housing 41 fixed to the bottom of the Z-axis table 37 (see FIG. 1). The spindle housing 41 includes a housing body 44 and a cylindrical housing cover 45 mounted on one end side of the housing body 44.

ハウジング本体４４の内部には、Ｙ軸の周りに回転するスピンドル４６が収容されている。スピンドル４６は、例えばエアスピンドルであり、圧縮エア層を介してハウジング本体４４に対して浮動状態で支持されている。ハウジング本体４４からはスピンドル４６の先端部分４６ａが突出している。 Inside the housing body 44, a spindle 46 that rotates around the Y axis is housed. The spindle 46 is, for example, an air spindle, and is supported in a floating state with respect to the housing body 44 via a compressed air layer. The tip portion 46a of the spindle 46 projects from the housing body 44.

ハウジングカバー４５の中央には、円形の開口４５ａが形成されている。また、ハウジングカバー４５のハウジング本体４４側には、孔４５ｂが形成された係止部４５ｃが設けられている。スピンドル４６の一端側を開口４５ａに挿通し、係止部４５ｃのネジ孔４５ｂを通じてハウジング本体４４のネジ孔４４ａにネジ４８（図２では不図示、図３参照）を締め込めば、ハウジングカバー４５をハウジング本体４４に固定できる。 A circular opening 45a is formed in the center of the housing cover 45. Further, a locking portion 45c in which a hole 45b is formed is provided on the housing body 44 side of the housing cover 45. If one end side of the spindle 46 is inserted into the opening 45a and the screw 48 (not shown in FIG. 2, see FIG. 3) is tightened into the screw hole 44a of the housing body 44 through the screw hole 45b of the locking portion 45c, the housing cover 45 Can be fixed to the housing body 44.

スピンドル４６の先端面にはネジ穴４６ｂが形成されている。また、スピンドル４６の先端部分４６ａには、固定フランジ５０が取り付けられる。固定フランジ５０は、円筒形状のボス部５１と、ボス部５１の周面から径方向外側に広がるフランジ形状の装着部５２とを有している。 A screw hole 46b is formed on the tip surface of the spindle 46. A fixed flange 50 is attached to the tip portion 46a of the spindle 46. The fixed flange 50 has a cylindrical boss portion 51 and a flange-shaped mounting portion 52 extending radially outward from the peripheral surface of the boss portion 51.

固定フランジ５０の中央には、ボス部５１を貫通する開口５０ａが形成されている。開口５０ａには、裏面側（スピンドルハウジング４５側）からスピンドル４６の先端部分４６ａが嵌め込まれる。この状態で、開口５０ａ内にワッシャー５４を位置付け、当該ワッシャー５４を通じて固定用のボルト５５をネジ穴４６ｂにねじ込むことで、固定フランジ部材５０はスピンドル４６に固定される。 An opening 50a penetrating the boss portion 51 is formed in the center of the fixed flange 50. The tip portion 46a of the spindle 46 is fitted into the opening 50a from the back surface side (spindle housing 45 side). In this state, the washer 54 is positioned in the opening 50a, and the fixing bolt 55 is screwed into the screw hole 46b through the washer 54, so that the fixing flange member 50 is fixed to the spindle 46.

切削ブレード４２は、略円板状のハブ基台５７の外周に環状の切れ刃５８が取り付けられたハブブレードであり、ハブ基台５７の中央には固定フランジ５０のボス部５１に挿入される挿入孔５９が形成されている。切れ刃５８は、金属や樹脂等のボンド材（結合材）に、ダイヤモンドやＣＢＮ（Cubic Boron Nitride）等の砥粒を混合して所定厚みに形成されている。なお、切削ブレード４２として、切れ刃のみで構成されたワッシャブレードを用いてもよい。 The cutting blade 42 is a hub blade in which an annular cutting edge 58 is attached to the outer circumference of a substantially disk-shaped hub base 57, and is inserted into a boss portion 51 of a fixed flange 50 at the center of the hub base 57. An insertion hole 59 is formed. The cutting edge 58 is formed to have a predetermined thickness by mixing abrasive grains such as diamond and CBN (Cubic Boron Nitride) with a bond material (bonding material) such as metal or resin. As the cutting blade 42, a washer blade composed of only a cutting edge may be used.

ハブ基台５７の挿入孔５９がボス部５１に押し込まれると、ハブ基台５７からボス部５１が突出される。ボス部５１の突出部分の外周面には雄ネジ５１ａが形成されており、この雄ネジ５１ａに環状の固定ナット６１が締め付けられて固定フランジ５０に切削ブレード４２が固定される。このようにして、スピンドル４６の先端に固定フランジ５０が装着され、さらに固定フランジ５０に切削ブレード４２が装着されている。 When the insertion hole 59 of the hub base 57 is pushed into the boss portion 51, the boss portion 51 protrudes from the hub base 57. A male screw 51a is formed on the outer peripheral surface of the protruding portion of the boss portion 51, and an annular fixing nut 61 is tightened to the male screw 51a to fix the cutting blade 42 to the fixing flange 50. In this way, the fixed flange 50 is attached to the tip of the spindle 46, and the cutting blade 42 is further attached to the fixed flange 50.

切削手段４０においては、サブチャックテーブル２４に保持されたドレッサーボード２５（何れも図１参照）を切削ブレード４２により切削する際に発生する弾性波を検出する弾性波検出センサ６４が設けられている。 The cutting means 40 is provided with an elastic wave detection sensor 64 that detects elastic waves generated when the dresser board 25 (both of which are referred to with reference to FIG. 1) held on the sub-chuck table 24 is cut by the cutting blade 42. ..

弾性波検出センサ６４は、例えば弾性波を検出する機能を備えたＡＥセンサ（アコースティック・エミッションセンサ）により構成される。具体的には、弾性波検出センサ６４は、固定フランジ５０の内部に固定された超音波振動子６６を備えている。この超音波振動子６６は、例えば、チタン酸バリウム（ＢａＴｉＯ３）、チタン酸ジルコン酸鉛（Ｐｂ（Ｚｉ，Ｔｉ）Ｏ３）、リチウムナイオベート（ＬｉＮｂＯ３）、リチウムタンタレート（ＬｉＴａＯ３）等の材料で形成されており、切削ブレード４２の振動を電圧（振動信号）に変換する。超音波振動子６６は、所定の周波数の振動に対して共振し、その共振周波数に応じて、弾性波検出センサ６４として検出できる振動の周波数が決まるようにしてもよい。この場合、複数の固定フランジ５０に共振周波数の異なる超音波振動子６６を設けておき、それら固定フランジ５０の何れかを加工条件等に応じて適宜選択して用いるようにしてもよい。 The elastic wave detection sensor 64 is composed of, for example, an AE sensor (acoustic emission sensor) having a function of detecting elastic waves. Specifically, the elastic wave detection sensor 64 includes an ultrasonic vibrator 66 fixed inside the fixed flange 50. The ultrasonic vibrator 66 includes, for example, barium titanate (BaTIO 3 ), lead zirconate titanate (Pb (Zi, Ti) O 3 ), lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), and the like. It is made of the above material and converts the vibration of the cutting blade 42 into a voltage (vibration signal). The ultrasonic vibrator 66 may resonate with vibration of a predetermined frequency, and the frequency of vibration that can be detected by the elastic wave detection sensor 64 may be determined according to the resonance frequency. In this case, ultrasonic vibrators 66 having different resonance frequencies may be provided on the plurality of fixed flanges 50, and any one of the fixed flanges 50 may be appropriately selected and used according to the processing conditions and the like.

弾性波検出センサ６４は、固定フランジ５０に設けられて超音波振動子６６に接続される第１のコイル手段６７と、ハウジングカバー４５に設けられて第１のコイル手段６７に対向する第２のコイル手段６８とを含む。第１のコイル手段６７及び第２のコイル手段６８としては、導線が巻回された円環状のコイルを例示できる。 The elastic wave detection sensor 64 includes a first coil means 67 provided on the fixed flange 50 and connected to the ultrasonic vibrator 66, and a second coil means 67 provided on the housing cover 45 and facing the first coil means 67. Includes coil means 68. As the first coil means 67 and the second coil means 68, an annular coil in which a conducting wire is wound can be exemplified.

第１のコイル手段６７及び第２のコイル手段６８は、磁気的に結合されており、超音波振動子６６で発生した電圧は、第１のコイル手段６７と第２のコイル手段６８との相互誘導によって、第２のコイル手段６８側に伝送される。 The first coil means 67 and the second coil means 68 are magnetically coupled, and the voltage generated by the ultrasonic vibrator 66 is mutual to the first coil means 67 and the second coil means 68. By induction, it is transmitted to the second coil means 68 side.

図３に示すように、第２のコイル手段６８には、信号処理部８１を介して制御手段８０が接続されている。信号処理部８１は、弾性波検出センサ６４が検出した出力信号を出力電圧に変換するアンプ等を備えている。従って、弾性波検出センサ６４が検出した出力信号は、信号処理部８１によって変換された出力信号（出力電圧等）として制御手段８０に入力される。 As shown in FIG. 3, the control means 80 is connected to the second coil means 68 via the signal processing unit 81. The signal processing unit 81 includes an amplifier or the like that converts an output signal detected by the elastic wave detection sensor 64 into an output voltage. Therefore, the output signal detected by the elastic wave detection sensor 64 is input to the control means 80 as an output signal (output voltage or the like) converted by the signal processing unit 81.

制御手段８０は、上述したメモリによって構成されて弾性波検出センサ６４からの出力信号と比較するための閾値を予め記憶する記憶部８０ａを含む。また、制御手段８０は、比較部８０ｂ及び停止制御部８０ｃを有している。比較部８０ｂは、ドレスの最中に、記憶部８０ａが記憶した閾値と、弾性波検出センサ６４からの出力信号とを比較し、かかる出力信号が閾値に到達したか否かを判断する。そして、比較部８０ｂの判断結果に応じ、停止制御部８０ｃによって各送り手段２２、３０、３５の動作を停止或いは所定動作後にその動作を停止し、切削ブレード４２のドレスを終了するよう制御する。 The control means 80 includes a storage unit 80a which is composed of the above-mentioned memory and stores a threshold value for comparison with an output signal from the elastic wave detection sensor 64 in advance. Further, the control means 80 has a comparison unit 80b and a stop control unit 80c. The comparison unit 80b compares the threshold value stored by the storage unit 80a with the output signal from the elastic wave detection sensor 64 during dressing, and determines whether or not the output signal has reached the threshold value. Then, according to the determination result of the comparison unit 80b, the stop control unit 80c stops the operation of each of the feeding means 22, 30, 35, or stops the operation after a predetermined operation, and controls to end the dressing of the cutting blade 42.

ここで、ドレッサーボード２５（図１参照）において切削ブレード４２をドレスする際、ドレッサーボード２５の上面が回転する切削ブレード４２の切れ刃５８に接触すると、切削ブレード４２で弾性波が発生する。弾性波の発生は、切れ刃５８にドレッサーボード２５が当接して切削送りする際の切れ刃５８の表面粗さに応じたものとなる。弾性波は、切削ブレード４２の近傍に位置する弾性波検出センサ６４に伝播し、弾性波検出センサ６４は伝播した弾性波を検出して出力信号となるＡＥ値を出力する。ドレスが進行されるにつれて、切れ刃５８の表面粗さは減少し、この減少に応じて弾性波検出センサ６４のＡＥ値も変化する。 Here, when the cutting blade 42 is dressed on the dresser board 25 (see FIG. 1), when the upper surface of the dresser board 25 comes into contact with the cutting blade 58 of the rotating cutting blade 42, an elastic wave is generated in the cutting blade 42. The generation of elastic waves depends on the surface roughness of the cutting edge 58 when the dresser board 25 abuts on the cutting edge 58 and feeds the cutting edge 58. The elastic wave propagates to the elastic wave detection sensor 64 located in the vicinity of the cutting blade 42, and the elastic wave detection sensor 64 detects the propagated elastic wave and outputs an AE value as an output signal. As the dressing progresses, the surface roughness of the cutting edge 58 decreases, and the AE value of the elastic wave detection sensor 64 changes accordingly.

図４は、弾性波検出センサの検出結果を示すグラフである。図４のグラフにおいて、縦軸は弾性波検出センサ６４が出力するＡＥ値、横軸は時間であり、目詰まりを起こした状態からドレスが完了するまでを出した結果である。図４に示すように、ドレスが完了した状態に比べ、目詰まりを起こして荒れた状態では、切れ刃５８が回転しながらドレッサーボード２５に接触する際の衝突エネルギーの変化が大きくなり、弾性波の出力信号となるＡＥ値も大きくなる。従って、ドレスする際に切削ブレード４２が目立てされるにつれて弾性波検出センサ６４からのＡＥ値が相対的に小さくなるよう変化する。制御手段８０の記憶部８０ａでは、ドレスが完了した状態の弾性波検出センサ６４からのＡＥ値を閾値として予め記憶する。この閾値は、切削ブレード４２の種類やドレッサーボード２５の種類、加工条件等に応じて予めドレスを行い、このドレスが完了した時に弾性波検出センサ６４で実際に弾性波を検出して求めることができる。なお、閾値は、切削加工での仕上げにて許容できる範囲にて、上述のように求めた閾値に所定係数を乗じたレンジとしてもよい。 FIG. 4 is a graph showing the detection results of the elastic wave detection sensor. In the graph of FIG. 4, the vertical axis represents the AE value output by the elastic wave detection sensor 64, and the horizontal axis represents time, which is the result from the clogged state to the completion of dressing. As shown in FIG. 4, in a clogged and rough state, the change in collision energy when the cutting edge 58 rotates and comes into contact with the dresser board 25 becomes larger than in the state where the dress is completed, resulting in an elastic wave. The AE value, which is the output signal of, also increases. Therefore, as the cutting blade 42 is sharpened during dressing, the AE value from the elastic wave detection sensor 64 changes so as to become relatively small. The storage unit 80a of the control means 80 stores in advance the AE value from the elastic wave detection sensor 64 in the state where the dressing is completed as a threshold value. This threshold value can be obtained by pre-dressing according to the type of the cutting blade 42, the type of the dresser board 25, the processing conditions, etc., and actually detecting the elastic wave with the elastic wave detection sensor 64 when this dressing is completed. it can. The threshold value may be a range obtained by multiplying the threshold value obtained as described above by a predetermined coefficient within a range acceptable for finishing by cutting.

切削ブレード４２のドレス時において、制御手段８０の比較部８０ｂでは、記憶部８０ａが記憶した閾値と、弾性波検出センサ６４から出力されて信号処理部８１を経たＡＥ値とを比較する。この比較によって、弾性波検出センサ６４のＡＥ値が閾値に到達したか、つまり、ＡＥ値が閾値より小さくなっているかを比較判断する。そして、比較部８０ｂにて、ＡＥ値が閾値より小さいと判断した場合、停止制御部８０ｃによって各送り手段２２、３０、３５の動作を停止或いは所定動作後にその動作を停止し、切削ブレード４２による切削を停止してドレスを終了するよう制御する。このドレスが終了すると、被加工物Ｗに対する切削加工が開始若しくは再開される。 When the cutting blade 42 is dressed, the comparison unit 80b of the control means 80 compares the threshold value stored in the storage unit 80a with the AE value output from the elastic wave detection sensor 64 and passed through the signal processing unit 81. By this comparison, it is compared and determined whether the AE value of the elastic wave detection sensor 64 has reached the threshold value, that is, whether the AE value is smaller than the threshold value. Then, when the comparison unit 80b determines that the AE value is smaller than the threshold value, the stop control unit 80c stops the operation of each of the feeding means 22, 30, 35, or stops the operation after a predetermined operation, and the cutting blade 42 stops the operation. Control to stop cutting and finish dressing. When this dress is finished, the cutting process on the workpiece W is started or restarted.

ここで、従来のドレス方法にあっては、本実施の形態のように弾性波の検出結果に応じてドレスを停止せずに、経験的に予め設定した回数のドレスが実施されていた。従って、ドレスによる切削ブレードの除去量もドレスの回数に応じて予め決まったものとなっていた。 Here, in the conventional dressing method, the dressing is empirically preset a number of times without stopping the dressing according to the detection result of the elastic wave as in the present embodiment. Therefore, the amount of cutting blade removed by the dress is also predetermined according to the number of dresses.

これに対し、本実施の形態の切削装置１では、切削ブレード４２の切れ刃５８をドレスする際に発生する弾性波を検出し、その検出結果と、ドレス完了時に検出した弾性波に基づく閾値とを比較している。従って、弾性波が閾値に到達したら、切れ刃５８の目詰まりが解消し、切れ刃５８の面粗さが良好になっていることを判断することができる。これにより、従来方法のように予め設定した回数のドレスを実施せずに、従来方法より少なく回数にて終了でき、ドレスによる切れ刃５８の無駄な除去をなくすことができる。この結果、ドレスの精度向上と、ドレス工程の短時間化とを同時に達成できる上、同じ切削ブレード４２を長期に亘って使用することができる。 On the other hand, in the cutting apparatus 1 of the present embodiment, an elastic wave generated when the cutting edge 58 of the cutting blade 42 is dressed is detected, and the detection result and the threshold value based on the elastic wave detected at the completion of dressing are obtained. Are being compared. Therefore, when the elastic wave reaches the threshold value, it can be determined that the clogging of the cutting edge 58 is cleared and the surface roughness of the cutting edge 58 is good. As a result, the dressing can be completed in a smaller number of times than in the conventional method without performing the dressing a preset number of times as in the conventional method, and the wasteful removal of the cutting edge 58 by the dress can be eliminated. As a result, the accuracy of the dress can be improved and the dressing process can be shortened at the same time, and the same cutting blade 42 can be used for a long period of time.

なお、弾性波検出センサ６４の設置位置は、切削手段４０の他の位置としてもよく、切削ブレード４２の外周を覆うホイールカバー４０ａ（図１参照）や、切削水を供給するノズル（シリコンノズル）４０ｂ（図１参照）等に設けることが例示できる。 The elastic wave detection sensor 64 may be installed at another position of the cutting means 40, such as a wheel cover 40a (see FIG. 1) that covers the outer periphery of the cutting blade 42, or a nozzle (silicon nozzle) that supplies cutting water. For example, it is provided in 40b (see FIG. 1) or the like.

また、弾性波検出センサ６４の設置位置は、切削手段４０及びサブチャックテーブル２４のいずれか一方に配設されていればよく、例えば、図５の変形例に示すように、サブチャックテーブル２４の内部に埋め込むように弾性波検出センサ６４を設置することが例示できる。この場合、弾性波検出センサ６４は、上面視で環状に配設したり、ドレッサーボード２５の周方向に所定角度毎に分散して配設したりしてもよい。上記のように例示した弾性波検出センサ６４の配設位置では、実施の形態におけるコイル手段６７、６８を省略することができる。 Further, the elastic wave detection sensor 64 may be installed on either the cutting means 40 or the sub-chuck table 24. For example, as shown in the modified example of FIG. 5, the sub-chuck table 24 may be installed. It can be exemplified that the elastic wave detection sensor 64 is installed so as to be embedded inside. In this case, the elastic wave detection sensors 64 may be arranged in an annular shape in a top view, or may be arranged dispersedly at predetermined angles in the circumferential direction of the dresser board 25. At the arrangement position of the elastic wave detection sensor 64 illustrated as described above, the coil means 67 and 68 in the embodiment can be omitted.

また、制御手段８０において、弾性波検出センサ６４からの出力電圧の波形をフーリエ変換し、切削ブレード４２から発せられる弾性波を主要な周波数成分に分けて検出してもよい。これにより、切れ刃５８に目詰まりがある状態での波形には、目詰まりが解消された波形には見られない周波数での振動モード（振動成分）を認識でき、切れ刃５８の面粗さが良好か否かを解析することができる。 Further, the control means 80 may Fourier transform the waveform of the output voltage from the elastic wave detection sensor 64 and detect the elastic wave emitted from the cutting blade 42 by dividing it into major frequency components. As a result, the waveform in the state where the cutting edge 58 is clogged can recognize the vibration mode (vibration component) at a frequency that is not seen in the waveform in which the clog is cleared, and the surface roughness of the cutting edge 58 can be recognized. Can be analyzed whether or not is good.

また、本実施の形態では、被加工物Ｗの分割用の切削装置１を例示したが、切削装置１は分割だけでなく、被加工物Ｗのエッジトリミングに使用されてもよい。 Further, in the present embodiment, the cutting device 1 for dividing the workpiece W is illustrated, but the cutting device 1 may be used not only for dividing but also for edge trimming of the workpiece W.

また、本発明の実施の形態は上記の実施の形態及び変形例に限定されるものではなく、本発明の技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらには、技術の進歩又は派生する別技術によって、本発明の技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、本発明の技術的思想の範囲内に含まれ得る全ての実施形態をカバーしている。 Further, the embodiment of the present invention is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by the advancement of technology or another technology derived from it, it may be carried out by using that method. Therefore, the scope of claims covers all embodiments that may be included within the scope of the technical idea of the present invention.

以上説明したように、本発明は、切削ブレードのドレスにおいて切れ刃が無駄に除去されなくなるという効果を有し、特に、切れ刃に複数回のドレスを行う切削装置に有用である。 As described above, the present invention has an effect that the cutting edge is not unnecessarily removed in the dressing of the cutting blade, and is particularly useful for a cutting device that dresses the cutting edge a plurality of times.

１ 切削装置
２２ 切削送り手段
２４ サブチャックテーブル（保持テーブル）
２５ ドレッサーボード（板状物）
３０ 割り出し送り手段
４０ 切削手段
４２ 切削ブレード
５８ 切れ刃
６４ 弾性波検出センサ
８０ 制御手段
８０ａ 記憶部 1 Cutting device 22 Cutting feed means 24 Sub-chuck table (holding table)
25 Dresser board (plate-shaped)
30 Indexing feeding means 40 Cutting means 42 Cutting blade 58 Cutting blade 64 Elastic wave detection sensor 80 Control means 80a Storage unit

Claims (1)

板状物を保持する保持テーブルと、該保持テーブルに保持された板状物を切削するための切れ刃を有する切削ブレードを備えた切削手段と、該保持テーブルと切削手段とを相対的に切削送り方向に切削送りする切削送り手段と、該保持テーブルと切削手段とを相対的に切削送り方向と直交する割り出し送り方向に割り出し送りする割り出し送り手段とを具備する切削装置において、
該切削手段又は該保持テーブルのいずれか一方に配設され該保持テーブルに保持された板状物を該切削ブレードにより切削する際に発生する弾性波を検出する弾性波検出センサと、少なくとも該切削送り手段及び該割り出し送り手段を制御する制御手段とを備え、
該制御手段は、該保持テーブルに保持されたドレッサーボードに該切削ブレードで切削してドレスする際に該切削ブレードが目立てされるにつれて変化する該弾性波検出センサの出力信号の目立てドレスが完了した時の値を閾値として予め記憶する記憶部を備え、
該閾値は、該切削ブレードの種類、該ドレッサーボードの種類及びドレスの加工条件に応じて求められ、
該保持手段で保持された該ドレッサーボードにおいて該切削ブレードをドレスする際に、該弾性波検出センサからの該出力信号が該記憶部に記憶された該閾値に到達したら、切削を停止しドレスを終了すること、を特徴とする切削装置。 A cutting means provided with a holding table for holding a plate-shaped object and a cutting blade having a cutting edge for cutting the plate-shaped object held on the holding table, and the holding table and the cutting means are relatively cut. In a cutting apparatus including a cutting feed means for cutting and feeding in a feed direction and an indexing and feeding means for indexing and feeding the holding table and the cutting means in an indexing feed direction relatively orthogonal to the cutting feed direction.
An elastic wave detection sensor that detects elastic waves generated when a plate-like object disposed on either the cutting means or the holding table and held on the holding table is cut by the cutting blade, and at least the cutting. A feeding means and a control means for controlling the indexing feeding means are provided.
The control means has completed the dressing of the output signal of the elastic wave detection sensor, which changes as the cutting blade is sharpened when the dresser board held on the holding table is cut and dressed by the cutting blade. It is equipped with a storage unit that stores the hour value as a threshold value in advance.
The threshold value is determined according to the type of the cutting blade, the type of the dresser board, and the processing conditions of the dress.
When dressing the cutting blade on the dresser board held by the holding means, when the output signal from the elastic wave detection sensor reaches the threshold value stored in the storage unit, cutting is stopped and the dress is dressed. A cutting device characterized by terminating.
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US10361102B2 (en) 2019-07-23
MY198516A (en) 2023-09-01
CN108335976B (en) 2023-04-07
KR20180086133A (en) 2018-07-30
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KR102315234B1 (en) 2021-10-19
TW201828350A (en) 2018-08-01

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