TWI651179B - Cutting device - Google Patents

Cutting device Download PDF

Info

Publication number
TWI651179B
TWI651179B TW104103909A TW104103909A TWI651179B TW I651179 B TWI651179 B TW I651179B TW 104103909 A TW104103909 A TW 104103909A TW 104103909 A TW104103909 A TW 104103909A TW I651179 B TWI651179 B TW I651179B
Authority
TW
Taiwan
Prior art keywords
cutting
vibration signal
vibration
flange member
axis
Prior art date
Application number
TW104103909A
Other languages
Chinese (zh)
Other versions
TW201540457A (en
Inventor
久保雅裕
中西優爾
和泉邦治
Original Assignee
迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪思科股份有限公司 filed Critical 迪思科股份有限公司
Publication of TW201540457A publication Critical patent/TW201540457A/en
Application granted granted Critical
Publication of TWI651179B publication Critical patent/TWI651179B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

Abstract

本發明之課題為提供一種可適當地檢測出切削中之異常的切削裝置。解決手段為做成以下之構成:包含用以產生對應於切削刀之振動的振動信號的振動信號產生機構,及根據振動信號產生機構所產生的振動信號判定切削刀之狀態之控制機構,振動信號產生機構是由超音波振動器及傳送機構所構成,該超音波振動器是配置於第1凸緣構件,且用以產生與對應於切削刀之振動的振動信號相當之電壓,傳送機構與超音波振動器連接,用以將電壓傳送至控制機構,又,在該第1凸緣構件中會配置與構成傳送機構之第1線圈機構並聯連接之共振頻率不同的複數個超音波振動器。 An object of the present invention is to provide a cutting apparatus capable of appropriately detecting an abnormality during cutting. The solution is a vibration signal generating mechanism that generates a vibration signal corresponding to the vibration of the cutting blade, and a control mechanism that determines the state of the cutting blade based on the vibration signal generated by the vibration signal generating mechanism, and the vibration signal The generating mechanism is composed of an ultrasonic vibrator and a conveying mechanism, and the ultrasonic vibrator is disposed on the first flange member and generates a voltage corresponding to a vibration signal corresponding to the vibration of the cutting blade, and the conveying mechanism and the super The sonic vibrator is connected to transmit a voltage to the control unit, and a plurality of ultrasonic vibrators having different resonance frequencies connected in parallel to the first coil mechanism constituting the transport mechanism are disposed in the first flange member.

Description

切削裝置 Cutting device 發明領域 Field of invention

本發明為一種有關於用於切削板狀之被加工物的切削裝置。 The present invention is a cutting device relating to a workpiece for cutting a plate.

發明背景 Background of the invention

代表板狀之被加工物的半導體晶圓,是在具備例如圓環狀的切削刀之切削裝置上進行切削,而被分割成複數個晶片。在這個被加工物的切削中,當發生切削刀的缺陷、切削性能的降低、與異物接觸、加工負荷的變化之異常時,切削刀會產生振動。 A semiconductor wafer representing a plate-shaped workpiece is cut into a plurality of wafers by cutting on a cutting device including, for example, an annular cutter. In the cutting of this workpiece, when a cutter defect, a decrease in cutting performance, a contact with a foreign object, or a change in a machining load occur, the cutter generates vibration.

於是,為了檢測像這樣的異常,已有各種方法被檢討。例如,可藉由使用光學感測器之方法來檢測切削刀的缺陷(參照例如,專利文獻1)。又,也可藉由對裝設有切削刀的轉軸(馬達)之電流進行監測的方法,來檢測加工負荷的變化。 Therefore, in order to detect such an abnormality, various methods have been reviewed. For example, the defect of the cutting blade can be detected by a method using an optical sensor (refer to, for example, Patent Document 1). Further, the change in the machining load can be detected by a method of monitoring the current of the rotating shaft (motor) on which the cutting blade is mounted.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本專利第4704816號公報 Patent Document 1: Japanese Patent No. 4784816

發明概要 Summary of invention

然而,在上述之使用光學感測器的方法中,會有無法適當地檢測出切削刀的缺陷以外的異常之問題。相對於此,監測電流之方法雖然可以檢測會影響到切削刀之旋轉的各種異常,但是由於有一定程度的測定誤差,因此不適用於只有些微的異常的檢測。 However, in the above method using an optical sensor, there is a problem that an abnormality other than the defect of the cutter cannot be appropriately detected. On the other hand, although the method of monitoring the current can detect various abnormalities that affect the rotation of the cutting blade, it is not suitable for the detection of only a slight abnormality because of a certain degree of measurement error.

本發明是有鑒於所述問題點而作成的,其目的為提供一種可適當地檢測出切削中之異常的切削裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a cutting apparatus capable of appropriately detecting an abnormality during cutting.

依據本發明提供之切削裝置,包含工作夾台及切削機構,該工作夾台用以保持被加工物,該切削機構具備切削刀,該切削刀用以切削保持於該工作夾台上的被加工物,且該切削機構設有被轉軸殼座支持成可旋轉之轉軸,與裝設於該轉軸的端部且用以挾持該切削刀之第1凸緣構件及第2凸緣構件。其特徵在於,在該切削裝置中還具備振動信號產生機構及控制機構,該振動信號產生機構用以產生對應於該切削刀的振動之振動信號,該控制機構是根據該振動信號產生機構所產生的振動信號來判定該切削刀的狀態。該振動信號產生機構是由超音波振動器及傳送機構所構成,該超音波振動器是配置於該第1凸緣構件,並產生與對應於該切削刀的振動之該振動信號相當的電壓,該傳送機構與該超音波振動器連接,並將該電壓傳送至該控制機構,且該傳送機構包含裝設於該第1凸緣構件之第1線圈 機構,及與該第1線圈機構隔著間隔而相向面對並配置於該轉軸殼座上之第2線圈機構。又,在該第1凸緣構件配置有與該第1線圈機構並聯連接之共振頻率不同的複數個該超音波振動器。 The cutting device according to the present invention comprises a working clamping table for holding a workpiece, and a cutting mechanism, wherein the cutting mechanism is provided with a cutting cutter for cutting and being processed on the working clamping table. And the cutting mechanism is provided with a rotating shaft supported by the rotating shaft housing, and a first flange member and a second flange member for mounting the cutting blade at the end of the rotating shaft. The cutting device further includes a vibration signal generating mechanism for generating a vibration signal corresponding to the vibration of the cutting blade, and a control mechanism generated by the vibration signal generating mechanism The vibration signal determines the state of the cutter. The vibration signal generating mechanism is composed of an ultrasonic vibrator and a transmission mechanism. The ultrasonic vibrator is disposed on the first flange member and generates a voltage corresponding to the vibration signal corresponding to the vibration of the cutting blade. The transmission mechanism is coupled to the ultrasonic vibrator and transmits the voltage to the control mechanism, and the transmission mechanism includes a first coil mounted on the first flange member The mechanism and the second coil mechanism that face the first coil mechanism and face each other and are disposed on the spindle housing. Further, the first flange member is provided with a plurality of the ultrasonic vibrators having different resonance frequencies connected in parallel to the first coil mechanism.

又,在本發明中,較理想的是,前述控制機構是將相當於前述振動信號之時間變化的波形做傳立葉轉換且進行解析,並從振動成分的變化判定切削刀之狀態的變化。 Further, in the invention, it is preferable that the control means converts and analyzes a waveform corresponding to a temporal change of the vibration signal, and determines a change in a state of the cutter from a change in the vibration component.

由於本發明之切削裝置包含可產生對應於切削刀的振動之振動信號的振動信號產生機構,及根據該振動信號產生機構所產生之振動信號來判定切削刀狀態之控制機構,因此,可將伴隨著切削刀的振動之切削中的異常適當地檢測出。 Since the cutting device of the present invention includes a vibration signal generating mechanism that can generate a vibration signal corresponding to the vibration of the cutting blade, and a control mechanism that determines the state of the cutting blade based on the vibration signal generated by the vibration signal generating mechanism, the accompanying An abnormality in the cutting of the vibration of the cutter is appropriately detected.

10‧‧‧工作夾台 10‧‧‧Working table

10a‧‧‧保持面 10a‧‧‧ Keep face

12‧‧‧夾具 12‧‧‧ fixture

14‧‧‧切削單元(切削機構) 14‧‧‧Cutting unit (cutting mechanism)

16‧‧‧支持構造 16‧‧‧Support structure

18‧‧‧切削單元移動機構 18‧‧‧Cutting unit moving mechanism

2‧‧‧切削裝置 2‧‧‧Cutting device

20‧‧‧Y軸導軌 20‧‧‧Y-axis guide

22‧‧‧Y軸移動台 22‧‧‧Y-axis mobile station

24‧‧‧Y軸螺桿 24‧‧‧Y-axis screw

26‧‧‧Z軸導軌 26‧‧‧Z-axis guide

28‧‧‧Z軸移動台 28‧‧‧Z-axis mobile station

30‧‧‧Z軸螺桿 30‧‧‧Z-axis screw

32‧‧‧Z軸脈衝馬達 32‧‧‧Z-axis pulse motor

34‧‧‧相機 34‧‧‧ camera

36‧‧‧轉軸殼座 36‧‧‧Shaft housing

38‧‧‧殼座本體 38‧‧‧Shell body

4‧‧‧基台 4‧‧‧Abutment

4a、40a、46a、42a、60a、66a‧‧‧開口 4a, 40a, 46a, 42a, 60a, 66a‧‧

40‧‧‧殼座蓋 40‧‧‧Shell cover

38a、40b‧‧‧螺孔 38a, 40b‧‧‧ screw holes

40c‧‧‧鎖定部 40c‧‧‧Locking Department

42‧‧‧轉軸 42‧‧‧ shaft

44‧‧‧螺絲 44‧‧‧ screws

46‧‧‧第1凸緣構件 46‧‧‧1st flange member

48‧‧‧凸緣部 48‧‧‧Flange

48a、66b‧‧‧抵接面 48a, 66b‧‧‧ abutment

50‧‧‧第1凸座部 50‧‧‧1st seat

50a、58a‧‧‧外周面 50a, 58a‧‧‧ outer perimeter

52‧‧‧第2凸座部 52‧‧‧2nd seat

56‧‧‧墊圈 56‧‧‧Washers

58‧‧‧螺栓 58‧‧‧ bolt

6‧‧‧X軸移動台 6‧‧‧X-axis mobile station

60‧‧‧切削刀 60‧‧‧Cutter

62‧‧‧支持基台 62‧‧‧Support abutments

64‧‧‧刀片 64‧‧‧blade

66‧‧‧第2凸緣構件 66‧‧‧2nd flange member

68‧‧‧振動信號產生裝置(振動信號產生機構) 68‧‧‧Vibration signal generating device (vibration signal generating mechanism)

70‧‧‧超音波振動器 70‧‧‧Ultrasonic vibrator

70a‧‧‧第1超音波振動器 70a‧‧‧1st ultrasonic vibrator

70b‧‧‧第2超音波振動器 70b‧‧‧2nd ultrasonic vibrator

70c‧‧‧第3超音波振動器 70c‧‧‧3rd ultrasonic vibrator

72‧‧‧傳送通道(傳送機構) 72‧‧‧Transport channel (transport mechanism)

74‧‧‧第1電感器(第1線圈機構) 74‧‧‧1st inductor (first coil mechanism)

76‧‧‧第2電感器(第2線圈機構) 76‧‧‧2nd inductor (2nd coil mechanism)

78‧‧‧控制裝置(控制機構) 78‧‧‧Control device (control mechanism)

8‧‧‧防水套 8‧‧‧Waterproof case

X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction

O‧‧‧軸心 O‧‧‧Axis

V‧‧‧電壓 V‧‧‧ voltage

t‧‧‧時間 t‧‧‧Time

f‧‧‧頻率 F‧‧‧frequency

圖1是模式地表示本實施形態之切削裝置的構成例之立體圖。 Fig. 1 is a perspective view schematically showing a configuration example of a cutting device of the embodiment.

圖2是模式地表示切削單元之構造的分解立體圖。 Fig. 2 is an exploded perspective view schematically showing the configuration of the cutting unit.

圖3是模式地表示切削單元之剖面等的圖。 FIG. 3 is a view schematically showing a cross section of the cutting unit and the like.

圖4(A)是模式地表示超音波振動器及第1電感器(inductor)之配置的圖,圖4(B)表示超音波振動器及第1電感器的連接關係的電路圖。 4(A) is a view schematically showing the arrangement of the ultrasonic vibrator and the first inductor, and FIG. 4(B) is a circuit diagram showing the connection relationship between the ultrasonic vibrator and the first inductor.

圖5(A)是表示傳送至控制裝置之電壓的波形(時間領域的波形)之例的圖形,圖5(B)是表示傅立葉轉換後之波形(頻 率領域的波形)之例的圖形。 Fig. 5(A) is a diagram showing an example of a waveform (a waveform of a time domain) of a voltage transmitted to a control device, and Fig. 5(B) is a waveform showing a Fourier transform (frequency) A graph of the case of the waveform of the rate field.

圖6是表示異常發生前後之波形(頻率領域的波形)之例的圖形。 FIG. 6 is a view showing an example of a waveform (a waveform in a frequency domain) before and after an abnormality occurs.

用以實施發明之形態 Form for implementing the invention

參照附圖以說明關於本發明之實施形態。圖1是模式地表示本實施形態之切削裝置的構成例之立體圖。如圖1所示,切削裝置2具備用以支持各個構成之基台4。 Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view schematically showing a configuration example of a cutting device of the embodiment. As shown in Fig. 1, the cutting device 2 is provided with a base 4 for supporting each structure.

在基台4的上表面有在X軸方向(前後方向,加工傳送方向)形成的長的矩形開口4a。在該開口4a內設置有X軸移動台6、使X軸移動台6沿X軸方向移動之X軸移動機構(圖未示),及覆蓋X軸移動機構之防水蓋8。 On the upper surface of the base 4, there is a long rectangular opening 4a formed in the X-axis direction (front-rear direction, processing conveyance direction). An X-axis moving table 6 and an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction and a waterproof cover 8 covering the X-axis moving mechanism are provided in the opening 4a.

X軸移動機構設有一對平行於X軸方向之X軸導軌(圖未示),且在X軸導軌上將X軸移動台6設置成可滑動。在X軸移動台6的下表面側,固定有螺帽部(圖未示),且是將與X軸導軌平行之X軸螺桿(圖未示)螺合在此螺帽部中。 The X-axis moving mechanism is provided with a pair of X-axis guides (not shown) parallel to the X-axis direction, and the X-axis moving table 6 is slidable on the X-axis guide. A nut portion (not shown) is fixed to the lower surface side of the X-axis moving table 6, and an X-axis screw (not shown) parallel to the X-axis guide is screwed into the nut portion.

在X軸螺桿的一端部上,連結有X軸脈衝馬達(圖未示)。藉由以X軸脈衝馬達使X軸螺桿旋轉,X軸移動台6即可沿著X軸導軌在X軸方向上移動。 An X-axis pulse motor (not shown) is coupled to one end of the X-axis screw. By rotating the X-axis screw with the X-axis pulse motor, the X-axis moving table 6 can be moved in the X-axis direction along the X-axis guide.

在X軸移動台6上設置有用以吸引保持板狀的被加工物(圖未示)之工作夾台10。被加工物可為例如圓盤狀之半導體晶圓、樹脂基板、陶瓷基板等,且下表面側被吸引保持於工作夾台10上。 A work chuck 10 for sucking a workpiece (not shown) that holds a plate shape is provided on the X-axis moving table 6. The workpiece may be, for example, a disk-shaped semiconductor wafer, a resin substrate, a ceramic substrate, or the like, and the lower surface side is sucked and held on the work chuck 10.

工作夾台10是與馬達等的旋轉機構(圖未示)相 連結,且以繞著在Z軸方向(垂直方向)上延伸之旋轉軸的方式進行旋轉。又,工作夾台10是利用上述X軸移動機構而在X軸方向上移動。在工作夾台10的周圍設置有用於挾持固定支持被加工物之環狀框架(圖未示)的夾具12。 The working chuck 10 is in contact with a rotating mechanism (not shown) of a motor or the like. The rotation is performed so as to rotate around a rotation axis extending in the Z-axis direction (vertical direction). Further, the work chuck 10 is moved in the X-axis direction by the X-axis moving mechanism. A jig 12 for holding and fixing an annular frame (not shown) for supporting the workpiece is provided around the work chuck 10.

工作夾台10的表面(上表面)為用以吸引保持被加工物之保持面10a。該保持面10a通過形成於工作夾台10內部之流路(圖未示)與吸引源(圖未示)相連接。 The surface (upper surface) of the work chuck 10 is a holding surface 10a for sucking and holding the workpiece. The holding surface 10a is connected to a suction source (not shown) through a flow path (not shown) formed inside the working chuck 10.

在基台4的上表面將支持切削單元(切削機構)14之門型的支持構造16配置成跨越開口4a。在支持構造16的前表面上方部設置有使切削單元14在Y軸方向(分度傳送方向)及Z軸方向上移動之切削單元移動機構18。 A gate-type support structure 16 supporting the cutting unit (cutting mechanism) 14 is disposed on the upper surface of the base 4 so as to span the opening 4a. A cutting unit moving mechanism 18 that moves the cutting unit 14 in the Y-axis direction (index transfer direction) and the Z-axis direction is provided above the front surface of the support structure 16.

切削單元移動機構18具備配置於支持構造16的前表面且平行於Y軸方向之一對Y軸導軌20。在Y軸導軌20上有構成切削單元移動機構18之Y軸移動台22可滑動地設置。 The cutting unit moving mechanism 18 includes a pair of Y-axis guide rails 20 disposed on the front surface of the support structure 16 and parallel to the Y-axis direction. A Y-axis moving table 22 constituting the cutting unit moving mechanism 18 is slidably provided on the Y-axis guide rail 20.

在Y軸移動台22的背面側(後表面側)固定有螺帽部(圖未示),且將與該Y軸導軌20平行之Y軸螺桿24螺合於該螺帽部。在Y軸螺桿24的一端部上連結有Y軸脈衝馬達(圖未示)。當利用Y軸脈衝馬達使Y軸螺桿24旋轉時,Y軸移動台22即可沿著Y軸導軌20在Y軸方向上移動。 A nut portion (not shown) is fixed to the back side (back surface side) of the Y-axis moving table 22, and a Y-axis screw 24 parallel to the Y-axis guide 20 is screwed to the nut portion. A Y-axis pulse motor (not shown) is coupled to one end of the Y-axis screw 24. When the Y-axis screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving table 22 can be moved in the Y-axis direction along the Y-axis guide 20.

在Y軸移動台22的表面(前表面)上,設置有平行於Z軸方向的一對Z軸導軌26。在Z軸導軌26上有Z軸移動台28可滑動地設置。 On the surface (front surface) of the Y-axis moving table 22, a pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided. A Z-axis moving table 28 is slidably disposed on the Z-axis guide 26.

在Z軸移動台28的背面側(後表面側)固定有螺帽 部(圖未示),且將與該Z軸導軌26平行之Z軸螺桿30螺合於該螺帽部。在Z軸螺桿30的一端部連結有Z軸脈衝馬達32。當利用Z軸脈衝馬達32使Z軸螺桿30旋轉時,Z軸移動台28即可沿著Z軸導軌26在Z軸方向上移動。 A nut is fixed to the back side (rear surface side) of the Z-axis moving table 28 A portion (not shown) is screwed to the nut portion of the Z-axis screw 30 parallel to the Z-axis guide rail 26. A Z-axis pulse motor 32 is coupled to one end of the Z-axis screw 30. When the Z-axis screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving table 28 can be moved in the Z-axis direction along the Z-axis guide 26.

在Z軸移動台28的下方部設置有用以切削被加工物之切削單元14。又,在與切削單元14相鄰接的位置上,設置有用於拍攝被加工的上表面側的相機34。藉由如上所述地使Y軸移動台22及Z軸移動台28移動,切削單元14及相機34就可在Y軸方向及Z軸方向上移動。 A cutting unit 14 for cutting a workpiece is provided at a lower portion of the Z-axis moving table 28. Further, at a position adjacent to the cutting unit 14, a camera 34 for photographing the processed upper surface side is provided. By moving the Y-axis moving table 22 and the Z-axis moving table 28 as described above, the cutting unit 14 and the camera 34 can move in the Y-axis direction and the Z-axis direction.

圖2是模式地表示切削單元14之構造的分解立體圖,圖3是模式地表示切削單元14之剖面等的圖。再者,在圖2及圖3中省略了切削單元14之構成的一部分。 FIG. 2 is an exploded perspective view schematically showing the structure of the cutting unit 14, and FIG. 3 is a view schematically showing a cross section and the like of the cutting unit 14. Further, a part of the configuration of the cutting unit 14 is omitted in FIGS. 2 and 3.

切削單元14具備固定於Z軸移動台28之下方部的轉軸殼座36。該轉軸殼座36包含大致成直方體形的殼座本體38,與固定於殼座本體38之一端側的圓柱狀之殼座蓋40。 The cutting unit 14 includes a shaft housing 36 that is fixed to a lower portion of the Z-axis moving table 28. The spindle housing 36 includes a housing body 38 that is substantially rectangular and has a cylindrical housing cover 40 that is fixed to one end side of the housing body 38.

在殼座本體38的內部收納有繞著Y軸旋轉的轉軸42。轉軸42的一端側是從殼座本體38突出於外部。在轉軸42的另一端側則連結有用於使轉軸42旋轉的馬達(圖未示)。 A rotating shaft 42 that rotates about the Y axis is housed inside the housing body 38. One end side of the rotating shaft 42 protrudes from the housing main body 38 to the outside. A motor (not shown) for rotating the rotating shaft 42 is coupled to the other end side of the rotating shaft 42.

在殼座蓋40的中央形成有圓形的開口40a。又,於殼座蓋40之殼座本體38側設置有形成有螺孔40b的鎖定部40c。只要將轉軸42的一端側插接於開口40a,並通過鎖定部40c的螺孔40b將螺絲44(圖3)鎖固於殼座本體38的螺孔 38a中,就可以將殼座蓋40固定於殼座本體38上。 A circular opening 40a is formed in the center of the housing cover 40. Further, a lock portion 40c in which a screw hole 40b is formed is provided on the side of the housing main body 38 of the housing cover 40. As long as one end side of the rotating shaft 42 is inserted into the opening 40a, the screw 44 (FIG. 3) is locked to the screw hole of the housing body 38 through the screw hole 40b of the locking portion 40c. In the case 38a, the housing cover 40 can be fixed to the housing body 38.

於轉軸42的一端部形成有開口42a,且在該開口42a的內壁面上設置有螺紋溝。在該轉軸42的一端部上裝設上第1凸緣構件46。 An opening 42a is formed in one end portion of the rotating shaft 42, and a thread groove is provided on an inner wall surface of the opening 42a. A first flange member 46 is attached to one end of the rotating shaft 42.

該第1凸緣構件46包含徑向向外延伸出去的凸緣部48、分別從凸緣部48的正、背面突出之第1凸座部50及第2凸座部52。在第1凸緣構件46的中央形成有貫穿第1凸座部50、凸緣部48及第2凸座部52之開口46a。 The first flange member 46 includes a flange portion 48 that extends radially outward, and a first boss portion 50 and a second boss portion 52 that protrude from the front and back surfaces of the flange portion 48, respectively. An opening 46a penetrating the first boss portion 50, the flange portion 48, and the second boss portion 52 is formed in the center of the first flange member 46.

在該第1凸緣構件46的開口46a中,是從背面側(轉軸殼座36側)將轉軸42的一端部嵌入。在此狀態下,只要將墊圈56定位在開口46a內,並通過該墊圈56將固定用的螺栓58鎖固於開口42a中,就可將第1凸緣構件46固定於轉軸42上。再者,於螺栓58的外周面58a設置有對應於開口42a之螺紋溝的螺紋牙。 In the opening 46a of the first flange member 46, one end portion of the rotating shaft 42 is fitted from the back side (the side of the rotating shaft housing 36). In this state, the first flange member 46 can be fixed to the rotating shaft 42 by positioning the washer 56 in the opening 46a and locking the fixing bolt 58 in the opening 42a by the washer 56. Further, a thread corresponding to the thread groove of the opening 42a is provided on the outer circumferential surface 58a of the bolt 58.

凸緣部48的外周側之表面成為抵接於切削刀60之背面的抵接面48a。從Y軸方向(轉軸42的軸心方向)來看,該抵接面48a是形成為圓環狀。 The surface on the outer peripheral side of the flange portion 48 serves as an abutting surface 48a that abuts against the back surface of the cutting blade 60. The abutting surface 48a is formed in an annular shape as viewed in the Y-axis direction (the axial direction of the rotating shaft 42).

第1凸座部50形成為圓筒狀,且在其前端側之外周面50a上設置有螺紋牙。切削刀60的中央形成有圓形的開口60a。藉由將第1凸座部50插接於該開口60a中,就可以將切削刀60裝設至第1凸緣構件46中。 The first boss portion 50 is formed in a cylindrical shape, and a thread is provided on the outer peripheral surface 50a on the distal end side. A circular opening 60a is formed in the center of the cutter 60. By inserting the first boss portion 50 into the opening 60a, the cutting blade 60 can be attached to the first flange member 46.

切削刀60為所謂的輪轂狀刀片(hub blade),且在圓盤狀之支持基台62的外周上固定有用以切削被加工物之圓環狀的切割刃64。切割刃64是在金屬或樹脂等的黏結材 (結合材)中混合金鋼石及CBN(Cubic Boron Nitride)等的研磨粒而形成預定厚度。再者,切削刀60也可以使用只由切割刃所構成之墊圈狀刀片(washer blade)。 The cutting blade 60 is a so-called hub blade, and an annular cutting blade 64 for cutting a workpiece is fixed to the outer circumference of the disk-shaped support base 62. The cutting edge 64 is a bonding material such as metal or resin. The (bonding material) is mixed with abrasive grains such as diamond and CBN (Cubic Boron Nitride) to form a predetermined thickness. Further, the cutter blade 60 may use a washer blade composed only of a cutting edge.

在將該切削刀60裝設於第1凸緣構件46的狀態下,於切削刀60的表面側配置圓環狀之第2凸緣構件66。於第2凸緣構件66的中央形成有圓形的開口66a,在該開口66a的內壁面設置有對應於第1凸座部50之外周面50a上所形成之螺紋牙的螺紋溝。 In a state in which the cutting blade 60 is attached to the first flange member 46, an annular second flange member 66 is disposed on the surface side of the cutting blade 60. A circular opening 66a is formed in the center of the second flange member 66, and a screw groove corresponding to the thread formed on the outer peripheral surface 50a of the first boss portion 50 is provided on the inner wall surface of the opening 66a.

第2凸緣構件66的外周側的背面會成為抵接於切削刀60的表面的抵接面66b(圖3)。抵接面66b是設置在與第1凸緣構件46的抵接面48a對應的位置上。 The back surface on the outer peripheral side of the second flange member 66 serves as an abutting surface 66b ( FIG. 3 ) that abuts against the surface of the cutting blade 60 . The abutting surface 66b is provided at a position corresponding to the abutting surface 48a of the first flange member 46.

藉由將第1凸座部50的前端鎖固於該第2凸緣構件66的開口66a,即可使切削刀60受到第1凸緣構件46與第2凸緣構件66所挾持。 By locking the distal end of the first boss portion 50 to the opening 66a of the second flange member 66, the cutting blade 60 can be held by the first flange member 46 and the second flange member 66.

在像這樣所構成之切削單元14中設置有用於檢測切削刀60之振動的振動檢測機構。振動檢測機構含有用以產生對應於切削刀60之振動的振動信號的振動信號產生裝置(振動信號產生機構)68(圖3)。 A vibration detecting mechanism for detecting the vibration of the cutting blade 60 is provided in the cutting unit 14 configured as described above. The vibration detecting mechanism includes a vibration signal generating means (vibration signal generating means) 68 (Fig. 3) for generating a vibration signal corresponding to the vibration of the cutting blade 60.

振動信號產生裝置68具備固定於第1凸緣構件46內部的複數個超音波振動器70。該超音波振動器70是用例如,鈦酸鋇(BaTiO3)、鋯鈦酸鉛(Pb(Zi,Ti)O3)、鈮酸鋰(LiNbO3)、鉭酸鋰(LiTaO3)等材料所形成,並用以將切削刀60的振動轉換成電壓(振動信號)。 The vibration signal generating device 68 includes a plurality of ultrasonic vibrators 70 fixed to the inside of the first flange member 46. The ultrasonic vibrator 70 is made of, for example, barium titanate (BaTiO 3 ), lead zirconate titanate (Pb(Zi, Ti)O 3 ), lithium niobate (LiNbO 3 ), lithium niobate (LiTaO 3 ), or the like. It is formed and used to convert the vibration of the cutting blade 60 into a voltage (vibration signal).

通常,該超音波振動器70是構成為可相對於預定 頻率的振動而形成共振。因此,因應超音波振動器70的共振頻率,以決定可以利用振動檢測機構進行檢測之振動頻率。在本實施形態中,是使用共振頻率不同的複數個超音波振動器70,而可以檢測出較廣的頻率範圍的振動。 Generally, the ultrasonic vibrator 70 is configured to be relatively pre-determined The vibration of the frequency forms a resonance. Therefore, in response to the resonance frequency of the ultrasonic vibrator 70, the vibration frequency that can be detected by the vibration detecting mechanism is determined. In the present embodiment, a plurality of ultrasonic vibrators 70 having different resonance frequencies are used, and vibration in a wide frequency range can be detected.

在超音波振動器70中連接有用於傳送在超音波振動器70所產生的電壓之非接觸型的傳送通道(傳送機構)72(圖3)。該傳送通道72包含連接於超音波振動器70的第1電感器(第1線圈機構)74,及相對於第1電感器74以預定間隔相向面對之第2電感器(第2線圈機構)76。 A non-contact type transfer path (transport mechanism) 72 (FIG. 3) for transmitting the voltage generated by the ultrasonic vibrator 70 is connected to the ultrasonic vibrator 70. The transmission channel 72 includes a first inductor (first coil mechanism) 74 connected to the ultrasonic vibrator 70, and a second inductor (second coil mechanism) facing each other at a predetermined interval with respect to the first inductor 74. 76.

第1電感器74及第2電感器76,代表性的有捲繞導線而做成之圓環狀的線圈,且分別被固定在第1凸緣構件46及殼座蓋40上。 The first inductor 74 and the second inductor 76 are typically annular coils formed by winding a wire, and are fixed to the first flange member 46 and the housing cover 40, respectively.

圖4(A)是模式地表示超音波振動器70及第1電感器74之配置的圖,圖4(B)表示超音波振動器70及第1電感器74的連接關係的電路圖。 4(A) is a view schematically showing the arrangement of the ultrasonic vibrator 70 and the first inductor 74, and FIG. 4(B) is a circuit diagram showing the connection relationship between the ultrasonic vibrator 70 and the first inductor 74.

在本實施形態中,如圖4(A)所示,從Y軸方向(轉軸42的軸心O的方向)來看,有共振頻率不同的3種超音波振動器70(第1超音波振動器70a、第2超音波振動器70b、第3超音波振動器70c)兩兩成對地配置在與第1電感器74重疊的位置上。 In the present embodiment, as shown in FIG. 4(A), three kinds of ultrasonic vibrators 70 having different resonance frequencies are observed from the Y-axis direction (the direction of the axis O of the rotation shaft 42) (the first ultrasonic vibration) The device 70a, the second ultrasonic vibrator 70b, and the third ultrasonic vibrator 70c) are disposed in pairs at a position overlapping the first inductor 74.

使用例如,第1超音波振動器70a、第2超音波振動器70b、第3超音波振動器70c而進行檢測的振動頻率範圍分別為50kHz~100kHz,100kHz~300kHz,300kHz~500kHz。像這樣,藉由利用共振頻率不同的複數個超音波振動器70, 就可以檢測較廣的頻率範圍的振動。上述的情況,即可以適當地對50kHz~500kHz的頻率範圍的振動進行檢測。 For example, the vibration frequency ranges detected by the first ultrasonic vibrator 70a, the second ultrasonic vibrator 70b, and the third ultrasonic vibrator 70c are 50 kHz to 100 kHz, 100 kHz to 300 kHz, and 300 kHz to 500 kHz, respectively. In this way, by using a plurality of ultrasonic vibrators 70 having different resonance frequencies, It is possible to detect vibrations in a wide frequency range. In the above case, it is possible to appropriately detect the vibration in the frequency range of 50 kHz to 500 kHz.

2個第1超音波振動器70a是相對於轉軸42的軸心O配置成對稱。又,2個第2超音波振動器70b是相對於轉軸42的軸心O配置成對稱。同樣地,2個第3超音波振動器70c是相對於轉軸42的軸心O配置成對稱。 The two first ultrasonic vibrators 70a are arranged symmetrically with respect to the axial center O of the rotating shaft 42. Further, the two second ultrasonic vibrators 70b are arranged symmetrically with respect to the axial center O of the rotating shaft 42. Similarly, the two third ultrasonic vibrators 70c are arranged symmetrically with respect to the axial center O of the rotating shaft 42.

像這樣,藉由將複數個超音波振動器70相對於轉軸42的軸心O對稱地配置,就可以高精度地對切削刀60的振動進行檢測。再者,超音波振動器70的數量、配置,形狀等,並不受限於圖4(A)所示之態樣。 As described above, by arranging the plurality of ultrasonic vibrators 70 symmetrically with respect to the axis O of the rotating shaft 42, the vibration of the cutting blade 60 can be detected with high precision. Further, the number, arrangement, shape, and the like of the ultrasonic vibrators 70 are not limited to those shown in Fig. 4(A).

如圖4(B)所示,第1超音波振動器70a、第2超音波振動器70b、第3超音波振動器70c是相對於第1電感器74並聯連接。又,第1電感器74與第2電感器76是相向面對,且以磁性結合。因此,在各個超音波振動器70所產生的電壓,會藉由第1電感器74與第2電感器76之相互電磁感應,而傳送至第2電感器76側。 As shown in FIG. 4(B), the first ultrasonic vibrator 70a, the second ultrasonic vibrator 70b, and the third ultrasonic vibrator 70c are connected in parallel to the first inductor 74. Further, the first inductor 74 and the second inductor 76 face each other and are magnetically coupled. Therefore, the voltage generated in each of the ultrasonic vibrators 70 is electromagnetically induced by the first inductor 74 and the second inductor 76, and is transmitted to the second inductor 76 side.

於第2電感器76上連接有控制裝置(控制機構)78。該控制裝置78會根據從第2電感器76所傳送來的電壓而判定切削刀的振動狀態。具體來說,是將相當於每一個任意的單位時間所傳送之電壓的時間變化的波形(時間領域的波形),透過傅立葉轉換(例如,高速傅立葉轉換)以進行頻譜解析,並根據所得到之頻率領域的波形,以判定切削刀60的狀態。作為單位時間,可考慮以下各種態樣:1條線的切削所需要的時間(按照每1條切線)、1片被加工物的切削所 需要的時間(按照每1個工件)、切削任意的距離所需要的時間(按照每個切削距離)等。 A control device (control mechanism) 78 is connected to the second inductor 76. The control device 78 determines the vibration state of the cutting blade based on the voltage transmitted from the second inductor 76. Specifically, a waveform (a waveform of a time domain) corresponding to a time variation of a voltage transmitted every arbitrary unit time is subjected to Fourier transform (for example, fast Fourier transform) for spectrum analysis, and is obtained according to the obtained The waveform in the frequency domain determines the state of the cutting blade 60. As the unit time, consider the following various aspects: the time required for the cutting of one line (according to one tangent line), and the cutting of one workpiece The time required (for each workpiece), the time required to cut an arbitrary distance (for each cutting distance), etc.

圖5(A)是表示傳送至控制裝置78之電壓的波形(時間領域的波形)之例的圖形,圖5(B)是表示傅立葉轉換後的波形(頻率領域的波形)之例的圖形。再者,在圖5(A)中,分別以縱軸表示電壓(V),橫軸表示時間(t),而在圖5(B)中,分別以縱軸表示振福,橫軸表示頻率(f)。 FIG. 5(A) is a diagram showing an example of a waveform (a waveform in a time domain) of a voltage transmitted to the control device 78, and FIG. 5(B) is a diagram showing an example of a waveform (a waveform in a frequency domain) after Fourier transform. Further, in Fig. 5(A), the vertical axis represents voltage (V), the horizontal axis represents time (t), and in Fig. 5(B), the vertical axis represents vibration, and the horizontal axis represents frequency. (f).

像這樣,只要將來自振動信號產生裝置68的電壓(振動信號)的波形以控制裝置78進行傅立葉轉換,就可以如圖5(B)所示地將切削刀60的振動區分成主要的頻率成分,而可以容易地解析切削中所發生的異常。藉此,可即時且以良好的精度檢測切削中的異常。 In this manner, as long as the waveform of the voltage (vibration signal) from the vibration signal generating device 68 is Fourier-converted by the control device 78, the vibration of the cutting blade 60 can be divided into the main frequency components as shown in Fig. 5(B). , and the abnormality occurring in the cutting can be easily analyzed. Thereby, the abnormality in the cutting can be detected immediately and with good precision.

圖6為表示異常發生前後的波形(頻率領域的波形)之例的圖形。在圖6中分別以縱軸表示振幅,橫軸表示頻率(f)。又,在圖6中,是以實線表示異常發生前的波形,以虛線表示異常發生後的波形。 FIG. 6 is a view showing an example of a waveform (a waveform in a frequency domain) before and after an abnormality occurs. In Fig. 6, the amplitude is represented by the vertical axis, and the horizontal axis represents the frequency (f). In addition, in FIG. 6, the waveform before the occurrence of the abnormality is indicated by a solid line, and the waveform after the occurrence of the abnormality is indicated by a broken line.

如圖6所示,在異常發生後的波形中存在有不會在異常發生前的波形中看到的高頻率側的振動模式(振動成分)。控制裝置78可例如,比較異常發生前後的波形(頻率領域的波形),以判定發生了與僅在異常發生後的波形中才會看到的振動模式相對應的異常。 As shown in FIG. 6, in the waveform after the occurrence of the abnormality, there is a vibration mode (vibration component) on the high frequency side that is not seen in the waveform before the abnormality occurs. The control device 78 can, for example, compare waveforms (waveforms in the frequency domain) before and after the occurrence of an abnormality to determine that an abnormality corresponding to the vibration mode that is only seen in the waveform after the abnormality has occurred.

如以上所述,由於本實施形態的切削裝置2包含用以產生對應於切削刀60的振動之振動信號的振動信號產生裝置(振動信號產生機構)68,及根據以振動信號產生裝置 68所產生的振動信號判定切削刀60之狀態的控制裝置(控制機構)78,因此可適當地檢測伴隨著切削刀60的振動而形成之切削中的異常。 As described above, the cutting device 2 of the present embodiment includes a vibration signal generating device (vibration signal generating mechanism) 68 for generating a vibration signal corresponding to the vibration of the cutting blade 60, and a vibration signal generating device according to the vibration signal generating device Since the vibration signal generated by 68 determines the state of the cutting blade 60 (control means) 78, it is possible to appropriately detect the abnormality in the cutting caused by the vibration of the cutting blade 60.

又,在本實施形態之切削裝置2中,由於對相當於電壓(振動信號)之時間變化的波形(時間領域的波形)進行傅立葉轉換,因此,與直接解析振動信號的情況相比,可將於切削中所發生之異常的解析變容易。藉此,可高精度地檢測切削中的異常。 Further, in the cutting device 2 of the present embodiment, since the waveform (the waveform in the time domain) corresponding to the time change of the voltage (vibration signal) is Fourier-transformed, compared with the case where the vibration signal is directly analyzed, The analysis of the abnormality occurring during cutting becomes easy. Thereby, the abnormality during cutting can be detected with high precision.

再者,本發明並不受限於上述實施形態之記載。例如,不將電壓(振動信號)進行傅立葉轉換而進行解析亦可。另外,上述實施形態之構成、方法等,只要在不脫離本發明之目的之範圍內,均可適當變更而實施。 Furthermore, the present invention is not limited to the description of the above embodiments. For example, the voltage (vibration signal) may not be subjected to Fourier transform for analysis. In addition, the configuration, the method, and the like of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the invention.

Claims (2)

一種切削裝置,包含用以保持被加工物之工作夾台,及具備切削刀的切削機構,該切削刀用以切削保持於該工作夾台上之被加工物,且該切削機構設有被轉軸殼座支持成可旋轉之轉軸,及裝設於該轉軸之端部且用以挾持該切削刀之第1凸緣構件與第2凸緣構件,其特徵在於,在該切削裝置中還包含:振動信號產生機構,用以產生對應於該切削刀的振動之振動信號;以及控制機構,根據該振動信號產生機構所產生的振動信號來判定該切削刀之狀態,該振動信號產生機構是由超音波振動器及傳送機構所構成,該超音波振動器是配置於該第1凸緣構件上,並可產生與對應於該切削刀之振動之該振動信號相當的電壓,該傳送機構與該超音波振動器連接,並將該電壓傳送至該控制機構,且該傳送機構包含裝設於該第1凸緣構件之第1線圈機構,及與該第1線圈機構隔著間隔而相向面對並配置於該轉軸殼座上之第2線圈機構,又,在該第1凸緣構件配置有與該第1線圈機構並聯連接之共振頻率不同的複數個該超音波振動器。 A cutting device includes a working clamping table for holding a workpiece, and a cutting mechanism having a cutting tool for cutting a workpiece held on the working clamping table, and the cutting mechanism is provided with a rotating shaft The housing supports a rotatable shaft, and a first flange member and a second flange member for mounting the cutter at the end of the shaft, wherein the cutting device further comprises: a vibration signal generating mechanism for generating a vibration signal corresponding to the vibration of the cutting blade; and a control mechanism for determining a state of the cutting blade according to the vibration signal generated by the vibration signal generating mechanism, the vibration signal generating mechanism is super a sonic vibrator and a transport mechanism, the ultrasonic vibrator being disposed on the first flange member and capable of generating a voltage corresponding to the vibration signal corresponding to the vibration of the cutter, the transport mechanism and the super The sound wave vibrator is connected to transmit the voltage to the control mechanism, and the transfer mechanism includes a first coil mechanism mounted on the first flange member and is separated from the first coil mechanism a second coil mechanism that faces and is disposed on the hinge housing, and a plurality of the ultrasonic vibrators having different resonance frequencies connected in parallel to the first coil mechanism are disposed on the first flange member. . 如請求項1之切削裝置,其中前述控制機構是將相當於前述振動信號之時間變化的波形做傅立葉轉換且進行解析,並從振動成分的變化判定切削刀之狀態的變化。 The cutting device according to claim 1, wherein the control means performs Fourier transform on the waveform corresponding to the time change of the vibration signal, analyzes the waveform, and determines a change in the state of the cutter from a change in the vibration component.
TW104103909A 2014-03-07 2015-02-05 Cutting device TWI651179B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-044995 2014-03-07
JP2014044995A JP6223238B2 (en) 2014-03-07 2014-03-07 Cutting equipment

Publications (2)

Publication Number Publication Date
TW201540457A TW201540457A (en) 2015-11-01
TWI651179B true TWI651179B (en) 2019-02-21

Family

ID=54023048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104103909A TWI651179B (en) 2014-03-07 2015-02-05 Cutting device

Country Status (5)

Country Link
JP (1) JP6223238B2 (en)
KR (1) KR102228491B1 (en)
CN (1) CN104889868B (en)
MY (1) MY177230A (en)
TW (1) TWI651179B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108297178B (en) * 2018-01-23 2021-05-07 东莞理工学院 Double-column cutting device with feedback function
CN115023317A (en) * 2020-01-29 2022-09-06 株式会社则武 AE signal detection device of grinding wheel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008290203A (en) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd Grinding work monitoring system and grinding work monitoring method
TW201226101A (en) * 2010-12-28 2012-07-01 Nat Univ Chung Hsing Method and device to detect the state of cutting tool in machine tool with multiple sensors
CN103029225A (en) * 2011-10-06 2013-04-10 株式会社迪思科 Cutting device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474816Y1 (en) 1967-03-30 1972-02-21
US4514797A (en) * 1982-09-03 1985-04-30 Gte Valeron Corporation Worn tool detector utilizing normalized vibration signals
JPS6062464A (en) * 1983-09-10 1985-04-10 Kawasaki Steel Corp Side end grinding attachment for metallic belt by rotary grinding wheel
JPH0499946A (en) * 1990-08-20 1992-03-31 Sanko Control Kk Method and apparatus for measuring cutting ability of grinder wheel
JPH05154833A (en) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd Dicing machine
JP3534338B2 (en) * 1999-10-07 2004-06-07 松下電器産業株式会社 Cutting equipment
JP2002066879A (en) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp Acoustic emission detecting device for machine tool
JP4658730B2 (en) * 2005-07-28 2011-03-23 株式会社ディスコ Cutting equipment
JP2007187512A (en) * 2006-01-12 2007-07-26 Nec Corp Monitoring device and monitoring system
KR101109165B1 (en) * 2006-01-12 2012-03-14 도쿄 세이미츄 코퍼레이션 리미티드 Working system, contact detecting method, and ae contact detecting device
JP4552883B2 (en) * 2006-04-19 2010-09-29 株式会社デンソー Vibration detection method
JP2009032726A (en) * 2007-07-24 2009-02-12 Disco Abrasive Syst Ltd Method for dividing wafer
JP5258921B2 (en) * 2011-03-31 2013-08-07 株式会社小松製作所 Machine tool and its processing control device
JP5943578B2 (en) * 2011-10-11 2016-07-05 株式会社東京精密 Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone
TW201332704A (en) * 2012-02-10 2013-08-16 中原大學 Cutting edge chip-buildup monitoring method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008290203A (en) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd Grinding work monitoring system and grinding work monitoring method
TW201226101A (en) * 2010-12-28 2012-07-01 Nat Univ Chung Hsing Method and device to detect the state of cutting tool in machine tool with multiple sensors
CN103029225A (en) * 2011-10-06 2013-04-10 株式会社迪思科 Cutting device

Also Published As

Publication number Publication date
TW201540457A (en) 2015-11-01
CN104889868A (en) 2015-09-09
JP2015170744A (en) 2015-09-28
KR20150105222A (en) 2015-09-16
JP6223238B2 (en) 2017-11-01
KR102228491B1 (en) 2021-03-15
CN104889868B (en) 2019-07-30
MY177230A (en) 2020-09-09

Similar Documents

Publication Publication Date Title
TWI651178B (en) Cutting device
TWI647056B (en) Cutting device
JP6695102B2 (en) Processing system
JP6846657B2 (en) Cutting equipment
JP6403601B2 (en) Processing equipment
JP4908143B2 (en) Cutting blade amplitude measuring device
JP6866217B2 (en) Cutting equipment
TWI651179B (en) Cutting device
TWI760478B (en) Cutting device
JP6925771B2 (en) Processing system
JP7148233B2 (en) Workpiece cutting method and cutting device
JP7145710B2 (en) cutting equipment
JP6800774B2 (en) Cutting equipment