TW201540451A - Cutting apparatus - Google Patents
Cutting apparatus Download PDFInfo
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- TW201540451A TW201540451A TW104103910A TW104103910A TW201540451A TW 201540451 A TW201540451 A TW 201540451A TW 104103910 A TW104103910 A TW 104103910A TW 104103910 A TW104103910 A TW 104103910A TW 201540451 A TW201540451 A TW 201540451A
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- cutting
- vibration signal
- vibration
- flange member
- cutting blade
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Abstract
Description
本發明為一種有關於用於切削板狀之被加工物的切削裝置。 The present invention is a cutting device relating to a workpiece for cutting a plate.
代表板狀之被加工物的半導體晶圓，是在具備例如圓環狀的切削刀之切削裝置上進行切削，而被分割成複數個晶片。在這個被加工物的切削中，當發生切削刀的缺陷、切削性能的降低、與異物接觸、加工負荷的變化之異常時，切削刀會產生振動。 A semiconductor wafer representing a plate-shaped workpiece is cut into a plurality of wafers by cutting on a cutting device including, for example, an annular cutter. In the cutting of this workpiece, when a cutter defect, a decrease in cutting performance, a contact with a foreign object, or a change in a machining load occur, the cutter generates vibration.
於是，為了檢測像這樣的異常，已有各種方法被檢討。例如，可藉由使用光學感測器之方法來檢測切削刀的缺陷(參照例如，專利文獻1)。又，也可藉由對裝設有切削刀的轉軸(馬達)之電流進行監測的方法，來檢測加工負荷的變化。 Therefore, in order to detect such an abnormality, various methods have been reviewed. For example, the defect of the cutting blade can be detected by a method using an optical sensor (refer to, for example, Patent Document 1). Further, the change in the machining load can be detected by a method of monitoring the current of the rotating shaft (motor) on which the cutting blade is mounted.
專利文獻1：日本專利4704816號公報 Patent Document 1: Japanese Patent No. 4708416
然而，在上述之使用光學感測器的方法中，會有無法適當地檢測出切削刀的缺陷以外的異常之問題。相對於此，監測電流之方法雖然可以檢測會影響到切削刀之旋轉的各種異常，但是由於有一定程度的測定誤差，因此不適用於只有些微的異常的檢測。 However, in the above method using an optical sensor, there is a problem that an abnormality other than the defect of the cutter cannot be appropriately detected. On the other hand, although the method of monitoring the current can detect various abnormalities that affect the rotation of the cutting blade, it is not suitable for the detection of only a slight abnormality because of a certain degree of measurement error.
本發明是有鑒於所述問題點而作成的，其目的為提供一種可適當地檢測出切削中之異常的切削裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a cutting apparatus capable of appropriately detecting an abnormality during cutting.
依據本發明提供之切削裝置，包含工作夾台及切削機構，該工作夾台用以保持被加工物，該切削機構具備切削刀以切削保持於該工作夾台上的被加工物，且該切削機構設有被轉軸座殼支持成可旋轉之轉軸，與裝設於該轉軸的端部且用以挾持該切削刀之第1凸緣構件及第2凸緣構件。其特徵在於，在該切削裝置中還具備振動信號產生機構及控制機構，該振動信號產生機構用以產生對應於該切削刀的振動之振動信號，該控制機構是根據該振動信號產生機構所產生的振動信號以判定該切削刀的狀態。該振動信號產生機構是由超音波振動器及傳送機構所構成，該超音波振動器是配置於該第1凸緣構件，並產生與對應於該切削刀的振動之該振動信號相當的電壓，該傳送機構與該超音波振動器連接，並將該電壓傳送至該控制機構，且該傳送機構包含裝設於該第1凸緣構件之第1線圈機構，及與該 第1線圈機構隔著間隔而相向面對並配置於該轉軸座殼上之第2線圈機構。又，是從不同於該超音波振動器之共振頻率所製作的複數個該第1凸緣構件中，選定對應於欲檢測之該切削刀的振動頻率之該第1凸緣構件以裝設於該轉軸上。 A cutting device according to the present invention includes a working clamping table for holding a workpiece, and a cutting mechanism for cutting a workpiece to be held on the working clamping table, and the cutting The mechanism is provided with a rotating shaft supported by the rotating shaft housing, and a first flange member and a second flange member for mounting the cutting blade at the end of the rotating shaft. The cutting device further includes a vibration signal generating mechanism for generating a vibration signal corresponding to the vibration of the cutting blade, and a control mechanism generated by the vibration signal generating mechanism The vibration signal determines the state of the cutter. The vibration signal generating mechanism is composed of an ultrasonic vibrator and a transmission mechanism. The ultrasonic vibrator is disposed on the first flange member and generates a voltage corresponding to the vibration signal corresponding to the vibration of the cutting blade. The transmission mechanism is connected to the ultrasonic vibrator, and transmits the voltage to the control mechanism, and the transmission mechanism includes a first coil mechanism mounted on the first flange member, and The first coil mechanism faces the second coil mechanism facing each other and disposed on the hinge housing. Further, the first flange member corresponding to the vibration frequency of the cutting blade to be detected is selected from a plurality of the first flange members different from the resonance frequency of the ultrasonic vibrator to be mounted on On the shaft.
又，在本發明中，較理想的是，前述控制機構是將相當於前述振動信號之時間變化的波形做傅立葉轉換並解析，並從振動成分的變化判定切削刀之狀態的變化。 Further, in the invention, it is preferable that the control means performs Fourier transform and analysis on a waveform corresponding to a temporal change of the vibration signal, and determines a change in the state of the cutter from a change in the vibration component.
由於本發明之切削裝置包含可產生對應於切削刀的振動之振動信號的振動信號產生機構，及根據該振動信號產生機構所產生之振動信號以判定切削刀狀態之控制機構，因此，可將伴隨著切削刀的振動之切削中的異常適當地檢測出。 Since the cutting device of the present invention includes a vibration signal generating mechanism that can generate a vibration signal corresponding to the vibration of the cutting blade, and a control mechanism that determines the state of the cutting blade based on the vibration signal generated by the vibration signal generating mechanism, the accompanying An abnormality in the cutting of the vibration of the cutter is appropriately detected.
10‧‧‧工作夾台 10‧‧‧Working table
10a‧‧‧保持面 10a‧‧‧ Keep face
12‧‧‧夾具 12‧‧‧ fixture
14‧‧‧切削單元(切削機構) 14‧‧‧Cutting unit (cutting mechanism)
16‧‧‧支持構造 16‧‧‧Support structure
18‧‧‧切削單元移動機構 18‧‧‧Cutting unit moving mechanism
2‧‧‧切削裝置 2‧‧‧Cutting device
20‧‧‧Y軸導軌 20‧‧‧Y-axis guide
22‧‧‧Y軸移動台 22‧‧‧Y-axis mobile station
24‧‧‧Y軸螺桿 24‧‧‧Y-axis screw
26‧‧‧Z軸導軌 26‧‧‧Z-axis guide
28‧‧‧Z軸移動台 28‧‧‧Z-axis mobile station
30‧‧‧Z軸螺桿 30‧‧‧Z-axis screw
32‧‧‧Z軸脈衝馬達 32‧‧‧Z-axis pulse motor
34‧‧‧相機 34‧‧‧ camera
36‧‧‧轉軸殼座 36‧‧‧Shaft housing
38‧‧‧殼座本體 38‧‧‧Shell body
4‧‧‧基台 4‧‧‧Abutment
4a、40a、46a、42a、60a、66a‧‧‧開口 4a, 40a, 46a, 42a, 60a, 66a‧‧
40‧‧‧殼座蓋 40‧‧‧Shell cover
38a、40b‧‧‧螺孔 38a, 40b‧‧‧ screw holes
40c‧‧‧鎖定部 40c‧‧‧Locking Department
42‧‧‧轉軸 42‧‧‧ shaft
44‧‧‧螺絲 44‧‧‧ screws
46‧‧‧第1凸緣構件 46‧‧‧1st flange member
48‧‧‧凸緣部 48‧‧‧Flange
48a、66b‧‧‧抵接面 48a, 66b‧‧‧ abutment
50‧‧‧第1凸座部 50‧‧‧1st seat
50a、58a‧‧‧外周面 50a, 58a‧‧‧ outer perimeter
52‧‧‧第2凸座部 52‧‧‧2nd seat
56‧‧‧墊圈 56‧‧‧Washers
58‧‧‧螺栓 58‧‧‧ bolt
6‧‧‧X軸移動台 6‧‧‧X-axis mobile station
60‧‧‧切削刀 60‧‧‧Cutter
62‧‧‧支持基台 62‧‧‧Support abutments
64‧‧‧刀片 64‧‧‧blade
66‧‧‧第2凸緣構件 66‧‧‧2nd flange member
68‧‧‧振動信號產生裝置(振動信號產生機構) 68‧‧‧Vibration signal generating device (vibration signal generating mechanism)
70‧‧‧超音波振動器 70‧‧‧Ultrasonic vibrator
72‧‧‧傳送通道(傳送機構) 72‧‧‧Transport channel (transport mechanism)
74‧‧‧第1電感器(第1線圈機構) 74‧‧‧1st inductor (first coil mechanism)
76‧‧‧第2電感器(第2線圈機構) 76‧‧‧2nd inductor (2nd coil mechanism)
78‧‧‧控制裝置(控制機構) 78‧‧‧Control device (control mechanism)
8‧‧‧防水套 8‧‧‧Waterproof case
X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction
O‧‧‧軸心 O‧‧‧Axis
V‧‧‧電壓 V‧‧‧ voltage
t‧‧‧時間 t‧‧‧Time
f‧‧‧頻率 F‧‧‧frequency
圖1是模式地表示本實施形態之切削裝置的構成例之立體圖。 Fig. 1 is a perspective view schematically showing a configuration example of a cutting device of the embodiment.
圖2是模式地表示切削單元之構造的分解立體圖。 Fig. 2 is an exploded perspective view schematically showing the configuration of the cutting unit.
圖3是模式地表示切削單元之剖面等的圖。 FIG. 3 is a view schematically showing a cross section of the cutting unit and the like.
圖4是模式地表示超音波振動器及第1電感器(inductor)之配置的圖。 4 is a view schematically showing an arrangement of an ultrasonic vibrator and a first inductor.
圖5(A)是表示傳送至控制裝置之電壓的波形(時間領域的波形)之例的圖形，圖5(B)是表示傅立葉轉換後之波形(頻率領域的波形)之例的圖形。 Fig. 5(A) is a diagram showing an example of a waveform (a waveform in a time domain) of a voltage transmitted to a control device, and Fig. 5(B) is a diagram showing an example of a waveform (a waveform in a frequency domain) after Fourier transform.
圖6是表示異常發生前後之波形(頻率領域的波形)之例的圖形。 FIG. 6 is a view showing an example of a waveform (a waveform in a frequency domain) before and after an abnormality occurs.
參照附圖以說明關於本發明之實施形態。圖1為模式地表示本實施形態之切削裝置的構成例之立體圖。如圖1所示，切削裝置2具備用以支持各個構成之基台4。 Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view schematically showing a configuration example of a cutting device of the embodiment. As shown in Fig. 1, the cutting device 2 is provided with a base 4 for supporting each structure.
在基台4的上表面有在X軸方向(前後方向，加工傳送方向)形成的長的矩形開口4a。在該開口4a內設置有X軸移動台6、使X軸移動台6沿X軸方向移動之X軸移動機構(圖未示)，及覆蓋X軸移動機構之防水蓋8。 On the upper surface of the base 4, there is a long rectangular opening 4a formed in the X-axis direction (front-rear direction, processing conveyance direction). An X-axis moving table 6 and an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction and a waterproof cover 8 covering the X-axis moving mechanism are provided in the opening 4a.
X軸移動機構設有一對平行於X軸方向之X軸導軌(圖未示)，且在X軸導軌上將X軸移動台6設置成可滑動。在X軸移動台6的下表面側，固定有螺帽部(圖未示)，且是將與X軸導軌平行之X軸螺桿(圖未示)螺合在此螺帽部中。 The X-axis moving mechanism is provided with a pair of X-axis guides (not shown) parallel to the X-axis direction, and the X-axis moving table 6 is slidable on the X-axis guide. A nut portion (not shown) is fixed to the lower surface side of the X-axis moving table 6, and an X-axis screw (not shown) parallel to the X-axis guide is screwed into the nut portion.
在X軸螺桿的一端部上，連結有X軸脈衝馬達(圖未示)。藉由以X軸脈衝馬達使X軸螺桿旋轉，X軸移動台6即可沿著X軸導軌在X軸方向上移動。 An X-axis pulse motor (not shown) is coupled to one end of the X-axis screw. By rotating the X-axis screw with the X-axis pulse motor, the X-axis moving table 6 can be moved in the X-axis direction along the X-axis guide.
在X軸移動台6上設置有用以吸引保持板狀的被加工物(圖未示)之工作夾台10。被加工物可為例如圓盤狀之半導體晶圓、樹脂基板、陶瓷基板等，且下表面側被吸引保持於工作夾台10上。 A work chuck 10 for sucking a workpiece (not shown) that holds a plate shape is provided on the X-axis moving table 6. The workpiece may be, for example, a disk-shaped semiconductor wafer, a resin substrate, a ceramic substrate, or the like, and the lower surface side is sucked and held on the work chuck 10.
工作夾台10是與馬達等的旋轉機構(圖未示)相連結，且以繞著在Z軸方向(垂直方向)上延伸之旋轉軸的方 式進行旋轉。又，工作夾台10是利用上述X軸移動機構而在X軸方向上移動。在工作夾台10的周圍設置有用於挾持固定支持被加工物之環狀框架(圖未示)的夾具12。 The working chuck 10 is coupled to a rotating mechanism (not shown) of a motor or the like and has a rotation axis extending in the Z-axis direction (vertical direction). Rotate. Further, the work chuck 10 is moved in the X-axis direction by the X-axis moving mechanism. A jig 12 for holding and fixing an annular frame (not shown) for supporting the workpiece is provided around the work chuck 10.
工作夾台10的表面(上表面)為用以吸引保持被加工物之保持面10a。該保持面10a通過形成於工作夾台10內部之流路(圖未示)與吸引源(圖未示)相連接。 The surface (upper surface) of the work chuck 10 is a holding surface 10a for sucking and holding the workpiece. The holding surface 10a is connected to a suction source (not shown) through a flow path (not shown) formed inside the working chuck 10.
在基台4的上表面將支持切削單元(切削機構)14之門型的支持構造16配置成跨越開口4a。在支持構造16的前表面上方部設置有使切削單元14在Y軸方向(分度傳送方向)及Z軸方向上移動之切削單元移動機構18。 A gate-type support structure 16 supporting the cutting unit (cutting mechanism) 14 is disposed on the upper surface of the base 4 so as to span the opening 4a. A cutting unit moving mechanism 18 that moves the cutting unit 14 in the Y-axis direction (index transfer direction) and the Z-axis direction is provided above the front surface of the support structure 16.
切削單元移動機構18具備配置於支持構造16的前表面且平行於Y軸方向之一對Y軸導軌20。在Y軸導軌20上有構成切削單元移動機構18之Y軸移動台22可滑動地設置。 The cutting unit moving mechanism 18 includes a pair of Y-axis guide rails 20 disposed on the front surface of the support structure 16 and parallel to the Y-axis direction. A Y-axis moving table 22 constituting the cutting unit moving mechanism 18 is slidably provided on the Y-axis guide rail 20.
在Y軸移動台22的背面側(後表面側)固定有螺帽部(圖未示)，且將與該Y軸導軌20平行之Y軸螺桿24螺合於該螺帽部。在Y軸螺桿24的一端部上連結有Y軸脈衝馬達(圖未示)。當利用Y軸脈衝馬達使Y軸螺桿24旋轉時，Y軸移動台22即可沿著Y軸導軌20在Y軸方向上移動。 A nut portion (not shown) is fixed to the back side (back surface side) of the Y-axis moving table 22, and a Y-axis screw 24 parallel to the Y-axis guide 20 is screwed to the nut portion. A Y-axis pulse motor (not shown) is coupled to one end of the Y-axis screw 24. When the Y-axis screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving table 22 can be moved in the Y-axis direction along the Y-axis guide 20.
在Y軸移動台22的表面(前表面)上，設置有平行於Z軸方向的一對Z軸導軌26。在Z軸導軌26上有Z軸移動台28可滑動地設置。 On the surface (front surface) of the Y-axis moving table 22, a pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided. A Z-axis moving table 28 is slidably disposed on the Z-axis guide 26.
在Z軸移動台28的背面側(後表面側)固定有螺帽部(圖未示)，且將與該Z軸導軌26平行之Z軸螺桿30螺合於 該螺帽部。在Z軸螺桿30的一端部連結有Z軸脈衝馬達32。當利用Z軸脈衝馬達32使Z軸螺桿30旋轉時，Z軸移動台28即可沿著Z軸導軌26在Z軸方向上移動。 A nut portion (not shown) is fixed to the back side (rear surface side) of the Z-axis moving table 28, and the Z-axis screw 30 parallel to the Z-axis guide 26 is screwed to The nut portion. A Z-axis pulse motor 32 is coupled to one end of the Z-axis screw 30. When the Z-axis screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving table 28 can be moved in the Z-axis direction along the Z-axis guide 26.
在Z軸移動台28的下方部設置有用以切削被加工物之切削單元14。又，在與切削單元14相鄰接的位置上，設置有用於拍攝被加工的上表面側的相機34。藉由如上所述地使Y軸移動台22及Z軸移動台28移動，切削單元14及相機34就可在Y軸方向及Z軸方向上移動。 A cutting unit 14 for cutting a workpiece is provided at a lower portion of the Z-axis moving table 28. Further, at a position adjacent to the cutting unit 14, a camera 34 for photographing the processed upper surface side is provided. By moving the Y-axis moving table 22 and the Z-axis moving table 28 as described above, the cutting unit 14 and the camera 34 can move in the Y-axis direction and the Z-axis direction.
圖2是模式地表示切削單元14之構造的分解立體圖，圖3是模式地表示切削單元14之剖面等的圖。再者，在圖2及圖3中省略了切削單元14之構成的一部分。 FIG. 2 is an exploded perspective view schematically showing the structure of the cutting unit 14, and FIG. 3 is a view schematically showing a cross section and the like of the cutting unit 14. Further, a part of the configuration of the cutting unit 14 is omitted in FIGS. 2 and 3.
切削單元14具備固定於Z軸移動台28之下方部的轉軸座殼36。該轉軸座殼36包含大致成直方體形的殼座本體38，與固定於殼座本體38之一端側的圓柱狀之殼座蓋40。 The cutting unit 14 includes a rotating shaft housing 36 that is fixed to a lower portion of the Z-axis moving table 28. The hinge housing 36 includes a housing body 38 that is substantially rectangular and has a cylindrical housing cover 40 that is fixed to one end side of the housing body 38.
在殼座本體38的內部收納有繞著Y軸旋轉的轉軸42。轉軸42的一端側是從殼座本體38突出於外部。在轉軸42的另一端側則連結有用於使轉軸42旋轉的馬達(圖未示)。 A rotating shaft 42 that rotates about the Y axis is housed inside the housing body 38. One end side of the rotating shaft 42 protrudes from the housing main body 38 to the outside. A motor (not shown) for rotating the rotating shaft 42 is coupled to the other end side of the rotating shaft 42.
在殼座蓋40的中央形成有圓形的開口40a。又，於殼座蓋40之殼座本體38側設置有形成有螺孔40b的鎖定部40c。只要將轉軸42的一端側插接於開口40a，並通過鎖定部40c的螺孔40b將螺絲44(圖3)鎖固於殼座本體38的螺孔38a中，就可以將殼座蓋40固定於殼座本體38上。 A circular opening 40a is formed in the center of the housing cover 40. Further, a lock portion 40c in which a screw hole 40b is formed is provided on the side of the housing main body 38 of the housing cover 40. As long as one end side of the rotating shaft 42 is inserted into the opening 40a, and the screw 44 (FIG. 3) is locked in the screw hole 38a of the housing body 38 through the screw hole 40b of the locking portion 40c, the housing cover 40 can be fixed. On the housing body 38.
於轉軸42的一端部形成有開口42a，且在該開口42a的內壁面上設置有螺紋溝。在該轉軸42的一端部上裝設上第1凸緣構件46。 An opening 42a is formed in one end portion of the rotating shaft 42, and a thread groove is provided on an inner wall surface of the opening 42a. A first flange member 46 is attached to one end of the rotating shaft 42.
該第1凸緣構件46包含徑向向外延伸出去的凸緣部48、分別從凸緣部48的正、背面突出之第1凸座部50及第2凸座部52。在第1凸緣構件46的中央形成有貫穿第1凸座部50、凸緣部48及第2凸座部52之開口46a。 The first flange member 46 includes a flange portion 48 that extends radially outward, and a first boss portion 50 and a second boss portion 52 that protrude from the front and back surfaces of the flange portion 48, respectively. An opening 46a penetrating the first boss portion 50, the flange portion 48, and the second boss portion 52 is formed in the center of the first flange member 46.
在該第1凸緣構件46的開口46a中，是從背面側(轉軸殼座36側)將轉軸42的一端部嵌入。在此狀態下，只要將墊圈56定位在開口46a內，並通過該墊圈56將固定用的螺栓58鎖固於開口42a中，就可將第1凸緣構件46固定於轉軸42上。再者，於螺栓58的外周面58a設置有對應於開口42a之螺紋溝的螺紋牙。 In the opening 46a of the first flange member 46, one end portion of the rotating shaft 42 is fitted from the back side (the side of the rotating shaft housing 36). In this state, the first flange member 46 can be fixed to the rotating shaft 42 by positioning the washer 56 in the opening 46a and locking the fixing bolt 58 in the opening 42a by the washer 56. Further, a thread corresponding to the thread groove of the opening 42a is provided on the outer circumferential surface 58a of the bolt 58.
凸緣部48的外周側之表面成為抵接於切削刀60之背面的抵接面48a。從Y軸方向(轉軸42的軸心方向)來看，該抵接面48a是形成為圓環狀。 The surface on the outer peripheral side of the flange portion 48 serves as an abutting surface 48a that abuts against the back surface of the cutting blade 60. The abutting surface 48a is formed in an annular shape as viewed in the Y-axis direction (the axial direction of the rotating shaft 42).
第1凸座部50形成為圓筒狀，且在其前端側之外周面50a上設置有螺紋牙。切削刀60的中央形成有圓形的開口60a。藉由將第1凸座部50插接於該開口60a中，就可以將切削刀60裝設至第1凸緣構件46中。 The first boss portion 50 is formed in a cylindrical shape, and a thread is provided on the outer peripheral surface 50a on the distal end side. A circular opening 60a is formed in the center of the cutter 60. By inserting the first boss portion 50 into the opening 60a, the cutting blade 60 can be attached to the first flange member 46.
切削刀60為所謂的輪轂狀刀片(hub blade)，且在圓盤狀之支持基台62的外周上固定有用以切削被加工物之圓環狀的切割刃64。切割刃64是在金屬或樹脂等的黏結材(結合材)中混合金鋼石及CBN(Cubic Boron Nitride)等的研 磨粒而形成預定厚度。再者，切削刀60也可以使用只由切割刃所構成之墊圈狀刀片(washer blade)。 The cutting blade 60 is a so-called hub blade, and an annular cutting blade 64 for cutting a workpiece is fixed to the outer circumference of the disk-shaped support base 62. The cutting blade 64 is a mixture of diamond, CBN (Cubic Boron Nitride), and the like in a bonding material (bonding material) such as metal or resin. The particles are ground to form a predetermined thickness. Further, the cutter blade 60 may use a washer blade composed only of a cutting edge.
在將該切削刀60裝設於第1凸緣構件46的狀態下，於切削刀60的表面側配置圓環狀之第2凸緣構件66。於第2凸緣構件66的中央形成有圓形的開口66a，在該開口66a的內壁面設置有對應於第1凸座部50之外周面50a上所形成之螺紋牙的螺紋溝。 In a state in which the cutting blade 60 is attached to the first flange member 46, an annular second flange member 66 is disposed on the surface side of the cutting blade 60. A circular opening 66a is formed in the center of the second flange member 66, and a screw groove corresponding to the thread formed on the outer peripheral surface 50a of the first boss portion 50 is provided on the inner wall surface of the opening 66a.
第2凸緣構件66的外周側的背面會成為抵接於切削刀60的表面的抵接面66b(圖3)。抵接面66b是設置在與第1凸緣構件46的抵接面48a對應的位置上。 The back surface on the outer peripheral side of the second flange member 66 serves as an abutting surface 66b ( FIG. 3 ) that abuts against the surface of the cutting blade 60 . The abutting surface 66b is provided at a position corresponding to the abutting surface 48a of the first flange member 46.
藉由將第1凸座部50的前端鎖固於該第2凸緣構件66的開口66a，即可使切削刀60受到第1凸緣構件46與第2凸緣構件66所挾持。 By locking the distal end of the first boss portion 50 to the opening 66a of the second flange member 66, the cutting blade 60 can be held by the first flange member 46 and the second flange member 66.
在像這樣所構成之切削單元14中設置有用於檢測切削刀60之振動的振動檢測機構。振動檢測機構含有用以產生對應於切削刀60之振動的振動信號的振動信號產生裝置(振動信號產生機構)68(圖3)。 A vibration detecting mechanism for detecting the vibration of the cutting blade 60 is provided in the cutting unit 14 configured as described above. The vibration detecting mechanism includes a vibration signal generating means (vibration signal generating means) 68 (Fig. 3) for generating a vibration signal corresponding to the vibration of the cutting blade 60.
振動信號產生裝置68具備固定於第1凸緣構件46內部的超音波振動器70。該超音波振動器70是用例如，鈦酸鋇(BaTiO3)、鋯鈦酸鉛(Pb(Zi,Ti)O3)、鈮酸鋰(LiNbO3)、鉭酸鋰(LiTaO3)等材料所形成，並用以將切削刀60的振動轉換成電壓(振動信號)。 The vibration signal generating device 68 includes an ultrasonic vibrator 70 that is fixed to the inside of the first flange member 46. The ultrasonic vibrator 70 is made of, for example, barium titanate (BaTiO 3 ), lead zirconate titanate (Pb(Zi, Ti)O 3 ), lithium niobate (LiNbO 3 ), lithium niobate (LiTaO 3 ), or the like. It is formed and used to convert the vibration of the cutting blade 60 into a voltage (vibration signal).
通常，該超音波振動器70是構成為可相對於預定頻率的振動而形成共振。因此，因應超音波振動器70的共 振頻率，以決定可以利用振動檢測機構進行檢測之振動頻率。 Generally, the ultrasonic vibrator 70 is configured to resonate with respect to vibration at a predetermined frequency. Therefore, in response to the totality of the ultrasonic vibrator 70 The vibration frequency determines the vibration frequency that can be detected by the vibration detecting mechanism.
在本實施形態之切削裝置2中，是從分別具備不同共振頻率之超音波振動器70的複數個第1凸緣構件46中，選擇對應於要檢測之切削刀60的振動頻率之第1凸緣構件46而裝設到轉軸42上。 In the cutting device 2 of the present embodiment, the first convex member corresponding to the vibration frequency of the cutting blade 60 to be detected is selected from the plurality of first flange members 46 each having the ultrasonic vibrator 70 having a different resonance frequency. The edge member 46 is attached to the rotating shaft 42.
藉此，即可因應切削刀60及被加工物的種類(材質、大小，重量等)、發生頻率高的異常態樣等，而將振動檢測機構最佳化。各個第1凸緣構件46的對應頻率是設成例如，50kHz~100kHz，100kHz~300kHz，300kHz~500kHz。此時，藉由更換3種第1凸緣構件46，就可以適當地對50kHz~500kHz的頻率範圍的振動進行檢測。 Thereby, the vibration detecting mechanism can be optimized in accordance with the type (material, size, weight, etc.) of the cutting blade 60 and the workpiece, and an abnormal state in which the frequency of occurrence is high. The corresponding frequency of each of the first flange members 46 is set to, for example, 50 kHz to 100 kHz, 100 kHz to 300 kHz, and 300 kHz to 500 kHz. At this time, by changing the three types of first flange members 46, it is possible to appropriately detect the vibration in the frequency range of 50 kHz to 500 kHz.
在超音波振動器70中連接有用於傳送在超音波振動器70所產生的電壓之非接觸型的傳送通道(傳送機構)72(圖3)。該傳送通道72包含連接於超音波振動器70的第1電感器(第1線圈機構)74，及相對於第1電感器74以預定間隔相向面對之第2電感器(第2線圈機構)76。 A non-contact type transfer path (transport mechanism) 72 (FIG. 3) for transmitting the voltage generated by the ultrasonic vibrator 70 is connected to the ultrasonic vibrator 70. The transmission channel 72 includes a first inductor (first coil mechanism) 74 connected to the ultrasonic vibrator 70, and a second inductor (second coil mechanism) facing each other at a predetermined interval with respect to the first inductor 74. 76.
第1電感器74及第2電感器76，代表性的有捲繞導線而做成之圓環狀的線圈，且分別被固定於第1凸緣構件46及殼座蓋40上。 The first inductor 74 and the second inductor 76 are typically annular coils formed by winding wires, and are fixed to the first flange member 46 and the housing cover 40, respectively.
圖4為模式地表示超音波振動器70及第1電感器74之配置的圖。在本實施形態中，如圖4所示，從Y軸方向(轉軸42的軸心O的方向)來看，有2個相同的超音波振動器70配置在與第1電感器74重疊的位置上。 FIG. 4 is a view schematically showing the arrangement of the ultrasonic vibrator 70 and the first inductor 74. In the present embodiment, as shown in FIG. 4, two identical ultrasonic vibrators 70 are disposed at positions overlapping the first inductor 74 as viewed in the Y-axis direction (the direction of the axis O of the rotating shaft 42). on.
2個超音波振動器70是相對於轉軸42的軸心O配置成對稱。像這樣，藉由將複數個超音波振動器70相對於轉軸42的軸心O對稱地配置，就可以高精度地對切削刀60的振動進行檢測。再者，超音波振動器70的數量、配置，形狀等，並不受限於圖4所示之態樣。 The two ultrasonic vibrators 70 are arranged symmetrically with respect to the axis O of the rotating shaft 42. As described above, by arranging the plurality of ultrasonic vibrators 70 symmetrically with respect to the axis O of the rotating shaft 42, the vibration of the cutting blade 60 can be detected with high precision. Furthermore, the number, arrangement, shape, and the like of the ultrasonic vibrators 70 are not limited to those shown in FIG.
第1電感器74與第2電感器76是相向面對，且以磁性結合。因此，在超音波振動器70所產生的電壓，會藉由第1電感器74與第2電感器76之相互電磁感應，而傳送至第2電感器76側。 The first inductor 74 and the second inductor 76 face each other and are magnetically coupled. Therefore, the voltage generated by the ultrasonic vibrator 70 is electromagnetically induced by the first inductor 74 and the second inductor 76, and is transmitted to the second inductor 76 side.
於第2電感器76上連接有控制裝置(控制機構)78。該控制裝置78會根據從第2電感器76所傳送來的電壓而判定切削刀的振動狀態。具體來說，是將相當於每一個任意的單位時間所傳送之電壓的時間變化的波形(時間領域的波形)，透過傅立葉轉換(例如，高速傅立葉轉換)以進行頻譜解析，並根據所得到之頻率領域的波形，以判定切削刀60的狀態。作為單位時間，可考慮以下各種態樣：1條線的切削所需要的時間(按照每1條切線)、1片被加工物的切削所需要的時間(按照每1個工件)、切削任意的距離所需要的時間(按照每個切削距離)等。 A control device (control mechanism) 78 is connected to the second inductor 76. The control device 78 determines the vibration state of the cutting blade based on the voltage transmitted from the second inductor 76. Specifically, a waveform (a waveform of a time domain) corresponding to a time variation of a voltage transmitted every arbitrary unit time is subjected to Fourier transform (for example, fast Fourier transform) for spectrum analysis, and is obtained according to the obtained The waveform in the frequency domain determines the state of the cutting blade 60. As the unit time, consider the following various conditions: the time required for cutting one wire (for each tangential line), the time required for cutting one workpiece (for each workpiece), and cutting arbitrary The time required for the distance (according to each cutting distance).
圖5(A)是表示傳送至控制裝置78之電壓的波形(時間領域的波形)之例的圖形，圖5(B)是表示傅立葉轉換後的波形(頻率領域的波形)之例的圖形。再者，在圖5(A)中，分別以縱軸表示電壓(V)，橫軸表示時間(t)，而在圖5(B)中，分別以縱軸表示振福，橫軸表示頻率(f)。 FIG. 5(A) is a diagram showing an example of a waveform (a waveform in a time domain) of a voltage transmitted to the control device 78, and FIG. 5(B) is a diagram showing an example of a waveform (a waveform in a frequency domain) after Fourier transform. Further, in Fig. 5(A), the vertical axis represents voltage (V), the horizontal axis represents time (t), and in Fig. 5(B), the vertical axis represents vibration, and the horizontal axis represents frequency. (f).
像這樣，只要將來自振動信號產生裝置68的電壓(振動信號)的波形以控制裝置78進行傅立葉轉換，就可以如圖5(B)所示地將切削刀60的振動區分成主要的頻率成分，而可以容易地解析切削中所發生的異常。藉此，可即時且以良好的精度檢測切削中的異常。 In this manner, as long as the waveform of the voltage (vibration signal) from the vibration signal generating device 68 is Fourier-converted by the control device 78, the vibration of the cutting blade 60 can be divided into the main frequency components as shown in Fig. 5(B). , and the abnormality occurring in the cutting can be easily analyzed. Thereby, the abnormality in the cutting can be detected immediately and with good precision.
圖6為表示異常發生前後的波形(頻率領域的波形)之例的圖形。在圖6中分別以縱軸表示振幅，橫軸表示頻率(f)。又，在圖6中，是以實線表示異常發生前的波形，以虛線表示異常發生後的波形。 FIG. 6 is a view showing an example of a waveform (a waveform in a frequency domain) before and after an abnormality occurs. In Fig. 6, the amplitude is represented by the vertical axis, and the horizontal axis represents the frequency (f). In addition, in FIG. 6, the waveform before the occurrence of the abnormality is indicated by a solid line, and the waveform after the occurrence of the abnormality is indicated by a broken line.
如圖6所示，在異常發生後的波形中存在有不會在異常發生前的波形中看到的高頻率側的振動模式(振動成分)。控制裝置78可例如，比較異常發生前後的波形(頻率領域的波形)，以判定發生了與僅在異常發生後的波形中才會看到的振動模式相對應的異常。 As shown in FIG. 6, in the waveform after the occurrence of the abnormality, there is a vibration mode (vibration component) on the high frequency side that is not seen in the waveform before the abnormality occurs. The control device 78 can, for example, compare waveforms (waveforms in the frequency domain) before and after the occurrence of an abnormality to determine that an abnormality corresponding to the vibration mode that is only seen in the waveform after the abnormality has occurred.
如以上所述，由於本實施形態的切削裝置2包含用以產生對應於切削刀60的振動之振動信號的振動信號產生裝置(振動信號產生機構)68，及根據以振動信號產生裝置68所產生的振動信號判定切削刀60之狀態的控制裝置(控制機構)78，因此可適當地檢測伴隨著切削刀60的振動而形成之切削中的異常。 As described above, the cutting device 2 of the present embodiment includes a vibration signal generating device (vibration signal generating mechanism) 68 for generating a vibration signal corresponding to the vibration of the cutting blade 60, and is generated based on the vibration signal generating device 68. Since the vibration signal determines the control device (control means) 78 of the state of the cutting blade 60, it is possible to appropriately detect the abnormality in the cutting formed by the vibration of the cutting blade 60.
又，在本實施形態之切削裝置2中，由於對相當於電壓(振動信號)之時間變化的波形(時間領域的波形)進行傅立葉轉換，因此，與直接解析振動信號的情況相比，可將於切削中所發生之異常的解析變容易。藉此，可高精 度地檢測切削中的異常。 Further, in the cutting device 2 of the present embodiment, since the waveform (the waveform in the time domain) corresponding to the time change of the voltage (vibration signal) is Fourier-transformed, compared with the case where the vibration signal is directly analyzed, The analysis of the abnormality occurring during cutting becomes easy. This can be highly refined Detect abnormalities during cutting.
再者，本發明並不受限於上述實施形態之記載。例如，不將電壓(振動信號)進行傅立葉轉換而進行解析亦可。另外，上述實施形態之構成、方法等，只要在不脫離本發明之目的之範圍內，均可適當變更而實施。 Furthermore, the present invention is not limited to the description of the above embodiments. For example, the voltage (vibration signal) may not be subjected to Fourier transform for analysis. In addition, the configuration, the method, and the like of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the invention.
14‧‧‧切削單元(切削機構) 14‧‧‧Cutting unit (cutting mechanism)
36‧‧‧轉軸殼座 36‧‧‧Shaft housing
38‧‧‧殼座本體 38‧‧‧Shell body
38a‧‧‧螺孔 38a‧‧‧ screw holes
40‧‧‧殼座蓋 40‧‧‧Shell cover
40a、42a、46a、60a、66a‧‧‧開口 40a, 42a, 46a, 60a, 66a‧‧
40b‧‧‧螺孔 40b‧‧‧ screw hole
40c‧‧‧鎖定部 40c‧‧‧Locking Department
42‧‧‧轉軸 42‧‧‧ shaft
44‧‧‧螺絲 44‧‧‧ screws
46‧‧‧第1凸緣構件 46‧‧‧1st flange member
48‧‧‧凸緣部 48‧‧‧Flange
48a、66b‧‧‧抵接面 48a, 66b‧‧‧ abutment
50‧‧‧第1凸座部 50‧‧‧1st seat
50a、58a‧‧‧外周面 50a, 58a‧‧‧ outer perimeter
52‧‧‧第2凸座部 52‧‧‧2nd seat
56‧‧‧墊圈 56‧‧‧Washers
58‧‧‧螺栓 58‧‧‧ bolt
60‧‧‧切削刀 60‧‧‧Cutter
62‧‧‧支持基台 62‧‧‧Support abutments
64‧‧‧刀片 64‧‧‧blade
66‧‧‧第2凸緣構件 66‧‧‧2nd flange member
68‧‧‧振動信號產生裝置(振動信號產生機構) 68‧‧‧Vibration signal generating device (vibration signal generating mechanism)
70‧‧‧超音波振動器 70‧‧‧Ultrasonic vibrator
72‧‧‧傳送通道(傳送機構) 72‧‧‧Transport channel (transport mechanism)
74‧‧‧第1電感器(第1線圈機構) 74‧‧‧1st inductor (first coil mechanism)
76‧‧‧第2電感器(第2線圈機構) 76‧‧‧2nd inductor (2nd coil mechanism)
78‧‧‧控制裝置(控制機構) 78‧‧‧Control device (control mechanism)
Y、Z‧‧‧方向 Y, Z‧‧‧ direction
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| JP2014-044994 | 2014-03-07 | ||
| JP2014044994A JP6223237B2 (en) | 2014-03-07 | 2014-03-07 | Cutting equipment |
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| TWI651178B TWI651178B (en) | 2019-02-21 |
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| KR (1) | KR102228492B1 (en) |
| CN (1) | CN104889869B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107756138A (en) * | 2016-08-18 | 2018-03-06 | 王智中 | Cutting tool state online test method and equipment |
| JP6846214B2 (en) * | 2017-01-20 | 2021-03-24 | 株式会社ディスコ | Cutting equipment |
| JP6846657B2 (en) * | 2017-01-20 | 2021-03-24 | 株式会社ディスコ | Cutting equipment |
| JP6800774B2 (en) * | 2017-02-22 | 2020-12-16 | 株式会社ディスコ | Cutting equipment |
| JP6847746B2 (en) * | 2017-04-11 | 2021-03-24 | 株式会社ディスコ | Cutting equipment |
| JP6866217B2 (en) | 2017-04-21 | 2021-04-28 | 株式会社ディスコ | Cutting equipment |
| JP6901906B2 (en) | 2017-05-12 | 2021-07-14 | 株式会社ディスコ | Cutting equipment |
| CN108417508B (en) * | 2018-01-22 | 2020-12-18 | 西安理工大学 | Micro-arc discharge cutting device for semiconductor |
| JP7145710B2 (en) * | 2018-09-25 | 2022-10-03 | 株式会社ディスコ | cutting equipment |
| CN109530845B (en) * | 2018-10-29 | 2021-03-26 | 陕西航空电气有限责任公司 | Tool for removing solder oxide layer on surface of rectifier tube chip |
| CN109834521A (en) * | 2019-01-23 | 2019-06-04 | 南京航空航天大学 | A kind of non-contact rotary ultrasonic machining Dynamic Signal extraction element |
| JP2021041502A (en) * | 2019-09-12 | 2021-03-18 | 株式会社ディスコ | Cutting blade, manufacturing method for cutting blade and cutting method for wafer |
| TWI741705B (en) | 2020-07-28 | 2021-10-01 | 國立中興大學 | Power supply outside the spindle |
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| JPS6062464A (en) * | 1983-09-10 | 1985-04-10 | Kawasaki Steel Corp | Side end grinding attachment for metallic belt by rotary grinding wheel |
| JPH0499946A (en) * | 1990-08-20 | 1992-03-31 | Sanko Control Kk | Method and apparatus for measuring cutting ability of grinder wheel |
| JPH05154833A (en) * | 1991-12-09 | 1993-06-22 | Nikko Kyodo Co Ltd | Dicing machine |
| JP3534338B2 (en) * | 1999-10-07 | 2004-06-07 | 松下電器産業株式会社 | Cutting equipment |
| JP2002066879A (en) * | 2000-09-04 | 2002-03-05 | Bosch Automotive Systems Corp | Acoustic emission detecting device for machine tool |
| JP4658730B2 (en) * | 2005-07-28 | 2011-03-23 | 株式会社ディスコ | Cutting equipment |
| WO2007080699A1 (en) * | 2006-01-12 | 2007-07-19 | Tokyo Seimitsu Co., Ltd. | Working system, contact detecting method, and ae contact detecting device |
| JP4552883B2 (en) * | 2006-04-19 | 2010-09-29 | 株式会社デンソー | Vibration detection method |
| JP2008290203A (en) * | 2007-05-25 | 2008-12-04 | Nissan Diesel Motor Co Ltd | Grinding work monitoring system and grinding work monitoring method |
| JP2009032726A (en) * | 2007-07-24 | 2009-02-12 | Disco Abrasive Syst Ltd | Method for dividing wafer |
| TW201226101A (en) * | 2010-12-28 | 2012-07-01 | Nat Univ Chung Hsing | Method and device to detect the state of cutting tool in machine tool with multiple sensors |
| JP5258921B2 (en) * | 2011-03-31 | 2013-08-07 | 株式会社小松製作所 | Machine tool and its processing control device |
| JP5764031B2 (en) * | 2011-10-06 | 2015-08-12 | 株式会社ディスコ | Cutting equipment |
| JP5943578B2 (en) * | 2011-10-11 | 2016-07-05 | 株式会社東京精密 | Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone |
| TW201332704A (en) * | 2012-02-10 | 2013-08-16 | 中原大學 | Cutting edge chip-buildup monitoring method |
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| MY177229A (en) | 2020-09-09 |
| KR20150105221A (en) | 2015-09-16 |
| KR102228492B1 (en) | 2021-03-15 |
| CN104889869A (en) | 2015-09-09 |
| JP2015170743A (en) | 2015-09-28 |
| JP6223237B2 (en) | 2017-11-01 |
| TWI651178B (en) | 2019-02-21 |
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