SG11201604448SA - Method for slicing workpiece and workpiece holder - Google Patents
Method for slicing workpiece and workpiece holderInfo
- Publication number
- SG11201604448SA SG11201604448SA SG11201604448SA SG11201604448SA SG11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- slicing
- holder
- workpiece holder
- slicing workpiece
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013265726A JP6000235B2 (en) | 2013-12-24 | 2013-12-24 | Work cutting method and work holding jig |
PCT/JP2014/005931 WO2015097985A1 (en) | 2013-12-24 | 2014-11-27 | Workpiece cutting method and workpiece holding tool |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604448SA true SG11201604448SA (en) | 2016-07-28 |
Family
ID=53477897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604448SA SG11201604448SA (en) | 2013-12-24 | 2014-11-27 | Method for slicing workpiece and workpiece holder |
Country Status (8)
Country | Link |
---|---|
US (1) | US10350788B2 (en) |
JP (1) | JP6000235B2 (en) |
KR (1) | KR102253809B1 (en) |
CN (1) | CN105814669B (en) |
DE (1) | DE112014005470T5 (en) |
SG (1) | SG11201604448SA (en) |
TW (1) | TWI580500B (en) |
WO (1) | WO2015097985A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6157421B2 (en) * | 2014-07-03 | 2017-07-05 | 信越半導体株式会社 | Work cutting method and work holding jig |
CN106112092A (en) * | 2016-08-16 | 2016-11-16 | 无锡尊宝电动车有限公司 | A kind of cutting machine for the processing of buffing machine shell |
JP6988358B2 (en) * | 2017-10-16 | 2022-01-05 | Tdk株式会社 | Work holding jig, electronic component processing device and manufacturing method of electronic components |
JP6971780B2 (en) * | 2017-10-27 | 2021-11-24 | 上村工業株式会社 | Work holding jig and load / unload device |
KR102037745B1 (en) * | 2017-12-14 | 2019-10-29 | 에스케이실트론 주식회사 | Ingot clamping device and wire sawing apparatus for cutting Ingot having the same |
CN110385746B (en) * | 2019-08-29 | 2021-02-02 | 常州金纬化工成套设备有限公司 | Sectional type cutting equipment of macromolecular material polyethylene board production usefulness |
CN115041995B (en) * | 2022-06-27 | 2023-11-17 | 青岛高测科技股份有限公司 | Feeding device and cutting equipment |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0310760A (en) * | 1989-06-09 | 1991-01-18 | Nippon Spindle Mfg Co Ltd | Wire saw for cutting crystalline brittle material |
JP3144269B2 (en) * | 1995-07-07 | 2001-03-12 | 株式会社東京精密 | Cutting method of single crystal material |
TW355151B (en) | 1995-07-07 | 1999-04-01 | Tokyo Seimitsu Co Ltd | A method for cutting single chip material by the steel saw |
CH692331A5 (en) | 1996-06-04 | 2002-05-15 | Tokyo Seimitsu Co Ltd | Wire saw and cutting method using the same. |
JPH09325124A (en) * | 1996-06-04 | 1997-12-16 | Tokyo Seimitsu Co Ltd | Method and device for crystallographic axis orientation adjustment of ingot using x ray |
JP3173564B2 (en) * | 1996-06-04 | 2001-06-04 | 株式会社東京精密 | Wire saw |
JP2000171417A (en) * | 1998-12-04 | 2000-06-23 | Toshiba Ceramics Co Ltd | Auxiliary apparatus for orientation measurement and method for orientation measuring processing |
JP2001050912A (en) * | 1999-08-11 | 2001-02-23 | Rigaku Corp | Support apparatus for single-crystal ingot and apparatus, and method for measurement of single-crystal ingot |
AU2000251024A1 (en) * | 2000-05-31 | 2001-12-11 | Memc Electronic Materials S.P.A. | Wire saw and process for slicing multiple semiconductor ingots |
DE10052154A1 (en) | 2000-10-20 | 2002-05-08 | Freiberger Compound Mat Gmbh | Method and device for separating single crystals, adjusting device and test method for determining an orientation of a single crystal for such a method |
JP4951914B2 (en) | 2005-09-28 | 2012-06-13 | 信越半導体株式会社 | (110) Silicon wafer manufacturing method |
-
2013
- 2013-12-24 JP JP2013265726A patent/JP6000235B2/en active Active
-
2014
- 2014-11-27 US US15/100,378 patent/US10350788B2/en active Active
- 2014-11-27 KR KR1020167016554A patent/KR102253809B1/en active IP Right Grant
- 2014-11-27 WO PCT/JP2014/005931 patent/WO2015097985A1/en active Application Filing
- 2014-11-27 CN CN201480067818.3A patent/CN105814669B/en active Active
- 2014-11-27 DE DE112014005470.4T patent/DE112014005470T5/en active Pending
- 2014-11-27 SG SG11201604448SA patent/SG11201604448SA/en unknown
- 2014-12-10 TW TW103143056A patent/TWI580500B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI580500B (en) | 2017-05-01 |
US10350788B2 (en) | 2019-07-16 |
CN105814669A (en) | 2016-07-27 |
JP2015122424A (en) | 2015-07-02 |
TW201540400A (en) | 2015-11-01 |
JP6000235B2 (en) | 2016-09-28 |
US20160303765A1 (en) | 2016-10-20 |
WO2015097985A1 (en) | 2015-07-02 |
KR20160102192A (en) | 2016-08-29 |
CN105814669B (en) | 2019-03-22 |
KR102253809B1 (en) | 2021-05-21 |
DE112014005470T5 (en) | 2016-08-11 |
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